JPS6367908A - Electric parts having two-terminal type piezoelectric resonance element and its production - Google Patents
Electric parts having two-terminal type piezoelectric resonance element and its productionInfo
- Publication number
- JPS6367908A JPS6367908A JP21330986A JP21330986A JPS6367908A JP S6367908 A JPS6367908 A JP S6367908A JP 21330986 A JP21330986 A JP 21330986A JP 21330986 A JP21330986 A JP 21330986A JP S6367908 A JPS6367908 A JP S6367908A
- Authority
- JP
- Japan
- Prior art keywords
- cup
- resonant element
- piezoelectric resonant
- terminal
- holding part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 239000000463 material Substances 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 7
- 239000003990 capacitor Substances 0.000 abstract description 15
- 239000000758 substrate Substances 0.000 abstract description 15
- 238000005476 soldering Methods 0.000 abstract description 6
- 239000000126 substance Substances 0.000 abstract 1
- 238000009434 installation Methods 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- 239000000057 synthetic resin Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
この発明は、２端子形圧電共振素子を有する電子部品お
よびその製造方法に関し、特にたとえばコンピュータの
発振源のクロック素子などに用いられる、２端子形圧電
共振素子を有する電子部品およびその製造方法に関する
。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an electronic component having a two-terminal type piezoelectric resonant element and a method for manufacturing the same, and in particular to a two-terminal type piezoelectric resonant element used in a clock element of a computer oscillation source, etc. The present invention relates to an electronic component having a shaped piezoelectric resonant element and a method for manufacturing the same.
（従来技術）
第４図は従来の２端子形圧電共振素子を有する電子部品
を示す斜視図である。この電子部品１では、カップ端子
２０カツプ状の保持部３に圧電共振素子４が保持されて
いる。そして、端子の長手方向に圧電共振素子４と並ん
で電子回路基板５が接続されている。このような電子部
品１では、カップ状の保持部３、圧電共振素子４および
電子回路基板５の周囲に、たとえば外装材（図示せず）
が形成される。(Prior Art) FIG. 4 is a perspective view showing an electronic component having a conventional two-terminal piezoelectric resonant element. In this electronic component 1, a piezoelectric resonant element 4 is held in a cup-shaped holding part 3 with a cup terminal 20. An electronic circuit board 5 is connected in line with the piezoelectric resonant element 4 in the longitudinal direction of the terminal. In such an electronic component 1, for example, an exterior material (not shown) is provided around the cup-shaped holding portion 3, the piezoelectric resonant element 4, and the electronic circuit board 5.
is formed.
（発明が解決しようとする問題点）
従来の２端子形圧電共振素子を有する電子部品では、圧
電共振素子と電子回路基板とがカップ端子の長手方向に
並べられているため、長いカップ端子を使う必要がある
。そのため、この電子部品をプリント基板などに取り付
けると、その高さのため大きな取り付はスペースが必要
となる。(Problems to be Solved by the Invention) In conventional electronic components having two-terminal piezoelectric resonant elements, long cup terminals are used because the piezoelectric resonant elements and the electronic circuit board are arranged in the longitudinal direction of the cup terminals. There is a need. Therefore, when this electronic component is attached to a printed circuit board or the like, a large installation space is required due to its height.
それゆえに、この発明の主たる目的は、低背化すること
によって取り付はスペースを小さくすることができる、
２端子形圧電共振素子を有する電子部品を提供すること
である。Therefore, the main purpose of this invention is to reduce the installation space by reducing the height.
An object of the present invention is to provide an electronic component having a two-terminal piezoelectric resonant element.
この発明の他の目的は、電子部品を低背化することがで
き、かつその製造工程を自動化することができる、２端
子形圧電共振素子を有する電子部品を製造する製造方法
を提供することである。Another object of the present invention is to provide a manufacturing method for manufacturing an electronic component having a two-terminal piezoelectric resonant element, which can reduce the height of the electronic component and automate the manufacturing process. be.
