JPS6338856B2 - - Google Patents
Info
- Publication number
- JPS6338856B2 JPS6338856B2 JP56089495A JP8949581A JPS6338856B2 JP S6338856 B2 JPS6338856 B2 JP S6338856B2 JP 56089495 A JP56089495 A JP 56089495A JP 8949581 A JP8949581 A JP 8949581A JP S6338856 B2 JPS6338856 B2 JP S6338856B2
- Authority
- JP
- Japan
- Prior art keywords
- feedthrough capacitor
- laminate
- chip
- ground conductor
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 45
- 239000003990 capacitor Substances 0.000 claims description 30
- 239000002131 composite material Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims 1
- 230000002265 prevention Effects 0.000 claims 1
- 239000000843 powder Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
【発明の詳細な説明】
本発明はチツプ型複合貫通コンデンサに関す
る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a chip type composite feedthrough capacitor.
従来の貫通コンデンサは針金状の芯導体（電
極）とその周りを円筒状に取囲む接地導体（電
極）とから成る。このような貫通コンデンサの製
造は、中心孔を有する円柱状誘電体に芯導体を貫
通固定し、また円柱状誘電体の周りに金属円筒を
嵌合固定させることにより行われていた。しかし
ながら、このような構造の貫通コンデンサは単一
の貫通コンデンサとしてしか役立たず、複合化し
たしかも小型の貫通コンデンサは提供されていな
い。 A conventional feedthrough capacitor consists of a wire-shaped core conductor (electrode) and a cylindrical ground conductor (electrode) surrounding the core conductor (electrode). Such feedthrough capacitors have been manufactured by fixing a core conductor through a cylindrical dielectric having a center hole, and fitting and fixing a metal cylinder around the cylindrical dielectric. However, a feedthrough capacitor having such a structure serves only as a single feedthrough capacitor, and a combined and small-sized feedthrough capacitor has not been provided.
本発明は従来の方式による貫通コンデンサとは
全く異つた着想の貫通コンデンサを提供すること
を目的とする。複数の貫通電極（内部電極）を用
いる場合にはそれに対応した数の外部端子が必要
になる。貫通コンデンサを小型化（チツプ化）す
ると、外部端子の間隔が接近して来るから、貫通
コンデンサを塔載すべきプリント配線基板への半
田づけの際に内部電極相互の短絡が生じる可能性
がある。本発明ではこの対策も講じてある。 An object of the present invention is to provide a feedthrough capacitor having a concept completely different from that of conventional feedthrough capacitors. When using a plurality of through electrodes (internal electrodes), a corresponding number of external terminals are required. When a feedthrough capacitor is miniaturized (chip-ized), the distance between the external terminals becomes closer, which may cause a short circuit between the internal electrodes when soldering to the printed wiring board on which the feedthrough capacitor is mounted. . The present invention also takes measures against this problem.
簡単に述べると、本発明は積層型の貫通コンデ
ンサを提供する。本発明の貫通コンデンサは誘電
体層の間に複数本の並行する内部電極を介在させ
た焼結体と、その焼結体の表面に前記内部電極の
方向とは直交又は斜交する向きに延びる接地電極
層と、前記内部電極と接続するように積層焼結体
の外面に形成された外部端子層とから成るチツプ
型複合貫通コンデンサであり、焼結体の外面のう
ち外部端子間には溝が形成されて半田によるブリ
ツジが生じるのを防止する。本発明は上記の構成
により複数の貫通電極を単一小型部品に設けるこ
とを可能にした。さらに、製造上も従来の観念を
全く破つた積層法で貫通コンデンサを製造するか
ら印刷や積層ですべての部分が形成でき、工程の
大量生産化を可能にするなど、多くの利益が得ら
れる。なお、RFカツプリングを防止するための
対策としてＬ字形金具を付設することも本発明の
範囲内で可能である。 Briefly stated, the present invention provides a multilayer feedthrough capacitor. The feedthrough capacitor of the present invention includes a sintered body in which a plurality of parallel internal electrodes are interposed between dielectric layers, and a surface of the sintered body that extends in a direction perpendicular or oblique to the direction of the internal electrodes. This is a chip-type composite feedthrough capacitor consisting of a ground electrode layer and an external terminal layer formed on the outer surface of a laminated sintered body so as to be connected to the internal electrode, and a groove is formed between the external terminals on the outer surface of the sintered body. is formed to prevent bridging caused by solder. The present invention has made it possible to provide a plurality of through electrodes in a single small component with the above configuration. Furthermore, since feedthrough capacitors are manufactured using a lamination method that completely breaks with conventional concepts, all parts can be formed by printing or lamination, making it possible to mass-produce the process, and many other benefits can be obtained. Note that it is also possible within the scope of the present invention to attach an L-shaped metal fitting as a measure to prevent RF coupling.
