JPS63259067A - Production of thin zinc sulfide film - Google Patents
Production of thin zinc sulfide filmInfo
- Publication number
- JPS63259067A JPS63259067A JP9139987A JP9139987A JPS63259067A JP S63259067 A JPS63259067 A JP S63259067A JP 9139987 A JP9139987 A JP 9139987A JP 9139987 A JP9139987 A JP 9139987A JP S63259067 A JPS63259067 A JP S63259067A
- Authority
- JP
- Japan
- Prior art keywords
- zinc sulfide
- active substance
- substrate
- zns
- thin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052984 zinc sulfide Inorganic materials 0.000 title claims description 62
- 239000005083 Zinc sulfide Substances 0.000 title claims description 58
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 title claims description 58
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 239000000758 substrate Substances 0.000 claims abstract description 48
- 239000013543 active substance Substances 0.000 claims abstract description 35
- 238000001704 evaporation Methods 0.000 claims abstract description 15
- 230000008020 evaporation Effects 0.000 claims abstract description 12
- 238000010438 heat treatment Methods 0.000 claims abstract description 7
- 239000010408 film Substances 0.000 claims description 33
- 239000010409 thin film Substances 0.000 claims description 33
- 230000008021 deposition Effects 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 17
- 238000005259 measurement Methods 0.000 claims description 3
- 238000012544 monitoring process Methods 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 238000007740 vapor deposition Methods 0.000 abstract description 8
- 239000010453 quartz Substances 0.000 abstract description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 6
- 108091008695 photoreceptors Proteins 0.000 abstract 1
- 230000001105 regulatory effect Effects 0.000 abstract 1
- 238000000151 deposition Methods 0.000 description 23
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 11
- 239000013078 crystal Substances 0.000 description 6
- 238000010894 electron beam technology Methods 0.000 description 6
- 239000011149 active material Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 239000012788 optical film Substances 0.000 description 5
- 230000007423 decrease Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 241001333909 Soter Species 0.000 description 2
- 238000005566 electron beam evaporation Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 241000894006 Bacteria Species 0.000 description 1
- NYZGMENMNUBUFC-UHFFFAOYSA-N P.[S-2].[Zn+2] Chemical compound P.[S-2].[Zn+2] NYZGMENMNUBUFC-UHFFFAOYSA-N 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明はエレクトロルミネッセンス素子(EL素子)な
どに用いられる硫化亜鉛薄膜の製造方法に関し、特に所
定濃度に制御された活性物質を含む硫化亜鉛薄膜を所定
膜厚作成するのに適した硫化亜鉛薄膜を製造する方法に
関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for producing a zinc sulfide thin film used in electroluminescent devices (EL devices), and particularly to a zinc sulfide thin film containing an active substance whose concentration is controlled to a predetermined concentration. The present invention relates to a method for manufacturing a zinc sulfide thin film suitable for forming a zinc sulfide thin film with a predetermined thickness.
[従来の技術]
Mn、Cu+ Ag+ Tb、Sm+ CIなどの活性
物質を含む硫化亜鉛蛍光体薄膜は最近エレクトロルミネ
ッセンス(E L)素子の発光層としてよ(使用されて
いる。[Prior Art] Zinc sulfide phosphor thin films containing active materials such as Mn, Cu+Ag+Tb, and Sm+CI have recently been used as light-emitting layers in electroluminescent (EL) devices.
該蛍光体薄膜を製造する方法としては、活性物質を含む
硫化亜鉛焼結体に電子ビームを照射し、加熱蒸着させる
電子ビーム蒸着法や硫化亜鉛と活性物質をそれぞれ別の
るつぼに入れ加熱蒸発させる2源蒸着法が用いられてい
た。The method for producing the phosphor thin film includes an electron beam evaporation method in which a zinc sulfide sintered body containing an active substance is irradiated with an electron beam and heated to evaporate, or a method in which zinc sulfide and the active substance are placed in separate crucibles and heated to evaporate. A two-source deposition method was used.
