JPS63188577U - - Google Patents
Info
- Publication number
- JPS63188577U JPS63188577U JP7888187U JP7888187U JPS63188577U JP S63188577 U JPS63188577 U JP S63188577U JP 7888187 U JP7888187 U JP 7888187U JP 7888187 U JP7888187 U JP 7888187U JP S63188577 U JPS63188577 U JP S63188577U
- Authority
- JP
- Japan
- Prior art keywords
- socket
- integrated circuits
- terminal
- contact
- pitches
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Connecting Device With Holders (AREA)
Description
第１図はこの考案の一実施例の構造を示す説明
図、第２図ａ，ｂはＤＩＰ型集積回路の外観構造
を示す平面図、正面図、第３図ａ，ｂはＤＭＰ型
集積回路の外観構造を示す平面図、正面図、第４
図ａ，ｂはＤＩＰ型集積回路用ソケツトの外観構
造を示す平面図、正面図、第５図ａ，ｂはＤＭＰ
型集積回路用ソケツトの外観構造を示す平面図、
正面図である。
５１……モールド樹脂、５２……接触子、５３
……取付けねじ用穴、５４……絶縁物構体、５５
……留め構体、５６……溝部、５７……突起、６
１……接触子。
なお図中同一符号は同一または相当する部分を示
す。
Figure 1 is an explanatory diagram showing the structure of an embodiment of this invention, Figures 2a and b are plan views and front views showing the external structure of a DIP type integrated circuit, and Figures 3a and b are DMP type integrated circuits. A plan view, a front view, and a fourth
Figures a and b are a plan view and front view showing the external structure of a DIP type integrated circuit socket, and Figures a and b are DMP.
A plan view showing the external structure of a socket for type integrated circuit,
It is a front view. 51...Mold resin, 52...Contact, 53
...Holes for mounting screws, 54...Insulator structure, 55
...Fixing structure, 56...Groove, 57...Protrusion, 6
1...Contact child. Note that the same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
端子の形状、寸法、ピツチが異なるデユアルイン
ラインパツケージ型の双方の集積回路の特性試験
に共用できるように、端子ピツチの小さい方の集
積回路の特性試験用で所定の位置に配置した集積
回路の端子に接続子を密接させるために該接触子
の先端部を押える絶縁物構体を備えたソケツトに
上記絶縁物構体を貫通する接触子を設け端子ピツ
チの大きい方の集積回路用のソケツト機構を付設
した集積回路用ソケツト。 Characteristics testing of integrated circuits with smaller terminal pitches can be used to test the characteristics of dual-in-line package integrated circuits, which have the same electrical properties but different package sizes and different terminal shapes, dimensions, and pitches. In order to bring the connector into close contact with the terminal of an integrated circuit placed at a predetermined position in a socket, a socket is equipped with an insulator structure that presses the tip of the contact, and a contact that penetrates the insulator structure is provided so that the terminal pitch is small. A socket for integrated circuits with a socket mechanism for larger integrated circuits.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7888187U JPS63188577U (en) | 1987-05-27 | 1987-05-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7888187U JPS63188577U (en) | 1987-05-27 | 1987-05-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63188577U true JPS63188577U (en) | 1988-12-02 |
Family
ID=30928235
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7888187U Pending JPS63188577U (en) | 1987-05-27 | 1987-05-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63188577U (en) |
-
1987
- 1987-05-27 JP JP7888187U patent/JPS63188577U/ja active Pending