JPS63265662A - optical printer head - Google Patents
optical printer headInfo
- Publication number
- JPS63265662A JPS63265662A JP62101087A JP10108787A JPS63265662A JP S63265662 A JPS63265662 A JP S63265662A JP 62101087 A JP62101087 A JP 62101087A JP 10108787 A JP10108787 A JP 10108787A JP S63265662 A JPS63265662 A JP S63265662A
- Authority
- JP
- Japan
- Prior art keywords
- height
- led
- array chip
- ceramic substrate
- sla
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 title claims description 14
- 239000000758 substrate Substances 0.000 claims abstract description 36
- 239000000919 ceramic Substances 0.000 claims abstract description 31
- 230000001105 regulatory effect Effects 0.000 claims abstract description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 4
- 229910001374 Invar Inorganic materials 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims description 2
- 230000007613 environmental effect Effects 0.000 abstract description 4
- 238000010276 construction Methods 0.000 abstract 2
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 241000238631 Hexapoda Species 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K15/00—Arrangements for producing a permanent visual presentation of the output data, e.g. computer output printers
- G06K15/02—Arrangements for producing a permanent visual presentation of the output data, e.g. computer output printers using printers
- G06K15/12—Arrangements for producing a permanent visual presentation of the output data, e.g. computer output printers using printers by photographic printing, e.g. by laser printers
- G06K15/1238—Arrangements for producing a permanent visual presentation of the output data, e.g. computer output printers using printers by photographic printing, e.g. by laser printers simultaneously exposing more than one point
- G06K15/1242—Arrangements for producing a permanent visual presentation of the output data, e.g. computer output printers using printers by photographic printing, e.g. by laser printers simultaneously exposing more than one point on one main scanning line
- G06K15/1247—Arrangements for producing a permanent visual presentation of the output data, e.g. computer output printers using printers by photographic printing, e.g. by laser printers simultaneously exposing more than one point on one main scanning line using an array of light sources, e.g. a linear array
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
- B41J2/447—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources
- B41J2/45—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources using light-emitting diode [LED] or laser arrays
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Dot-Matrix Printers And Others (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
- Exposure Or Original Feeding In Electrophotography (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野〕
本発明は光プリンタの露光用光源として使用されるＬＥ
Ｄアレイを搭載した光プリンタヘッドに関するものであ
る。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an LE used as an exposure light source of an optical printer.
The present invention relates to an optical printer head equipped with a D array.
［従来の技術］
第２図は従来の光プリンタヘッドを示す図面であり、第
２図（ａ）は正面図、第２図（ｂ）は第２図（ａ）にお
けるＢ−Ｂ断面図である。[Prior Art] Fig. 2 is a diagram showing a conventional optical printer head, in which Fig. 2(a) is a front view, and Fig. 2(b) is a sectional view taken along line B-B in Fig. 2(a). be.
Ｌ Ｅ Ｄ （Ｌｉｇｈｔ Ｅｍｉｔｔｉｎｇ Ｄｉｏ
ｄｅ）アレイチップ３２及びＬＥＤアレイチップ３２を
駆動するためのドライバＩＣ３３はセラミック基板３１
の上にそれぞれ搭載され、セラミック基板３１は固定板
３０に樹脂等で固定されている。ＬＥＤアレイチップ３
２から発光された光を集光するためのセルフォックレン
ズアレイ（以下ＳＬＡと称す）３４は、固定板３０にネ
ジ３８で固定されたＳＬＡ固定治具３５に偏心ネジ３６
で固定されている。L E D (Light Emitting Dio
de) The driver IC 33 for driving the array chip 32 and the LED array chip 32 is a ceramic substrate 31
The ceramic substrate 31 is fixed to the fixed plate 30 with resin or the like. LED array chip 3
A SELFOC lens array (hereinafter referred to as SLA) 34 for condensing light emitted from 2 is attached to an SLA fixing jig 35 fixed to a fixing plate 30 with screws 38 and an eccentric screw 36.
is fixed.
ここで、□セラミック基板３１は固定板３０に樹脂等で
固定されているが、それぞれの製品によってセラミック
基板３１の高さが異なってしまうため、各製品毎に偏心
ネジ３６で５ＬＡ３４の高さを調整して５ＬＡ３４とＬ
ＥＤアレイチップ３２との焦点距離が最適になるよう設
定しなければならなかった。Here, the □ceramic substrate 31 is fixed to the fixing plate 30 with resin or the like, but since the height of the ceramic substrate 31 differs depending on each product, the height of 5LA34 is adjusted using the eccentric screw 36 for each product. Adjust 5LA34 and L
The focal distance with the ED array chip 32 had to be set to be optimal.
