JPS638146Y2 - - Google Patents

Description

[Detailed description of the invention] The present invention relates to a semiconductor integrated circuit incorporating a switch, and an object of the present invention is to provide a semiconductor device in which a switch mechanism and a semiconductor integrated circuit are integrally formed by forming a switch contact on a lead frame. do.

A semiconductor device equipped with a switch of the present invention will be explained based on FIGS. 1 to 5.

FIG. 1 shows an embodiment of a semiconductor device equipped with a switch according to the present invention. 1 is a semiconductor device, 2 is a switch key, and 3 is a terminal pin.

FIG. 2 shows a lead frame 4 equipped with contacts of a switch according to the present invention, and an outer frame 5 is provided with terminal pins 3. 6 is a guide hole, and 7 is a support frame. A portion 8, which is the tip of the terminal pin 3 and is surrounded by a dotted line, forms the contacts 3a and 3b of the switch. The other ends 3e of the contacts 3a, 3b are connected to a semiconductor element 10 attached to a ceramic substrate 15 by a wiring 11. The ceramic substrate 15 has a semiconductor element 10 or a circuit element such as a chip capacitor attached thereto to form an integrated circuit, and the terminal pin 3 and the fixed contact portion of the switch at the tip thereof are bonded by means such as thermal fusion. It is fixed to the ceramic substrate 15 by.

FIG. 3 shows another embodiment of the lead frame with the contact portion 8 of the switch. The tip portions 3c and 3d of the terminal pin 3 are contacts, and 3g is a portion to which a circuit element such as the semiconductor integrated circuit device 10 is attached to the tip portion of the terminal pin 3, and the tip portion 3f of the terminal pin 3 and the semiconductor element are connected by wiring 11. The shape of the lead frame is not limited to those shown in FIGS. 2 and 3, and can be made into various shapes.

Next, the switch mechanism will be explained based on FIGS. 4 and 5.

FIG. 4 is a side sectional view showing the switch mechanism of the contact portion 8 of FIG. 2. FIG. Reference numeral 9 denotes an elastic contact made of conductive rubber and having a cylindrical appearance.
The contact 3b at the tip of the terminal pin is in contact with the protrusion provided at the center of the movable contact 9 of the switch, and the conductive rubber is distorted by the pressure from the direction of the arrow.
contacts 3a and 3b through the movable contact 9 in contact with
becomes conductive.

FIG. 5 is a side sectional view showing an embodiment of a resin-molded switch mechanism, and is an embodiment in which the lead frame of FIG. 3 is used. The protruding part of the contact 9 made of conductive rubber is connected to the ceramic substrate 1.
5, the contact 9 is fitted into the engagement body 13, and the engagement body 13 is equipped with the key 2. By pressing the key 2 in the direction of the arrow, the contact 9 is distorted and the contacts 3c and 3d become electrically connected through the interposition of the contact 9. 12 is a housing.

A semiconductor device equipped with a switch according to the present invention is
A lead frame 4 on which wiring such as the semiconductor device 10 was formed was adhered to a ceramic substrate 15, and a housing 12 containing a movable contact was adhered so as to cover the fixed contact of the switch formed on the lead frame 4. These parts are then resin molded, and the switch mechanism parts and parts such as the semiconductor device are integrally resin molded.

FIG. 6 is a diagram showing a usage state in which the semiconductor device 1 according to the present invention is attached to a printed circuit board 14. 1
6 is a panel having an opening 17. Panel 1
The printed circuit board 14 to which the semiconductor device 1 is attached is fixed to a mounting shaft 18 fixed to the mounting shaft 6 , and the key 2 is mounted in the opening 17 .

The lead frame according to the present invention may be an ordinary copper plate, and the shape of the semiconductor device 1 can be transfer molded or various packages.
Engagement body 1 with key 2 attached as shown in FIG.
A housing 1 housing a contact 9 fitted into a housing 3
2 to a ceramic substrate 15 in advance and resin molding, or a method in which a substrate on which a semiconductor integrated circuit is formed is formed with a keyboard switch inside the housing 12 as shown in FIG. 5 and mounted in a storage container.
This storage container and the semiconductor integrated circuit fixed to the substrate are resin molded to form a semiconductor integrated circuit equipped with a switch. A protrusion is formed on the bottom of the housing 12, and is fixed together with the semiconductor integrated circuit 10 by solidified resin.

In addition, in Figures 4 and 5, conductive rubber is connected to the contact point 9.
Contact point 3 is used, but is not limited to this.
It is obvious that, for example, a plate-shaped metal contact that can short-circuit between a and 3b or between contacts 3c and 3d may be used. (Not shown) Additionally, when the semiconductor element 10 is attached to the tip 3g of the terminal pin 3 as shown in the lead frame of FIG. do not. Needless to say, the substrate on which circuit elements such as semiconductor integrated circuits are attached is not limited to ceramic substrates.

As described above, the present invention is a semiconductor device equipped with a switch, and is characterized in that a contact portion is provided on a lead frame and incorporated into an integrated circuit. The semiconductor device according to the present invention can be applied to various uses such as changing the voltage by pressing a switch like an electronic volume control or switching from AM reception to FM reception. In this way, by integrating the switch and the semiconductor integrated circuit, the number of parts can be reduced, making it possible to form a compact device and reducing the number of assembly steps during mounting. Of course, since a lead frame is used, it is clear that it has an excellent effect on mass production.

[Brief explanation of drawings]

Figure 1 is a perspective view of a semiconductor device equipped with a switch according to the present invention, Figures 2 and 3 are plan views of a lead frame equipped with switch contacts, and Figures 4 and 5 are switch contact mechanisms. A side sectional view showing
FIG. 6 is a side view of one embodiment of the semiconductor device according to the present invention, showing how it is used. 1: Semiconductor device, 2: Key, 3: Terminal pin,
4: Lead frame, 5: Outer frame, 6: Guide hole,
7: Support frame, 8: Contact portion, 9: Contact, 10: Semiconductor element, 11: Wiring, 12: Housing, 13:
Engagement body, 14: Printed circuit board, 15: Ceramic substrate, 16: Panel, 17: Opening, 3a, 3
b, 3c, 3d: Contact points.

Claims (1)

[Scope of utility model registration request] A semiconductor integrated circuit element, a substrate, an internal terminal of a lead frame bonded to the substrate and wired to the semiconductor integrated circuit element, and at least two of the internal terminals of the lead frame are used as fixed contacts of the switch to press the key. A switch characterized in that a housing housing a movable contact for short-circuiting the fixed contact is placed on the fixed contact and fixed to the substrate, and a switch is formed in the same package by resin molding. A semiconductor device equipped with