JPS63283147A - Semiconductor device - Google Patents

Abstract

PURPOSE:To dispense with working of leads and supply of bonding material by a method wherein brazing material is applied to through-holes and peripheral parts. CONSTITUTION:A semiconductor element 6 is fixed to an insulating substrate 1 through a bonding agent 5 and connected electrically with a bonding wire 7, which is packaged with a resin mold 8. A spherical brazing material protrusion 9, which is formed in a soldering processing device such as a melting solder cell, is coated over a through-hole 3 and a rear land section 4. When the processing condition is kept constant, the protrusion 9 varies according to the diameter of the hole 3 and the area of the land section 4. The said brazing material 9 is used as bonding material when a mounting process is performed onto a printed substrate or the like. By these processes, when a mounting process is performed onto a printed substrate or the like, supply of a brazing material and a lead forming processing such as a tie-bar cut or the like can be dispensed with.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a structure of a semiconductor device that is effective for processing to be attached to a printed circuit board or the like.

[Summary of the invention]

A detailed explanation of the invention disclosed in this application is as follows. In other words, a printed wiring board is constructed in which the front surface is wired so that the semiconductor elements are electrically connected, and the external lead ends extend to the rear surface lands via through holes. The package is formed by bonding and resin molding. After that, the brazing metal is deposited, and the following two are typical.

- Fish eyes are formed by forming spherical brazing material protrusions on land portions including through holes in solder processing equipment such as molten solder baths. The second type is one in which a soldering material containing flux is driven into the through-hole.

[Conventional technology]

When processing semiconductor devices, bonding using a brazing material such as solder is often used, but the semiconductor device itself does not contain an effective amount of brazing material for bonding (it is supplied during processing).

[Problem that the invention seeks to solve]

Regarding the issue of reducing the manufacturing cost of semiconductor devices and the cost of mounting them on printed circuit boards, etc., lead processing can be eliminated in manufacturing compared to those using conventional lead frames as the base material, and mounting is easier. In some cases, the aim is to streamline the process by eliminating the need to supply bonding materials.

〔Example〕

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, features of the present invention will be explained with reference to drawings which are embodiments.

FIG. 1 is a cross-sectional view taken approximately at the center of a semiconductor device, and shows an insulating substrate 1.A printed wiring board has a roughening process applied to the center of the surface. External lead 2. It is composed of a through hole 3 and a back land portion 4, and after fixing a semiconductor element 6 with an adhesive 5 and electrically connecting it with a bonding wire 7,
It is packaged in a resin mold 8. In this case, the protrusions of the brazing material generally vary depending on the diameter of the through hole and the land area when the processing conditions are constant. For example, if the diameter of the through hole is Q, 5 mm, and the land diameter where the through hole is in the center is l mvs, the maximum thickness part is Q, 3
It is possible to obtain protrusions of about mm. Spherical brazing material protrusions 9 formed in a solder processing apparatus such as a molten solder bath are attached to the through-hole portions and the rear surface land portions. This brazing filler metal is used as a bonding material when attaching to a printed circuit board or the like.

The basic configuration in FIG. 2 is the same as that in the previous FIG. 1, but a brazing filler metal 10 containing fluff is driven into the through-hole portion and then adhered thereto.

FIG. 3 is a plan view showing a state in which printed wiring boards are connected after packaging. It is possible to manufacture a large number of semiconductor devices by providing wiring in advance at the mesh holes 2 using index marks 11, and by separating the cut portions 13 after soldering and bonding, an independent semiconductor device can be obtained.

Figure 4 shows a device in which multiple through holes are provided in one lead terminal to increase the capacity of the brazing material and to narrow the lead spacing. b
) has been subjected to the treatment described in FIG. 1 and has a brazing material protrusion 14 attached thereto. FIG. 4 (C1 shows a plurality of brazing materials 15 that have been subjected to the treatment described in FIG. 2).

〔Effect of the invention〕

(There is no need to supply a brazing material when attaching to a 11 Pudding l-M board etc.

(2) Compared to semiconductor devices that use lead frames as a base material, there is no need for lead forming processes such as tie bar cutting, and there is a manufacturing advantage.

(3) In comparison with a semiconductor device using a lead frame as a base material, it is possible to inspect electrical characteristics in a continuous state during the manufacturing process.

[Brief explanation of drawings]

FIG. 1 is a sectional view of an embodiment of the present invention, FIG. 2 is a sectional view of another embodiment of the present invention, FIG. 3 is a plan view of the present invention in a continuous state, and FIG. 4(a) is a sectional view of the present invention. A partial plan view of another embodiment of the invention;
Figure 4 1b) is a partial sectional view of another embodiment, Figure 4 (C1
is a partial cross-sectional view of another embodiment. 1... Insulating substrate 2... External lead 3... Through hole 4... Back surface land 5... Adhesive 6... Semiconductor element 7... Bonding wire 8... Resin mold 9... ... Brazing filler metal 10... Bar-shaped brazing filler metal 11... Index mark 12... Plated lead 13... Separation part and above Applicant: Seiko Keiyo Kogyo Co., Ltd. Cross-sectional view of the present invention No. Figure 1 Figure 2 Figure 3

Claims (1)

[Claims] 1. A semiconductor device in which a printed wiring board having a through hole is used as a base material and a semiconductor element is mounted thereon, the semiconductor package having a soldering material applied to the through hole and the area around the through hole.