JPS63183723A - Bending method for lead of resin sealing semiconductor device - Google Patents

Abstract

PURPOSE:To perform the bending of a lead in specific dimension without peeling off the resin of a resin sealing part by relatively moving a forming tool in the resin sealing part direction intersecting at right angles with the pinching direction with relatively moving it in the pinching direction of a pinching tool. CONSTITUTION:A forming roller 10 is advanced in the arrow mark direction 9, i.e., pinching direction to bend the base part of a lead 4 after pinching by a pair of pinching tools 20a, 20b the base part of the lead 4 extending from the outer side of a resin sealing part 6. The forming roller 10 is further advanced and when it reaches the position opposing to the relief part 21 of the pinching tool 20b, it is moved in the arrow mark direction 22 with advancing in the arrow mark direction 9. With this movement, the tip part side of the lead 4 is formed in a key shape along the relief part 21 of the pinching tool 20b. Thereafter, the forming roll 10 is returned to the original position and the pinching of a pair of pinching tools 20a, 20b is released to return them to their original position.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a method for bending leads of a resin-sealed semiconductor device.

(Prior Art) As shown in FIG. 3, a resin-sealed semiconductor device is manufactured by attaching a semiconductor pellet (1) on which a predetermined pattern is formed to a pellet mounting portion (3) of a lead frame (2), and After connecting the pad (1) and the lead (4) formed on the lead frame (2) with a gold Jit thin wire (5), they are sealed with resin, and further, after this resin sealing,
Leads (
4) by bending it at a predetermined position.

Conventionally, there is a method shown in FIGS. 4 and 5 as a method for bending the lead (4). Namely.

As shown in FIG. 4A, the method shown in FIG. ), then move the forming roller (10) to the clamping tool (8a) as shown by the arrow (9) on the outside of the clamping tool (8a), (llb).
) and (8b) in the clamping direction, and as shown in figure (B), place the tip end side of the lead (4) in one clamping tool (8b).
b) Bend at a nearly right angle along the outer surface. Also, the fifth
The method shown in the figure is a method of bending using a forming punch (11) instead of the forming roller (]O), and (A)
As shown in the figure, the base of the lead (4) extending from the outside of the resin sealing part (6) is held by a pair of clamping tools (8a),
(8b), then insert the forming punch (11) with the arrow (
9) and bend it at a nearly right angle as shown in figure (B).

Incidentally, as the density of semiconductor devices such as semiconductor integrated circuits increases, the pellets (1) tend to become larger, and the outer dimensions m of the resin sealing parts (6) tend to increase accordingly. Therefore, the leads of this semiconductor device (
4) is bent using the conventional method described above, the dimension between the tip ends of the lead (4) becomes the same as the shoulder dimension n, and is larger than that of a semiconductor device that is not densified. but,
On the other hand, the connector on the circuit side that connects this semiconductor device is
As the size of semiconductor devices increases, if a large socket is used, the meaning of increasing the density of semiconductor devices will be lost.Therefore, even if semiconductor devices become larger, the shoulder dimensions of the leads (4) will become smaller. A bending method that reduces n is desired.

FIG. 6 shows an example of such a bending method, and as shown in FIG.
a) After clamping and fixing with (13b), fan-shaped molding tools (14) arranged closely to the lead (4) on both sides of one clamping tool (13b), as shown in figure (B). 90 to
'Rotate and bend at the boundary with the resin sealing part (6).

However, in this bending method, the lead (4) is bent at the boundary with the resin sealing part (6).
Even if the external dimension m of the lead (4) increases, the shoulder dimension n of the lead (4) can be made smaller. Since the clamping tools (8a) and (8b) for fixing the semiconductor devices are not used, the resin at the boundary parts peels off, resulting in a problem of lowering the reliability of the semiconductor device.

