JPS6330271A - Optical printer head - Google Patents
Optical printer headInfo
- Publication number
- JPS6330271A JPS6330271A JP61174469A JP17446986A JPS6330271A JP S6330271 A JPS6330271 A JP S6330271A JP 61174469 A JP61174469 A JP 61174469A JP 17446986 A JP17446986 A JP 17446986A JP S6330271 A JPS6330271 A JP S6330271A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting diode
- diode array
- insulating substrate
- mark
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003287 optical effect Effects 0.000 title claims description 16
- 239000000758 substrate Substances 0.000 claims abstract description 28
- 238000003491 array Methods 0.000 claims abstract description 18
- 238000007639 printing Methods 0.000 abstract description 3
- 239000004020 conductor Substances 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000012777 electrically insulating material Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- CTNCAPKYOBYQCX-UHFFFAOYSA-N [P].[As] Chemical compound [P].[As] CTNCAPKYOBYQCX-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- RBFQJDQYXXHULB-UHFFFAOYSA-N arsane Chemical compound [AsH3] RBFQJDQYXXHULB-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910001195 gallium oxide Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 239000003550 marker Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
- B41J2/447—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources
- B41J2/45—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources using light-emitting diode [LED] or laser arrays
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Exposure Or Original Feeding In Electrophotography (AREA)
- Facsimile Scanning Arrangements (AREA)
- Dot-Matrix Printers And Others (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕 、
本発明は電子写真式プリンタなどの記録装置の光源とし
て使用される光プリンタヘッドの改良に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an improvement in an optical printer head used as a light source in a recording device such as an electrophotographic printer.
（従来の技術）
近時、情報処理技術ならびに通信技術の進展に伴い普通
紙に任意の漢字や図形を高速度、高品質で大量に出力す
ることができる小型で、かつ安価な電子写真式プリンタ
が要求されている。そのためこの要求に対処するために
プリンタの光源として絶縁基板上に複数個の発光ダイオ
ード（ＬＥＤ）を直線状に配列取着して成る光プリンタ
ヘッドを使用した電子写真式、プリンタが小型、高解像
度のものとして提案されている。(Prior art) With the recent advances in information processing technology and communication technology, small and inexpensive electrophotographic printers that can output large quantities of arbitrary kanji and figures on plain paper at high speed and with high quality have become popular. is required. To meet this demand, electrophotographic printers, which use an optical printer head consisting of a plurality of light emitting diodes (LEDs) arranged in a straight line on an insulating substrate as the printer's light source, are small and have high resolution. It is proposed as a.
この従邑の電子写真式プリンタに使用されている光プリ
ンタヘッドは通常、第３図及び第４図に示すようにアル
ミナセラミックス等の電気絶縁材料から成る基板ｌｌ上
に直線状に配列したガリウム−砒素−リン（ＧａＡｓＰ
）等から成る発光ダイオード（ＬＥＤ） １２と、該発
光ダイオード１２を選択的に発光、させるための駆動用
ＩＣ素子１３と、発光ダイオード１２と駆動用１．ｃｒ
；子１３！電気的に接続する配線導体１４とを取着搭載
した構造を有しており、駆動用ＩＣ素子１３の駆動によ
り直線状に配列した発光ダイオード１２の個々に印加さ
れる電力を制御し、発光ダイオード１２を選択的に発光
させることによって電子写真式プリンタの光源として機
能する。The optical printer head used in this conventional electrophotographic printer usually has gallium oxides arranged in a straight line on a substrate made of an electrically insulating material such as alumina ceramics, as shown in FIGS. 3 and 4. Arsenic-phosphorus (GaAsP
), a driving IC element 13 for selectively causing the light emitting diode 12 to emit light; cr
; Child 13! It has a structure in which a wiring conductor 14 for electrical connection is attached and mounted, and the power applied to each of the light emitting diodes 12 arranged in a linear manner is controlled by driving the driving IC element 13. 12 functions as a light source for an electrophotographic printer by selectively emitting light.