［発明が解決しようとする問題点］
しカシ、ＬＥＤアレイチップ３２と５ＬＡ３４の間隙調
整を行う場合、５ＬＡ３４からの出力光のビームサイズ
をモニタしながらそのビームサイズが最小となるように
偏心ネジ３６の回転角度を調整しなければならず、この
ため量産性が劣るという問題があった。従って、修理、
定期点検等の目的で一度分解した後に再度組立てる場合
でも、同様の調整を行う必要があると共に再現性良く組
立て直すことが困難である。[Problems to be Solved by the Invention] When adjusting the gap between the LED array chip 32 and the 5LA 34, the eccentric screw 36 must be adjusted while monitoring the beam size of the output light from the 5LA 34 so that the beam size is minimized. It is necessary to adjust the rotation angle of the , which causes a problem of poor mass productivity. Therefore, repair,
Even when disassembled and reassembled for the purpose of periodic inspection or the like, it is necessary to make similar adjustments and it is difficult to reassemble with good reproducibility.
又、５ＬＡ３４が固定板３ｏに設けられたＳＬＡ固定治
具３５に偏心ネジ３６で固定されているため、使用環境
の温度変化、振動等により５ＬＡ３４とＬＥＤアレイチ
ップ３２の発光面との距離が変化してしまい、信頼性に
欠けるという問題もあった。In addition, since the 5LA34 is fixed to the SLA fixing jig 35 provided on the fixing plate 3o with an eccentric screw 36, the distance between the 5LA34 and the light emitting surface of the LED array chip 32 changes due to temperature changes, vibrations, etc. in the usage environment. There was also the problem of lack of reliability.
［発明の目的］
本発明の目的は前記した従来技術の問題点を解消し、全
製品のＳＬＡとＬＥＤアレイチップとの焦点距離が最適
且つ均一であり、生産性及び耐環境性を大幅に向上させ
ることができる光プリンタヘッドを提供することにある
。[Object of the Invention] The object of the present invention is to solve the problems of the prior art described above, to ensure that the focal length between the SLA and the LED array chip of all products is optimal and uniform, and to significantly improve productivity and environmental resistance. The object of the present invention is to provide an optical printer head that can
Ｃ問題点を解消するための手段］
本発明の要旨は、セラミック基板の表面にＬＥＤアレイ
チップ、ＬＥＤ駆動用ドライバＩＣ及びこれらを保護す
るためのガラスカバーが設けられ且つ下面に上記ＬＥＤ
アレイチップ及び上記ＬＥＤ駆動用ドライバＩＣと通電
する銅／インバ／銅の３層構造の導体が固定されたＬＥ
Ｄヘッド基板が長手方向に中空部を有する筐体の上記中
空部内に収納され、上記ＬＥＤアレイチップの出力光を
集光するためのＳＬＡが上記筐体の上記中空部の上方に
設けられた長手方向に伸びるスリット内に収納されてな
る光プリンタヘッドにおいて、上記筐体の上記中空部内
には上記セラミック基板表面の高さを規制するための突
起部が設けられ、上記スリット下端には上記ＳＬＡの底
面の高さを規制するための突起部が設けられていること
にある。〔実 施 例〕
第１図に本発明の一実施例を示す。第１図（ａ）は本発
明の光プリンタヘッドの内部構造を示す説明図であり、
第１図（ｂ）は第１図（ａ）におけるＡ−Ａ断面図であ
る。Means for Solving Problem C] The gist of the present invention is that an LED array chip, a driver IC for driving the LED, and a glass cover for protecting these are provided on the surface of a ceramic substrate, and the above-mentioned LED is provided on the bottom surface of the ceramic substrate.
An LE to which a conductor with a three-layer structure of copper/invar/copper is fixed, which conducts electricity with the array chip and the driver IC for driving the LED.
