JPS63253271A - Contact block - Google Patents

Abstract

PURPOSE:To prevent a contact pin from being damaged due to an excessive pressure, and an electrical contact defect due to the shortage of pressure, by providing a stopper in a line with a contact pin on a substrate of a contact block. CONSTITUTION:On a substrate 1 of a contact block, plural pin sockets 2 connected to the respective wiring patterns and contact pins 3 which can be moved up and down by a spring against pressure in the vertical direction in the pin sockets are provided. Also, on the substrate 1, at least two pieces of insulating stoppers 8 which are longer than the length extending from the upper face of the substrate 1 to the upper end of the pin socket, and also, shorter than the length extending from the upper face of the substrate 1 to the upper end of the contact pin 3 are provided, by which even if a head part 6 of a handler is inclined, the excessive pressure is not applied directly to the contact pin 3.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a contact block, and more particularly to a contact block used for measuring the electrical characteristics of a semiconductor device assembled using a tape carrier method.

[Conventional technology]

Conventionally, this ball contact block has an insulating substrate 1 each having an insulated conductor pattern formed thereon, and a plurality of insulating substrates 1 connected to each conductor pattern planted on the substrate 1, as shown in FIG. The contact pin 3 is configured to include a pin socket 2 and a vertically movable contact pin 3 which is pushed up with elasticity and is placed on the upper surface of each pin socket 2 in electrical connection with the pin socket 2.

By pressing down the electrode pad 5 of the tape carrier 4 in which a semiconductor device is incorporated into the contact block configured in this manner from the upper surface of the tape carrier 4 with the head portion 6 of the handler, the tip 7 of the contact pin 3 is pushed down onto the electrode pad 5. The electrical characteristics of semiconductor devices were measured by contacting them with

[Problem that the invention seeks to solve]

In the conventional contact block described above, as shown in FIG. 3, if the head section 6 of the handler is tilted, a difference occurs in the amount of sinking of the contact pin 3. This leads to damage to the contact pin, and on the other hand, there is a drawback that insufficient pressing force causes electrical contact failure.

[Means for solving problems]

The contact block of the present invention includes an insulating substrate on which a plurality of insulated conductor patterns are formed, a plurality of pin sockets connected to the respective conductor patterns and planted on the substrate, and a plurality of pin sockets connected to the respective conductor patterns and planted on the substrate, and a plurality of pin sockets connected to the respective conductor patterns and planted on the substrate. a plurality of vertically movable contact pins that are electrically connected to the pin socket and are planted on the top surface of the pin socket and pushed up with elasticity; and a plurality of contact pins that are planted on the board and have a length from the board surface to the top end of the pin socket. and at least two insulating stoppers that are long and shorter than the length to the upper end of the contact pin.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a sectional view of a first embodiment of the invention.

As shown in FIG. 1, a plurality of pin sockets 2 are embedded in a substrate 1 on which a plurality of insulated wiring patterns (not shown) are formed on an insulating plate, each of which is connected to each wiring pattern. A contact pin 3 is inserted into each pin socket 2 and is movable up and down by a spring in response to vertical pressure. Further, conduction is established between the conductor pattern of the substrate 1, the pin socket 2, and the contact pin 3, respectively.

At least two insulating stoppers 8 are planted on the board 1, which is longer than the length from the top surface of the board 1 to the top end of the pin socket 2, and shorter than the length from the top surface of the board 1 to the top end of the contact pin 3. It is being

By pressing down the electrode pad 5 of the tape carrier 4 in which the semiconductor device is incorporated into the contact block configured in this manner from the upper surface of the tape carrier 4 with the head portion 6 of the handler, the tip 7 of the contact pin 3 is pushed down onto the electrode pad 5. to measure the electrical characteristics of the semiconductor device.

At this time, even if the head portion 6 of the handler is tilted, its pressing force is applied to the stopper 8 provided on the substrate 1, and excessive pressure is not directly applied to the contact pin 3.

Furthermore, the inclination of the head portion 6 of the handler is corrected in the horizontal direction by at least two stoppers 8, and a uniform pressing force is always applied to the plurality of contact pins 3.

FIG. 2 is a cross-sectional view of a second embodiment of the invention.

As shown in FIG. 2, in the second embodiment, the outer periphery of the pin socket 2 is surrounded by an insulating stopper 8a,
A contact pin 3 is inserted into a pin socket 2.

In the second embodiment, since the pin socket 2 and the stopper 8a are paired, the strength of the pin socket itself is increased, and the pin socket itself is strong enough to withstand pressure not only from the vertical direction but also from the diagonal and ridge directions. It has the advantage of being strong.

〔Effect of the invention〕

As described above, the present invention has the effect of preventing damage to the contact pins due to excessive pressure and electrical contact failure due to insufficient pressure by providing a stopper on the substrate in parallel with the contact pins.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of a first embodiment of the invention, FIG. 2 is a sectional view of a second embodiment of the invention, and FIG. 3 is a sectional view of an example of a conventional contact block. DESCRIPTION OF SYMBOLS 1... Board, 2... Pin socket, 3... Contact pin, 4... Tape carrier, 5... Electrode pad, 6... Head part, 7... Tip, 8, 8a ...
Stopper.

Claims (1)

[Claims] an insulating substrate on which a plurality of insulated conductor patterns are formed, a plurality of pin sockets connected to each of the conductor patterns and planted on the substrate, and electrically conductive with each of the pin sockets; a plurality of vertically movable contact pins that are planted on the top surface of the pin socket and pushed up with elasticity; and at least two insulating stoppers shorter than the length of the contact block.