以下図を参照して本発明の実施例を詳しく説明
する。第１図から第８図は本発明の第１実施例を
示し、第９図から第１４図は第２実施例を示し、
第１５図はプリント配線基板への取付けを示す。 Embodiments of the present invention will be described in detail below with reference to the drawings. 1 to 8 show a first embodiment of the present invention, and FIGS. 9 to 14 show a second embodiment,
FIG. 15 shows attachment to a printed wiring board.
先ず第１図のように長方形の誘電体シート１を
用意する。誘電体シート１はTiO2、BaTiO3等の
誘電体粉末を適当なバインダーでペースト化した
ものをシート状に延ばした、または印刷したもの
である。次に第２図のように枝３，４のある中心
導体２を印刷する。接地導体２はPd、Pd−Agな
どの金属粉末をペースト化したものから印刷する
ことにより製作することができる。接地導体に枝
３，４を形成するのは、プリント配線基板上で任
意の位置から接地導体への接続を行うためであ
り、枝部分は必ずしも必要でない。次に第３図の
ように誘電体シート１及び接地導体２の全面に第
２の誘電体シート５を積層し、さらにその上に第
４図のように中心導体６，７，８接地導体２と同
様な導電ペーストから形成する。これらの中心導
体は、接地導体２と一部重畳して容量を形成する
ようになつていると共に、枝３，４には重畳しな
いで互にずれるように位置づけられている。次に
第５図に示すように積層体の全面に誘電体シート
９を積層する。第６図の工程に移つて積層体の周
辺に溝ないし凹所１０及び隅部切欠き１１を形成
する。なお必要に応じて第５図と第６図の工程の
間に第２図で示した接地導体と同様の接地導体を
追加しても良い。溝１０は中心導体６，７，８の
両端の中間部分にあつて、接地導体の枝３，４の
端部を露出させている。切欠き１１は接地導体２
の左右両端の露出端と中心導体６，８の上下両端
の露出端との間を隔離している。このようにして
得た積層体の周辺には、接地導体２の左右両端、
その枝３，４の上下両端、中心導体６，７，８の
上下両端が露出されている。この積層体を次に焼
成炉に装入して所定の高温度及び所定の時間焼成
することにより、一体的な焼結体を得る。最後に
第７図のように、接地導体２の両端に接続する外
部端子ｄ，ｅ、枝３，４に接続する外部端子ｆ，
ｇ、中部導体６，７，８の両端に接続する外部端
子aa′，bb′，cc′を導電ペースト（Cu、Ag、Ni等
の金属粉末ペースト）の低温焼付けで形成して本
発明のチツプ型複合貫通コンデンサを得る。この
等価回路は第８図に示される。 First, a rectangular dielectric sheet 1 is prepared as shown in FIG. The dielectric sheet 1 is made by pasting dielectric powder such as TiO 2 or BaTiO 3 with a suitable binder and then stretching or printing it into a sheet. Next, the center conductor 2 with branches 3 and 4 is printed as shown in FIG. The ground conductor 2 can be manufactured by printing a paste of metal powder such as Pd or Pd-Ag. The reason for forming the branches 3 and 4 on the ground conductor is to connect to the ground conductor from any position on the printed wiring board, and the branch portions are not necessarily necessary. Next, as shown in FIG. 3, a second dielectric sheet 5 is laminated on the entire surface of the dielectric sheet 1 and the ground conductor 2, and on top of that, as shown in FIG. It is formed from the same conductive paste. These center conductors partially overlap the ground conductor 2 to form a capacitance, and are positioned so as not to overlap the branches 3 and 4 but to be offset from each other. Next, as shown in FIG. 5, a dielectric sheet 9 is laminated over the entire surface of the laminate. Moving to the step shown in FIG. 6, grooves or recesses 10 and corner notches 11 are formed around the laminate. If necessary, a ground conductor similar to the ground conductor shown in FIG. 2 may be added between the steps shown in FIGS. 5 and 6. The groove 10 is located in the middle between the ends of the center conductors 6, 7, 8 and exposes the ends of the branches 3, 4 of the ground conductor. Notch 11 is ground conductor 2