（問題点を解決するための手段）
第１発明は、電極を有する圧電共振素子と、この圧電共
振素子を保持するためにその開口が対向するように配置
されるカップ状の保持部を有し、この保持部に圧電共振
素子の電極が電気的に接続される１対のカップ端子と、
この１対のカップ端子の保持部の外側面に電気的に接続
される任意の回路を構成した回路基板と、この回路基板
に電気的に接続される端子とを含む、２端子形圧電共振
素子を有する電子部品である。(Means for Solving the Problems) The first invention includes a piezoelectric resonant element having an electrode, and a cup-shaped holding part arranged such that its openings face each other in order to hold the piezoelectric resonant element. , a pair of cup terminals to which electrodes of the piezoelectric resonant element are electrically connected to the holding portion;
A two-terminal piezoelectric resonant element that includes a circuit board that configures an arbitrary circuit that is electrically connected to the outer surface of the holding portion of the pair of cup terminals, and a terminal that is electrically connected to the circuit board. It is an electronic component with
第２発明は、電極を有する圧電共振素子を準備するステ
ップと、カップ状の保持部を有するカップ端子を準備す
るステップと、任意の回路を構成した回路基板を準備す
るステップと、回路基板に電気的に接続するための端子
を準備するステップと、回路基板に端子を電気的に接続
するステップと、圧電共振素子をカップ状の保持部に保
持するステップと、カップ状の保持部と圧電共振素子の
電極とを電気的に接続するステップと、回路基板を保持
部の外側面に電気的に接続するステップとを含む、２端
子形圧電共振素子を有する電子部品の製造方法である。The second invention includes the steps of preparing a piezoelectric resonant element having an electrode, preparing a cup terminal having a cup-shaped holding part, preparing a circuit board configured with an arbitrary circuit, and providing an electrical connection to the circuit board. a step of preparing a terminal for electrical connection to the circuit board, a step of electrically connecting the terminal to the circuit board, a step of holding the piezoelectric resonant element in a cup-shaped holding part, and a step of holding the piezoelectric resonant element in the cup-shaped holding part and the piezoelectric resonant element. This is a method of manufacturing an electronic component having a two-terminal piezoelectric resonant element, including the steps of electrically connecting the circuit board to the electrode of the holding part, and electrically connecting the circuit board to the outer surface of the holding part.
（発明の効果）
この発明によれば、２端子形圧電共振素子を有する電子
部品の低背化を図ることができる。そのため、この電子
部品の取り付はスペースが小さくなる。(Effects of the Invention) According to the present invention, it is possible to reduce the height of an electronic component having a two-terminal piezoelectric resonant element. Therefore, the mounting space for this electronic component is reduced.
また、回路基板が圧電共振素子に沿って一体化されるた
め圧電共振素子の機械的強度が向上する。Furthermore, since the circuit board is integrated along the piezoelectric resonant element, the mechanical strength of the piezoelectric resonant element is improved.
さらに、２端子形圧電共振素子を有する電子部品の製造
方法を用いることによって、低背型の電子部品の製造が
自動化される。Furthermore, by using the method for manufacturing an electronic component having a two-terminal piezoelectric resonant element, manufacturing of a low-profile electronic component is automated.
この発明の上述の目的、その他の目的、特徴および利点
は、図面を参照して行う以下の実施例の詳細な説明から
一層明らかとなろう。The above objects, other objects, features and advantages of the present invention will become more apparent from the following detailed description of embodiments with reference to the drawings.
（実施例）
第１図はこの発明の一実施例を示す斜視図である。この
２端子形圧電共振素子を有する電子部品１０はカップ端
子１２を含む。第２図に示すように、カップ端子１２の
長手方向の一方には、細い棒状のリード部１４が形成さ
れ、他方には断面半円形のカップ状の保持部１６が形成
される。そして、リード部１４と保持部１６との間には
、後述の圧電共振素子を保持するためのストッパ部１８
が形成される。このストッパ部１８は、保持部１６から
延びるリード部１４を折り曲げることによって形成され
る。２つのカップ状の保持部１６の開口は対向し、この
保持部に圧電共振素子２０が保持される。(Embodiment) FIG. 1 is a perspective view showing an embodiment of the present invention. The electronic component 10 having this two-terminal piezoelectric resonant element includes a cup terminal 12 . As shown in FIG. 2, a thin bar-shaped lead portion 14 is formed on one longitudinal side of the cup terminal 12, and a cup-shaped holding portion 16 with a semicircular cross section is formed on the other side. A stopper portion 18 for holding a piezoelectric resonant element, which will be described later, is provided between the lead portion 14 and the holding portion 16.
is formed. This stopper portion 18 is formed by bending the lead portion 14 extending from the holding portion 16. The openings of the two cup-shaped holding parts 16 face each other, and the piezoelectric resonant element 20 is held in these holding parts.