A D head board is housed in the hollow part of a casing having a hollow part in the longitudinal direction, and an SLA for condensing output light of the LED array chip is provided above the hollow part of the casing. In the optical printer head housed in a slit extending in the direction, a protrusion for regulating the height of the surface of the ceramic substrate is provided in the hollow part of the housing, and a protrusion for regulating the height of the surface of the ceramic substrate is provided at the lower end of the slit. The reason is that a protrusion is provided to regulate the height of the bottom surface. [Embodiment] FIG. 1 shows an embodiment of the present invention. FIG. 1(a) is an explanatory diagram showing the internal structure of the optical printer head of the present invention,
FIG. 1(b) is a sectional view taken along the line AA in FIG. 1(a).
セラミック基板１１の表面にはＬＥＤアレイチップ１２
、ＬＥＤ駆動用ドライバＩＣｌ３及びガラスカバー１５
が搭載され、裏面には銅／インバ／銅の三層構造を有す
る導体（以下ＣＩＣと称す）１６が半田付けにより設け
られ、ＬＥＤヘッド基板が構成されている。An LED array chip 12 is mounted on the surface of the ceramic substrate 11.
, LED driver ICl3 and glass cover 15
is mounted, and a conductor (hereinafter referred to as CIC) 16 having a three-layer structure of copper/Invar/copper is provided on the back surface by soldering to constitute an LED head board.
このＣｌＣ１６はＬＥＤアレイチップ１２及びドライバ
ＩＣ２４の底部にそれぞれ配線されたコモンライン及び
グランドライン等の配線パターン（図示せず）の補強ラ
インであり、セラミック基板２２を貫通するスルーホー
ルを通して配線された引出しライン（図示せず）により
セラミック基板２２表面のコモンライン及びグランドラ
インに接続されている。このＣｌＣ１６を設けたことに
より、コモンライン及びグランドラインに大電流を流し
ても、各ラインの抵抗が均一になっているため電圧降下
が起こることがなく、良好な印字が可能となる。更に、
このＣｌＣ１６は良好な放熱効果を有しており、ＬＥＤ
アレイチップ１２及びドライ）＜ Ｉ Ｃを非常に安定
させて動作させることができる。This ClC 16 is a reinforcing line for wiring patterns (not shown) such as a common line and a ground line wired at the bottom of the LED array chip 12 and the driver IC 24, respectively, and is a drawer wired through a through hole penetrating the ceramic substrate 22. It is connected to a common line and a ground line on the surface of the ceramic substrate 22 by a line (not shown). By providing this ClC 16, even if a large current is passed through the common line and the ground line, the resistance of each line is uniform, so no voltage drop occurs, and good printing is possible. Furthermore,
This ClC16 has good heat dissipation effect, and LED
Array chip 12 and dry) < IC can be operated very stably.
上述のＬＥＤヘッド基板は中空部１８を有する筐体１０
内に挿入され、セラミック基板１１は中空部１８の突起
部２０によりその高さが規制されている。なお、セラミ
ック基板１１と突起部２０とのギャップが０．０５關も
あればセラミック基板１１を中空部１８に挿入すること
ができる。また、セラミック基板１１はその厚さを高精
度に加工できるため、中空部１８の突起部２０がセラミ
ック基板１１の下面に位置するようにすることにより、
セラミック基板１１の高さを全製品において一定にする
ことができる。この場合は、セラミック基板１１上方の
中空部１８の幅を広くすることにより、セラミック基板
１１を容易に挿入することができる。なお、図中１７は
ＣｌＣ１６と筐体１０とを電気的に絶縁するための絶縁
シートである。The above-mentioned LED head board has a housing 10 having a hollow part 18.
The height of the ceramic substrate 11 is regulated by the protrusion 20 of the hollow portion 18 . The ceramic substrate 11 can be inserted into the hollow portion 18 if the gap between the ceramic substrate 11 and the protrusion 20 is 0.05 degrees. Furthermore, since the thickness of the ceramic substrate 11 can be processed with high precision, by positioning the protrusion 20 of the hollow portion 18 on the lower surface of the ceramic substrate 11,
The height of the ceramic substrate 11 can be made constant for all products. In this case, by widening the width of the hollow portion 18 above the ceramic substrate 11, the ceramic substrate 11 can be easily inserted. Note that 17 in the figure is an insulating sheet for electrically insulating the ClC 16 and the housing 10.
