JPS6347803A - Sequence controller - Google Patents

Abstract

PURPOSE:To make a fast response without the intervention of a CPU by controlling the sequence of wire bonding by a target time arrival event generating circuit, a Z-axial target position arrival even generating circuit, and a conductor circuit which has an event selector and a counter. CONSTITUTION:A CPU 1 transfers wire bonding sequence data to a RAM 8, the counter 17 is reset, and a RAM address is set to zero. Then, RAM data in an address zero is held in respective latches 9, 10, and 13. On-off control over the start of a shaft, a dumper, a clamper, etc., is performed according to the data in the latch 9. The event selector 16 selects events generated by comparators 12 and 15 and the counter 17 counts up in response to event generation to transfer RAM data in a next address to the latches 9, 10, and 13. Thus, the sequence is advanced without the intervention of the CPU 1.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a sequence control device that controls the bonding sequence of a wire bonding device.

[Conventional technology]

FIG. 4 is a system diagram of the wire bonder control section shown, for example, in the magazine "Automation", Vol. 26, No. 4, page 41. In FIG. 4, 1 is a control CPU, 2X,
2Y, 2Z are axis control hardware for the x, y, and z axes, 3 is an axis drive motor, 4 is a CPU bus, 5 is on/off control drive hardware for controlling dampers, clampers, etc.
6 is an input interface such as a bottom detection limit switch.

Next, the operation will be explained using the z-axis as an example. The wire bonding sequence is stored in the CPUI in the form of a program, and when driving the axis, the axis control hardware 2
Data is set in Z, and data is set in the on/off control drive hardware 5 when controlling dampers, clampers, etc. During bonding, the CPU reads data from the input interface 6 and the Z-axis control hardware 2Z, and controls the wire bonding sequence based on whether the bottom surface has been detected or the Z-axis position has reached the target value. do.

[Problem that the invention seeks to solve]

Since the conventional sequence control device is configured as described above, the CPU must always work for sequence control during bonding, and a complicated program is required to perform axis control correction calculations for bonding band deviation. However, since the sequence is progressed by software, there were problems such as the inability to provide high-speed response.

The present invention has been made in view of these points, and its purpose is to control the wire bonding sequence with hardware, relieve the CPU from the task of sequence control, enable high-speed response, and achieve even higher speeds. The object of the present invention is to obtain a sequence control device capable of high-speed bonding.

[Means for solving problems]

In order to achieve such an object, the present invention includes a RAM that stores wire bonding sequence control data, a target time arrival event generation circuit that generates an event of reaching a target time, and a circuit that generates an event of reaching a Z-axis target position. Z
The conductor circuit of the device is provided with an axis target position arrival event generation circuit, an event selector that selects the target time arrival event and the Z-axis target position arrival event, and a counter that adds a RAM address each time an event occurs. It is.

[Effect]

In the present invention, after the bonding start command,
Control sequences without CPU intervention.

〔Example〕

An embodiment of a sequence control device according to the present invention is shown in FIG. In FIG. 1, 7 is a conductor circuit that controls the wire bonding sequence. In FIG. 1, the same or equivalent parts as in FIG. 4 are given the same reference numerals. The conductor circuit 7 outputs a start signal al, a position pulse a2, and a positioning completion signal a3.

Figure 2 shows the inside of the conductor circuit 7. In Figure 2, 8 is a RAM for storing wire bonding sequence data, 9 is a latch for axis start signals and drive signals for dampers, clampers, etc., and 10 is a target time latch. ,1
1 is a timer, 12 is a timer comparator that compares the target time and the counting time of timer 11, 13 is a latch for the Z-axis target position, 14 is a Z-axis position counter, and 15 is a Z-axis that is counted as the Z-axis target position. Z-axis position comparator for comparing with the axis position, 16
is an event selector that selects an event, and 17 is a RAM
A counter 18 increments an address every time an event occurs, and 18 is an event signal line. Also, latch 10. timer 11
．． The comparator 12 constitutes a target time reaching event generation circuit, and the latch 13. Counter 14. The comparator 15 constitutes a Z-axis target position arrival event generation circuit.

Next, the operation of the conductor circuit 7 will be explained.

Transfer the wire bonding sequence data from the CPUI to the RAM 8 and set the RAM address to O. RAM data at address 0 is held in each latch 9, 10.13. The launch 9 data controls the start of the axis and the on/off of dampers, clampers, and the like. The event selector 16 selects an event generated from the comparator 12.15, and upon occurrence of this event, the counter 17 is incremented, and the RAM data at the next address is latched to the latch 9.1.
Transferred to 0.13. In this way the sequence is
If the process progresses without the intervention of the CPU and CPU control is required, the event selector 16 requests inclusion by included request b when an event occurs based on RAM data, and sequence control by the CPU can be performed.

In the above embodiment, the Z-axis absolute position is one of the event occurrences, but if this part is configured as shown in FIG.
The height from the bottom of the axis can be used as an event. In FIG. 3, 19 is a launcher that holds the bottom position set by the CPU 1, and 20 is a subtracter that subtracts the bottom position from the Z-axis absolute position. If this configuration is used, by setting the latest bottom surface position in the latch 19, an event can be generated at an accurate height from the bottom surface.

〔Effect of the invention〕

As explained above, the present invention controls a wire bonding sequence using a conductor circuit having a target time arrival event generation circuit, a Z-axis target position arrival event generation circuit, an event selector, and a counter.
Since the wire bonding sequence can be controlled without the intervention of effective.

[Brief explanation of drawings]

Fig. 1 is a system diagram showing an embodiment of the sequence system ff1I device according to the present invention, Fig. 2 is a system diagram showing a conductor circuit that constitutes the device in Fig. 1, and Fig. 3 is a diagram showing the Z-axis target position arrival event. FIG. 4 is a system diagram showing another example of a generating circuit. FIG. 4 is a system diagram showing a conventional sequence control device. 1...CPU, 2X, 2Y, 2Z...axis control hardware, 3...axis drive motor, 7...conductor circuit.

Claims (2)

[Claims] (1) A conductor circuit that controls the wire bonding sequence is provided, and this conductor circuit includes a RAM that stores wire bonding sequence control data, a target time arrival event generating circuit that generates an event of reaching the target time, and a Z-axis target position It has a Z-axis target position arrival event generation circuit that generates an event of arrival, an event selector that selects an event of reaching the target time and a Z-axis target position arrival event, and a counter that adds a RAM address each time an event occurs. , a sequence control device characterized in that the sequence is advanced according to an event selected by the event selector. (2) The sequence control device according to claim 1, wherein the Z-axis target position is a relative position from a bottom surface position.