圧電共振素子２０の一方主面には、その一方端から一定
の位置まで電極２２が形成される。同様に、圧電共振素
子２０の他方主面には、その他方端から一定の位置まで
電極２２が形成される。そして、圧電共振素子２０の電
極２２とカップ状の保持部１６とが、たとえばはんだ付
けなどにより電気的に接続される。An electrode 22 is formed on one principal surface of the piezoelectric resonant element 20 from one end to a certain position. Similarly, an electrode 22 is formed on the other main surface of the piezoelectric resonant element 20 from the other end to a certain position. Then, the electrode 22 of the piezoelectric resonant element 20 and the cup-shaped holding part 16 are electrically connected, for example, by soldering.
カップ端子１２の保持部１６外側面には、コンデンサ基
板２４が、たとえばはんだ付けなどにより電気的に接続
される。コンデンサ基板２４は、板状の誘電体の一方主
面の長手方向の両端に１対の電極２６ａ、２６ａが形成
される。また、誘電体の他方主面の中央には、電極２６
ｂが形成される。そして、電極２６ａ、２６ａと１対の
カップ端子１２．１２の保持部１６．１６の外側面とが
電気的に接続される。さらに、コンデンサ基板２４の中
央の電極２６ｂに端子２８が接続される。A capacitor board 24 is electrically connected to the outer surface of the holding portion 16 of the cup terminal 12 by, for example, soldering. The capacitor substrate 24 has a pair of electrodes 26a, 26a formed at both longitudinal ends of one principal surface of a plate-shaped dielectric. Further, an electrode 26 is provided at the center of the other main surface of the dielectric.
b is formed. Then, the electrodes 26a, 26a and the outer surface of the holding portion 16.16 of the pair of cup terminals 12.12 are electrically connected. Further, a terminal 28 is connected to the central electrode 26b of the capacitor substrate 24.
この電子部品１０は、カップ端子１２の長手方向に圧電
共振素子２０とコンデンサ基板２４を並べたものに比べ
て、低背化されている。したがって、この電子部品１０
を装置内に組み込んだとき、その取り付はスペースが小
さくなる。This electronic component 10 has a lower height than one in which the piezoelectric resonant element 20 and the capacitor substrate 24 are arranged in the longitudinal direction of the cup terminal 12. Therefore, this electronic component 10
When incorporated into a device, its installation requires less space.
次に、この２端子形圧電共振素子を有する電子部品の製
造方法を説明する。Next, a method for manufacturing an electronic component having this two-terminal piezoelectric resonant element will be explained.
まず、第３Ａ図に示すように、１対のカップ端子１２と
端子２８とが準備される。１対のカップ端子１２と端子
２８とはフープ３０に一体的に形成される。さらに、圧
電共振素子２０とコンデンサ基板２４とが準備される。First, as shown in FIG. 3A, a pair of cup terminals 12 and terminals 28 are prepared. A pair of cup terminals 12 and terminals 28 are integrally formed in a hoop 30. Furthermore, a piezoelectric resonant element 20 and a capacitor substrate 24 are prepared.
そして、第３Ｂ図に示すように、コンデンサ基板２４の
電極２６ａ、２６ａが、カップ端子１２．１２の保持部
１６．１６の外側面に当てられ、コンデンサ基板２４の
電極２６ｂに端子２８が、たとえばはんだ付けなどによ
り電気的に接続される。次に、第３Ｃ図に示すように、
カップ端子１２．１２の保持部１６．１６に圧電共振素
子２０が挿入される。このとき、圧電共振素子２０はカ
ップ端子１２．１２のストッパ部１８．１８で保持され
る。そして、圧電共振素子２０の電極２２．２２とカッ
プ状の保持部１６．１６とが、たとえばはんだ付けなど
により電気的に接続される。Then, as shown in FIG. 3B, the electrodes 26a, 26a of the capacitor substrate 24 are applied to the outer surface of the holding portion 16.16 of the cup terminal 12.12, and the terminal 28 is placed on the electrode 26b of the capacitor substrate 24, for example. Electrically connected by soldering etc. Next, as shown in Figure 3C,
A piezoelectric resonant element 20 is inserted into the holding part 16.16 of the cup terminal 12.12. At this time, the piezoelectric resonant element 20 is held by the stopper portion 18.18 of the cup terminal 12.12. Then, the electrode 22.22 of the piezoelectric resonant element 20 and the cup-shaped holding portion 16.16 are electrically connected, for example, by soldering.
