JPS6362297A - Method of mounting electronic parts - Google Patents
Method of mounting electronic partsInfo
- Publication number
- JPS6362297A JPS6362297A JP20659886A JP20659886A JPS6362297A JP S6362297 A JPS6362297 A JP S6362297A JP 20659886 A JP20659886 A JP 20659886A JP 20659886 A JP20659886 A JP 20659886A JP S6362297 A JPS6362297 A JP S6362297A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- adhesive
- electronic component
- electronic components
- plastic film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title description 21
- 239000000853 adhesive Substances 0.000 description 30
- 230000001070 adhesive effect Effects 0.000 description 30
- 239000002985 plastic film Substances 0.000 description 11
- 229920006255 plastic film Polymers 0.000 description 11
- 239000010408 film Substances 0.000 description 8
- 238000005476 soldering Methods 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 239000003990 capacitor Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229920000728 polyester Polymers 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004831 Hot glue Substances 0.000 description 2
- 239000002174 Styrene-butadiene Substances 0.000 description 2
- 229920006311 Urethane elastomer Polymers 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229920003051 synthetic elastomer Polymers 0.000 description 2
- 239000005061 synthetic rubber Substances 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 241000252185 Cobitidae Species 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000004830 Super Glue Substances 0.000 description 1
- 229910021383 artificial graphite Inorganic materials 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- FGBJXOREULPLGL-UHFFFAOYSA-N ethyl cyanoacrylate Chemical compound CCOC(=O)C(=C)C#N FGBJXOREULPLGL-UHFFFAOYSA-N 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は電子部品の実装方法、特には回路基板と各種電
子部品とをハンダを使用せずに、異方導電性接着剤を用
いて容易にかつ高い信頼度で回路基板に実装する方法に
関するものである。[Detailed Description of the Invention] (Field of Industrial Application) The present invention relates to a method for mounting electronic components, and in particular, a method for easily mounting electronic components on a circuit board and various electronic components using an anisotropic conductive adhesive without using solder. The present invention relates to a method for mounting on a circuit board quickly and with high reliability.
（従来の技術）
近年、電子部品についてはその小型化が急速に進んでお
り、トランジスター、コンデンサー、抵抗器などは数ｍ
角という小さなものが多数を占めるようになってきてい
る。(Conventional technology) In recent years, electronic components have rapidly become smaller, and transistors, capacitors, resistors, etc.
Small objects called horns have come to occupy the majority.
しかし、この電子部品の回路基板への搭載が従来からハ
ンダ付けで行なわれてきていることから、この種の微小
な電子部品の回路基板への搭載にもこのハンダ付は方が
採られており、これにはりフローソルダリング、ディッ
プソルダリングなどのハンダ付は法が採られているが、
このハンダ付は法では電子部品や基板が２００〜３００
℃という高温にさらされることになるので、この電子部
品。However, since this electronic component has traditionally been mounted on a circuit board by soldering, soldering is also the preferred method for mounting this type of minute electronic component on a circuit board. , Although there are laws in place for soldering such as flow soldering and dip soldering,
According to the law, this soldering requires 200~300 yen for electronic parts and boards.
This electronic component will be exposed to high temperatures of ℃.
回路基板には２６０℃に数１０秒は耐える耐熱性が要求
され、これに伴う技術的、コスト的な問題があり、この
解決が要望されている。Circuit boards are required to have heat resistance that can withstand 260° C. for several tens of seconds, and there are technical and cost problems associated with this, and solutions to these problems are desired.
（発明の構成）
本発明はこのような不利を解決した電子部品の実装方法
に関するものであり、これは回路基板と電子部品とを異
方導電性接着剤を用いて接着と同時に電気的に接続した
のち、この電子部品搭載物全体をプラスチックフィルム
で被覆し、該フィルムを回路基板に接着固定してなるこ
とを、特徴とするものである。(Structure of the Invention) The present invention relates to a method for mounting electronic components that solves the above-mentioned disadvantages, and is a method for electrically connecting a circuit board and electronic components at the same time as bonding them using an anisotropic conductive adhesive. After that, the entire electronic component mounting object is covered with a plastic film, and the film is adhesively fixed to the circuit board.