しかし電子ビーム蒸着法では、硫化亜鉛と活性物質との
蒸気圧の差により、焼結体中の活性物質と形成した薄膜
の活性物質20度が同一でな(、また膜厚方向に濃度勾
配が生しる問題があった。そこで、最近では、硫化亜鉛
と活性物質を別々の蒸発源から同時に蒸発させ、堆積速
度と堆積時間をそれぞれ独立に制御することにより所定
の715度の活性物質を含んだ蛍光体薄膜を所定の膜厚
たけ製造できる2#、薄石法が用いられるようになって
きた。その際従来の2源Ha法では、第2図に示すよう
に2つの膜厚計8,14を遮へい板7などを用いて互い
に混合しないように設置して硫化亜鉛と活性物質の膜厚
計4への堆積速度をそれぞれ独立に測定し、そして膜厚
計8,14への堆積速度から基板上への堆積速度を推定
していた。However, in the electron beam evaporation method, due to the difference in vapor pressure between zinc sulfide and the active material, the active material in the sintered body and the active material in the formed thin film do not have the same 20 degree angle (and the concentration gradient in the film thickness direction). Therefore, recently, zinc sulfide and the active substance were simultaneously evaporated from separate evaporation sources, and the deposition rate and deposition time were independently controlled to achieve a predetermined 715 degree concentration of the active substance. However, the 2# thin stone method, which can produce a phosphor thin film to a predetermined thickness, has come into use.At this time, in the conventional two-source Ha method, two film thickness gauges 8 are used as shown in Figure 2. , 14 are installed using a shielding plate 7 or the like so that they do not mix with each other, and the deposition rates of zinc sulfide and the active substance on the film thickness gauge 4 are measured independently. The deposition rate on the substrate was estimated from
膜厚計としては、水晶振動子の周波数の差から水晶振動
子への堆積膜厚を算出する水冷装置等を供なう水晶振動
子膜厚計、あるいは膜内の光学的干渉効果による透過光
の増域から膜の膜厚を算出する光学式膜厚計が一般に用
いられている。As a film thickness meter, a quartz crystal oscillator film thickness meter with a water cooling device that calculates the thickness of the deposited film on the quartz crystal oscillator from the difference in the frequency of the quartz oscillator, or a quartz crystal oscillator film thickness meter that uses the optical interference effect in the film to calculate the thickness of the deposited film on the quartz crystal oscillator. An optical film thickness meter that calculates the film thickness from the increase in the area of the film is generally used.
[発明が解決しようとする問題点コ
しかし、膜厚計は硫化亜鉛と活性物質をそれぞれ独立に
4(す定する必要上、基板とは離れた位置に設定されて
おり、膜厚計と基板の温度は異なっているのが普通であ
る。このような場合、実際のJJ根板上の堆積速度を求
めるには膜厚計から得た堆積速度に基板の付着係数を考
慮して補正を加える必要がある。[Problems to be Solved by the Invention] However, because the film thickness meter needs to measure zinc sulfide and the active substance independently, it is set at a distance from the substrate; Normally, the temperatures of the two layers are different.In such cases, to determine the actual deposition rate on the JJ root plate, the deposition rate obtained from the film thickness meter must be corrected by taking into account the adhesion coefficient of the substrate. There is a need.
しかし、硫化亜鉛は基板上で再蒸発しやすく付τを係数
は第3図に示すように基板温度に依存することがわかっ
ている。また別の研究により、高輝度で長寿命なEL用
蛍光体薄膜を製造するには第3図においてAA’で示す
基板の温度領域が適当であることがわかっており、この
ような温度領域ではZnSはわずかな温度差が大きな付
着係数の差を生じる。それに対し一般にMr>等の活性
物質は、AA’の温度領域では付着係数はほぼ一定であ
る。However, it has been found that zinc sulfide tends to reevaporate on the substrate and the coefficient of τ depends on the substrate temperature as shown in FIG. In addition, another study has revealed that the temperature range of the substrate indicated by AA' in Figure 3 is appropriate for producing a high-brightness, long-life phosphor thin film for EL. In ZnS, a small temperature difference causes a large difference in adhesion coefficient. On the other hand, active substances such as Mr> generally have a nearly constant adhesion coefficient in the temperature range of AA'.