次に、ＬＥＤアレイチップ１２の出力光を集光するため
の５ＬＡ１４は、筺体１０の中空部１８上方に設けられ
たスリット１９内に収納されており、５ＬＡ１４の底面
高さはスリット１９の下端の突起部２１により規制され
ている。このスリット１９の突起部２１の高さは、この
突起部２１の高さと中空部１８に挿入されたＬＥＤヘッ
ド基板上のＬＥＤアレイチップ１２の発光面の高さとの
差がＳＬＡの焦点距離と一致するように設定されている
。従って、中空部１８の突起部２０がセラミック基板１
１の上にある場合は、初めからセラミック基板１１を挿
入するときに必要なギャップを考慮して加工しておけば
、５ＬＡ１４とＬＥＤアレイチップ１２の発光面との距
離を精度良く６ＬＡ１４の焦点距離に設定することがで
きる。Next, the 5LA 14 for condensing the output light of the LED array chip 12 is housed in a slit 19 provided above the hollow part 18 of the housing 10, and the bottom height of the 5LA 14 is the lower end of the slit 19. It is regulated by the protrusion 21. The height of the protrusion 21 of this slit 19 is such that the difference between the height of this protrusion 21 and the height of the light emitting surface of the LED array chip 12 on the LED head substrate inserted into the hollow part 18 matches the focal length of the SLA. is set to. Therefore, the protrusion 20 of the hollow portion 18
1, if the required gap is taken into consideration when inserting the ceramic substrate 11 from the beginning, the distance between the 5LA14 and the light emitting surface of the LED array chip 12 can be accurately adjusted to the focal length of the 6LA14. Can be set to .
中空部１８の突起部２０がセラミック基板１１の下にあ
る場合は、上記のようなギャップを考慮する必要はない
。If the protrusion 20 of the hollow portion 18 is under the ceramic substrate 11, there is no need to consider the gap as described above.
なお、セラミック基板１１の高さをいくら精度良く規制
しても、ＬＥＤアルイチップ１２自体の高さ或いはセラ
ミック基板１１にＬＥＤアレイチップ１２を固定する際
の半田の厚さがばらついてしまうと、５ＬＡ１４の焦点
とＬＥＤアレイチップ１２の発光面の位置が一致しなく
なってしまうが、各製品におけるＬＥＤアレイチップ１
２の高さの誤差は数μｍ以下であり、また、半田の厚さ
は±０．０１■■の精度を容易に実現することができる
。これは５ＬＡ１４の焦点距離の許容誤差上０．１ｍｍ
に対し、十分な精度を有している。No matter how precisely the height of the ceramic substrate 11 is regulated, if the height of the LED array chip 12 itself or the thickness of the solder used to fix the LED array chip 12 to the ceramic substrate 11 varies, the height of the 5LA14 will vary. Although the focal point and the position of the light emitting surface of the LED array chip 12 do not match, the LED array chip 1 in each product
The error in the height of No. 2 is several μm or less, and the solder thickness can easily achieve an accuracy of ±0.01■■. This is 0.1mm due to the focal length tolerance of 5LA14.
It has sufficient accuracy.
なお、５ＬＡ１４は筺体１０の側面よりネジで固定され
、ＬＥＤヘッド基板（すなわちセラミック基板１１）は
筐体１０の上面よりネジで押付けて固定している。これ
らはいづれも光学的にＬＥＤアレイチップ１２の出力光
の光路を妨げない位置に設けている。Note that the 5LA 14 is fixed with screws from the side surface of the casing 10, and the LED head substrate (that is, the ceramic substrate 11) is pressed and fixed with screws from the top surface of the casing 10. All of these are provided at positions that do not optically obstruct the optical path of the output light of the LED array chip 12.
本実施例では、筺体１０の下部に放熱のためのヒートシ
ンク部を設けており、全体として複雑な構造になってい
るが、この筺体１０はアルミの押出し加工により容易に
高精度なものを得ることがきる。In this embodiment, a heat sink section for heat dissipation is provided at the bottom of the housing 10, and the structure as a whole is complicated. However, this housing 10 can be easily manufactured with high precision by extrusion processing of aluminum. I'm struggling.
このように、本実施例の光プリンタヘッドは、筐体１０
のスリット１９及び中空部１８に５ＬＡ１４の底面高さ
及びＬＥＤアレイチップ１２を搭載したセラミック基板
１１の高さを規制する突起部をそれぞれ設けたことによ
り、５ＬＡ１４の焦点とＬＥＤアレイチップ１２の発光
面の位置を全製品において精度良く一致させることがで
きる。In this way, the optical printer head of this embodiment has a housing 10.
