JPS6333415A - Resin composition for flame-retardant laminates - Google Patents

Abstract

PURPOSE:To obtain the titled composition having excellent applicability to a substrate and giving a laminated sheet having high heat-resistance, by using a mixture of a specific difunctional epoxy resin and a halogenated bisphenol A as a main component and adding a compound expressed by a specific formula as a hardener to the component. CONSTITUTION:The objective composition can be produced by using a mixture of a difunctional epoxy resin having a molecular weight of <=500 and a halogenated bisphenol A as a main component and adding a compound of formula (n>=1) as a hardener to the component.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention provides a resin composition for flame-retardant laminates that has excellent workability in coating onto base materials and can provide laminates with good heat resistance and impact resistance. relating to things.

2. Description of the Related Art As electronic devices become smaller and lighter, chip components and flat package LSIs are increasingly being used for various components mounted on insulating substrates on which circuits are formed. As an insulating substrate,
A laminate is used, which is formed by forming an #i layer of prepreg obtained by impregnating and drying a thermosetting resin on a base material such as paper, cloth, glass woven fabric, or glass nonwoven fabric. It is desired to improve properties such as heat resistance, moisture resistance, and measling resistance.

As a flame-retardant resin composition for laminates to provide such laminates, a resin composition containing an epoxy resin and a halide of dihydric phenols as main ingredients and a phenol novolak resin as a curing agent has been proposed. (Japanese Unexamined Patent Publication No. 58-89614). This is intended to improve the wettability to the base material when impregnating the resin composition into the base material, thereby satisfying each of the above-mentioned properties.

Problems to be Solved by the Invention However, in recent years, laminates have been used especially for flat packages.
It is desired to improve the heat resistance associated with SI mounting as well as the impact resistance associated with punching. Heat resistance and impact resistance are contradictory properties, and it has been difficult to improve both at the same time.

In view of the above points, the present invention provides a resin composition for a flame-retardant laminate that has good coating workability and wettability to a base material, and can provide a laminate with good heat resistance and impact resistance. It is something to do.

Means for Solving the Problems In order to achieve the above objects, the present invention provides the molecule ff150
The main ingredient is a mixture of a bifunctional epoxy resin of 0 or less and halogenated bisphenol A, and a compound (2) represented by the following general formula (where n≧1) is blended as a curing agent.

Effect: By using the above compound I as a curing agent, the reaction between the epoxy resin and the halogenated bisphenol A can be selectively carried out in the step of impregnating the base material with this composition and drying it. As a result, the heat resistance, moisture resistance, and solvent resistance of the laminate are improved, and the crosslink density of the cured product is not significantly reduced (flexibility can be imparted, so impact resistance can be improved).

Examples The bifunctional epoxy resin used in the present invention is not particularly limited as long as it is bisphenol A type and has a molecular weight of 500 or less.

A halogenated bisphenol A is represented by a halogen or a halogen, at least one of which is a halogen, and is a tetrabromobisphenol A.

Tetrachlorobisphenol A and the like. Halogen is
Generally, bromine has better thermal stability, but there is no particular limitation.

Furthermore, the resin composition of the present invention may also contain a tertiary amine type, imidazole type, etc. as a curing accelerator. It is preferable to include an inorganic filler because the dimensional stability of the laminate becomes good.

Example 1 Bifunctional epoxy resin (molecule ff1370.epoxy
dl 86) l 00 parts by weight ffi, 40 parts by weight of tetrabromobisphenol A as main ingredients, 30 parts by weight of compound sea urchin (in this case nm2, hydroxyl group [161)], and 0.4 parts by weight of 2-ethyl-4-methylimidazole. The resin composition for a flame-retardant laminate was laminated, copper foil was placed on both surfaces, and then heated and pressed to obtain a double-sided copper-clad laminate having a thickness of 1.211 aw.

Example 2 In Example 1, nx4 was used as compound I at 20
A double-sided copper-clad laminate with a thickness of 1.2 was obtained in the same manner as in Example 1, except that the above ingredients were mixed.

Conventional Example 1 In Example 1, 20 parts by weight of phenol novolac resin (hydroxyl equivalent: 103) was blended instead of Compound I,
Otherwise, a double-sided copper-clad laminate having a thickness of 1.2 fl was obtained in the same manner as in Example 1.

Comparative Example 1 A flame-retardant epoxy resin (trade name: Epon 1045, manufactured by Yuka Shell Co., Ltd.) with an epoxy weight of 11,500% was used as the main ingredient (tetrabromobisphenol A was not blended), and the other conditions were the same as in Example 1. A double-sided copper-clad laminate having a thickness of 1.2 fi was obtained.

Comparative Example 2 Bifunctional epoxy resin (molecule fi680, epoxy equivalent 3
40) 100 parts by weight, tetrabromobisphenol A4
0 parts by weight was used as the main ingredient, and the pond was prepared in the same manner as in Example 1 to 1.2 parts by weight.
A thick double-sided copper-clad laminate was obtained.

Comparative Example 3 In Example 1, dicyandiamide 4 was used instead of compound ①.
A double-sided steel clad laminate having a thickness of 1.21 mm was obtained in the same manner as in Example 1 except that the weight parts were blended.

Example 1.2, Conventional Example 1. The properties of the laminates in Comparative Examples 1 to 31 are shown in Table 1.

Table 1: A small piece with a diameter of 25 m was cut from an impregnable Nigarasu woven fabric base material, and the time required for the piece to be completely wetted by floating it on a resin composition at a temperature of 20°C was measured.

In addition, the nonvolatile content in the resin composition Content weight is 654 in acetone Adjusted to.

*2 Soldering heat resistance: After processing in saturated steam at 120"C and 12 atmospheres for 12 hours, float it in a soldering bath at 270"C and measure the time until blistering occurs.

Wood 3 Flammability: Compliant with UL-94 law.

*4 Punching workability: Punching was performed using the mold used by DIN Kiraku, and the state of crack occurrence was observed.

O: No cracks △: Some cracks ×: Cracks visible on the entire surface *5 Measling resistance: Processed in saturated steam at 120'C and 2 atm for 4 hours, then placed in a soldering bath at 270'C for 30 seconds Float it to see if measling is forming.

○: No measling △: Some measling present ×: Significant measling Effects of the invention As is clear from Table 1, the present invention has good coating workability and wettability to the base material. Moreover, its industrial value is enormous in that it can provide a flame-retardant resin composition for laminates that can yield laminates with good heat resistance and impact resistance.

Claims (1)

[Claims] Compound I, whose main ingredient is a mixture of bifunctional epoxy resin with a molecular weight of 500 or less and halogenated bisphenol A, and which is represented by the following general formula as a curing agent ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ (However, A resin composition for flame-retardant laminates containing n≧1).