すなわち、本発明者らはハンダ付は法にによらない電子
部品の回路基板への実装方法ついて種々検討した結果、
回路基板と電子部品との接続を異方導電性接着剤を用い
て行なえばこれらが接着と共に電気的に接続されるし、
この電子部品搭載物をプラスチックフィルムで被覆し、
このフィルムを回路基板に接着固定すれば１回路基板に
接着された電子部品搭載物が熱や振動によってゆるむこ
ともなく強固に固定されるので１回路基板への電子部品
の接続がハンダ付けをしなくても容易にかつ高い信頼度
で達成できることを見出して本発明を完成させた。That is, as a result of the inventors' studies on various methods of mounting electronic components on circuit boards, where soldering is not regulated by law,
If the circuit board and electronic components are connected using an anisotropic conductive adhesive, they will be electrically connected together with the adhesive.
This electronic component mounted object is covered with a plastic film,
If this film is adhesively fixed to a circuit board, the electronic components mounted on the circuit board will be firmly fixed without loosening due to heat or vibration, so electronic components can be connected to the circuit board without soldering. The present invention was completed by discovering that it can be achieved easily and with a high degree of reliability even without the above.
本発明の方法で使用される電子部品は公知のものでよく
、これにはトランジスター、リードレスＩＣ，Ｊベント
したリードを有するＩＣなどのほかダイオード、コンデ
ンサー、抵抗器などが例示され、この種類、形状、構造
は任意のものとされる。The electronic components used in the method of the present invention may be of known types, such as transistors, leadless ICs, ICs with J-bent leads, as well as diodes, capacitors, resistors, etc. The shape and structure may be arbitrary.
この電子部品は上記したように異方導電性接着剤によっ
て回路基板に実装されるのであるがこの回路基板も公知
のものでよい。したがってこの回路基板はポリイミド、
ポリエステル、ポリエーテルサルホン、ポリフェニレン
サルファイド、フェノール樹脂などの基板上にスプレー
法や蒸着などで酸化インジウムや酸化すずなどの薄膜を
設けてエツチングで電極を形成させたもの、ニッケル、
アルミニウム、銅、金、銀、白金などの薄膜をとりつけ
、エツチングして電極などを形成させたものとすればよ
いが、背面から熱圧着する場合にはこれは熱伝導の点か
ら薄いものとすることが好ましい。As described above, this electronic component is mounted on a circuit board using an anisotropic conductive adhesive, and this circuit board may also be of a known type. Therefore, this circuit board is made of polyimide,
A thin film of indium oxide or tin oxide is formed by spraying or vapor deposition on a substrate made of polyester, polyether sulfone, polyphenylene sulfide, phenol resin, etc., and then an electrode is formed by etching, nickel,
A thin film of aluminum, copper, gold, silver, platinum, etc. may be attached and etched to form electrodes, but if thermocompression is bonded from the back, this should be thin for thermal conductivity. It is preferable.
本発明の方法はまずこの電子部品と回路基板との接続を
異方導電性接着剤の接着によって行なうのであるが、こ
の異方導電性接着剤は電気絶縁性の接着剤、例えば熱可
塑性ＳＢＲ，エチレン−酢酸ビニル共重合体、ポリエス
テルなどを主剤とする融点が１１０℃以上であるホット
メルト型接着剤、またはエポキシ、ウレタン、合成ゴム
などの電気絶縁性接着剤１００重量部中に、金、銀、ニ
ッケル、アルミニウムなどのような金属粉、人造黒鉛、
どじょう黒鉛などのカーボン粉、カーボン繊維、タング
ステンカーバイド繊維、しんちゅう繊維などの導電性繊
維を５〜３０重量部添加して押圧したときに縦方向には
導通するが横方向には導通がとれない構造としたものと
すればよい。また、この異方導電性接着剤による回路基
板と電子部品との接着は回路基板上に異方導電性接着剤
を塗布するか異方導電性接着剤から作られたフィルムを
載置したのち、この上に電子部品を載置して゛圧着する
か１３０〜１８０℃に加熱すればよく、これによれば回
路基板と異方導電性接着剤とは接着と共に異方導電性接
着剤が縦方向にのみ導通性を示すものであることからこ
の回路基板と電子部品とは電気的にも接続される。In the method of the present invention, the electronic component and the circuit board are first connected by bonding with an anisotropically conductive adhesive, and this anisotropically conductive adhesive is an electrically insulating adhesive such as thermoplastic SBR, Gold, silver, etc. in 100 parts by weight of a hot-melt adhesive with a melting point of 110°C or higher that is based on ethylene-vinyl acetate copolymer, polyester, etc., or an electrically insulating adhesive such as epoxy, urethane, or synthetic rubber. , metal powders like nickel, aluminum etc., artificial graphite,
When 5 to 30 parts by weight of conductive fibers such as carbon powder such as loach graphite, carbon fiber, tungsten carbide fiber, and brass fiber are added and pressed, conduction occurs in the vertical direction but not in the horizontal direction. It may be a structure. In addition, to bond the circuit board and electronic components using this anisotropic conductive adhesive, after applying the anisotropic conductive adhesive on the circuit board or placing a film made from the anisotropic conductive adhesive, Electronic components can be placed on top of this and crimped or heated to 130 to 180°C. According to this method, the circuit board and the anisotropically conductive adhesive are bonded together and the anisotropically conductive adhesive is bonded vertically. Since the circuit board and the electronic component are electrically connected to each other, the circuit board and the electronic component are also electrically connected.