By providing protrusions in the slit 19 and hollow portion 18 of the 5LA 14 to regulate the bottom height of the 5LA 14 and the height of the ceramic substrate 11 on which the LED array chip 12 is mounted, the focal point of the 5LA 14 and the light emitting surface of the LED array chip 12 can be adjusted. The positions of all products can be matched with high accuracy.
また、筐体１０の中空部１８及びスリット１９にＬＥＤ
ヘッド基板及び５ＬＡ１４をそれぞれ挿入固定するだけ
で５ＬＡ１４の焦点とＬＥＤアレイチップ１２の発光面
の位置が一致し、５ＬＡ１４とＬＥＤアレイチップ１２
の発光面との距離を調整する必要がないため、非常に生
産性に優れている。更に、ＬＥＤヘッド基板及び５ＬＡ
１４が高精度に加工された筐体１０の中空部１８及びス
リット１９にそれぞれ挿入固定されているため、使用環
境の温度変化或いは振動に対しても十分耐えることがで
きる。In addition, an LED is installed in the hollow part 18 and slit 19 of the housing 10.
By simply inserting and fixing the head board and 5LA14, the focal point of 5LA14 and the light emitting surface of LED array chip 12 are aligned, and 5LA14 and LED array chip 12 are aligned.
Since there is no need to adjust the distance between the light emitting surface and the light emitting surface, productivity is extremely high. Furthermore, the LED head board and 5LA
14 are inserted and fixed into the hollow part 18 and slit 19 of the housing 10 which are machined with high precision, so that it can sufficiently withstand temperature changes or vibrations in the usage environment.
［発明の効果］
以上に説明した如く、本発明の光プリンタヘッドによれ
ば、次のような顕著な効果を奏する。[Effects of the Invention] As explained above, the optical printer head of the present invention provides the following remarkable effects.
（１） ｆｆ１体のスリット及び中空部にＳＬＡの底
面高さ及びＬＥＤアレイチップを搭載したセラミック基
板の高さを規制する突起部をそれぞれ設けたことにより
、ＳＬＡの焦点とＬＥＤアレイチップの発光面の位置を
全製品において精度良く一致させることができる。(1) Protrusions that regulate the bottom height of the SLA and the height of the ceramic substrate on which the LED array chip is mounted are provided in the slit and hollow part of the ff1 body, so that the focal point of the SLA and the light emitting surface of the LED array chip are The positions of all products can be matched with high accuracy.
（２） 筐体の中空部及びスリットにＬＥＤヘッド基
板及びＳＬＡをそれぞれ挿入固定するだけでＳＬＡの焦
点とＬＥＤアレイチップの発光面の位置が一致するため
、ＳＬＡとＬＥＤ７レイチツプの発光面との距離を調整
する必要がなく、生産性を大幅に向上させることができ
る。(2) By simply inserting and fixing the LED head board and SLA into the hollow part and slit of the housing, the focal point of the SLA and the light emitting surface of the LED array chip will match, so the distance between the SLA and the light emitting surface of the LED7 array chip will be reduced. There is no need to make any adjustments, and productivity can be greatly improved.
（３） ＬＥＤヘッド基板及びＳＬＡが高精度に加工
された筐体の中空部及びスリットにそれぞれ挿入固定さ
れているため、使用環境の温度変化或いは振動に対して
も十分耐え、耐環境亡を向上させることができる。(3) Since the LED head board and SLA are inserted and fixed into the hollow parts and slits of the highly precisely machined housing, they can withstand temperature changes and vibrations in the usage environment, improving environmental resistance. can be done.
第１図（ａ）は本発明の光プリンタヘッドの内部構造を
示す説明図、第１図（ｂ）は第１図（ａ）におけるＡ−
Ａ断面図、第２図（ａ）は従来の光プリンタヘッドを示
す正面図、第２図（ｂ）は第２図（ａ）におけるＢ−Ｂ
断面図である。
１０：筐体、
１１：セラミック基板、
１２ ： ＬＥＤアレイチップ、
１３：ドライバＩＣ。
１４：セルフ中ツクレンズアレイ（ＳＬＡ）、１５ニガ
ラスカバー、
１６：ＣＩＣ。
１７：絶縁シート、
１８：中空部、
１９ニスリツト、
２０．２１：突起部。
第１図
（蟲）
→＾
第２図
（ｂ）
ＡFIG. 1(a) is an explanatory diagram showing the internal structure of the optical printer head of the present invention, and FIG. 1(b) is an A-
A sectional view, FIG. 2(a) is a front view showing a conventional optical printer head, and FIG. 2(b) is a sectional view taken along line B-B in FIG. 2(a).