ところが、真空中で、しかもEL用ガラス基板のように
赤外線を透過するような基板では、基板の温度を一定に
保つのは難しく再現性も悪い。そのため、±10℃程度
の基板温度の誤差は製造上避けることができない。しか
し、そのわすかな温度誤差が硫化亜鉛については先はど
述べたように±30%程度の付着係数の誤差、しいては
堆積誤差を生み、最終的に蛍光薄膜の組成、膜厚の大き
な誤差を生む原因となっていた。又蛍光体薄膜の組成は
ELの発光効率を支配する最も大きなパラメータであり
、また蛍光体薄膜の膜厚はELの駆動填圧を左右する重
要なパラメータであり、さきの原因で生じた蛍光薄膜の
組成および膜厚のばらつきは、EL用蛍光体薄膜製造上
の歩留を下げる大きな原因となっていた。However, in a vacuum and with a substrate that transmits infrared rays, such as an EL glass substrate, it is difficult to maintain a constant temperature of the substrate and the reproducibility is poor. Therefore, an error in substrate temperature of about ±10° C. cannot be avoided in manufacturing. However, as mentioned earlier, this slight temperature error causes an error in the adhesion coefficient of about ±30% for zinc sulfide, and also a deposition error, which ultimately leads to large errors in the composition and thickness of the fluorescent thin film. It was the cause of. In addition, the composition of the phosphor thin film is the most important parameter that controls the luminous efficiency of EL, and the thickness of the phosphor thin film is an important parameter that affects the driving pressure of EL. Variations in composition and film thickness have been a major cause of lowering the yield in manufacturing EL phosphor thin films.
口問題点を解決するための手段]
本発明は、真空装置内で硫化亜鉛と活性物質とを別々の
蒸発源から蒸発させて、該真空装置内に加熱保持された
基板」二に該活性物質を含む硫化亜鉛薄膜を形成する硫
化亜鉛薄膜の製造方法において、硫化亜鉛用蒸着源から
蒸発した硫化亜鉛が直接到達しない位置に置かれた活性
物質用膜厚計に形成される蒸着膜の蒸着速度から活性物
質の蒸発速度を測定するとともに、該基板近くであって
該基板とほぼ等しい温度に保持されたモニター用基板又
は該基板の上に形成された該活性物質を含む硫化亜鉛薄
膜の形成速度から活性物質を含んだ硫化亜鉛のi着速度
を測定し、該測定結果に基づき活性物質および/または
硫化亜鉛用蒸発源の加熱変化させ゛C蒸看膜中の活性物
質のl0度を所定の濃度に保持することを特徴とする硫
化亜鉛薄膜の製造方法である。[Means for Solving the Problem] The present invention evaporates zinc sulfide and an active substance from separate evaporation sources in a vacuum apparatus, and then heats and holds the substrate in the vacuum apparatus. In the method for manufacturing a zinc sulfide thin film that forms a zinc sulfide thin film containing zinc sulfide, the evaporation rate of the evaporated film formed on the active substance film thickness gauge placed in a position where the zinc sulfide evaporated from the zinc sulfide evaporation source does not reach directly. In addition to measuring the evaporation rate of the active substance from the substrate, the formation rate of a zinc sulfide thin film containing the active substance formed on a monitoring substrate that is near the substrate and held at approximately the same temperature as the substrate or on the substrate. The deposition rate of zinc sulfide containing the active material is measured from This is a method for producing a zinc sulfide thin film characterized by maintaining the concentration at a certain level.
前述のとうり、活性物質の硫化亜鉛薄膜蒸着時の基板温
度領域での付着係数はほぼ一定であり、硫化亜鉛の付着
係数が大きく変化する。そこで蒸着膜中の活性物質の濃
度を所定のla度に保持する方法としては、前記2つの
蒸着速度の測定結果に基づき、■活性物質の加熱は変化
させずに硫化亜鉛の加熱を変化させる方法。■活性物質
の加熱を変化させ硫化亜鉛の加熱を変化させる方法。■
活性物質および硫化亜鉛の加熱を同時に変化させる方法
等が考えられる。As described above, the adhesion coefficient in the substrate temperature range when depositing a thin film of zinc sulfide as an active substance is approximately constant, and the adhesion coefficient of zinc sulfide varies greatly. Therefore, as a method for maintaining the concentration of the active substance in the deposited film at a predetermined la degree, based on the above two measurement results of the vapor deposition rate, there is a method of: 1) changing the heating of zinc sulfide without changing the heating of the active substance; . ■A method of changing the heating of zinc sulfide by changing the heating of the active substance. ■
Possible methods include changing the heating of the active substance and zinc sulfide at the same time.