次に、コンデンサ基板２４の電極２６ａ、２６ａがカッ
プ端子１２．１２の保持部１６．１６外側面に電気的に
接続される。この状態で、第３Ｄ図に示すように、圧電
共振素子２０の一方側面から、加熱して液状になったワ
ックス３２を落とすと、ワックス３２は圧電共振素子２
０の反対側にも回り込んで固化する。第４図に示す従来
の電子部品１では、圧電共振素子４の両側面からワック
スを付着させていたが、第３Ｄ図の場合、圧電共振素子
２０とコンデンサ基板２４との間が狭いため、毛管現象
により圧電共振素子２０の一方側面から、その周囲にワ
ックスを付着させることができる。Next, the electrodes 26a, 26a of the capacitor substrate 24 are electrically connected to the outer surface of the holding portion 16.16 of the cup terminal 12.12. In this state, as shown in FIG. 3D, when the heated and liquid wax 32 is dropped from one side of the piezoelectric resonant element 20, the wax 32 is removed from the piezoelectric resonant element 2.
It also wraps around to the opposite side of 0 and solidifies. In the conventional electronic component 1 shown in FIG. 4, wax was attached to both sides of the piezoelectric resonant element 4, but in the case of FIG. 3D, since the gap between the piezoelectric resonant element 20 and the capacitor substrate 24 is narrow, Due to this phenomenon, wax can be attached to the circumference of the piezoelectric resonant element 20 from one side thereof.
そして、カップ状の保持部１６．圧電共振素子２０およ
びコンデンサ基板２４の周囲には、外装材（図示せず）
が形成される。この外装材には、エポキシ樹脂などの多
孔質の合成樹脂が用いられる。これを加熱することによ
って、合成樹脂は硬化し、ワックス３２は液化して合成
樹脂に吸収される。そのため、この外装材と圧電共振素
子２０との間のワックスの付着していた部分に空洞が形
成される。そして、この空洞が圧電共振素子２０の振動
のための間隙となる。Then, a cup-shaped holding portion 16. An exterior material (not shown) is placed around the piezoelectric resonant element 20 and the capacitor substrate 24.
is formed. This exterior material is made of porous synthetic resin such as epoxy resin. By heating this, the synthetic resin hardens, and the wax 32 is liquefied and absorbed into the synthetic resin. Therefore, a cavity is formed between the exterior material and the piezoelectric resonant element 20 in the area where the wax was attached. This cavity becomes a gap for vibration of the piezoelectric resonant element 20.
次に、ツー１３０からカップ端子１２．１２のリード部
１４．１４および端子２８を切り離して、電子部品１０
が形成される。Next, the lead portion 14.14 of the cup terminal 12.12 and the terminal 28 are cut off from the tool 130, and the electronic component 10.
is formed.
この実施例では、カップ状の保持部１６外側面にコンデ
ンサ基板２４を取り付けたが、抵抗など他の電子部品素
子でもよいし、これらを組み合わせた回路基板を用いる
ことも可能である。また、電気的に接続する方法として
、はんだ付は以外にも導電ペーストなど他の導電性接合
材を用いてもよい。さらに、カップ状の保持部１６は、
断面半円形以外にも、断面「コ」字状や断面「り」字状
など他の形状に形成してもよい。In this embodiment, the capacitor board 24 is attached to the outer surface of the cup-shaped holding part 16, but other electronic components such as resistors may be used, or a circuit board combining these may also be used. Further, as a method for electrically connecting, other than soldering, other conductive bonding materials such as conductive paste may be used. Furthermore, the cup-shaped holding part 16 is
In addition to the semicircular cross section, it may be formed in other shapes such as a "U"-shaped cross section or a "R"-shaped cross section.