FIG. 10: Housing, 11: Ceramic substrate, 12: LED array chip, 13: Driver IC. 14: Self-cleaning lens array (SLA), 15 Ni glass cover, 16: CIC. 17: Insulating sheet, 18: Hollow part, 19 Nislit, 20.21: Protrusion part. Figure 1 (Insect) →^ Figure 2 (b) A
Claims (1)
ＥＤ駆動用ドライバＩＣ及びこれらを保護するためのガ
ラスカバーが設けられ且つ下面に前記ＬＥＤアレイチッ
プ及び前記ＬＥＤ駆動用ドライバＩＣと通電する銅／イ
ンバ／銅の３層構造の導体が固定された ＬＥＤヘッド基板が長手方向に中空部を有する筺体の前
記中空部内に収納され、前記 ＬＥＤアレイチップの出力光を集光するためのセルフォ
ックレンズアレイが前記筐体の前記中空部の上方に設け
られた長手方向に伸びるスリット内に収納されてなる光
プリンタヘッドにおいて、前記筐体の前記中空部内には
前記セラミック基板の高さを規制するための突起部が設
けられ、前記スリット下端には前記セルフォックレンズ
アレイの底面の高さを規制するための突起部が設けられ
ていることを特徴とする光プリンタヘッド。(1) LED array chip, L on the surface of the ceramic substrate
An LED which is provided with a driver IC for driving an ED and a glass cover to protect them, and has a conductor with a three-layer structure of copper/Invar/copper fixed to the lower surface of the LED array chip and the driver IC for driving the LED, which conducts electricity. A head substrate is housed in the hollow part of a housing having a hollow part in the longitudinal direction, and a SELFOC lens array for condensing output light of the LED array chip is provided above the hollow part of the housing. In an optical printer head housed in a slit extending in the longitudinal direction, a protrusion for regulating the height of the ceramic substrate is provided in the hollow portion of the housing, and the self-locking plate is provided at the lower end of the slit. An optical printer head characterized in that a protrusion is provided for regulating the height of the bottom surface of a lens array.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62101087A JPS63265662A (en) | 1987-04-23 | 1987-04-23 | optical printer head |
| US07/184,074 US4829321A (en) | 1987-04-23 | 1988-04-20 | Optical printer head with a light emitting diode array |
| US07/315,055 US4905021A (en) | 1987-04-23 | 1989-02-24 | Optical printer head with a light emitting diode array |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62101087A JPS63265662A (en) | 1987-04-23 | 1987-04-23 | optical printer head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63265662A true JPS63265662A (en) | 1988-11-02 |
Family
ID=14291315
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62101087A Pending JPS63265662A (en) | 1987-04-23 | 1987-04-23 | optical printer head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63265662A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02215171A (en) * | 1989-02-15 | 1990-08-28 | Sharp Corp | Light emitting element array light source |
| JPH03250194A (en) * | 1990-02-27 | 1991-11-07 | Taisei Corp | Construction method of shaft and shaft excavation device |
| JPH03129450U (en) * | 1990-04-09 | 1991-12-26 | ||
| JPH047145U (en) * | 1990-05-07 | 1992-01-22 | ||
| JP2008507150A (en) * | 2004-07-19 | 2008-03-06 | ラミナ ライティング インコーポレーテッド | LED array package with internal feedback and control |
-
1987
- 1987-04-23 JP JP62101087A patent/JPS63265662A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02215171A (en) * | 1989-02-15 | 1990-08-28 | Sharp Corp | Light emitting element array light source |
| JPH03250194A (en) * | 1990-02-27 | 1991-11-07 | Taisei Corp | Construction method of shaft and shaft excavation device |
| JPH03129450U (en) * | 1990-04-09 | 1991-12-26 | ||
| JPH047145U (en) * | 1990-05-07 | 1992-01-22 | ||
| JP2008507150A (en) * | 2004-07-19 | 2008-03-06 | ラミナ ライティング インコーポレーテッド | LED array package with internal feedback and control |
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