JPS63249345A - Flexible mounting substrate - Google Patents
Flexible mounting substrateInfo
- Publication number
- JPS63249345A JPS63249345A JP62083066A JP8306687A JPS63249345A JP S63249345 A JPS63249345 A JP S63249345A JP 62083066 A JP62083066 A JP 62083066A JP 8306687 A JP8306687 A JP 8306687A JP S63249345 A JPS63249345 A JP S63249345A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- semiconductor
- bonding
- substrate
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H10W90/754—
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、半導体ｔＣチップ等の電子部品を搭載する
フレキシブル搭載基板に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a flexible mounting board on which electronic components such as semiconductor tC chips are mounted.
従来、電子部品を搭載するフレキシブル搭載基板におい
て、半導体ＩＣチップなどを直接実装する場合、第３図
＾、田）の平面図及び断面図に示すように、ポリイミド
樹脂フィルムのような軟質基板１１の半導体ＩＣチップ
搭載部に該チップ収納用の開口部１２を設け、前記基板
１１の表面には、接着された導電層を搭載する前記半導
体ＩＣＣチップ３のポンディングパッドの配置位置に整
合するようにパターニングすることによって、ビームリ
ード１４を前記開口部１２の一部にフィンガー状に一部
突出するように形成してフレキシブル搭載基板を構成す
る。そして半導体ＩＣチ・ブ１３を前８ｉ基板１１の開
口部１２内に配置して、そのポンディングパッドをバン
プ１５を介してビームリード１４の突出部に、通常の熱
圧着等の手段で接続固定し、半導体ＩＣチップ１３と軟
質基板１１の一部をエポキシ樹脂等の封止樹脂１６で一
体的にモールド等の手段により封止している。Conventionally, when mounting a semiconductor IC chip or the like directly on a flexible mounting board on which electronic components are mounted, a flexible board 11 such as a polyimide resin film is used, as shown in the plan view and cross-sectional view of FIG. An opening 12 for accommodating the semiconductor IC chip is provided in the semiconductor IC chip mounting portion, and an opening 12 for accommodating the chip is provided on the surface of the substrate 11 so as to match the placement position of the bonding pad of the semiconductor ICC chip 3 on which the bonded conductive layer is mounted. By patterning, the beam lead 14 is formed in a part of the opening 12 so as to partially protrude in the shape of a finger, thereby configuring a flexible mounting board. Then, the semiconductor IC chip 13 is placed in the opening 12 of the front 8i substrate 11, and its bonding pad is connected and fixed to the protrusion of the beam lead 14 via the bump 15 by ordinary thermocompression bonding or other means. However, the semiconductor IC chip 13 and a part of the soft substrate 11 are integrally sealed with a sealing resin 16 such as epoxy resin by means such as molding.
ところが、従来のビームリードを備えたフレキシブル搭
載基板に対して、半導体ＩＣチップを接続固定する場合
には、前述のように半導体ＩＣチップなどのポンディン
グパッド部にバンブを形成しなければならないし、また
接合工程においては専用のボンディングツールを用意し
なければならない、したがってこのような構成のフレキ
シブル搭載基板に半導体ＩＣチップ等をバンプを介して
接続固定する方式は、半導体装置の大量生産には適して
いるが、多種少量生産には適さないという問題点を有し
ていた。またフレキシブル搭載基板に、超音波ワイヤボ
ンディング方式を用いて半導体ＩＣチップ等を基板上に
パターニングされたリードに直接接続しようとしても、
基板自体が柔軟であるために、印加する超音波が吸収さ
れてしまいボンディングすることは全く不可能であった
。However, when connecting and fixing a semiconductor IC chip to a flexible mounting board equipped with a conventional beam lead, it is necessary to form a bump on the bonding pad portion of the semiconductor IC chip, etc., as described above. In addition, a dedicated bonding tool must be prepared in the bonding process, so the method of connecting and fixing semiconductor IC chips, etc. to a flexible mounting board with this configuration via bumps is not suitable for mass production of semiconductor devices. However, it had the problem that it was not suitable for high-mix, low-volume production. Furthermore, even if you try to directly connect semiconductor IC chips etc. to the leads patterned on the flexible mounting board using the ultrasonic wire bonding method,
Since the substrate itself is flexible, the applied ultrasonic waves are absorbed, making bonding impossible.
更に樹脂で封止する場合、基板の開口部を通してその表
裏面に亘り封止部が形成されるため、薄型の実装ができ
ないという問題点があった。Furthermore, when sealing with a resin, a sealing portion is formed through the opening of the substrate and extends over the front and back surfaces of the substrate, so there is a problem that thin mounting is not possible.
本発明は、従来のフレキシブル基板における上記問題点
を解決するためになされたもので、バンプの形成の不要
な超音波ワイヤボンディングが可能であり、且つ薄型の
実装の可能な、多種少量生産に好適なフレキシブル搭載
基板を提供することを目的とする。The present invention was made to solve the above-mentioned problems with conventional flexible substrates, and enables ultrasonic wire bonding that does not require the formation of bumps, and also enables thin mounting, and is suitable for high-mix, low-volume production. The purpose is to provide a flexible mounting board.
〔問題点を解決するための手段及び作用〕上記問題点を
解決するため、本発明は、基板面に導電層をパターニン
グすることによって半導体ＩＣチップ等の電子部品接続
用に形成されたリードの端部に対応する基板部分に、該
リードの幅より小さい幅のワイヤ接続用開口部を形成し
てフレキシブル搭載基板を構成するものである。[Means and operations for solving the problems] In order to solve the above problems, the present invention provides a method for improving the ends of leads formed for connecting electronic components such as semiconductor IC chips by patterning a conductive layer on a substrate surface. A flexible mounting board is constructed by forming a wire connection opening having a width smaller than the width of the lead in a part of the board corresponding to the lead.
このように構成することにより、ワイヤ接続用開口部を
介してバンプを必要としないワイヤボンディングが可能
となり、また基板の表裏に貫通する開口部が形成されな
いため、半導体ＩＣチップ等の電子部品の搭載側のみで
樹脂封止することができ、薄型の実装が可能となる。With this configuration, wire bonding that does not require bumps is possible through the wire connection opening, and since there is no opening that penetrates the front and back of the board, it is possible to mount electronic components such as semiconductor IC chips. Only the sides can be sealed with resin, allowing for thin mounting.
以下実施例について説明する。第１図＾は本発明に係る
フレキシブル搭載基板の第１実施例の平面図で、半導体
ＩＣチップを実装した状態を示しており、第１図［Ｂｌ
はその断面図である０図において１はポリイミドフィル
ム、ポリエステルフィルム等からなる軟質基板で、該軟
質基板ｌの裏面には、接着された導電層をパターニング
することによって、多数のり一部２を半導体ＩＣチップ
搭載部に対応するように形成している。そして前記各リ
ード２の端部に対応する基板部分には、該リード２の幅
より小さい幅を有する、ボンディングワイヤを挿通する
ためのワイヤ接続用開口部３を形成して、フレキシブル
搭載基板４を構成している。Examples will be described below. FIG. 1 is a plan view of the first embodiment of the flexible mounting board according to the present invention, showing a state in which a semiconductor IC chip is mounted.
In Figure 0, which is a cross-sectional view of the same, 1 is a flexible substrate made of polyimide film, polyester film, etc. On the back side of the flexible substrate 1, by patterning an adhesive conductive layer, a portion 2 of a large number of adhesives is formed into a semiconductor layer. It is formed to correspond to the IC chip mounting section. Then, a wire connection opening 3 having a width smaller than the width of the lead 2 and through which a bonding wire is inserted is formed in a portion of the board corresponding to the end of each lead 2, and a flexible mounting board 4 is formed. It consists of
このように構成したフレキシブル搭載基板４に半導体Ｉ
Ｃチップ５を搭載する場合は、該半導体ＩＣチップ５を
軟質基板ｌ上の多数のワイヤ接続用開口部３に囲まれた
半導体ＩＣチップ搭載部に接着し、該ＩＣチップ５のポ
ンディングパッド部に接続したボンディングワイヤ６の
他端を、それぞれワイヤ接続用開口部３を通して所定の
各り−ド２に接続する。この際、軟質基板ｌのリード形
成側には、リードのみが配置されているため、このリー
ド配置面を金属板等の硬質板からなる治具で支持するよ
うにすることにより、超音波によるワイヤボンディング
時における超音波エネルギーの吸収を避け、ボンディン
グワイヤ６による超音波ボンディングを容易に行うこと
ができる。A semiconductor I is mounted on the flexible mounting board 4 configured in this way.
When mounting a C chip 5, the semiconductor IC chip 5 is adhered to a semiconductor IC chip mounting area surrounded by a large number of wire connection openings 3 on a soft substrate l, and the bonding pad part of the IC chip 5 is The other end of the bonding wire 6 connected to is connected to each predetermined board 2 through the wire connection opening 3, respectively. At this time, since only the leads are arranged on the lead formation side of the soft substrate l, by supporting this lead arrangement surface with a jig made of a hard plate such as a metal plate, the ultrasonic wire can be Ultrasonic bonding using the bonding wire 6 can be easily performed while avoiding absorption of ultrasonic energy during bonding.
そして半導体ＩＣチップ５のワイヤボンディングによる
所定の接続を行った後、エポキシ樹脂等の封止用樹脂を
、軟質基板１上の半導体ＩＣチップの搭載部分にポツテ
ィングして封止部７を形成し、半導体ＩＣチップ５のフ
レキシブル搭載基板４への実装を完了する。After making a predetermined connection of the semiconductor IC chip 5 by wire bonding, a sealing resin such as epoxy resin is potted onto the mounting portion of the semiconductor IC chip on the flexible substrate 1 to form a sealing part 7. The mounting of the semiconductor IC chip 5 onto the flexible mounting board 4 is completed.
この封止用樹脂のポツティングの際は、ワイヤ接続用開
口部３は、その幅がリード２の幅より小さく形成されて
いて、軟質基板１の表裏面に亘る貫通孔は形成されてい
ないため、裏面へ封止樹脂が漏れることはなく、樹脂封
止部７は軟質基板１の表面にのみ形成されるので、薄型
の実装ができる。When potting this sealing resin, the width of the wire connection opening 3 is formed to be smaller than the width of the lead 2, and a through hole extending over the front and back surfaces of the soft substrate 1 is not formed. Since the sealing resin does not leak to the back surface and the resin sealing portion 7 is formed only on the front surface of the soft substrate 1, thin mounting is possible.
第２図＾は、本発明の第２実施例を示す平面図で、第２
図■）はその断面図である。この実施例は、軟質基板１
の半導体ＩＣチップ搭載部に該ＩＣチップ５の収納用の
開口部８を形成するものである。FIG. 2 is a plan view showing a second embodiment of the present invention.
Figure ■) is its cross-sectional view. In this embodiment, the soft substrate 1
An opening 8 for storing the IC chip 5 is formed in the semiconductor IC chip mounting portion.
そして軟質基板１の裏面には該チップ収納用開口部８を
囲むように、パターニングにより多数のり一部２を形成
し、またこのリード２の形成時に、同時にパターニング
された銅箔等の金属薄膜で、前記チップ収納用開口部８
の底部を閉塞するように、裏打ち金属薄膜部９を形成し
ている。また第１実施例と同様に、前記リード２の各端
部には、該リード２の幅より小さい幅のワイヤ接続用開
口部３を形成してフレキシブル搭載基板４を構成してい
る。Then, on the back surface of the soft substrate 1, a large number of adhesive parts 2 are formed by patterning so as to surround the chip storage opening 8, and when the leads 2 are formed, a metal thin film such as copper foil is patterned at the same time. , the chip storage opening 8
A backing metal thin film portion 9 is formed so as to close the bottom of the lining. Further, as in the first embodiment, a wire connection opening 3 having a width smaller than the width of the lead 2 is formed at each end of the lead 2 to form a flexible mounting board 4.
このように構成したフレキシブル搭載基板４に半導体Ｉ
Ｃチップ５を実装する場合は、該ＩＣチップ５を軟質基
板ｌのチップ収納用開口部８において、裏打ち金属薄膜
部９上に接着し、そして第１実施例と同様に、金属板等
の硬質板の治具上において、半導体ＩＣチップ５のポン
ディングパッド部と対応するリード２間を、ワイヤ接続
用開口部３を通してボンディングワイヤ６により超音波
を用いて接続する。この場合もボンディングワイヤ６が
接続されるリード２は治具上で保持されているため、超
音波エネルギーの吸収がなく、ボンディングワイヤ６に
よる超音波ボンディングが良好に行われる。A semiconductor I is mounted on the flexible mounting board 4 configured in this way.
When mounting the C chip 5, the IC chip 5 is bonded onto the backing metal thin film portion 9 in the chip storage opening 8 of the soft substrate l, and then, as in the first embodiment, a hard material such as a metal plate is bonded to the IC chip 5. On a plate jig, the bonding pads of the semiconductor IC chip 5 and the corresponding leads 2 are connected using bonding wires 6 through the wire connection openings 3 using ultrasonic waves. In this case as well, since the lead 2 to which the bonding wire 6 is connected is held on the jig, there is no absorption of ultrasonic energy, and ultrasonic bonding by the bonding wire 6 is performed satisfactorily.
ワイヤボンディングにより所定の接続を行った後は、半
導体ＩＣチップ搭載部にエポキシ樹脂等の封止用樹脂を
ポツティングして封止部７を形成し、半導体ＩＣチップ
の実装が完了する。この樹脂封止時においても、チップ
収納用開口部８は裏打ち金属薄膜部９で閉塞されている
ため、封止樹脂が軟質基板１の裏面へ漏れることがなく
、しかも半導体ＩＣチップ５は軟質基板１のチップ収納
用開口部８内に配置されるため、軟質基板ｌの厚み分だ
け半導体ＩＣチップ５を低く配置することができ、更に
薄型に実装することが可能となる。After predetermined connections are made by wire bonding, a sealing resin such as epoxy resin is potted into the semiconductor IC chip mounting portion to form a sealing portion 7, and the mounting of the semiconductor IC chip is completed. Even during this resin sealing, since the chip housing opening 8 is closed by the lining metal thin film portion 9, the sealing resin does not leak to the back surface of the soft substrate 1, and the semiconductor IC chip 5 is not attached to the soft substrate. 1, the semiconductor IC chip 5 can be placed as low as the thickness of the soft substrate 1, making it possible to mount it even thinner.
以上実施例に基づいて説明したように、本発明によれば
、軟質基板の裏面に形成されたリードの端部に対応する
基板部分に、該リードの幅より小さい幅を有するワイヤ
接続用開口部を設けてフレキシブル搭載基板を構成した
ので、該基板を治具に載置することにより、基板に搭載
した半導体ＩＣチップ等の電子部品を、ワイヤ接続用開
口部を通して超音波を用いたワイヤボンディングにより
リードに接続することが可能となり、搭載されるＩＣチ
ップ等の電子部品のポンディングパッド部へのバンブの
形成が不要となる。また種々の形態のＩＣチップ等の電
子部品をワイヤボンディングによりフレキシブル搭載基
板へダイレクトボンディングすることが可能となり、多
種少量生産に極めて容易に対応させることができる。As described above based on the embodiments, according to the present invention, a wire connection opening having a width smaller than the width of the lead is formed in the substrate portion corresponding to the end of the lead formed on the back surface of the soft substrate. By placing the board on a jig, electronic components such as semiconductor IC chips mounted on the board can be wire bonded using ultrasonic waves through the wire connection openings. It becomes possible to connect to a lead, and there is no need to form a bump on the bonding pad portion of an electronic component such as an IC chip to be mounted. Moreover, it becomes possible to directly bond electronic components such as IC chips of various forms to a flexible mounting board by wire bonding, and it is possible to extremely easily cope with high-mix low-volume production.
また基板裏面に貫通する開口部が形成されないため、Ｉ
Ｃチップ等の電子部品の搭載側にのみ樹脂封止部を形成
することができ、薄型の実装が可能となる等の利点が得
られる。In addition, since no opening is formed to penetrate the back surface of the substrate, I
The resin sealing portion can be formed only on the mounting side of the electronic component such as the C-chip, and advantages such as thin mounting can be obtained.
第１図＾、 ＣＢ＋は、本発明に係るフレキシブル搭載
基板の第１実施例の平面図及びその断面図、第２図＾、
■）は、本発明の第２実施例の平面図及びその断面図、
第３図＾、■）は、従来のフレキシブル搭載基板の平面
図及びその断面図である。
図において、１は軟質基板、２はリード、３はワイヤ接
続用開口部、４はフレキシブル搭載基板、５は半導体Ｉ
Ｃチップ、６はボンディングワイヤ、７は封止部、８は
チップ収納用開口部、９は裏打ち金属薄膜部を示す。
特許出願人 オリンパス光学工業株式会社第１図
第３図
（Ａ）
（Ｂ）
Ｉｊ ’Ｆ） １１１７Fig. 1^, CB+ is a plan view and a sectional view thereof of the first embodiment of the flexible mounting board according to the present invention, Fig. 2^,
(2) is a plan view and a sectional view thereof of the second embodiment of the present invention;
FIG. 3 ^, 2) is a plan view and a cross-sectional view of a conventional flexible mounting board. In the figure, 1 is a soft substrate, 2 is a lead, 3 is an opening for wire connection, 4 is a flexible mounting board, and 5 is a semiconductor I
C chip, 6 is a bonding wire, 7 is a sealing part, 8 is an opening for storing the chip, and 9 is a backing metal thin film part. Patent applicant: Olympus Optical Industry Co., Ltd. Figure 1 Figure 3 (A) (B) Ij 'F) 1117
Claims (1)
基板において、該基板面に導電層をパターニングするこ
とによって電子部品接続用に形成されたリードの端部に
対応する基板部分に、該リードの幅より小さい幅のワイ
ヤ接続用開口部を形成したことを特徴とするフレキシブ
ル搭載基板。In a flexible substrate on which electronic components such as semiconductor IC chips are mounted, a conductive layer is patterned on the surface of the substrate, so that a portion of the substrate corresponding to the end of the lead formed for connecting the electronic component has a width smaller than that of the lead. A flexible mounting board characterized by forming an opening for connecting wires with a width of 100 cm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62083066A JPS63249345A (en) | 1987-04-06 | 1987-04-06 | Flexible mounting substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62083066A JPS63249345A (en) | 1987-04-06 | 1987-04-06 | Flexible mounting substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63249345A true JPS63249345A (en) | 1988-10-17 |
Family
ID=13791805
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62083066A Pending JPS63249345A (en) | 1987-04-06 | 1987-04-06 | Flexible mounting substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63249345A (en) |
Cited By (73)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6258632B1 (en) | 1996-01-15 | 2001-07-10 | Kabushiki Kaisha Toshiba | Molded packaging for semiconductor device and method of manufacturing the same |
| US6331451B1 (en) | 1999-11-05 | 2001-12-18 | Amkor Technology, Inc. | Methods of making thin integrated circuit device packages with improved thermal performance and substrates for making the packages |
| US6448506B1 (en) | 2000-12-28 | 2002-09-10 | Amkor Technology, Inc. | Semiconductor package and circuit board for making the package |
| US6580159B1 (en) | 1999-11-05 | 2003-06-17 | Amkor Technology, Inc. | Integrated circuit device packages and substrates for making the packages |
| US6844615B1 (en) | 2003-03-13 | 2005-01-18 | Amkor Technology, Inc. | Leadframe package for semiconductor devices |
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-
1987
- 1987-04-06 JP JP62083066A patent/JPS63249345A/en active Pending
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