JPS63198086U - - Google Patents
Info
- Publication number
- JPS63198086U JPS63198086U JP1987089455U JP8945587U JPS63198086U JP S63198086 U JPS63198086 U JP S63198086U JP 1987089455 U JP1987089455 U JP 1987089455U JP 8945587 U JP8945587 U JP 8945587U JP S63198086 U JPS63198086 U JP S63198086U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting element
- lead wire
- tip
- display device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920003002 synthetic resin Polymers 0.000 claims 1
- 239000000057 synthetic resin Substances 0.000 claims 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
図面は本考案の実施例を示し、第１図は第１の
実施例を示す断面図、第２図は第２の実施例を示
す断面図、第３図は第３の実施例を示す視断面図
、第４図は発光ダイオードを使用したランプに適
用した場合の縦断正面図、第５図は第４図の−
視断面図である。 １，１ａ……発光ダイオード、２，２ａ……一
方のリード線、３，３ａ，３ｂ……他方のリード
線、４，４ａ，４ｂ……発光素子、５，５ａ，５
ｂ……ワイヤー、６，６ａ……樹脂モールド、７
……金属製パイプ、８……吸熱・放熱部。
実施例を示す断面図、第２図は第２の実施例を示
す断面図、第３図は第３の実施例を示す視断面図
、第４図は発光ダイオードを使用したランプに適
用した場合の縦断正面図、第５図は第４図の−
視断面図である。 １，１ａ……発光ダイオード、２，２ａ……一
方のリード線、３，３ａ，３ｂ……他方のリード
線、４，４ａ，４ｂ……発光素子、５，５ａ，５
ｂ……ワイヤー、６，６ａ……樹脂モールド、７
……金属製パイプ、８……吸熱・放熱部。
Claims (1)
- 一方のリード線の先端に発光素子を固着し、該
発光素子と他方のリード線の先端との間をワイヤ
ーにて接続し、且つ、前記両リード線の先端部を
合成樹脂にてモールドして成る発光表示装置にお
いて、前記リード線のうち発光素子を固着した一
方のリード線には、当該一方のリード線が前記樹
脂モールド部より突出する箇所に表面積を増大し
た吸熱・放熱部を設けたことを特徴とする発光表
示装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987089455U JPS63198086U (ja) | 1987-06-09 | 1987-06-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987089455U JPS63198086U (ja) | 1987-06-09 | 1987-06-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63198086U true JPS63198086U (ja) | 1988-12-20 |
Family
ID=30948454
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987089455U Pending JPS63198086U (ja) | 1987-06-09 | 1987-06-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63198086U (ja) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003258314A (ja) * | 2001-12-26 | 2003-09-12 | Toyoda Gosei Co Ltd | Ｌｅｄランプ装置 |
| KR20050050292A (ko) * | 2003-11-25 | 2005-05-31 | 삼성전기주식회사 | 열방출부를 구비한 발광소자 램프 |
| JP2008533716A (ja) * | 2005-03-11 | 2008-08-21 | ソウル セミコンダクター カンパニー リミテッド | 直列接続された発光セルのアレイを有する発光ダイオードパッケージ |
| JP2011165675A (ja) * | 2003-05-05 | 2011-08-25 | Lumination Llc | Ｌｅｄ利用型電球 |
| US9470372B2 (en) | 2008-11-26 | 2016-10-18 | Deloren E. Anderson | High intensity replaceable light emitting diode module and array |
-
1987
- 1987-06-09 JP JP1987089455U patent/JPS63198086U/ja active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003258314A (ja) * | 2001-12-26 | 2003-09-12 | Toyoda Gosei Co Ltd | Ｌｅｄランプ装置 |
| JP2011165675A (ja) * | 2003-05-05 | 2011-08-25 | Lumination Llc | Ｌｅｄ利用型電球 |
| KR20050050292A (ko) * | 2003-11-25 | 2005-05-31 | 삼성전기주식회사 | 열방출부를 구비한 발광소자 램프 |
| JP2008533716A (ja) * | 2005-03-11 | 2008-08-21 | ソウル セミコンダクター カンパニー リミテッド | 直列接続された発光セルのアレイを有する発光ダイオードパッケージ |
| US9470372B2 (en) | 2008-11-26 | 2016-10-18 | Deloren E. Anderson | High intensity replaceable light emitting diode module and array |
| US10925139B2 (en) | 2008-11-26 | 2021-02-16 | Yjb Led, Inc. | High intensity replaceable light emitting diode module and array |
| US11178744B2 (en) | 2008-11-26 | 2021-11-16 | Yjb Led, Inc. | High intensity replaceable light emitting diode module and array |
| US11924943B2 (en) | 2008-11-26 | 2024-03-05 | Yjb Led, Inc. | High intensity replaceable light emitting diode module and array |
| US12219678B2 (en) | 2008-11-26 | 2025-02-04 | In 2 Developments Llc | High intensity replaceable light emitting diode module and array |