(Problems to be Solved by the Invention) As described above, as a method for bending leads of resin-sealed semiconductor devices, conventionally, the bases of the leads extending from the outside of the resin-sealed part are held with a pair of clamping tools. There is a method of bending by holding and moving a forming tool such as a forming roller or a forming punch in the holding direction of the holding tool, but with this processing method, if the external dimensions of the resin-sealed part become large, There is a problem that the shoulder size of the lead cannot be made small. In addition, one method to solve this problem is to use a fan-shaped rotary molding tool to bend the part at the boundary with the resin sealing part, but with this method, the resin at the boundary part peels off and the resin seal There is a problem in that the reliability of the semiconductor device is reduced.

This invention was made to solve the above problems, and relates to a resin-sealed semiconductor device.

An object of the present invention is to provide a method for bending a lead by which the lead can be bent to a predetermined size without peeling off the resin of the resin-sealed part even if the outer dimensions of the resin-sealed part are large.

[Structure of the invention]

(Means for solving the problem) In a method for bending leads of a resin-sealed semiconductor device,
The base of the lead extending to the outside of the resin sealing part is held between a pair of clamping tools, and the molding tool is moved relative to the clamping direction of the clamping tools to remove the base of the lead extending from the clamping tool to the outside. After bending, the molding tool is further moved relatively in the clamping direction of the clamping tool and in the direction of the resin sealing part perpendicular to the clamping direction to bend the tip end side of the bent lead. I decided to mold it.

(Function) As described above, the base of the lead is held between a pair of clamping tools, and
By bending the base of the lead extending outside the pair of clamping tools using the molding tool, the lead can be bent without causing peeling of the resin at the boundary with the resin sealing part, and then the molding By relatively moving the tool in the direction of the clamping tool and in the direction of the resin sealing part, the distance between the tips of the bent leads can be set to a predetermined dimension.

(Example) Hereinafter, the present invention will be described based on an example with reference to the drawings.

FIG. 1 shows a method for bending leads of a resin-sealed semiconductor device, which is an embodiment of the present invention.

First, as shown in FIG.
20a) and (20b). Afterwards, a forming roller (10
) on the outer side of the clamping tools (20a) and (20b), as shown by the arrow (9), in the clamping direction, and as shown in Figure (B), the clamping tools (20a),
Bend the base of the lead (4) extending outward from (20b).

Of the pair of clamping tools (20a) and (20b), the clamping tool (20b) located in the forward direction of the forming roller (lO) is
20b) is provided with a relief part (21) of a size necessary for molding the distal end side of the lead (4), which will be described later.

Furthermore, as shown in Figure (C), even after bending the base of the lead (4), the forming roller (10) is moved forward,
This forming roller (10) is located at the relief part (
21), the forming roller (10) is moved in the direction of the resin sealing part (6) as shown by the arrow (22) while being moved forward as shown by the arrow (9). This movement in the direction of the resin sealing part (6) can be performed by any means such as an air or hydraulic cylinder, a cam, or an electromagnetic mechanism. Thus, due to the movement of the forming roller (10), the tip end side of the lead (4) is pressed against the clamping tool (20b).
along the relief part (21), and form it into the hook-shaped shape shown in figure (D).

After that, as shown by the dashed line in Figure (D).

The forming roll (10) is returned to its original position, and the pair of clamping tools (20a) and (20b) are released from the grip to return them to their original positions.

Next, another bending method will be described with reference to FIG.

In the bending method of this example, as shown in Figure (A), the base of the lead (4) extending from the outside of the resin sealing part (6) is held by a pair of clamping tools (24a) similar to the conventional one.

After clamping with (24b), this clamping tool (24a),
(24b) along the outside of the forming roller (10) with the arrow (
9), the leads (4) are moved forward in the clamping direction, and the bases of the leads (4) extending outside the clamping tools (24a) and (24b) are bent as shown in FIG. 9(B). Then, when the lead (4) is bent at 45 to 60 degrees at this base, as shown in FIG.
4b) as shown by the arrows (25a) and (25b) to release the lead (4) from being held,
(D) As shown in the figure, move the forming roller (10) to the arrow (9).
) while moving it forward in the same direction as the above-mentioned clamping direction, move it toward the resin sealing part (6) as shown by the arrow (26) to mold the tip end side of the bent lead (4). do. In addition, in this bending method, due to the stress during the above-mentioned molding, the lead (4) is slightly bent at the boundary with the resin sealing part (6) as shown in Figures (C) and (D). Ru.