The left and right exposed ends of the center conductors 6 and 8 are isolated from the upper and lower exposed ends of the center conductors 6 and 8. Around the laminate obtained in this way, both left and right ends of the ground conductor 2,
The upper and lower ends of the branches 3 and 4 and the upper and lower ends of the center conductors 6, 7, and 8 are exposed. This laminate is then charged into a firing furnace and fired at a predetermined high temperature for a predetermined time to obtain an integral sintered body. Finally, as shown in Fig. 7, external terminals d and e are connected to both ends of the ground conductor 2, external terminals f are connected to branches 3 and 4,
g. External terminals aa', bb', cc' connected to both ends of the middle conductors 6, 7, 8 are formed by low-temperature baking of conductive paste (metal powder paste such as Cu, Ag, Ni, etc.) to form the chip of the present invention. type composite feedthrough capacitor is obtained. This equivalent circuit is shown in FIG.
以上のように構成したから、本貫通コンデンサ
は１個の部品で複数の貫通コンデンサの役割を果
すことができる。さらに、溝または凹所１０及び
切欠き１１が形成されているために、外部端子
ａ，ｂ，ｃ，a′，b′，c′の群と、外部端子ｄ，ｅ，
ｆ，ｇの群とは機械的に隔離されるため、貫通コ
ンデンサをプリント基板へ取付ける際の半田は隣
接端子間をブリツジするおそれがなくなる。な
お、本例では接地導体引出しのための端子ｆ，ｇ
を用いたが、第２図で示した枝３，４を省略し、
単に凹部１０とし、また外部端子ｆ，ｇを省略す
ることも可能である。 With the structure as described above, this feedthrough capacitor can serve as a plurality of feedthrough capacitors with one component. Further, since the grooves or recesses 10 and the notches 11 are formed, the groups of external terminals a, b, c, a', b', c' and the external terminals d, e,
Since it is mechanically isolated from groups f and g, there is no risk of solder bridging between adjacent terminals when attaching the feedthrough capacitor to a printed circuit board. In addition, in this example, terminals f and g for drawing out the ground conductor
was used, but branches 3 and 4 shown in Fig. 2 were omitted,
It is also possible to simply provide the recess 10 and omit the external terminals f and g.
本発明の第２実施例を第９図以下に示す。第９
図のように長方形の誘電体シート１２を先ず用意
し、その面に第１０図のように中心導体１３，１
４，１５を印刷する。次に長方形の誘電体シート
１６を積層し、さらに多数の溝１７を形成する。
溝１７は中心導体の部分を避けた位置で積層体の
周辺に形成されている。この積層体は次に焼成さ
れて焼結体となる。中心導体１３，１４，１５が
上下の辺に露出しているから、これに外部端子１
８，１９，２０をそれぞれ焼付ける。外部端子は
例えばAg、Cu、Ni、Sn等の粉末ペーストの焼付
けまたはこれらの金属によるメツキにより形成す
る。また中心導体１３，１４，１５と交差する方
向に接地導体２１を同様な導電ペーストの焼付け
またはメツキで形成し、必要に応じてさらに接地
導体２１から枝部分２２，２３、或いは両端接続
端子２４，２５などを同時に形成する。第１２図
はこうして完成したチツプ型複合貫通コンデンサ
の平面図であり、第１３図は端面図である。接地
電極は必要な容量に応じて裏面側にも形成しうる
ことは第１３図に示される通りである。等価回路
は第１４図に示されている。本実施例の貫通コン
デンサもまた、チツプ型小型であり、単一部品中
に複数の中心導体（電極）を有し、全体が一体的
で強固であり、また中心導体間及びそれらと接地
導体間の凹部ないし溝により、半田によるブリツ
ジが回避できるなどの利益を提供する。 A second embodiment of the present invention is shown in FIG. 9 and below. 9th
First, a rectangular dielectric sheet 12 is prepared as shown in the figure, and center conductors 13 and 1 are placed on its surface as shown in FIG.