第１図はこの発明の一実施例を示す斜視図である。
第２図は第１図実施例に用いられるカップ端子を示す斜
視図である。
第３Ａ図〜第３Ｄ図はこの電子部品を製造する製造方法
を示す斜視図である。
第４図は従来の２端子形圧電共振素子を有する電子部品
の斜視図である。
図において、１０は２端子形圧電共振素子を有する電子
部品、１２はカップ端子、１６はカップ状の保持部、２
０は圧電共振素子、２２は圧電共振素子の電極、２４は
コンデンサ基板、２６ａおよび２６ｂはコンデンサ基板
の電極、２８は端子を示す。
第 １ ｂ＋
曳
第３Ａ図
第３［）Ｌ′ｌFIG. 1 is a perspective view showing an embodiment of the present invention. FIG. 2 is a perspective view showing the cup terminal used in the embodiment shown in FIG. FIGS. 3A to 3D are perspective views showing a manufacturing method for manufacturing this electronic component. FIG. 4 is a perspective view of an electronic component having a conventional two-terminal piezoelectric resonant element. In the figure, 10 is an electronic component having a two-terminal piezoelectric resonant element, 12 is a cup terminal, 16 is a cup-shaped holding part, and 2
0 is a piezoelectric resonant element, 22 is an electrode of the piezoelectric resonant element, 24 is a capacitor substrate, 26a and 26b are electrodes of the capacitor substrate, and 28 is a terminal. No. 1 b+ Tow No. 3A No. 3 [)L'l
Claims (1)
ように配置されるカップ状の保持部を有し、前記保持部
に前記圧電共振素子の前記電極が電気的に接続される１
対のカップ端子、 前記１対のカップ端子の前記保持部の外側面に電気的に
接続される任意の回路を構成した回路基板、および 前記回路基板に電気的に接続される端子を含む、２端子
形圧電共振素子を有する電子部品。 ２ 前記カップ状の保持部、前記圧電共振素子および前
記回路基板の周囲には外装材が形成され、前記圧電共振
素子と前記外装材との間には空洞が形成される、特許請
求の範囲第１項記載の２端子形圧電共振素子を有する電
子部品。 ３ 電極を有する圧電共振素子を準備するステップ、 カップ状の保持部を有するカップ端子を準備するステッ
プ、 任意の回路を構成した回路基板を準備するステップ、 前記回路基板に電気的に接続するための端子を準備する
ステップ、 前記回路基板に前記端子を電気的に接続するステップ、 前記圧電共振素子を前記カップ状の保持部に保持するス
テップ、 前記カップ状の保持部と前記圧電共振素子の前記電極と
を電気的に接続するステップ、および前記回路基板を前
記保持部の外側面に電気的に接続するステップを含む、
２端子形圧電共振素子を有する電子部品の製造方法。 ４ 前記回路基板を前記保持部の外側面に電気的に接続
した後、前記圧電共振素子の周囲にワックス層を形成す
るステップ、 前記カップ状の保持部、前記圧電共振素子および前記回
路基板の周囲に外装材を形成するステップ、および 前記ワックスを前記外装材に吸収させ、前記圧電共振素
子と前記外装材との間に空洞を形成するステップを含む
、特許請求の範囲第３項記載の２端子形圧電共振素子を
有する電子部品の製造方法。[Scope of Claims] 1. A piezoelectric resonant element having an electrode, comprising a cup-shaped holding part arranged such that openings thereof face each other in order to hold the piezoelectric resonant element, the holding part having a cup-shaped holding part that holds the piezoelectric resonant element. 1 to which the electrodes of are electrically connected
a pair of cup terminals, a circuit board configured with an arbitrary circuit electrically connected to the outer surface of the holding portion of the pair of cup terminals, and a terminal electrically connected to the circuit board; An electronic component with a terminal type piezoelectric resonant element. 2. An exterior material is formed around the cup-shaped holding part, the piezoelectric resonant element, and the circuit board, and a cavity is formed between the piezoelectric resonance element and the exterior material. An electronic component comprising the two-terminal piezoelectric resonant element according to item 1. 3. preparing a piezoelectric resonant element having an electrode; preparing a cup terminal having a cup-shaped holding part; preparing a circuit board configured with an arbitrary circuit; preparing a terminal; electrically connecting the terminal to the circuit board; holding the piezoelectric resonant element in the cup-shaped holding part; and connecting the cup-shaped holding part and the electrode of the piezoelectric resonant element. and electrically connecting the circuit board to the outer surface of the holding part,
