JPS63262861A - Cooling body for semiconductor element - Google Patents

Abstract

PURPOSE:To obtain a cooling body having high efficiency and low fluid loss by spirally formimg a through-path between both side faces, feeding a refrigerant from the center of the cooling body and flowing the refrigerant through the through-path. CONSTITUTION:Cooling water is fed from an inlet 13, and divided into two at the central section of a cooling body through a water channel 18 and supplied to a spiral through-path 15 in both surfaces by a water channel 17, thus cooling a semiconductor element. Water after cooling is collected by a water channel 20 at a terminal section 19, and drained from an outlet 14 through a water channel 21. According to the constitution, the spiral through-paths are shaped in both surfaces, thus increasing a contact area with a refrigerant, then lowering fluid loss. The refrigerant is fed from the central section of the cooling body, thus augmenting the contact area, then also improving cooling efficiency.

Description

Detailed Description of the Invention [Objective of the Invention] (Industrial Field of Application) The present invention relates to a cooling body that cools a semiconductor device by bringing it into contact with both sides of a flat semiconductor device having contact electrodes on both sides. The present invention relates to a cooling body for a semiconductor device, which cools a semiconductor element by causing a liquid medium, such as water, to flow through the inside of the cooling body.

(Prior art) The recent development of semiconductor devices has been remarkable, with larger currents, higher voltages, and larger capacities being achieved year by year.Currently, 40
00V-3000A or higher semiconductor devices have been developed and put into practical use. In such a large capacity semiconductor element, a heat loss of several K1 or more occurs from a small electrode surface of only a few tens of aJ.

Therefore, in semiconductors, a more efficient cooling body is required to dissipate a large amount of heat from such a small electrode surface.

A conventional internal flow-through cooling body using a liquid of this type will be explained below with reference to FIGS. 4, 5, and 6. - As shown in FIG. 4, the internal flow type cooling body 1 is alternately stacked with flat semiconductor devices 2 such as diodes, thyristors, GTOs, etc. in the form of a stack 4, and is pressed against both ends of the stack 4 with a pressure of several tons. The cooling body 1 is connected to the next cooling body by an insulating pipe 3. In the tap 4 configured in this manner, the cooling medium 5, for example, water, is supplied to the cooling body 1 via the insulating main vibro, and passes through the cooling body through the insulated pipe 3 in order to cool the semiconductor element 2. , and circulates through the insulated main vibro to the heat exchanger 7. Note that 8 is a circulation pump that circulates the cooling medium.

The conventional cooling body 1 constructed in this manner is realized, for example, by forming a flow passage 9 in a block of copper or aluminum having good thermal conductivity, as shown in FIG.

Water, which is the cooling medium 5, flows in from the opening 10 and is cooled by absorbing the heat emitted from the semiconductor element 2 while passing through the through-flow passage 9 provided in the cooling body 1. It acts as if it flows out from IO.

Further, as shown in FIG. 6, the cooling body 1 is realized by bending a copper or aluminum tube 11 into a meandering shape to form a through-flow passage 9, and casting the entire tube 11 from a metal with good thermal conductivity. Sometimes I did.

In this way, in the conventional cooling body 1, the through-flow passage 9 is made as long as possible in a meandering shape in order to increase the contact area with the cooling medium as much as possible and enhance the cooling effect.

(Problems to be Solved by the Invention) As described above, in the conventional cooling body 1, the through-flow passage 9 is lengthened in a meandering manner to increase the contact area. Currently, there is a limit to the amount of cooling that can be achieved, and it cannot be said that the surface of the cooling body that comes into contact with the semiconductor element is effectively cooled.

Furthermore, if the winding is made into a meandering shape and the bend is steep, the fluid loss increases, so there is also the drawback that the capacity of the cooling medium circulation pump must be increased.

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems by providing a cooling body for semiconductor devices that has a through-flow passageway with high cooling efficiency and low fluid loss.

[Structure of the invention]

(Means for solving the problem) The through-flow passage is configured in a spiral shape, and the through-flow passage is provided on both sides of the cooling body. Further, a passage for the cooling medium is provided so that the cooling medium is supplied from the center of the cooling body and drained from the outer periphery of the cooling body through the spiral flow passage.

(Function) The contact area of the cooling medium can be greatly increased by forming the through-flow passage in a spiral shape and providing it on both sides of the cooling body. Furthermore, the spiral-shaped through-flow passage eliminates sharp bends and reduces fluid loss.

In addition, the cooling medium flows from the center of the cooling body through the spiral-shaped through passage, which means that the center of the cooling body, which is in contact with the center of the semiconductor element, which is the hottest part, has the lowest temperature. A cooling medium is supplied, resulting in a cooling body with high cooling efficiency.

(Example) The details of the present invention will be explained below with reference to FIG.

FIG. 1 is a block diagram showing an embodiment of the present invention.

In this embodiment, the semiconductor element cooling body is composed of three parts.