Print 4,15. Next, rectangular dielectric sheets 16 are laminated, and a large number of grooves 17 are further formed.
The groove 17 is formed around the laminate at a position avoiding the center conductor. This laminate is then fired to become a sintered body. Since the center conductors 13, 14, and 15 are exposed on the upper and lower sides, connect the external terminals 1 to them.
8, 19, and 20 respectively. The external terminals are formed, for example, by baking a powder paste of Ag, Cu, Ni, Sn, etc., or by plating with these metals. In addition, a ground conductor 21 is formed by baking or plating a similar conductive paste in the direction intersecting the center conductors 13, 14, 15, and if necessary, branch parts 22, 23 or both end connecting terminals 24, 25 etc. are formed at the same time. FIG. 12 is a plan view of the chip-type composite feedthrough capacitor thus completed, and FIG. 13 is an end view. As shown in FIG. 13, the ground electrode can also be formed on the back side depending on the required capacity. The equivalent circuit is shown in FIG. The feedthrough capacitor of this example is also a small chip type, has multiple center conductors (electrodes) in a single component, is integral and strong as a whole, and has connections between the center conductors and between them and the ground conductor. The recesses or grooves provide benefits such as avoiding bridging due to solder.
第１５図はプリント基板へ本発明の貫通コンデ
ンサを取付けた様子を示す。２６は絶縁基板、２
７はその表面の銅箔配線パターン、２８は貫通コ
ンデンサを導体パターン２７へ固着し且つ電気接
続する半田である。中心導体はプリント基板２６
の平面の方向へ延びている。この場合、RF周波
数が入力側と出力側でカツプリングを起すのを防
止するために、アングル形の金属板２９及び３０
を接地導体から起立させることができる。 FIG. 15 shows how the feedthrough capacitor of the present invention is attached to a printed circuit board. 26 is an insulating substrate, 2
7 is a copper foil wiring pattern on the surface thereof, and 28 is solder for fixing the feedthrough capacitor to the conductor pattern 27 and electrically connecting it. The center conductor is the printed circuit board 26
extends in the direction of the plane of In this case, in order to prevent the RF frequency from coupling between the input and output sides, the angled metal plates 29 and 30 are
can be raised from the ground conductor.