本発明の方法はこのようにして回路基板に接着された電
子部品搭載部をプラスチックフィルムで被覆し、ついで
このフィルムを回路基板に接着固定することによって電
子部品を回路基板に固着させるのであるが、このプラス
チックフィルムは電気絶縁性のものとする必要があるし
、このものは回路基板への接着が好ましくは熱硬化性接
着剤によって行なわれるので少なくとも１００℃の耐熱
性を有するもの、換言すると１００℃以下では大きな熱
変形を起さないものとすることがよいので、ポリエステ
ル、ポリカーボネート、ポリアクリレート、ポリイミド
などで作られたものとすればよいが、このものは実用性
の面から厚さが１゜０〜２００μｍのものとすればよく
、これが柔軟性に富むものであるときにはそのまま使用
すればよいが、硬質、半硬質のものである場合には被覆
すべき電子部品の形状に合せるように予め真空成形、プ
レス成形などで成形したものとすることがく、さらには
電子部品が数ｍ角と非常に小型化しているために精密な
成形金型を使用するプレス成形で成形したものとするこ
とがよい。また、このプラスチックフィルムはこれを電
子部品に当接させてから回路基板に接着するのであるが
、電子部品を保護するためには電子部品との当接部に予
めウレタンゴム、シリコーンゴムなどの合成ゴムから作
られた弾性体を設置しておくことがよく、このようにす
れば電子部品を回路基板に押しつける圧接力が働くので
電子部品のゆるみによる接続不良を防止することができ
る。なお、このプラスチックフィルムの回路基板への接
着は接着剤を用いて行えばよいが、この接着剤としては
異方導電性接着剤で固定した部分を加熱しないというこ
とからシアノアクリレート系のような熱硬化性接着剤ま
たはポリエステルアクリレート系、エポキシアクリレー
ト系、ウレタンアクリレート系などのような紫外線硬化
性のものとすればよい。The method of the present invention covers the electronic component mounting portion bonded to the circuit board with a plastic film, and then adhesively fixes the film to the circuit board, thereby fixing the electronic component to the circuit board. This plastic film needs to be electrically insulating and has a heat resistance of at least 100°C, as the bonding to the circuit board is preferably done by a thermosetting adhesive, i.e. 100°C. In the following, it is best to use a material that does not cause large thermal deformation, so it is best to use a material made of polyester, polycarbonate, polyacrylate, polyimide, etc. However, from the viewpoint of practicality, this material should have a thickness of 1°. The material may have a thickness of 0 to 200 μm. If it is highly flexible, it can be used as is, but if it is hard or semi-hard, it may be vacuum formed or molded in advance to match the shape of the electronic component to be coated. It is difficult to use press molding or the like, and furthermore, since electronic parts are extremely small, measuring several meters square, it is preferable to use press molding using a precision mold. In addition, this plastic film is bonded to the circuit board after it is brought into contact with the electronic components, but in order to protect the electronic components, synthetic rubber such as urethane rubber or silicone rubber is first applied to the contact area with the electronic components. It is best to install an elastic body made of rubber, which will apply a pressure force that presses the electronic components against the circuit board, thereby preventing connection failures due to loosening of the electronic components. Note that this plastic film can be bonded to the circuit board using an adhesive, but as this adhesive does not heat the part fixed with an anisotropic conductive adhesive, it is recommended to use a heat-resistant adhesive such as a cyanoacrylate adhesive. A curable adhesive or an ultraviolet curable adhesive such as polyester acrylate, epoxy acrylate, or urethane acrylate may be used.
