JPS63292660A - Multilayered printed wiring substrate - Google Patents

Abstract

PURPOSE:To increase the package density of electronic components, by providing the exposed parts of metallic base layers on the laminated bodies, wherein an insulating plate, on which a wiring layer is provided, and the metallic base layers are laminated, and by attaching the electronic components, which produce heat, closely to the exposed parts. CONSTITUTION:Exposed parts 6 of metallic base layers are provided on a multilayered printed wiring board 5 having the metallic base layers, in which an insulating plate having a wiring layer and the metallic base layers are laminated. Electronic parts 2, which yield heat, are attached to the exposed parts 6 tightly. The exposed parts 6 of said metallic base layers 91 and 92 are formed on both surfaces (or on one surface) on the multilayered printed board 5 having the metallic base layers by cutting and the like. The electronic components 2 are tightly attached to the exposed parts 6. Therefore, a heat radiater, which occupies a space, is not required. Heat can be directly radiated to the metallic base layers. Therefore, the packaging density of the electronic components is increased. The components can be mounted on both surfaces by the adoption of the multilayered printed wiring board having the metallic base layers.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a multilayer printed wiring board on which electronic components are mounted.

(Prior Art) Conventionally, when heat-generating electronic components (for example, integrated circuit devices) are mounted on a printed wiring board, it has been done as shown in FIG.

In FIG. 3, reference numeral 1 denotes a printed wiring board, and when electronic components 2 that generate heat are mounted on this printed wiring board 1, a heat radiator (radiating fin) 3 is used as a heat radiation measure.

(Problem to be Solved by the Invention) Therefore, in consideration of the height restriction of the heatsink 3 when storing the printed wiring board 1, in order to secure the volume of the heatsink 3 under that condition, the heatsink 3 is mounted. It had the disadvantage of requiring a large area.

The present invention has been made in view of the above-mentioned circumstances, and aims to provide a multilayer printed wiring board that does not require a heat sink that requires a large mounting area as in the prior art, and that increases the mounting density of electronic components.

[Structure of the invention] (Means and effects for solving the problems) The present invention
The present invention is characterized in that an exposed portion of the metal base layer is provided in a laminate in which an insulating plate with layers and a metal base layer are laminated, and an electronic component that generates heat is attached in close contact with the exposed portion. That is, the present invention includes a metal base layer in the layers of a multilayer printed wiring board, and heat-generating electronic components are brought into direct contact with this metal base layer to absorb all of the heat and improve the heat radiation effect.

(Example) One embodiment of the present invention will be described below with reference to the drawings.
The figure is a partially cutaway perspective view of the same embodiment, and FIG. 2 is a perspective view showing a part of the same embodiment, and the same reference numerals are used for parts corresponding to those in FIG. 3. That is, in this configuration, an insulating plate provided with a wiring layer and a metal base layer are stacked on a printed wiring board 5 with a metal base layer, and the metal base layer is exposed t! A6
The electronic component 2 which generates heat is attached to the exposed portion 6 in close contact with the exposed portion 6. 71 y 7k +
81 to 87 are insulating plates provided with the above wiring layer% 91 1
92 is the metal base layer, where #-i, 71
+8! +8! +91+83~'! 'I +9
They are stacked in the order of 2 + 8 m + 81 + '2. The multi-JWIF lint board 5 with a metal base layer has the metal base layer 91y9 on both sides (or one side is possible). An exposed portion 6 is formed by cutting or the like, and an electronic component (here, an integrated circuit) 2 is attached in close contact with the exposed portion 6. The external lead JO of the electronic component 2 is the metal base layer 9
1+92 and key money provided on each laminated insulating board
N! It penetrates in a three-way state and connects to a predetermined location. The metal base layers 91+92 mainly serve as heat dissipation for the electronic components 2, but they can also serve as electrical connections; for example, they can be screwed to a metal frame for storing the multilayer printed wiring board 1 with a metal base layer, etc. is fixed. 1 is an electronic component (integrated circuit, etc.) that generates some heat but could not conventionally be equipped with heat dissipation fins, and such a component 11 also has an exposed metal layer 6
Heat dissipation is now possible by installing the

[Effects of the Invention] (1) By laminating the metal base layer within the printed wiring board, the conventional space-consuming heat radiator is no longer necessary.

(2) Heat can be radiated directly to the metal base/m.

(3) Since a conventional heatsink is no longer necessary, the packaging density of electronic components increases.

(4) By adopting a multilayer printed wiring board with a metal base,
A fire pocket is formed on the inner surface of the parts.

(5) By employing the mounting method of the present invention, the mounting state of electronic components that generate heat can be reduced.

[Brief explanation of the drawing]

FIG. 1 is a partially cutaway perspective view showing the configuration of an embodiment of the present invention, FIG. 2 is a partial perspective view of the same configuration, and FIG. 3 is a perspective view of a conventional configuration. 2...Electronic components (integrated circuits) that generate heat, 5...Multilayer printed wiring board with metal base, 6...Conductive metal (
fM, aluminum, etc.) paste layer exposed part, 71+72+8, ~
87...Insulating plate with wiring no. 91+92...Acid-conducting metal base layer, lθ...Lead, 11...Electronic component (
integrated circuits).

Claims (2)

[Claims] (1) A laminate in which an insulating plate provided with a wiring layer and a metal base layer are laminated, an exposed portion of the metal base layer is provided, and an electronic component that generates heat is attached in close contact with this exposed portion. multilayer printed wiring board. (2) The metal base layer and the insulating plate provided with the wiring layer are laminated in multiple layers, the exposed portion of the metal base layer is provided on both sides or one side of the laminate, and the heat-generating electronic component is placed in the laminate. The multilayer print according to claim 1, wherein the multilayer print is attached to both sides or one side of the exposed portion of the metal base layer, and the external leads of the electronic component penetrate the metal base layer in an insulating state. wiring board.