尚、前記複数個の発光ダイオード１２は通常、６４個が
１単位として１つの発光ダイオードアレイ１２ａを構成
し、Ｂ４サイズの電子写真式プリンタの光源として使用
される場合には前記発光ダイオードアレイ１２ａは３２
個が直線状に配列される。Incidentally, the plurality of light emitting diodes 12 usually constitute one light emitting diode array 12a as a unit of 64, and when used as a light source of a B4 size electrophotographic printer, the light emitting diode array 12a is 32
The pieces are arranged in a straight line.
しかし乍ら、この従来の光プリンタヘッドは絶縁基板１
１」二に多数個の発光ダイオードアレイ１２ａを直線状
に配列取着する作業が目視による手作業によって行われ
ており、外形寸法が極めて小さい発光ダイオードアレイ
１２ａを直線状に配するには極めて精巧な作業性を必要
とし、位置合わせの作業性が極めて悪く、製品としての
光プリンタヘッドを高価とする欠点を有していた。However, this conventional optical printer head has an insulating substrate 1.
1) Second, the work of arranging and attaching a large number of light emitting diode arrays 12a in a straight line is carried out manually by visual inspection, and it takes extremely elaborate work to arrange the light emitting diode arrays 12a, which have extremely small external dimensions, in a straight line. This method requires high workability, has extremely poor positioning workability, and has the drawback of making the optical printer head as a product expensive.
また発光ダイオードアレイ１２ａの配列に差が生じると
発光ダイオード１２を直線状に配列させることができな
くなり、その結果、発光ダイオード１２に電力を印加し
て発光させた際、各発光ダイオード１２の発光位置がバ
ラツキ、高品質の印字印画ができないという欠点も有し
ていた。Furthermore, if a difference occurs in the arrangement of the light emitting diode arrays 12a, it becomes impossible to arrange the light emitting diodes 12 in a straight line, and as a result, when power is applied to the light emitting diodes 12 to emit light, the light emitting position of each light emitting diode 12 It also had the drawbacks of unevenness and the inability to produce high-quality prints.
本発明は上記欠点に鑑み案出されたもので、その目的は
多数個の発光ダイオードアレイを極めて容易に直線状に
配列することができ、各発光ダイオードアレイに設けら
れた発光ダイオードの発光位置を直線状として高品質の
印字、印画を得ることができる光プリンタヘッドを提供
することにある。The present invention was devised in view of the above-mentioned drawbacks, and its purpose is to extremely easily arrange a large number of light emitting diode arrays in a straight line, and to adjust the light emitting positions of the light emitting diodes provided in each light emitting diode array. An object of the present invention is to provide an optical printer head capable of obtaining high-quality printing and printing in a straight line.
本発明は絶縁基板の一主面上に、複数個の発光ダイオー
ドが直線状に配された発光ダイオードアレイを多数個、
直線状に配列取着して成る光プリンタヘッドにおいて、
前記各発光ダイオードアレイの夫々に、隣接する発光ダ
イオードアレイの位置合わせを行うための標識を設けた
ことを特徴とするものである。The present invention provides a large number of light emitting diode arrays in which a plurality of light emitting diodes are arranged linearly on one main surface of an insulating substrate.
In an optical printer head that is arranged and mounted in a straight line,
The present invention is characterized in that each of the light emitting diode arrays is provided with a mark for aligning adjacent light emitting diode arrays.
次に本発明を添付図面に示す実施例に基づき詳細に説明
する。Next, the present invention will be described in detail based on embodiments shown in the accompanying drawings.
第１図及び第２図は本発明の光プリンタヘッド−３＝
の一実施例を示し、１はセラミック、ガラス等の電気絶
縁材料から成る基板であり、その表面に発光ダイオード
（ＬＥＤ）２及び駆動用ＩＣ素子３がそれぞれ増養搭載
されている。1 and 2 show an embodiment of the optical printer head 3 of the present invention, in which 1 is a substrate made of an electrically insulating material such as ceramic or glass, and light emitting diodes (LEDs) 2 and The driving IC elements 3 are each additionally mounted.
