JPS63296283A - Pressure sensor device - Google Patents

Abstract

PURPOSE:To prevent a stress applied to the pressure inlet of a package part from being transmitted to the pressure inlet of a sensor part by a method wherein the pressure inlet of the sensor part is connected to the pressure inlet of the package part with a flexible connecting member. CONSTITUTION:The part of a package case 3 to which a hybrid circuit board 2 is attached with bonding resin 5 is elevated to keep a sensor pipe 8 far enough not to be inserted into a package pipe 9 and the sensor pipe 8 is connected to the package pipe 9 with a flexible connecting member 4 while the space between the pipes 8 and 9 are sealed with the member 4. With this constitution, a stress applied to the pressure inlet provided in the package part 3 in which the sensor part 1 is housed is not transmitted to the sensor pipe 8 of the sensor part 1 so that the degradation of the characteristics of the sensor part 1 can be avoided.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a pressure sensor device, and more particularly to a pressure sensor device that measures pressure by storing a semiconductor pressure sensor or the like therein.

[Prior Art] FIG. 2 is a schematic cross-sectional view of a conventional semiconductor pressure sensor device.

Referring to the figure, a semiconductor pressure sensor 1 having a sensor vibe 8 as a pressure introduction part is fixed to a control hybrid circuit board 2 with solder 6 via sensor leads 7. The semiconductor pressure sensor 1 itself is covered with a hermetically sealed metal case in order to form and maintain a vacuum chamber, but the semiconductor pressure sensor 1 and the entire hybrid circuit board 2 are covered with a hybrid circuit board inside the outer case 3. 2 is stored and protected by fixing it with adhesive resin 25. In this case, pressure is introduced through the exterior vibrator 9 provided in the exterior case 3, so the sensor vibe 8 of the semiconductor pressure sensor 1 is inserted into the exterior vibe 9, and an O-ring 10 is installed between them to provide a seal. maintains sexuality.

Here, the reason why the exterior vibrator 9 is used to connect to the object to be measured is to avoid problems such as the adhesion of dirt caused by using the sensor vibrator 8 directly.

[Problems to be Solved by the Invention] In the conventional semiconductor pressure sensor device as described above, since the sensor vibe 8 is inserted into the exterior vibe 9 via the O-ring 10, stress applied to the exterior vibe 9 is transmitted to the sensor vibe 8, and the semiconductor pressure sensor 1
There was a point where the characteristics of the device were compromised or the reliability decreased.

This invention was made to solve this problem, and even in a pressure sensor device that introduces pressure through the exterior vibrator 9, the stress received by the exterior vibrator 9 can be absorbed by the sensor vibe 8 and the semiconductor pressure sensor 1. The purpose is to provide a device that does not affect

[Means for Solving the Problems] A pressure sensor device according to the present invention includes a first pressure introduction part connected to a sensor part and a second pressure introduction part provided in an exterior part housing the sensor part and receiving pressure. and are connected by a flexible connecting member in such a manner that external force applied to the second pressure introduction part is not transmitted to the first pressure introduction part.

[Operation] In the present invention, the flexible connecting member acts as a buffer material and does not transmit the stress received by the first pressure introduction part to the second pressure introduction part.

[Example code] FIG. 1 is a schematic sectional view showing one embodiment of the present invention.

Referring to the figure, a semiconductor pressure sensor 1 having a sensor vibe 8 as a pressure introduction part is connected to a hybrid circuit board for control via a sensor lead 7. It is fixed and installed with solder 6. The semiconductor pressure sensor 1 itself is covered with a hermetically sealed metal case in order to form and protect a vacuum chamber, but the semiconductor pressure sensor 1 and the entire hybrid circuit board are covered by a hybrid circuit board 2 that is pasted inside the outer case 3. It is stored and protected by fixing it with resin.

The above configuration is almost the same as the conventional device, but in this invention, the part of the exterior case 3 where the hybrid circuit board 2 is attached with the adhesive resin 5 is raised, so that the sensor vibe 8 is not inserted into the exterior vibe 9. The two pipes are separated in position and connected while being sealed by a rubber tube 4 such as silicone rubber. This sealing property is sufficient to allow the initial change in pressure introduced from the exterior vibrator 9 to be transmitted to the semiconductor pressure sensor 1 via the sensor vibrator 8, so that the connection is easy.

In the above embodiment, a semiconductor pressure sensor is used as the sensor section, but other pressure sensors can be similarly applied as long as they are used with a sensor vibrator and stored in an external case.

In addition, in the above embodiment, rubber tubes are used to connect the pipes, but other materials may also be used with similar sealing properties and
A similar effect can be achieved if it has a buffering function.

[Effects of the Invention] As explained above, the present invention connects the first pressure introduction part of the sensor part and the second pressure introduction part of the exterior part with a flexible connecting member, so that the second pressure introduction part The stress applied to the first pressure introducing section is not transmitted to the first pressure introducing section and has no effect on the first pressure introduction section, so there is an effect that a highly reliable pressure sensor device can be obtained without impairing the characteristics of the sensor section.

[Brief explanation of the drawing]

FIG. 1 is a schematic sectional view showing an embodiment of the present invention, and FIG. 2 is a schematic sectional view of a conventional semiconductor pressure sensor device. In the figure, 1 is a semiconductor pressure sensor, 3 is an exterior case, and 4 is a semiconductor pressure sensor.
8 is a rubber tube, 8 is a sensor vibrator, and 9 is an exterior vibrator. Note that the same reference numerals in each figure indicate the same or corresponding parts.

Claims (5)

[Claims] (1) a sensor section having a first pressure introduction section; an exterior section housing the sensor section and having a second pressure introduction section corresponding to the first pressure introduction section; and the first pressure introduction section. a flexible connecting member that connects the pressure introduction part and the second pressure introduction part in such a manner that an external force applied to the second pressure introduction part is not transmitted to the first pressure introduction part; A pressure sensor device equipped with (2) The pressure sensor device according to claim 1, wherein the sensor section is a semiconductor pressure sensor. (3) The pressure sensor device according to claim 1 or 2, wherein the first pressure introduction part, the second pressure introduction part, and the connection member have a tube shape. (4) The pressure sensor device according to claim 3, wherein the material of the connecting member is rubber. (5) The pressure sensor device according to claim 4, wherein the rubber is silicone rubber.