A method for manufacturing an electronic component having a two-terminal piezoelectric resonant element. 4. Forming a wax layer around the piezoelectric resonant element after electrically connecting the circuit board to the outer surface of the holding part, and forming a wax layer around the cup-shaped holding part, the piezoelectric resonant element, and the circuit board. 3. The two-terminal device according to claim 3, comprising: forming an exterior material on the exterior material; and absorbing the wax into the exterior material to form a cavity between the piezoelectric resonant element and the exterior material. A method for manufacturing an electronic component having a shaped piezoelectric resonant element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21330986A JPS6367908A (en) | 1986-09-10 | 1986-09-10 | Electric parts having two-terminal type piezoelectric resonance element and its production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21330986A JPS6367908A (en) | 1986-09-10 | 1986-09-10 | Electric parts having two-terminal type piezoelectric resonance element and its production |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4124179A Division JPH0817302B2 (en) | 1992-04-16 | 1992-04-16 | Method for manufacturing electronic component having two-terminal piezoelectric resonance element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6367908A true JPS6367908A (en) | 1988-03-26 |
| JPH0533847B2 JPH0533847B2 (en) | 1993-05-20 |
Family
ID=16636999
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21330986A Granted JPS6367908A (en) | 1986-09-10 | 1986-09-10 | Electric parts having two-terminal type piezoelectric resonance element and its production |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6367908A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH032732U (en) * | 1989-05-29 | 1991-01-11 | ||
| JPH0334318U (en) * | 1989-08-09 | 1991-04-04 | ||
| JPH0559955U (en) * | 1992-01-09 | 1993-08-06 | 株式会社村田製作所 | Piezoelectric resonator |
| US5596244A (en) * | 1994-09-13 | 1997-01-21 | Murata Manufacturing Co., Ltd. | Composite electronic component and method of manufacturing the same |
| US5982076A (en) * | 1997-05-28 | 1999-11-09 | Samsung Electro-Mechanics Co., Ltd. | Electronic component involving 2-terminal type piezo-electric device |
| US6310758B1 (en) | 1999-11-12 | 2001-10-30 | Murata Manufacturing Co., Ltd. | Lead terminal and electronic component including lead terminal |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS577226U (en) * | 1980-06-12 | 1982-01-14 | ||
| JPS5994911A (en) * | 1982-11-19 | 1984-05-31 | Matsushita Electric Ind Co Ltd | Manufacture of composite type ceramic resonator |
| JPS59119629U (en) * | 1983-02-01 | 1984-08-13 | 株式会社村田製作所 | Piezoelectric components with terminals |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5428716A (en) * | 1977-08-09 | 1979-03-03 | Furukawa Electric Co Ltd:The | Process for producing electroconductive highly heat-resisting aluminum alloy |
-
1986
- 1986-09-10 JP JP21330986A patent/JPS6367908A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS577226U (en) * | 1980-06-12 | 1982-01-14 | ||
| JPS5994911A (en) * | 1982-11-19 | 1984-05-31 | Matsushita Electric Ind Co Ltd | Manufacture of composite type ceramic resonator |
| JPS59119629U (en) * | 1983-02-01 | 1984-08-13 | 株式会社村田製作所 | Piezoelectric components with terminals |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH032732U (en) * | 1989-05-29 | 1991-01-11 | ||
| JPH0334318U (en) * | 1989-08-09 | 1991-04-04 | ||
| JPH0559955U (en) * | 1992-01-09 | 1993-08-06 | 株式会社村田製作所 | Piezoelectric resonator |
| US5596244A (en) * | 1994-09-13 | 1997-01-21 | Murata Manufacturing Co., Ltd. | Composite electronic component and method of manufacturing the same |
| CN1077729C (en) * | 1994-09-13 | 2002-01-09 | 株式会社村田制作所 | Combined electronical assembly and making of same |
| US5982076A (en) * | 1997-05-28 | 1999-11-09 | Samsung Electro-Mechanics Co., Ltd. | Electronic component involving 2-terminal type piezo-electric device |
| US6310758B1 (en) | 1999-11-12 | 2001-10-30 | Murata Manufacturing Co., Ltd. | Lead terminal and electronic component including lead terminal |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0533847B2 (en) | 1993-05-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |