JPS63270574A - Adhesive applying device - Google Patents
Adhesive applying deviceInfo
- Publication number
- JPS63270574A JPS63270574A JP10514887A JP10514887A JPS63270574A JP S63270574 A JPS63270574 A JP S63270574A JP 10514887 A JP10514887 A JP 10514887A JP 10514887 A JP10514887 A JP 10514887A JP S63270574 A JPS63270574 A JP S63270574A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- adhesive
- dispenser
- dispensers
- transferring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Coating Apparatus (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
この発明は接着剤等の塗布を行う接着剤塗布装置に関す
る。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention This invention relates to an adhesive coating device for applying adhesive or the like.
従来の技術
従来のこの種接着剤塗布装置は、第4図のような構造に
なっていた。すなわち上下動可能な基板搬入部1によシ
ブリント基板はXYテーブルに送り込まれる。接着剤塗
布部には、2つの円筒形状をもったアーム3ρ上下摺動
可能な2本のディスペンサ4a、4bが取り付けられて
いる。ディスペンサ4at/Cは、第3図aに示すよう
に小型部品6を装着するため小量のM清剤6aを吐出す
るノズル管径の小さいノズルが2本取付けられ、ディス
ペンサ4bには、第3図すに示すように大型部品7を装
着するため大量の接着剤abi吐出するノズル管径の大
きいノズルが2本取付けられておシ、チップ部品の大小
及び形状に合わせディスペンサが選択できる。アーム3
は、駆動用シリンダー8により回転し2本のディスペン
サ+a 、 4bはグレート9の溝部9aにそって移動
する。このプレート9の中央にあるディスペンサの真下
にXYテーブル2がプリント基板の所定位置を持って来
てディスペンサはノズル10がプリント基板に接するま
で下降して接着剤hノズル1oよシ吐出する。接着剤塗
布の終了したプリント基板は、上下動可能な基板搬出部
11により接着剤塗布装置から送シ出される。2. Description of the Related Art A conventional adhesive applicator of this type has a structure as shown in FIG. That is, the printed board is fed into the XY table by the board loading section 1 which is movable up and down. Two dispensers 4a and 4b having two cylindrical arms 3ρ and capable of vertically sliding are attached to the adhesive application section. As shown in FIG. 3a, the dispenser 4at/C is equipped with two nozzles with small diameter pipes for discharging a small amount of M detergent 6a in order to mount the small parts 6, and the dispenser 4b is equipped with a third nozzle. As shown in the figure, two nozzles with large diameters for discharging a large amount of adhesive are attached to attach a large component 7, and a dispenser can be selected according to the size and shape of the chip component. Arm 3
is rotated by a driving cylinder 8, and the two dispensers +a and 4b move along the groove 9a of the grate 9. The XY table 2 brings the printed circuit board to a predetermined position directly below the dispenser located in the center of the plate 9, and the dispenser descends until the nozzle 10 touches the printed circuit board, discharging the adhesive h from the nozzle 1o. The printed circuit board on which the adhesive has been applied is conveyed out of the adhesive coating apparatus by a vertically movable substrate unloading section 11.
発明が解決しようとする問題点
しかしながら上記のような構成では、XYテーブルがプ
リント基板の流れと平行な方向にも移動するのでプリン
ト基板をXYテーブル搬入し搬出するレールはXYテー
ブルとの干渉を避けるために、レール全上下動させる駆
動を有した専用の基板搬入部と基板搬出部を備えておら
ねばならず接着剤塗布装置全体の寸法が大変大きくなっ
ているという問題点を有していた。Problems to be Solved by the Invention However, in the above configuration, the XY table also moves in a direction parallel to the flow of printed circuit boards, so the rails for loading and unloading printed circuit boards into the XY table avoid interference with the XY table. Therefore, it is necessary to have a dedicated board loading section and a board unloading section which have a drive for moving the entire rail up and down, which poses a problem in that the overall size of the adhesive coating device becomes very large.
また近年において増加の傾向を見せている微小チップ部
品に対して専用のディスペンサを設ける必要性が出てき
た。Furthermore, it has become necessary to provide a dedicated dispenser for microchip components, which have been on the rise in recent years.
しかしながら上記のような構成において、アームに取シ
付けるディスペンサの数を増加させるとすると駆動用の
シリンダーでディスペンサの選択を行うには無理がある
ので、アームを回転させる駆動源としてたとえばモータ
ーなどが必要となってくる。従って接着剤塗布部は大型
化し、機構的に複雑になるという問題点を有していた。However, in the above configuration, if the number of dispensers to be attached to the arm is increased, it is impossible to select the dispenser using a driving cylinder, so a motor or the like is required as a drive source to rotate the arm. It becomes. Therefore, the adhesive application section has become large and mechanically complex, which has been a problem.
本発明は、上記問題点に鑑み、専用の基板搬入部と基板
搬出部を必要とせず全体の寸法が大幅に小さくなシなお
かつディスペンサの数音増加させても接着剤塗布部は大
型化せず、機構的にも簡単な接着剤塗布装置全提供する
ものである。In view of the above-mentioned problems, the present invention eliminates the need for a dedicated board loading section and board unloading section, significantly reduces the overall size, and does not increase the size of the adhesive application section even if the dispenser increases several times. The present invention provides an adhesive application device that is mechanically simple.
問題点を解決するだめの手段
上記問題点全解決するために本発明の接着剤塗布装置は
、プリント基板保持可能に設けられ一方向に移動可能な
テーブルを有するテーブル部とテーブルが移動する方向
と垂直方向に複数個整列したディスペンサをもちテーブ
ルの移動方向と垂直方向に移動可能な接着剤塗布部とテ
ーブルを所定位置に移動させ所定のディスペンサを選択
して接着剤を塗布させる制御部とから成る構成?備えた
ものである。Means for Solving the Problems In order to solve all of the above problems, the adhesive applicator of the present invention has a table part which is provided to be able to hold a printed circuit board and is movable in one direction, and a table part which is provided to be able to hold a printed circuit board and which is movable in one direction. It consists of an adhesive applicator that has a plurality of vertically aligned dispensers and is movable in a direction perpendicular to the movement direction of the table, and a control unit that moves the table to a predetermined position, selects a predetermined dispenser, and applies adhesive. composition? It is prepared.
作 用
上記手段による作用は次のようになる。すなわち、テー
ブルは、基板の流れに垂直な方向にしか移動しないので
、上下動可能な基板搬入部と基板搬出部を設けてテーブ
ルとの干渉をさける必要がなくなり接着剤塗布装置全体
の寸法を大幅に小さくすることが可能である。Effect The effect of the above means is as follows. In other words, since the table only moves in the direction perpendicular to the flow of substrates, there is no need to provide a substrate loading section and a substrate loading section that can move up and down to avoid interference with the table, which greatly reduces the overall size of the adhesive applicator. It is possible to make it as small as possible.
また接着剤塗布部はディスペンサを複数個整列してもち
そのディスペンサ選択のための駆動源を必要としないの
で大型化全防げその上、機構的に簡単化が可能である。In addition, since the adhesive application section has a plurality of dispensers arranged in a row and does not require a drive source for selecting the dispensers, it is possible to completely prevent an increase in size and also to simplify the mechanism.
実施例
以下、本発明の一実施例の接着剤塗布装置について図面
を参照しながら説明する。EXAMPLE Hereinafter, an adhesive coating apparatus according to an example of the present invention will be described with reference to the drawings.
第1図は本発明の一実施例における接着剤塗布装置の斜
視図である。第1図において、12はディスペンサガイ
ドで、このディスペンサガイドと上下摺動可能な構造で
3本のディスペンサ13a。FIG. 1 is a perspective view of an adhesive applicator according to an embodiment of the present invention. In FIG. 1, 12 is a dispenser guide, and three dispensers 13a are vertically slidable on this dispenser guide.
13b、13cが取シ付けられている。ディスペンサガ
イド12は摺動可能にボディ14に取り付けられ、ディ
スペンサガイド12の駆動動力全仏えるボールネジ16
はベアリング16を介してボディ14に取りつけられて
いる。ボールネジ16に固定された回転軸プーリー17
は、パルスモータ18に固定されたグー+7−19とベ
ルト2oで結ばれている。テーブル21は、ボディ14
に固定されたガイド22に摺動可能に取9つけられ、テ
ーブルの摺動動力全仏えるポールネジ230回転軸グー
924は、パルスモータ26に固定されたグーリー26
とベルト27で結ばれている。基板搬送レール28a、
28bは、接着剤塗布装置に取シつけられているのでは
なくプリント基板を本装置のテーブル21に搬入できる
位置まで搬送するものである。13b and 13c are attached. The dispenser guide 12 is slidably attached to the body 14, and the entire driving force for the dispenser guide 12 is driven by a ball screw 16.
is attached to the body 14 via a bearing 16. Rotating shaft pulley 17 fixed to ball screw 16
is connected to the gear 7-19 fixed to the pulse motor 18 by a belt 2o. The table 21 is the body 14
The pole screw 230 rotary shaft 924 is slidably attached to the guide 22 fixed to the table, and the rotation shaft 924 of the pole screw 230 receives all the sliding power of the table.
and are connected by a belt 27. board transport rail 28a,
28b is not attached to the adhesive applicator, but is used to transport the printed circuit board to a position where it can be loaded onto the table 21 of this apparatus.
次にこの一実施例の構成における作用を説明する。プリ
ント基板は、テーブル21が基板搬入可能な位置に移動
し終わると基板搬送レール28aによってテーブル21
の上面に搬入される。3本のディスペンサ13a、13
b、j3cは、それぞれ大型部品用、小型部品用、微小
部品用のディスペンサでノズルの形状が異っておシ装着
するチップ部品の形状によりディスペンサを選択できる
。Next, the operation of the configuration of this embodiment will be explained. When the table 21 has moved to a position where the board can be loaded, the printed circuit board is moved to the table 21 by the board transport rail 28a.
is carried onto the top surface of the Three dispensers 13a, 13
b and j3c are dispensers for large parts, small parts, and micro parts, respectively, and the nozzle shapes are different, and the dispenser can be selected depending on the shape of the chip part to be mounted.
パルスモータ18によって回転するボールネジ15でデ
ィスペンサガイド12は、駆動され使用するディスペン
サを基板の所定位置上へ基板流れと平行方向で移動する
ことによってディスペンサの選択はなされる。同時にテ
ーブル21ば、パルスモータ26によって回転するボー
ルネジ23によって基板流れと垂直方向に移動して基板
の所定位置全ディスペンサの整列直線下に移動させる。The dispenser guide 12 is driven by a ball screw 15 rotated by a pulse motor 18, and the dispenser is selected by moving the dispenser to be used onto a predetermined position of the substrate in a direction parallel to the substrate flow. At the same time, the table 21 is moved in a direction perpendicular to the flow of the substrate by a ball screw 23 rotated by a pulse motor 26 to move a predetermined position of the substrate under the alignment line of all dispensers.
基板の所定位置が選択されたディスペンサの真下に移動
した後、ディスペンサはノズル29の先端が基板に接す
るまで降下して接着剤をノズル29から吐出する。接着
剤塗布が終了したプリント基板は、テーブル21が基板
搬出可能な位置に移動し終わると基板搬送レール28b
によってテーブル21の上面から搬出される。After the predetermined position of the substrate has been moved directly below the selected dispenser, the dispenser is lowered until the tip of the nozzle 29 contacts the substrate and the adhesive is discharged from the nozzle 29. Once the table 21 has moved to a position where the board can be unloaded, the printed circuit board that has been coated with adhesive is transferred to the board transport rail 28b.
It is carried out from the top surface of the table 21 by.
この結果、テーブル21が基板流れと垂直方向にしか移
動しないので、従来のように上下動可能な基板搬入部、
基板搬出部は必要としなくなって、接着剤塗布装置全体
の寸法を大幅に小さくなる。As a result, the table 21 moves only in the direction perpendicular to the substrate flow, so the substrate loading section, which can move up and down as in the conventional case,
A substrate carrying-out section is no longer required, and the size of the entire adhesive application device can be significantly reduced.
ディスペンサ選択は、接着剤塗布部を基板流れに平行に
移動させて行うので、ディスペンサの選択?するための
駆動源全接着剤塗布部に搭載する必要がなく機構的に簡
単になる。Dispenser selection is done by moving the adhesive application part parallel to the substrate flow, so it is difficult to select a dispenser. It is not necessary to mount a drive source in all adhesive application parts, which simplifies the mechanism.
発明の効果
以上、本発明は、基板流れと垂直方向にしか移動しない
上記テーブルを設けることによp、基板をテーブルに搬
入、テーブルから搬出する際、テーブルとの干渉をさけ
るためJg@源を設けた上下動可能な基板搬入部、基板
搬出部は必要なく、接着剤塗布装置全体の寸法は大幅に
小さくなる。In addition to the effects of the invention, the present invention provides the above-mentioned table that moves only in the direction perpendicular to the flow of the substrate. There is no need for the vertically movable substrate loading section and substrate loading section, and the size of the entire adhesive coating device can be significantly reduced.
また、本発明は、ディスペンサ選択は、ディスペンサが
複数個整列した接着剤塗布装全体板流れと平行方向に移
動させて行うので、ディスペンサ選択のための駆動源を
接着剤塗布部に搭載する必要がなく機構的に簡単になる
。Further, in the present invention, the dispenser selection is performed by moving the entire adhesive application device in which a plurality of dispensers are arranged in a direction parallel to the plate flow, so it is necessary to mount a drive source for dispenser selection in the adhesive application section. It becomes mechanically simpler.
第1図は本発明の一実施例における接着剤塗布装置の斜
視図、第2図は制御部のブロック図、第3図とおよびb
はチップ部品の装着状態の拡大平面図、第4図は従来の
接着剤塗布装置の斜視図である。
13a、13b、13cmディスペンサ、21・・・・
・・テーブル、22・・・・・・ガイド。
代理人の氏名 弁理士 中 尾 敏 男 ほか1名法
派FIG. 1 is a perspective view of an adhesive applicator according to an embodiment of the present invention, FIG. 2 is a block diagram of a control section, and FIG.
FIG. 4 is an enlarged plan view of a state in which a chip component is mounted, and FIG. 4 is a perspective view of a conventional adhesive application device. 13a, 13b, 13cm dispenser, 21...
...Table, 22...Guide. Name of agent: Patent attorney Toshio Nakao and 1 other law attorney
sect
Claims (1)
ブルを有するテーブル部と、テーブルの移動方向と略垂
直方向に複数個整列した接着剤を塗布するディスペンサ
を有し、テーブルの移動方向と略垂直方向に移動可能な
接着剤塗布部と、テーブルを所定位置に移動させ所定の
ディスペンサを選択して接着剤を塗布させる制御部とか
ら成ることを特徴とする接着剤塗布装置。It has a table part that is capable of holding a substrate and has a table that is movable in one direction, and a plurality of dispensers that apply adhesive arranged in a direction substantially perpendicular to the direction of movement of the table. An adhesive applicator comprising an adhesive applicator that is vertically movable and a control unit that moves a table to a predetermined position and selects a predetermined dispenser to apply adhesive.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62105148A JPH07100147B2 (en) | 1987-04-28 | 1987-04-28 | Adhesive coating device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62105148A JPH07100147B2 (en) | 1987-04-28 | 1987-04-28 | Adhesive coating device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63270574A true JPS63270574A (en) | 1988-11-08 |
JPH07100147B2 JPH07100147B2 (en) | 1995-11-01 |
Family
ID=14399640
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62105148A Expired - Lifetime JPH07100147B2 (en) | 1987-04-28 | 1987-04-28 | Adhesive coating device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH07100147B2 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0461669U (en) * | 1990-10-01 | 1992-05-27 | ||
JP2007275702A (en) * | 2006-04-03 | 2007-10-25 | Yamaha Motor Co Ltd | Coating device |
WO2008150651A1 (en) * | 2007-06-01 | 2008-12-11 | Illinois Tool Works Inc. | Method and apparatus for dispensing a viscous material on a substrate |
US9815081B2 (en) | 2015-02-24 | 2017-11-14 | Illinois Tool Works Inc. | Method of calibrating a dispenser |
CN110767583A (en) * | 2019-11-10 | 2020-02-07 | 朱首红 | Electronic equipment mechanism |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6118196A (en) * | 1984-07-04 | 1986-01-27 | 三洋電機株式会社 | Device for coating paint agent |
JPS6238265A (en) * | 1985-08-12 | 1987-02-19 | Matsushita Electric Ind Co Ltd | Apparatus for applying adhesive |
-
1987
- 1987-04-28 JP JP62105148A patent/JPH07100147B2/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6118196A (en) * | 1984-07-04 | 1986-01-27 | 三洋電機株式会社 | Device for coating paint agent |
JPS6238265A (en) * | 1985-08-12 | 1987-02-19 | Matsushita Electric Ind Co Ltd | Apparatus for applying adhesive |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0461669U (en) * | 1990-10-01 | 1992-05-27 | ||
JP2007275702A (en) * | 2006-04-03 | 2007-10-25 | Yamaha Motor Co Ltd | Coating device |
WO2008150651A1 (en) * | 2007-06-01 | 2008-12-11 | Illinois Tool Works Inc. | Method and apparatus for dispensing a viscous material on a substrate |
GB2462398A (en) * | 2007-06-01 | 2010-02-10 | Illinois Tool Works | Method and apparatus for dispensing a viscous material on a substrate |
GB2462398B (en) * | 2007-06-01 | 2012-01-04 | Illinois Tool Works | Method and apparatus for dispensing a viscous material on a substrate |
US9815081B2 (en) | 2015-02-24 | 2017-11-14 | Illinois Tool Works Inc. | Method of calibrating a dispenser |
US9993838B2 (en) | 2015-02-24 | 2018-06-12 | Illinois Tool Works Inc. | Method of calibrating a dispenser |
US10926287B2 (en) | 2015-02-24 | 2021-02-23 | Illinois Tool Works Inc. | Method of calibrating a dispenser |
CN110767583A (en) * | 2019-11-10 | 2020-02-07 | 朱首红 | Electronic equipment mechanism |
CN110767583B (en) * | 2019-11-10 | 2021-12-21 | 郑鹏程 | Electronic equipment mechanism |
Also Published As
Publication number | Publication date |
---|---|
JPH07100147B2 (en) | 1995-11-01 |
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Legal Events
Date | Code | Title | Description |
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EXPY | Cancellation because of completion of term | ||
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