該基板又は該モニター用基板上に形成される硫化亜鉛膜
の成長速度の測定方法としては、硫化亜鉛膜の膜内干渉
効果に基づく透過光の増減量を用いたものが、非接触で
しかも正確な膜厚変化をオンタイムで測定できるので好
ましい。As a method for measuring the growth rate of the zinc sulfide film formed on the substrate or the monitoring substrate, there is a non-contact and accurate method of measuring the growth rate of the zinc sulfide film based on the intra-film interference effect of the zinc sulfide film. This is preferable because it allows for on-time measurement of changes in film thickness.
モニター用基板に形成される硫化亜鉛膜を測定する場合
、該モニター用基板の温度は製品として使用する基板が
保持されている温度と同一の温度に保持されることが望
ましいが、±3℃程度の温度差程度であれば、本発明の
効果はさほど低下しない。When measuring the zinc sulfide film formed on a monitor substrate, it is desirable that the temperature of the monitor substrate be maintained at the same temperature as the substrate used as a product, but approximately ±3°C. If the temperature difference is about , the effect of the present invention will not decrease much.
[作 用コ
本発明によればその時の基板温度に応じた基板への堆積
速度を直接的に?!11I定することができるので、従
来基板温度の誤差によって生じていた堆積速度のばらつ
きを硫化亜鉛の蒸発源の温度をコントロールすることに
より補正するこ七が可能となった。[According to the present invention, the deposition rate on the substrate can be directly adjusted according to the substrate temperature at that time. ! By controlling the temperature of the zinc sulfide evaporation source, it has become possible to correct the variation in deposition rate that conventionally occurred due to an error in the substrate temperature.
この方法の問題点は、硫化亜鉛を独立ではな(活性物質
を含んだ形で測定する点にあるが、通常蛍光体薄膜中に
含まれる活性物質の量は、2 w t%以下であり、特
に活性物質かMnの場合の最適濃度は0.5wt%程度
でありこのような薄膜は膜厚測定上硫化亜鉛単体と考え
てさしつかえない。The problem with this method is that zinc sulfide is measured in a form that contains the active substance, but the amount of active substance contained in the phosphor thin film is usually less than 2 wt%. In particular, in the case of the active substance Mn, the optimum concentration is about 0.5 wt%, and such a thin film can be considered to be zinc sulfide alone when measuring the film thickness.
[実 施 例コ
活性物質にMnを0.5wt%含んだ黄橙色の発光をす
るEL用ZnS蛍光体薄膜を580nm蒸着した例を第
1図を用いて説明する。[Example] An example in which a ZnS phosphor thin film for EL, which contains 0.5 wt % Mn as a co-active substance and emits yellow-orange light, is deposited to a thickness of 580 nm will be described with reference to FIG.
ガラス基板(コーニング7059)上にITO1窒化け
い素をそれぞれ成膜したものを蒸着用基板6として用い
た。モニター基板3は、基板6のすぐ傍に設置し、基板
6と同じ材質、構造のものを用いた。これは、モニター
基板3と基板6の温度を同一にするためである。モニタ
ー基板3および基板6はいずれもヒーター5により30
0℃程度に加熱した。るつぼ9に焼結した硫化亜鉛10
および溶融Mn1lを入れ、電子ビームにより加熱を行
ない充分な脱ガスを行なった。A glass substrate (Corning 7059) on which films of ITO and silicon nitride were respectively formed was used as the deposition substrate 6. The monitor board 3 was installed immediately adjacent to the board 6, and was made of the same material and structure as the board 6. This is to make the temperatures of the monitor board 3 and the board 6 the same. Both the monitor board 3 and the board 6 are heated to 30° by the heater 5.
It was heated to about 0°C. Zinc sulfide 10 sintered in crucible 9
Then, 1 liter of molten Mn was added and heated with an electron beam to perform sufficient degassing.
