JPS6377327U - - Google Patents
Info
- Publication number
- JPS6377327U JPS6377327U JP17177786U JP17177786U JPS6377327U JP S6377327 U JPS6377327 U JP S6377327U JP 17177786 U JP17177786 U JP 17177786U JP 17177786 U JP17177786 U JP 17177786U JP S6377327 U JPS6377327 U JP S6377327U
- Authority
- JP
- Japan
- Prior art keywords
- nickel
- chip
- multilayer ceramic
- main component
- elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
図―１は、従来のチツプ形積層セラミツクコン
デンサの半田付け方法。図―２は、基板に弾性の
ある端子を用い、端子とチツプ形積層セラミツク
コンデンサを半田付けする方法。図―３は、本考
案によるチツプ形積層セラミツクコンデンサを半
田付けする方法。
１…チツプ形積層セラミツクコンデンサ。２…
基板端子。３…半田。４…基板。５…弾性導電端
子。６…電極材。
Figure 1 shows the conventional soldering method for chip-type multilayer ceramic capacitors. Figure 2 shows a method of using elastic terminals on the board and soldering the terminals to a chip-shaped multilayer ceramic capacitor. Figure 3 shows the method of soldering the chip-type multilayer ceramic capacitor according to the present invention. 1...Chip type multilayer ceramic capacitor. 2...
board terminal. 3...Solder. 4...Substrate. 5...Elastic conductive terminal. 6...Electrode material.
Claims (1)
取り出し方法において、端面銀電極の上に、断面
がコの字形の形状をし、その表面に半田メツキ、
或は錫メツキを施した純銅又は、室温付近に於け
る熱膨張係数が１２×１０−６ないし８×１０−
６の、ニツケルを主成分とし他の元素を含むニツ
ケル銅合金、ニツケルを主成分とし他の元素を含
むニツケル鉄合金の電極を取り付けた構造のチツ
プ形積層セラミツクコンデンサ。 In the method for taking out the external electrodes of chip-shaped multilayer ceramic capacitors, a U-shaped cross section is formed on the end silver electrode, and the surface is soldered,
Or tin-plated pure copper or a material with a thermal expansion coefficient of 12×10 −6 to 8×10 − around room temperature.
No. 6 , a chip-type multilayer ceramic capacitor having a structure in which electrodes of a nickel-copper alloy containing nickel as a main component and other elements, and a nickel-iron alloy containing nickel as a main component and other elements are attached.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17177786U JPS6377327U (en) | 1986-11-07 | 1986-11-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17177786U JPS6377327U (en) | 1986-11-07 | 1986-11-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6377327U true JPS6377327U (en) | 1988-05-23 |
Family
ID=31107718
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17177786U Pending JPS6377327U (en) | 1986-11-07 | 1986-11-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6377327U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02161711A (en) * | 1988-12-15 | 1990-06-21 | Hitachi Cable Ltd | Lead wires for heat-resistant electronic parts |
| US7944128B2 (en) | 2009-07-01 | 2011-05-17 | Murata Manufacturing Co., Ltd. | Electronic component |
| JP2017063166A (en) * | 2015-09-26 | 2017-03-30 | 京セラ株式会社 | Multilayer capacitor and mounting structure therefor |
-
1986
- 1986-11-07 JP JP17177786U patent/JPS6377327U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02161711A (en) * | 1988-12-15 | 1990-06-21 | Hitachi Cable Ltd | Lead wires for heat-resistant electronic parts |
| US7944128B2 (en) | 2009-07-01 | 2011-05-17 | Murata Manufacturing Co., Ltd. | Electronic component |
| JP2017063166A (en) * | 2015-09-26 | 2017-03-30 | 京セラ株式会社 | Multilayer capacitor and mounting structure therefor |
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