つぎに本発明の方法を添付の図面にもとすいて説明する
が、第１図〜第７図は本発明の方法における各工程の縦
断面図を示したものである。第１図はポリイミドのよう
な絶縁性基板２の上に銅箔を載置し、エツチングによっ
て回路３を形成させた回路基板上を示したものであるが
、この回路基板上には第２図に示したように例えば熱可
塑性ＳＢＲを主剤とするホットメルト型接着剤にニッケ
ル粉を２０重量％混合して作った異方導電性接着剤４が
塗布される。ついでこれには第３図に示したようにトラ
ンジスター５またはコンデンサー６のような電子部品が
搭載されるが、このものはホットメルト接着剤が接着作
用を呈する温度、例えば１５０℃に加熱すると共に上部
からこれを押圧すると回路基板上上の回路３と電子部品
５．６とがこの接着剤によって接着されると共に、この
接着剤が異方導電性のものであることから電気的にも接
続される。 また、第４図はこの発明の方法に使用され
るプラスチックフィルムを示したものであるが、これは
例えばポリエチレンテレフタレートからなるフィルムシ
ート７の上にシリコーンゴム製のゴム状弾性体８を印刷
したものとされる。Next, the method of the present invention will be explained with reference to the accompanying drawings, and FIGS. 1 to 7 show longitudinal cross-sectional views of each step in the method of the present invention. Figure 1 shows a circuit board in which a copper foil is placed on an insulating substrate 2 such as polyimide and a circuit 3 is formed by etching. As shown in FIG. 3, an anisotropically conductive adhesive 4 made by mixing 20% by weight of nickel powder with a hot melt adhesive mainly composed of thermoplastic SBR, for example, is applied. Electronic components such as a transistor 5 or a capacitor 6 are then mounted on this as shown in FIG. When this is pressed, the circuit 3 on the circuit board and the electronic component 5.6 are bonded by this adhesive, and since this adhesive is anisotropically conductive, they are also electrically connected. . FIG. 4 shows a plastic film used in the method of the present invention, which is made by printing a rubber-like elastic body 8 made of silicone rubber on a film sheet 7 made of polyethylene terephthalate, for example. It is said that
しかして、このフィルム７は上記した第３図に示した電
子部品の実装構造体を被覆するものであることから、こ
の実装構造体を被覆するために予め第５図に示したよう
にプレス成形によって、成形したものとされるが、この
ものはさらに回路基板との接着のために第６図に示した
ようにその脚部に接着剤９が塗布される。Since this film 7 is intended to cover the electronic component mounting structure shown in FIG. 3, it is press-formed in advance as shown in FIG. This product is molded according to the method described above, and an adhesive 9 is further applied to the leg portions of this product as shown in FIG. 6 in order to bond it to the circuit board.
本発明の方法はこのようにして準備された、成形され、
接着剤の塗布された第６図に示されたフィルム７を第３
図に示された電子部品の実装構造体の上に第７図に示し
たように載置し、ついでこの接着剤９を加熱してこれを
回路基板上に接着させればよく、これによれば異方導電
性接着剤４で回路３と接着し、電気的にも接続されてい
る電子部品５．６がこのフィルム７によって回路基板↓
に強固に固着されるので、この電子部品を容易にかつ高
い信頼度で回路基板に実装することができるという工業
的な有利性が与えられる。The method of the present invention is thus prepared, shaped,
The adhesive coated film 7 shown in FIG.
It is sufficient to place the electronic components on the electronic component mounting structure shown in the figure as shown in FIG. 7, and then heat the adhesive 9 to bond it onto the circuit board. In this case, the electronic components 5 and 6, which are bonded to the circuit 3 with an anisotropic conductive adhesive 4 and are electrically connected, are attached to the circuit board ↓ by this film 7.
This provides an industrial advantage in that the electronic component can be easily and reliably mounted on a circuit board.