第１図から第７図は本発明の第１実施例による
貫通コンデンサの製造工程と構造を示す平面図、
第８図は同等価回路図、第９図から第１２図は本
発明の第２実施例による貫通コンデンサの製造工
程と構造を示す平面図、第１３図は同貫通コンデ
ンサの端面図、第１４図は同等価回路図、及び、
第１５図は本発明の貫通コンデンサをプリント基
板へ取付けた様子を示す部分断面図である。図中
主な部分は次の通り。
１，５，９：誘電体シート、２：接地導体、
３，４：枝、６，７，８：中心導体、１０：溝、
１１：切欠き、ａ，a′，ｂ，b′，ｃ，c′，ｄ，ｅ，
ｆ，ｇ：外部端子、１２，１６：誘電体シート、
１３，１４，１５：中心導体、２１：接地導体、
２２，２３：枝、２４，２５：端子、１８，１
９，２０：外部端子、１７：溝又は凹所。
1 to 7 are plan views showing the manufacturing process and structure of a feedthrough capacitor according to a first embodiment of the present invention;
8 is an equivalent circuit diagram, FIGS. 9 to 12 are plan views showing the manufacturing process and structure of the feedthrough capacitor according to the second embodiment of the present invention, FIG. 13 is an end view of the feedthrough capacitor, and FIG. The figure shows an equivalent circuit diagram and
FIG. 15 is a partial sectional view showing how the feedthrough capacitor of the present invention is attached to a printed circuit board. The main parts in the diagram are as follows. 1, 5, 9: dielectric sheet, 2: ground conductor,
3, 4: Branch, 6, 7, 8: Center conductor, 10: Groove,
11: Notch, a, a', b, b', c, c', d, e,
f, g: external terminal, 12, 16: dielectric sheet,
13, 14, 15: center conductor, 21: ground conductor,
22, 23: Branch, 24, 25: Terminal, 18, 1
9, 20: External terminal, 17: Groove or recess.
Claims (1)
とともに前記内部導体と交差する方向に誘電体シ
ートを介して接地導体を設けて積層体を構成し、
該積層体の周辺には、前記内部導体の両端に接続
する外部端子を設けるとともに前記外部端子間に
は溝を有している、チツプ型複合貫通コンデン
サ。 ２ 接地導体は積層体の周辺の溝へ引出されてい
る枝を含んでいる特許請求の範囲第１項に記載の
チツプ型複合貫通コンデンサ。 ３ 接地導体は積層体の周辺へ引出された枝を含
んでおり、溝は前記枝と中心導体の外部端子との
間に設けられている特許請求の範囲第１項記載の
チツプ型複合貫通コンデンサ。 ４ 表面に起立した板状金具を有する、RFカツ
プリング防止効果を有する特許請求の範囲第１、
２又は３項記載のチツプ型複合貫通コンデンサ。[Scope of Claims] 1. A laminate is constructed by laminating a dielectric sheet and a plurality of internal conductors, and providing a ground conductor via the dielectric sheet in a direction intersecting the internal conductors,
A chip-type composite feedthrough capacitor, wherein external terminals connected to both ends of the internal conductor are provided around the laminate, and a groove is provided between the external terminals. 2. The chip-type composite feedthrough capacitor according to claim 1, wherein the ground conductor includes a branch extending into a groove around the laminate. 3. The chip type composite feedthrough capacitor according to claim 1, wherein the grounding conductor includes a branch drawn out to the periphery of the laminate, and the groove is provided between the branch and the external terminal of the center conductor. . 4. Claim 1, which has a plate-shaped metal fitting that stands up on the surface and has an RF coupling prevention effect.
Chip-type composite feedthrough capacitor according to item 2 or 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56089495A JPS57206016A (en) | 1981-06-12 | 1981-06-12 | Chip type composite through condenser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56089495A JPS57206016A (en) | 1981-06-12 | 1981-06-12 | Chip type composite through condenser |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57206016A JPS57206016A (en) | 1982-12-17 |
| JPS6338856B2 true JPS6338856B2 (en) | 1988-08-02 |
Family
ID=13972333
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56089495A Granted JPS57206016A (en) | 1981-06-12 | 1981-06-12 | Chip type composite through condenser |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57206016A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0621220Y2 (en) * | 1987-09-02 | 1994-06-01 | キヤノン株式会社 | Leadless parts equipment |
| JP3231350B2 (en) * | 1991-05-08 | 2001-11-19 | 松下電器産業株式会社 | Capacitor network |
| KR101444536B1 (en) * | 2012-10-18 | 2014-09-24 | 삼성전기주식회사 | Multi-Layered Ceramic Electronic Component And Manufacturing Method Thereof |
| CN109637808B (en) * | 2019-01-11 | 2024-02-23 | 芯百特微电子(无锡)有限公司 | Novel capacitor and device |
-
1981
- 1981-06-12 JP JP56089495A patent/JPS57206016A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57206016A (en) | 1982-12-17 |
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