前記発光ダイオード２はＧａＡｓＰ系、ＧａＰ系等の発
光ダイオードが使用され、例えばＧａＡｓＰ系の発光ダ
イオードの場合には、先ずＧ ａ Ａ’ｓの基板を炉中
にて高温に加熱するとともにＡｓＨ＋ （アルシン）と
ｐＨ３（ホスヒン）とＧａ（ガリウム）を適量に含むガ
スを接触させて基板表面にｎ型半導体のＧａＡｓＰ（ガ
リウム−砒素−リン）の単結晶を成長させ、次に前記Ｇ
ａＡｓＰ単結晶層表面に５ｉ３Ｎ４（窒化シリコン）の
窓付膜を被着させるとともに該窓部にＺｎ（亜鉛）のガ
スをさらし、ｎ型半導体のＧ ａ Ａ’ｓ Ｐ単結晶層
の一部にＺｎを拡散させてＰ型半導体を形成し、Ｐｎ接
合をもたすことによって形成される。The light-emitting diode 2 is a GaAsP-based or GaP-based light-emitting diode. For example, in the case of a GaAsP-based light-emitting diode, first, a GaA's substrate is heated to a high temperature in a furnace, and AsH+ (arsine) is heated. ), pH 3 (phosphine), and a gas containing appropriate amounts of Ga (gallium) to grow a single crystal of GaAsP (gallium-arsenic-phosphorus), an n-type semiconductor, on the substrate surface, and then
A windowed film of 5i3N4 (silicon nitride) is deposited on the surface of the aAsP single crystal layer, and Zn (zinc) gas is exposed to the window to form a part of the n-type semiconductor G a A's P single crystal layer. It is formed by diffusing Zn to form a P-type semiconductor and providing a Pn junction.
また前記発光ダイオード（Ｌ［！Ｄ）２は絶縁基板１上
に直線状に配列されて取着されており、Ｂ４サイズの電
子写真式プリンタに使用される光プリンタヘッドの場合
には２０４８個（１ｍ＋ｎ当たり８個）の発光ダイオー
ド２が直線状に配列される。Further, the light emitting diodes (L[!D) 2 are installed in a linear arrangement on the insulating substrate 1, and in the case of an optical printer head used for a B4 size electrophotographic printer, 2048 light emitting diodes (L[!D) 2 ( 8) light emitting diodes 2 per 1m+n are arranged in a straight line.
尚、この場合、発光ダイオード２はその６４個が１単位
として１つの発光ダイオードアレイを構成し、該発光ダ
イオードアレイを３２個（２ａ＋＋２ａｚ＋２ａｉ＋２
ａ、 ・・・）、直線状に配列することによって２０
４８個の発光ダイオード２が絶縁基板１上に直線状に配
列取着される。In this case, 64 light emitting diodes 2 constitute one light emitting diode array, and the light emitting diode array is divided into 32 pieces (2a++2az+2ai+2
a, ...), 20 by arranging them in a straight line.
Forty-eight light emitting diodes 2 are linearly arranged and mounted on an insulating substrate 1.
前記発光ダイオードアレイ２ａ＋＋２８２＋２８３＋２
８４ ・・・の夫々には第２図に示すように標識２ｃ
Ｉ ｌ ２ｃ ２１２ｃ、・・・２ｃ、が設けられて
おり、該標識２ＣＩ１２Ｃ２１２Ｃ３・・・２ｃｓは各
発光ダイオードアレイ２ａ ＋ ＋ ２ａ ２１２ａ３
＋２ａ４ ・・・を絶縁基板１上に直線状に配列取着
させる際、その位置合わせに使用さる。The light emitting diode array 2a++282+283+2
84... is marked with a sign 2c as shown in Figure 2.
I l 2c 212c, . . . 2c, are provided, and the markings 2CI 12C 212C 3 .
+2a4... are used for positioning when arranging and attaching them linearly on the insulating substrate 1.