The central portion 12 has an inlet 13 for the cooling medium and an outlet for the output 14, and a spiral through passage 15 is provided on both surfaces. The space between this spiral-shaped through-flow passage 15 is a predetermined distance from zero (only the wall thickness of the passage), and the center portion 16 of this through-flow passage 15 is provided with a water channel 17 that connects both surfaces. A water channel 18 from the cooling medium inlet 13 is provided in the center of the cooling medium inlet 17 .

Furthermore, a water channel 20 is also provided at the terminal end 19 of the spiral through passage 15 for connecting both ends of the spiral through passage.
A water channel 21 to the coolant output 14 is provided in the center of the water channel 20 .

A cooling body is constructed by brazing the left and right side plates 22 and 23 to the central portion 12 described above.

The operation of the cooling body of the present invention constructed as described above will be explained below.

A cooling medium, for example water, is supplied through the inlet 13 and first reaches the center of the cooling body through a water channel 18. Here, it is divided into two parts and supplied to the spiral through-flow passages 15 on both surfaces by a waterway 17. The water that has cooled the semiconductor device through the spiral flow passages on both surfaces is collected again at the water channel 20 at the terminal end 19, passes through the water channel 21, and is drained from the outlet 14.

In the embodiment employing the present invention, the through-flow passage 15 is spiral-shaped and provided on both surfaces, so that the contact area of the cooling medium can be significantly increased. Moreover, in order to satisfy the required thermal resistance value, it is possible to cope with this by increasing the number of turns of the spiral-shaped through-flow passage. Further, since the spiral flow passage has little fluid loss, the load on the pump can be reduced.

Furthermore, since the cooling medium flows from the center of the cooling body toward the periphery, the coolant with the lowest temperature is supplied to the center of the cooling body, which has the highest temperature.

High cooling efficiency.

FIG. 2 shows one of the other embodiments of the present invention.

In this embodiment, it is constructed of a rectangular metal tube having the cross-sectional structure shown in FIG. 3, which is commonly sold. This metal tube has parallel water channels 24 and 25 as shown in FIG. Therefore, this metal tube is wound in a spiral shape as shown in FIG. 2, and the gaps are soldered. Note that both ends of this metal tube are capped at the water channels 24 and 25 to seal the water channels.

Next, a water inlet section 13 and an outlet section 14 are provided. Entrance part 1
3 is a water channel 24 from the outer circumference of the spirally shaped square.
Make a hole between 25 and the 6th water channel 24.
A vertical hole 26 is made in the center in order to form a waterway connecting the pipe 25 and the pipe 25. After connecting the water channels 24 and 25, they are sealed with a metal lid 27 as shown in the figure to prevent water from leaking. The outlet section 14 can be constructed in a similar manner.

In this embodiment, a commonly sold square metal tube is used, so unlike the previous embodiment, there is no need for a metal tube, etc., and the number of spirals can be adjusted freely, so the cooling body can be adjusted to match the contact area of the semiconductor element. It also has the advantage that it can be manufactured. In other words, the economic efficiency and manufacturability of the heat sink can be significantly improved.

〔Effect of the invention〕

As described above, since the cooling body employing the present invention has spiral flow passages on both sides, the contact area with the cooling medium is large and the fluid loss is low.

Furthermore, since the cooling medium is supplied from the center of the cooling body, in combination with the large contact area, the cooling body can have high cooling efficiency.

[BRIEF DESCRIPTION OF THE DRAWINGS] Fig. 1 is a block diagram of one embodiment of a cooling body adopting the present invention, Fig. 2 is a block diagram of another embodiment adopting the present invention, and Fig. 3 is a block diagram of an embodiment of a cooling body adopting the present invention.
The figure is a cross-sectional view of the square pipe used in the embodiment shown in Fig. 2.
The figure is a cooling system diagram for explaining where the cooling body is used, FIG. 5 is a configuration diagram showing an example of a conventional cooling body, and FIG. 6 is a configuration diagram showing another example of a conventional cooling body. 1... Internal once-through cooling body 2... Flat semiconductor element 3
... Insulated pipe 5 ... Cooling medium 9 ... Through-flow passage 11 ... Pipe 12 ... Central part
13...Entrance 14...Exit 1
5... Spiral-shaped through passage 16... Center part
17... Waterway 18... Waterway 19
...Terminal part 20...Waterway 21...
Waterway 22.23... Waterway 24, 25...
・Waterway 26... Vertical hole 27... Lid Fig. 1 Side view Plan view Fig. 2 Fig. 3 Fig. 4 Fig. 5

Claims (1)

[Claims] A cooling body that has a structure in which a cooling medium is passed through the cooling body, and has a cooling medium inlet and an outlet on the side of the cooling body, and a passage from the cooling medium inlet to the center of the cooling body, and a connection to the passage at the center of the cooling body. The cooling body has a passageway for dividing the cooling medium between the two surfaces of the cooling body, and a through-flow passageway on both surfaces of the cooling body, which is designed so that the cooling medium flows in a spiral shape starting from the surface of the cooling body of this passage, A cooling body for a semiconductor device, characterized in that it has a passage for connecting the cooling medium on both surfaces of the cooling body into one at the end of the spiral through-flow passage, and a passage connecting the passage and a cooling medium outlet.