Tables 1 and 2 show the target dimension between the tips of the leads (4): 7.6flII11 for those with external dimensions of the resin sealing part (6) of 6mm, 8non, and 7.4mm, respectively.
The actual dimensions between lead tip ends and the state of resin peeling at the boundary with the resin sealing part (6) when bending is performed using each of the above methods are shown in comparison with the conventional bending method.

(Leaving space below) Table 1 Table 2 As shown in Table 1, when the external dimension of the resin sealing part (6) is 6.8 mm, it is bent to a length of 7.6 mm between the tips of the leads (4). In the case of bending, the required bending process can be performed either by the conventional method or by the method according to the embodiment of the present invention. However, as seen from Table 2,
When the external dimension of the resin-sealed portion (6) reaches 7.4 mm, the conventional method cannot perform the required bending process, resulting in a defective resin-sealed semiconductor device, especially as shown in the middle part. According to the method of the embodiment, the required bending process can be performed.

That is, according to the method of each of the above embodiments, lead (4)
When bending the base of the
, (20b) or (24a), (24b) and is bent on the outside thereof, so the resin at the boundary with the resin sealing part (6) can be bent without peeling to the extent that it becomes defective. Can be done. Moreover, in this way, the clamping tool (20a)
.

(20b), (24a), and (24b), when the external dimensions of the resin sealing part (6) are large, the shoulder dimensions of the lead (4) will be the same as in the conventional processing method. Although the lead (4) becomes larger, by shaping the tip end side of the lead (4) after bending, the dimension between the tip ends of the lead (4) can be easily made to a predetermined size.

In the embodiment shown in FIG. 1 above, one of the clamping tools located in the forward direction of the forming roller was provided with a relief part, but instead of the relief part, this clamping tool had a relief part on the outer surface at an angle of about 8 degrees. It may also be a tapered surface inclined at a small angle.

Furthermore, in each of the above embodiments, the bending process was performed by moving the forming roller, but the same bending process can be achieved by moving a clamping tool that holds the resin-sealed semiconductor device and its leads in place of the forming roller. can be carried out.

〔Effect of the invention〕

In a resin-sealed semiconductor device, the base of the lead extending outside the resin-sealed part is held between a pair of holding tools, and the molding tool is moved relative to the holding direction, thereby allowing the lead to extend from the outside of the holding tool. After bending the base of the lead to be taken out, the molding tool is moved relative to the clamping direction and toward the resin sealing part to mold the tip end of the lead, so that the resin sealing part and the resin sealing part are molded. The lead can be bent without peeling off to the extent that the resin at the boundary part becomes defective, and the dimension between the tip ends of the bent lead can be easily set to a predetermined dimension.

[Brief explanation of the drawing]

Figures 1 (A) to D) are process diagrams for explaining one embodiment of the present invention, and Figures 2 (A) to D, respectively.
) are process diagrams for explaining other embodiments, FIG. 3 is a configuration diagram of a resin-sealed semiconductor device, and FIGS. 4 (A) and (B) are diagrams of a conventional resin-sealed semiconductor device. Figure 5 (A) is a process diagram for explaining the lead bending method.
) and (B) are process diagrams for explaining other conventional processing methods, respectively, and Figures 6 (A) and (B) are process diagrams for explaining other different conventional processing methods, respectively. be.

Claims (1)

[Claims] After the base of the lead extending to the outside of the resin sealing part is clamped between a pair of clamping tools, the molding tool is relatively moved in the clamping direction of the clamping tool to clamp the base of the lead extending to the outside from the clamping tool. bending the base, and moving the molding tool relative to the bent lead in the clamping direction of the clamping tool and moving the molding tool relative to the resin sealing part, thereby forming the bent lead. 1. A method for bending a lead of a resin-sealed semiconductor device, the method comprising: forming a tip end side of the lead.