前記各発光ダイオードアレイ２ａ＋＋２８ｇ＋２ａｓ＋
２Ｓ４・・・を絶縁基板１上に取着するにあたっては、
まず発光ダイオードアレイ自動装着機（不図示）により
絶縁基板１上に設けた標識１ｃｏを検出し、該検出した
標識１ｃｏと第１の発光ダイオードアレイ２ａ、に設け
た標識２ｃ＋ とを対応させて第１の発光ダイオードア
レイ２ａ＋ を絶縁基板１の所定位置に位置を合わせ装
着固定する。次に前記第１の発光ダイオードアレイ２ａ
＋に設けた標１１ｉ ２ ＣＺを自動装着機により検出
し、該検出した標識２ｃｚと第２の発光ダイオードアレ
イ２ａｉに設けた標１１ｔｔｔ ２ ｃ ｔとを対応さ
せて第２の発光ダイオードアレイ２ａ、を絶縁基板１の
所定位置に位置を合わせて装着固定する。そして以後、
その他の発光ダイオードアレイ２ａｚ＋２ａａ ・・
・も同様にして順次絶縁基板１上に位置を合わせて固定
し、これによって多数個の発光ダイオードアレイ２ａ＋
＋２ａｚ＋２ａｚ＋２ａ４・・・が絶縁基板１上に直線
状に配列取着される。Each of the light emitting diode arrays 2a++28g+2as+
When attaching 2S4... on the insulating substrate 1,
First, a light emitting diode array automatic mounting machine (not shown) detects the mark 1co provided on the insulating substrate 1, and matches the detected mark 1co with the mark 2c+ provided on the first light emitting diode array 2a. The first light emitting diode array 2a+ is aligned and fixed at a predetermined position on the insulating substrate 1. Next, the first light emitting diode array 2a
The mark 11i 2 CZ provided at are aligned and fixed at a predetermined position on the insulating substrate 1. And from then on,
Other light emitting diode arrays 2az+2aa...
・Sequentially align and fix the LEDs onto the insulating substrate 1 in the same manner, thereby forming a large number of light emitting diode arrays 2a+
+2az+2az+2a4... are linearly arranged and attached on the insulating substrate 1.
前記各発光ダイオードアレイ２ａ＋＋２ａｚ＋２ａｚ＋
２ａｎ・・・の夫々に設けた標識２Ｃ＋ ＋ ２ｃｇ＋
２Ｃ１・・・は十字形と成しておくと該標識の座標点
の確認が正確かつ容易となり好ましいが他の形状、例え
ば円形や方形状であってもよい。Each of the light emitting diode arrays 2a++2az+2az+
Marks attached to each of 2an... 2C+ + 2cg+
It is preferable that 2C1... be formed into a cross shape so that the coordinate points of the marker can be confirmed accurately and easily, but other shapes such as a circle or a rectangle may be used.
前記標識２ｃ＋＋２ｃｇ＋２ｃｚ ・・・は各発光ダ
イオードアレイ２ａ＋＋２ａｚ ２ａｓ＋２ａｎ ・
・・の表面に従来周知の薄膜手法等により被着形成され
る。The signs 2c++2cg+2cz... are each light emitting diode array 2a++2az 2as+2an.
It is adhered and formed on the surface of . . . by a conventionally well-known thin film method.
前記絶縁基板１上の直線状に配列された発光ダイオード
２の両側には該発光ダイオード２の配列に対し平行とな
るように駆動用ＩＣ素子３が搭載されており、駆動用Ｉ
Ｃ素子３の各出力電極３ａは該ＩＣ素子３の一側辺で、
かつ発光ダイオード２の配列と平行となるように形成さ
れている。これにより各発光ダイオード２と駆動用ＩＣ
素子３の各出力電極３ａとの距離は実質的にすべて同一
となすことが可能となる。Drive IC elements 3 are mounted on both sides of the light emitting diodes 2 arranged linearly on the insulating substrate 1 so as to be parallel to the arrangement of the light emitting diodes 2.
Each output electrode 3a of the C element 3 is on one side of the IC element 3,
Moreover, it is formed so as to be parallel to the arrangement of the light emitting diodes 2. As a result, each light emitting diode 2 and the driving IC
The distances from each output electrode 3a of the element 3 can be made substantially the same.
尚、前記駆動用ＩＣ素子３は発光ダイオード２の両側に
分けて搭載したが、上下いずれかの片側にのみ搭載して
もよい。Although the driving IC element 3 is mounted separately on both sides of the light emitting diode 2, it may be mounted only on either the upper or lower side.
前記駆動用ＩＣ素子３は従来周知の半導体技術により作
製され、発光ダイオード２に印加される電力を制御して
発光ダイオード２を選択的に発光させる作用を為す。The driving IC element 3 is manufactured using conventionally well-known semiconductor technology, and has the function of controlling the power applied to the light emitting diode 2 to selectively cause the light emitting diode 2 to emit light.