Mnの堆積速度は水晶振動子膜厚計8により、またMn
を含む硫化亜鉛の堆積速度は光源4、モニター基板3、
フィルター2、受光器1からなる光学式膜厚計でそれぞ
れ測定した。The deposition rate of Mn was determined by the crystal oscillator film thickness meter 8, and the Mn
The deposition rate of zinc sulfide containing
Each was measured using an optical film thickness meter consisting of 2 filters and 1 light receiver.
光学式膜厚計ではモニター基板3上の膜厚の増加と共に
、校内干渉効果により透過光が周期的に増減する。In the optical film thickness meter, as the film thickness on the monitor substrate 3 increases, the transmitted light periodically increases or decreases due to the internal interference effect.
透過光をフィルタ2により580nmの波長の単色光に
すると半周期の透過光変化は波長の1/4つまり145
nmの膜厚と屈折率の積(約2゜1)に相当する。58
0nm蒸着するには約4周期分変化させればよい。When the transmitted light is converted into monochromatic light with a wavelength of 580 nm by filter 2, the change in transmitted light in a half cycle is 1/4 of the wavelength, or 145
This corresponds to the product of the film thickness in nm and the refractive index (approximately 2°1). 58
In order to deposit 0 nm, it is sufficient to change it by about 4 cycles.
この実施例では、12分間で580nmvつまり3分間
で1周期変化させることを目標として初期の電子ビーム
パワー6kV、40mAを硫化亜鉛に投入した。In this example, an initial electron beam power of 6 kV and 40 mA was applied to zinc sulfide with the goal of changing 580 nmv in 12 minutes, that is, one cycle in 3 minutes.
Mrlについても、12分間で580nmの硫化亜鉛の
0.5wt%に相当するMnが膜中に入るように過去の
平均的なパワー8kV、60mAを初期パワーとして投
入した。基板用シャッター12を開放し、次にその後ま
ず硫化亜鉛のるつぼ7ヤソター13を開け、モニター基
板3上に硫化亜鉛が堆積し始めるのを光学式膜厚計で確
認した後にMn側のるつぼ7ヤツタ13を開いた。この
ようにるつぼンヤソタ13を開ける時期をずらすのは、
硫化亜鉛は、Mr+と異なりンヤソターを開けてから実
際に基板上に堆積するのに15秒から1分程度の時間遅
れがあるためである。硫化亜鉛、Mnの両方のるつぼシ
ャッター13を開けて、蒸着を始めた後は、5秒ごとに
硫化亜鉛、Mnの堆積速度をそれぞれ光学式膜厚計1お
よび水晶振動子膜厚計8でモニターした。蒸着10秒後
、硫化亜鉛の堆積速度が目標の堆積速度よりも8%程小
さいことがわかったため、硫化亜鉛に没入する電子ビー
ムパワーを目標の堆積速度になるまで徐々に上げていっ
た。30秒後に目標値に達し、その後は一定のパワーを
加えることにより安定に目標の体積速度を維持すること
ができた。当初、堆積速度が目標値よりも小さかったの
はこのバッチでの基板6の温度が目標値より高かったた
めである。Regarding Mrl, the past average power of 8 kV and 60 mA was applied as an initial power so that Mn equivalent to 0.5 wt% of 580 nm zinc sulfide entered the film in 12 minutes. Open the substrate shutter 12, then first open the zinc sulfide crucible 7 soter 13, and after confirming that zinc sulfide begins to accumulate on the monitor substrate 3 with an optical film thickness meter, open the crucible 7 on the Mn side. I opened 13. The reason for shifting the timing of opening the crucible Yasota 13 in this way is to
This is because, unlike Mr+, zinc sulfide has a time delay of about 15 seconds to 1 minute from when the nya soter is opened until it is actually deposited on the substrate. After opening the crucible shutters 13 for both zinc sulfide and Mn and starting vapor deposition, the deposition rates of zinc sulfide and Mn are monitored every 5 seconds using the optical film thickness meter 1 and the crystal oscillator film thickness meter 8, respectively. did. After 10 seconds of vapor deposition, it was found that the deposition rate of zinc sulfide was about 8% lower than the target deposition rate, so the power of the electron beam immersed into the zinc sulfide was gradually increased until the target deposition rate was reached. The target value was reached after 30 seconds, and thereafter the target volume velocity could be stably maintained by applying constant power. Initially, the deposition rate was lower than the target value because the temperature of the substrate 6 in this batch was higher than the target value.