第１図〜第７図は本発明方法の各工程の縦断面図を示し
たものであり、第１図は本発明に使用される回路基板の
縦断面図、第２図はこれに異方導電性接着剤を塗布した
もの、第３図はこれに電子部品を実装したものの縦断面
図、第４図は本発明の方法に使用されるプラスチックフ
ィルムの縦断面図、第５図はこれをプレス成形したもの
、第６図はこれに接着剤を塗布したものの縦断面図、第
７図は本発明の方法で得られた回路基板に電子部品を実
装した構造体の縦断面図を示したものである。
１ ・・・回路基板、 ２・・・絶縁性基板、
３・・・回路、 ４・・・異方導電性接着
剤、５・・・トランジスター、 ６・・・コンデンサ
ー、７・・・プラスチックフィルム、
８・・・ゴム状弾性体、 ９・・・接着剤。
特許出願人 信越ポリマー株式会社
第４図
第５図
第６図
第７図Figures 1 to 7 show longitudinal cross-sectional views of each step of the method of the present invention. Figure 1 is a vertical cross-sectional view of a circuit board used in the present invention, and Figure 2 is an anisotropic view thereof. Figure 3 is a vertical cross-sectional view of a plastic film coated with a conductive adhesive and electronic components mounted thereon, Figure 4 is a vertical cross-sectional view of a plastic film used in the method of the present invention, and Figure 5 is a vertical cross-sectional view of a plastic film used in the method of the present invention. Fig. 6 shows a longitudinal cross-sectional view of a press-molded product, and Fig. 7 shows a longitudinal cross-sectional view of a structure obtained by the method of the present invention, in which electronic components are mounted on a circuit board. It is something. 1...Circuit board, 2...Insulating board,
3... Circuit, 4... Anisotropic conductive adhesive, 5... Transistor, 6... Capacitor, 7... Plastic film, 8... Rubber-like elastic body, 9... Adhesion agent. Patent applicant Shin-Etsu Polymer Co., Ltd. Figure 4 Figure 5 Figure 6 Figure 7
Claims (1)
接着と同時に電気的に接続したのち、この電子部品搭載
物全体をプラスチックフィルムで被覆し、該フィルムを
回路基板に接着固定してなることを特徴とする電子部品
の実装方法。 ２、異方導電性接着剤が熱接着型のものである特許請求
の範囲第１項記載の電子部品の実装方法。 ３、プラスッチクフイルムを熱硬化型または紫外線硬化
型の接着剤で接着固定する特許請求の範囲第１項記載の
電子部品の実装方法。 ４、プラスッチクフィルムが内面に弾性体を設置したも
のである特許請求の範囲第１項記載の電子部品の実装方
法。[Claims] 1. After bonding and electrically connecting the circuit board and electronic components using an anisotropic conductive adhesive, the entire electronic component mounting object is covered with a plastic film, and the film is A method for mounting electronic components, characterized by adhesively fixing them to a circuit board. 2. The electronic component mounting method according to claim 1, wherein the anisotropic conductive adhesive is of a thermal adhesive type. 3. The electronic component mounting method according to claim 1, wherein the plastic film is adhesively fixed with a thermosetting or ultraviolet curing adhesive. 4. The electronic component mounting method according to claim 1, wherein the plastic film has an elastic body installed on its inner surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20659886A JPS6362297A (en) | 1986-09-02 | 1986-09-02 | Method of mounting electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20659886A JPS6362297A (en) | 1986-09-02 | 1986-09-02 | Method of mounting electronic parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6362297A true JPS6362297A (en) | 1988-03-18 |
Family
ID=16526045
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20659886A Pending JPS6362297A (en) | 1986-09-02 | 1986-09-02 | Method of mounting electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6362297A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002019783A1 (en) * | 2000-08-29 | 2002-03-07 | Fujitsu Limited | Circuit board unit and method of manufacture thereof |
| JP2012195615A (en) * | 2012-07-10 | 2012-10-11 | Denso Corp | Electronic apparatus |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5630788A (en) * | 1979-08-22 | 1981-03-27 | Tokyo Shibaura Electric Co | Device for mounting chip element |
| JPS61168996A (en) * | 1985-01-22 | 1986-07-30 | 松下電器産業株式会社 | Semiconductor device |
-
1986
- 1986-09-02 JP JP20659886A patent/JPS6362297A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5630788A (en) * | 1979-08-22 | 1981-03-27 | Tokyo Shibaura Electric Co | Device for mounting chip element |
| JPS61168996A (en) * | 1985-01-22 | 1986-07-30 | 松下電器産業株式会社 | Semiconductor device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002019783A1 (en) * | 2000-08-29 | 2002-03-07 | Fujitsu Limited | Circuit board unit and method of manufacture thereof |
| JP2012195615A (en) * | 2012-07-10 | 2012-10-11 | Denso Corp | Electronic apparatus |
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