また前記駆動用ＩＣ素子３と発光ダイオード２との間の
絶縁基板１上には該駆動用ＩＣ素子３の各出力電極３ａ
と各発光ダイオード２とを電気的に接続するための配線
導体４が被着形成されている。この配線導体４はアルミ
ニウム（ＡＩ）、銅（Ｃｕ）等の金属材料から成り、従
来周知の蒸着やスパッタリング等による薄膜手法を採用
することにより絶縁基板１上で駆動用ＩＣ素子３と発光
ダイオード２との間に被着形成される。この場合、駆動
用ＩＣ素子３のすべての出力電極３ａが発光ダイオード
２の配列に対し平行となっており、駆動用ＩＣ素子３の
各出力電極３ａと各発光ダイオード２との距離が同一で
あることからすべての配線導体４の長さを同一となすと
ともにその電気抵抗値を実質的に同一となすことができ
る。Further, each output electrode 3a of the driving IC element 3 is provided on the insulating substrate 1 between the driving IC element 3 and the light emitting diode 2.
A wiring conductor 4 for electrically connecting the light emitting diodes 2 and the light emitting diodes 2 is deposited thereon. The wiring conductor 4 is made of a metal material such as aluminum (AI) or copper (Cu), and is formed on the insulating substrate 1 by using a thin film method such as vapor deposition or sputtering. An adhesion is formed between the In this case, all the output electrodes 3a of the driving IC element 3 are parallel to the arrangement of the light emitting diodes 2, and the distance between each output electrode 3a of the driving IC element 3 and each light emitting diode 2 is the same. Therefore, all the wiring conductors 4 can be made to have the same length and have substantially the same electrical resistance value.
前記配線導体４はその両端に発光ダイオード２および駆
動用ＩＣ素子３の各出力電極３ａがそれぞれアルミニウ
ム（ＡＩ）、金（＾Ｕ）等の細線（ボンディングワイヤ
）５を介し接続され、これによって各発光ダイオード２
と駆動用ＩＣ素子３とは配線導体４を介し電気的に接続
されることとなる。The output electrodes 3a of the light emitting diode 2 and the driving IC element 3 are connected to both ends of the wiring conductor 4 through thin wires (bonding wires) 5 made of aluminum (AI), gold (^U), etc. light emitting diode 2
and the driving IC element 3 are electrically connected via the wiring conductor 4.
かくして、駆動用ＩＣ素子３の駆動により駆動用ＩＣ素
子３の出力電極３ａ及び配線導体４を介し発光ダイオー
ド２の個々に印加される電力を制御し、発光ダイオード
２を均一波長、均一輝度で選択的に発光させることによ
って電子写真式プリンタの光源として機能する。In this way, by driving the driving IC element 3, the power applied to each light emitting diode 2 is controlled via the output electrode 3a of the driving IC element 3 and the wiring conductor 4, and the light emitting diode 2 is selected with uniform wavelength and uniform brightness. By emitting light, it functions as a light source for electrophotographic printers.
本発明の光プリンタヘッドによれば、発光ダイオードア
レイの夫々に、隣接する発光ダイオードアレイの位置合
わせを行うための標識を設けたことから該標識を基準と
して発光ダイオードアレイを自動装着機により絶縁基板
上の所定位置に直線状に配列取着することができ、これ
によって光プリンタヘッドを安価として、かつ各発光ダ
イオードの発光位置を直線状となし極めて高品質の印字
、印画を出力させることが可能となる。According to the optical printer head of the present invention, each of the light emitting diode arrays is provided with a mark for aligning adjacent light emitting diode arrays, so that the light emitting diode array is attached to the insulating substrate by an automatic mounting machine using the mark as a reference. They can be arranged and mounted in a straight line at predetermined positions on the top, making it possible to make the optical printer head inexpensive and to output extremely high quality prints by setting the light emitting position of each light emitting diode in a straight line. becomes.
