JPS63289904A - Manufacture of electronic component - Google Patents

Abstract

PURPOSE:To facilitate the setting of the prescribed resistance value as well as to make it possible to supply the electronic components in an electrically stabilized manner by a method wherein an insulative film is pasted on a metal thin plate, a resistive circuit or a conductive circuit is formed thereon, and a baking operation is conducted. CONSTITUTION:An insulative film 2 is pasted on a metal thin plate 1, a resistive circuit 4 or a conductive circuit 5 is formed on the insulative film 2, and said resistive circuit 4 and conductive circuit 5 are sintered. For example, a hoop-like cold-rolled steel plate 1 and a roll-formed insulative film 2 are rolled and they are pasted together. After the resistive circuit 4 and the conductive circuit 5 have been printed and baked on the hoop-like substrate 3 on which the insulative film 2 is pasted on the cold-rolled steel plate 1 as above-mentioned, a punching work is conducted as shown in the diagram, they are supplied in the assembling process of the variable resistor as a hoop-like resistance substrate 6. This resistance substrate is cut before it is incorporated into the variable resistor, the coupled part 7 is bent, and it is completed as a resistance substrate 8.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for manufacturing electronic components used in electronic equipment such as television receivers.

2. Description of the Related Art Conventionally, when forming resistive paths, conductive paths, etc. on a substrate, a resistive or conductive paint was printed and fired on the desired circuit on the substrate. In this case, for example, in the case of a variable resistor resistor, (1) carbon range resistance material is printed and baked on a phenolic resin laminate, or (2) carbon range resistance material is printed and baked on a roll film and this film is placed on a substrate. Pasting methods have been implemented or considered.

Problems to be Solved by the Invention In the method (1) mentioned above, continuous production is difficult due to the limited length of the substrate, and in the method (2), although continuous production is possible, the film There was a problem in that the resistance value fluctuated due to elongation due to the heat during firing, making it difficult to set the resistance value to a predetermined value.

Means for Solving the Problems In order to solve the above problems, the present invention provides an electrical connection by pasting an insulating film on a thin metal plate, forming a resistive path or a conductive path thereon, and firing it. The purpose is to manufacture parts.

Function Since the structure is as described above, the elongation of the film is regulated to the elongation of Kin 11, Bunsei I:, and 17 plates, making it possible to easily set the resistance value.

Embodiment An embodiment will be explained based on FIGS. 1 and 2 using a variable resistor as an example. 1 is a hoop-shaped cold-rolled steel plate, and 2 is a roll-shaped insulating film, both of which are rolled as shown in FIG. 1 and stretched by a known method.

3 is a hoop-shaped substrate with an insulating film 2 pasted on a cold-rolled steel plate 1 as described above, and after printing and baking a resistance path 4 and a conductive path 6 as shown in FIG. 4, a hoop-shaped resistance substrate is punched out as shown in FIG. 3. It is supplied to the variable resistor assembly process as a liquid.

Before this resistor board is assembled into a variable resistor, the resistor board 8 is completed by cutting the resistor board shown in FIG. 3 and bending the connecting portion 7 as shown in FIG. 4.

Effects of the Invention Since the present invention has the above-described structure, the elongation of the film during firing is limited to the elongation of the thin metal plate, so it is easy to set a predetermined resistance value, and the insulating film can be used with known insulating films. This manufacturing method allows stable control of the thickness, making it possible to supply electronic components that are electrically stable. In addition,
Although the above embodiment describes a variable resistor resistor, the manufacturing method of the present invention can also be applied to other electronic components (eg, fixed resistors, thick film ICs).

[Brief explanation of the drawing]

Figure 1 is a schematic diagram showing the process of pasting an insulating film onto a thin metal plate, Figure 2 is a perspective view of a thin metal plate with resistance paths and conductive paths printed on the insulating film, and Figure 3 is a diagram showing the process of pasting an insulating film onto a thin metal plate. FIG. 4 is a perspective view showing a resistor board punched into a hoop shape, and FIG. 4 is a perspective view showing a resistor board as a single piece. 1... Hoop-shaped cold-rolled steel plate, 2... Roll-shaped insulating film, 3... Cold-rolled steel plate pasted with insulating film, 4...・Resistance path, 5...
...Conducting path, 6...Resistance board (hoop shape), End...Connection part, 8...Resistance board. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
figure? Figure 2 Figure 3 Figure 4

Claims (1)

[Claims] A method for manufacturing an electronic component, comprising the steps of pasting an insulating film on a thin metal plate, forming a resistive path or conductive path on the insulating film, and firing the resistive path or conductive path. .