Mnについては、8分ごろまでは目標の堆積速度が得ら
れていたが、その後るつぼ9内のソースの減少に伴ない
堆積速度が低下し始めたのでMnに没入する電子ビーム
パワーを上げることにより目標の堆積速度を維持した。Regarding Mn, the target deposition rate was obtained until about 8 minutes, but after that, the deposition rate began to decrease as the number of sources in the crucible 9 decreased, so by increasing the power of the electron beam immersed in Mn. The target deposition rate was maintained.
12分後両方の基板用ンヤノター12を閉め、電子ビー
ムパワーを下げた。このような蒸着方法により、再現性
よく、580nm厚、0.5wt%のMnを含む硫化亜
鉛薄膜を製造することができた。After 12 minutes, both substrate converters 12 were closed and the electron beam power was lowered. By using such a vapor deposition method, a zinc sulfide thin film having a thickness of 580 nm and containing 0.5 wt% Mn could be manufactured with good reproducibility.
[発明の効果コ
本発明によれば、従来不可能であった2源蒸着法による
硫化亜鉛と活性物質からなる蛍光体薄膜の製造に際し、
その薄膜の組成、膜厚を正確に制御することが可能とな
り、EL用蛍光体薄膜製造の際の歩留を大きく上げるこ
とが出来、低コストなEL用蛍光体薄膜を製造すること
が可能になる。[Effects of the Invention] According to the present invention, when producing a phosphor thin film made of zinc sulfide and an active substance by a two-source vapor deposition method, which was previously impossible,
It has become possible to accurately control the composition and thickness of the thin film, greatly increasing the yield when manufacturing EL phosphor thin films, and making it possible to manufacture EL phosphor thin films at low cost. Become.
第1菌は、実施例で使用したZnS薄膜の製造装置の概
略を示す模式図、第2図は従来知られているZ n S
薄膜製造装置の概略を示す模式図、第3図は硫化亜鉛の
付着係数の基板温度依存性の図である。
第1図The first bacterium is a schematic diagram showing the outline of the ZnS thin film manufacturing apparatus used in the examples, and FIG. 2 is a conventionally known ZnS
FIG. 3 is a schematic diagram showing the outline of the thin film manufacturing apparatus, and is a diagram showing the dependence of the adhesion coefficient of zinc sulfide on the substrate temperature. Figure 1
Claims (2)
源から蒸発させて、該真空装置内に加熱保持された基板
上に該活性物質を含む硫化亜鉛薄膜形成する硫化亜鉛薄
膜の製造方法において、硫化亜鉛用蒸発源から蒸発した
硫化亜鉛が直接到達しない位置に置かれた活性物質用膜
厚計に形成される蒸着膜の蒸着速度から活性物質の蒸発
速度を測定するとともに、該基板近くであって該基板と
ほぼ等しい温度に保持されたモニター用基板又は該基板
の上に形成された該活性物質を含む硫化亜鉛薄膜の形成
速度から活性物質を含んだ硫化亜鉛の蒸着速度を測定し
、該測定結果に基づき活性物質および/または硫化亜鉛
用蒸発源の加熱を変化させて蒸着膜中の活性物質の濃度
を所定の濃度に保持することを特徴とする硫化亜鉛薄膜
の製造方法。(1) Production of a zinc sulfide thin film by evaporating zinc sulfide and an active substance from separate evaporation sources in a vacuum apparatus to form a zinc sulfide thin film containing the active substance on a substrate heated and maintained in the vacuum apparatus. In the method, the evaporation rate of the active substance is measured from the evaporation rate of a deposited film formed on a film thickness gauge for the active substance placed in a position where the zinc sulfide evaporated from the evaporation source for zinc sulfide does not directly reach the substrate. Determining the deposition rate of zinc sulfide containing the active substance from the formation rate of a thin film of zinc sulfide containing the active substance formed on a monitoring substrate that is nearby and held at approximately the same temperature as the substrate or on the substrate. A method for producing a zinc sulfide thin film, comprising: changing the heating of the active substance and/or the evaporation source for zinc sulfide based on the measurement results to maintain the concentration of the active substance in the deposited film at a predetermined concentration.
3℃以内の温度差に保持されている特許請求の範囲第1
項記載の硫化亜鉛薄膜の製造方法。(2) Claim 1, wherein the temperature of the monitor substrate is maintained within a temperature difference of 3° C. with respect to the temperature of the substrate.
A method for producing a zinc sulfide thin film as described in .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9139987A JPS63259067A (en) | 1987-04-14 | 1987-04-14 | Production of thin zinc sulfide film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9139987A JPS63259067A (en) | 1987-04-14 | 1987-04-14 | Production of thin zinc sulfide film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63259067A true JPS63259067A (en) | 1988-10-26 |
Family
ID=14025301
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9139987A Pending JPS63259067A (en) | 1987-04-14 | 1987-04-14 | Production of thin zinc sulfide film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63259067A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02209465A (en) * | 1989-02-08 | 1990-08-20 | Komatsu Ltd | Production of thin film el element luminous layer |
| FR2771810A1 (en) * | 1997-11-28 | 1999-06-04 | Sgs Thomson Microelectronics | IMPROVEMENT OF THE REAL-TIME THICKNESS MEASUREMENT OF MATERIAL DEPOSITED IN AN EVAPORATION DEPOSIT INSTALLATION |
| WO2002051960A1 (en) * | 2000-12-22 | 2002-07-04 | Ifire Technology Inc. | Multiple source deposition process |
| JP2008214461A (en) * | 2007-03-02 | 2008-09-18 | Canon Inc | Phosphor film and method for producing phosphor film |
| US7581511B2 (en) | 2003-10-10 | 2009-09-01 | Micron Technology, Inc. | Apparatus and methods for manufacturing microfeatures on workpieces using plasma vapor processes |
| US7588804B2 (en) | 2002-08-15 | 2009-09-15 | Micron Technology, Inc. | Reactors with isolated gas connectors and methods for depositing materials onto micro-device workpieces |
| JP2011060891A (en) * | 2009-09-08 | 2011-03-24 | Optorun Co Ltd | Method of controlling composition of multi-source deposit thin film, and manufacturing apparatus |
| US9023436B2 (en) | 2004-05-06 | 2015-05-05 | Micron Technology, Inc. | Methods for depositing material onto microfeature workpieces in reaction chambers and systems for depositing materials onto microfeature workpieces |
-
1987
- 1987-04-14 JP JP9139987A patent/JPS63259067A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02209465A (en) * | 1989-02-08 | 1990-08-20 | Komatsu Ltd | Production of thin film el element luminous layer |
| FR2771810A1 (en) * | 1997-11-28 | 1999-06-04 | Sgs Thomson Microelectronics | IMPROVEMENT OF THE REAL-TIME THICKNESS MEASUREMENT OF MATERIAL DEPOSITED IN AN EVAPORATION DEPOSIT INSTALLATION |
| WO2002051960A1 (en) * | 2000-12-22 | 2002-07-04 | Ifire Technology Inc. | Multiple source deposition process |
| US6610352B2 (en) | 2000-12-22 | 2003-08-26 | Ifire Technology, Inc. | Multiple source deposition process |
| US7588804B2 (en) | 2002-08-15 | 2009-09-15 | Micron Technology, Inc. | Reactors with isolated gas connectors and methods for depositing materials onto micro-device workpieces |
| US7581511B2 (en) | 2003-10-10 | 2009-09-01 | Micron Technology, Inc. | Apparatus and methods for manufacturing microfeatures on workpieces using plasma vapor processes |
| US9023436B2 (en) | 2004-05-06 | 2015-05-05 | Micron Technology, Inc. | Methods for depositing material onto microfeature workpieces in reaction chambers and systems for depositing materials onto microfeature workpieces |
| JP2008214461A (en) * | 2007-03-02 | 2008-09-18 | Canon Inc | Phosphor film and method for producing phosphor film |
| JP2011060891A (en) * | 2009-09-08 | 2011-03-24 | Optorun Co Ltd | Method of controlling composition of multi-source deposit thin film, and manufacturing apparatus |
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