第１図は本発明の光プリンタヘッドの一部分を示す平面
図、第２図は絶縁基板に発光ダイオードアレイを装着す
る方法を説明するための概略図、第３図は従来の光プリ
ンタヘッドの一部分を示す平面図、第４図は第３図の縦
断面図である。Fig. 1 is a plan view showing a part of the optical printer head of the present invention, Fig. 2 is a schematic diagram for explaining a method of mounting a light emitting diode array on an insulating substrate, and Fig. 3 is a part of a conventional optical printer head. FIG. 4 is a vertical sectional view of FIG. 3.
Claims (1)
状に配された発光ダイオードアレイを多数個、直線状に
配列取着して成る光プリンタヘッドにおいて、前記各発
光ダイオードアレイの夫々に、隣接する発光ダイオード
アレイの位置合わせを行うための標識を設けたことを特
徴とする光プリンタヘッド。In an optical printer head in which a large number of light emitting diode arrays each having a plurality of light emitting diodes arranged in a straight line are arranged and attached on one main surface of an insulating substrate, each of the light emitting diode arrays has a An optical printer head characterized in that a mark is provided for aligning adjacent light emitting diode arrays.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17446986A JP2639646B2 (en) | 1986-07-23 | 1986-07-23 | Optical printer head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17446986A JP2639646B2 (en) | 1986-07-23 | 1986-07-23 | Optical printer head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6330271A true JPS6330271A (en) | 1988-02-08 |
| JP2639646B2 JP2639646B2 (en) | 1997-08-13 |
Family
ID=15979026
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17446986A Expired - Fee Related JP2639646B2 (en) | 1986-07-23 | 1986-07-23 | Optical printer head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2639646B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59227675A (en) * | 1983-06-08 | 1984-12-20 | 三菱電機株式会社 | Statistical device for traffic of elevator |
| US5173759A (en) * | 1990-02-06 | 1992-12-22 | Kyocera Corporation | Array of light emitting devices or photo detectors with marker regions |
| JPH05261971A (en) * | 1992-03-18 | 1993-10-12 | Kyocera Corp | Imaging device |
| US5943586A (en) * | 1995-12-26 | 1999-08-24 | Oki Electric Industry Co., Ltd. | LED array alignment mark, method and mask for forming same, and LED array alignment method |
| US6833563B2 (en) * | 2001-09-25 | 2004-12-21 | Intel Corporation | Multi-stack surface mount light emitting diodes |
| JP2007538395A (en) * | 2004-05-19 | 2007-12-27 | インテンス リミテッド | Printing device with laser activation |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58203071A (en) * | 1982-05-21 | 1983-11-26 | Mitsubishi Electric Corp | Light emitting diode array |
| JPS60146364U (en) * | 1984-03-09 | 1985-09-28 | 三菱電機株式会社 | light emitting diode array head |
-
1986
- 1986-07-23 JP JP17446986A patent/JP2639646B2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58203071A (en) * | 1982-05-21 | 1983-11-26 | Mitsubishi Electric Corp | Light emitting diode array |
| JPS60146364U (en) * | 1984-03-09 | 1985-09-28 | 三菱電機株式会社 | light emitting diode array head |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59227675A (en) * | 1983-06-08 | 1984-12-20 | 三菱電機株式会社 | Statistical device for traffic of elevator |
| US5173759A (en) * | 1990-02-06 | 1992-12-22 | Kyocera Corporation | Array of light emitting devices or photo detectors with marker regions |
| JPH05261971A (en) * | 1992-03-18 | 1993-10-12 | Kyocera Corp | Imaging device |
| US5943586A (en) * | 1995-12-26 | 1999-08-24 | Oki Electric Industry Co., Ltd. | LED array alignment mark, method and mask for forming same, and LED array alignment method |
| US6023104A (en) * | 1995-12-26 | 2000-02-08 | Oki Electric Industry Co., Ltd. | LED array alignment mark, method and mask for forming same, and LED array alignment method |
| US6833563B2 (en) * | 2001-09-25 | 2004-12-21 | Intel Corporation | Multi-stack surface mount light emitting diodes |
| JP2007538395A (en) * | 2004-05-19 | 2007-12-27 | インテンス リミテッド | Printing device with laser activation |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2639646B2 (en) | 1997-08-13 |
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| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |