JPS63237446A - Manufacture of semiconductor package - Google Patents

Abstract

PURPOSE:To eliminate a conventional cleaning process using an organic solvent and to enhance the marking performance by a method wherein the surface of a semiconductor package is irradiated with a laser such as, e.g., a weak laser or the like and, after that, a mark is put on this part. CONSTITUTION:A mask 4 to transmit only a desired laser beam 3 is arranged in front of a laser oscillator 2 which oscillates the laser beam 3; a 90 deg. reflector 5 is arranged in front of this mask 4. By this setup, the laser beam 3 is deflected downward by 90 deg.; the laser beam 3 which has been condensed by a condenser 6 arranged under the reflector 5 irradiates a mark face 1a of a semiconductor package 1. The semiconductor package 1 is irradiated with the laser beam 3 in this way and an organic substance or the like is removed; after that, a mark is put on the mark face 1a. By this setup, a conventional cleaning process using an organic solvent is eliminated.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a method of manufacturing a semiconductor package, particularly in the assembly process of a plastic package sealed with a resin.

(Prior art) Conventionally, in the assembly process of semiconductor packages, the fifth
As shown in the figure, a semiconductor package 1 such as a resin-sealed plastic package is placed in a mesh carrier 10, and is boiled via a heater 11 and soaked in koji in a solution of a solvent 12. It has been common practice to decompose and clean organic substances, dust, etc. adhering to the surface of the semiconductor package 1, and then mark the surface of the semiconductor package 1.

(Problems to be Solved by the Invention) However, in the conventional example described above, the organic solvent used to clean the semiconductor package has an adverse effect on the human body.

For this reason, not only is the use of organic solvents required to be strictly controlled, but organic solvents can also be used repeatedly to remove organic matter and dirt that may adhere to the surface of the semiconductor package. As impurities accumulate, this cleaning ability deteriorates significantly, causing variations in cleaning ability, and impurities such as ionic impurities contained in organic solvents can corrode the semiconductor chip inside the semiconductor package. There were some problems, such as gender.

In view of the above, the present invention eliminates the cleaning of semiconductor chips with organic solvents during the assembly process of semiconductor packages, thereby completely eliminating the problems described in item 2 above, and improving the adhesive strength of marks. This was done with the aim of providing what is possible.

[Structure of the invention]

(Means for Solving the Problems) In order to achieve the above object, the present invention irradiates the surface of a semiconductor package with a laser such as a weak laser, and then marks are attached thereto. .

(Function) By irradiating the semiconductor package with a laser, the mark strength deteriorating substances adhering to the surface of the semiconductor package are destroyed and removed, thereby eliminating the need for conventional cleaning with organic solvents and improving the mark strength. On the other side! ].

(Embodiment) FIGS. 1 and 2 show an embodiment of the present invention, in which a mark surface 1a of a semiconductor package 1 is irradiated with a weak laser beam 3 emitted from a laser transmitter 2, As shown in FIG. 2, this destroys organic substances and the like that deteriorate the strength of the mark attached to the mark surface 1a, thereby improving the markability.

That is, in front of the laser transmitter 2 that emits the laser beam 3, there is a mask 4 that allows only the desired laser beam 3 to pass through.
A 90° reflecting mirror 5 is arranged in front of this mask 4, whereby the laser beam 3 is bent 90° downward, and is focused by a condensing mirror 6 arranged below this reflecting mirror 5. The emitted laser beam 3 irradiates the marm surface 1a of the semiconductor package 1.

After the semiconductor package 1 is irradiated with the laser beam 3 to remove organic matter and the like, a mark is attached to the mark surface 1a, and by doing so, it is possible to remove the conventional cleaning with an organic solvent. can.

By changing the mask 4, it is possible to deal with various types of semiconductor packages, and moreover, it is also possible to process two or more semiconductor packages at the same time.

3 and 4 show other embodiments of the present invention,
A mask 4 that cannot be destroyed by the laser beam 3 is installed above a series of semiconductor packages 1' consisting of a plastic mold part 7 and a lead frame 8.
By moving the semiconductor package 1' and the semiconductor package 1' in the same direction at the same speed and irradiating the laser beam 3 focused by the condensing lens 6 disposed above, the semiconductor package 1' is moved as shown in FIG. Mark surface i/
A is obtained continuously.

After that, a mark is attached to the mark surface 1'a.

In addition, by performing the laser irradiation with the laser beam 3 in a weak beam, it destroys the organic matter etc. attached to the surface of the semiconductor parallax, . can be made to prevent the negative effects of

〔Effect of the invention〕

Since the present invention has the configuration as described in 1-, it is possible to safely pre-process marks without using organic solvents that have an adverse effect on the human body.

Moreover, since the surface of the semiconductor package can be processed uniformly with little variation, it is not only highly reliable but also does not easily deteriorate.

Furthermore, by irradiating with a weak laser, it is possible to prevent destruction of the semiconductor package body and adverse effects on the semiconductor chip inside the package body.

[Brief Description of the Drawings] Figures 1 and 2 show an embodiment of the present invention, with Figure 1 being a schematic front view showing the state of laser irradiation, and Figure 2 showing the semiconductor package after laser irradiation. The plan view, FIGS. 3 and 4 show other embodiments, FIG. 3 is a view equivalent to FIG. 1, FIG. 4 is a view equivalent to FIG. 2, and FIG. 5 is a schematic plan view of a conventional example. . ], 1'... semiconductor package, la, l'a...
Same mark surface, 3... Laser beam, 4... Mask,
6...Condensing lens. Applicant's agent Mr. Sato, Figure 1, Item 2

Claims (1)

[Claims] 1. A method for manufacturing a semiconductor package, which comprises irradiating the surface of the semiconductor package with a laser and then marking the surface. 2. The method for manufacturing a semiconductor package according to claim 1, characterized in that a weak radar is used as the laser.