JPS63182571U

JPS63182571U -

Info

Publication number: JPS63182571U
Application number: JP7489387U
Authority: JP
Priority date: 1987-05-19
Filing date: 1987-05-19
Publication date: 1988-11-24

Description

[Brief explanation of the drawing]

第１図ａ〜ｅはこの考案の一実施例の金属ベー
ス回路基板をその製造工程順に示す断面図、第２
図はこの考案の他の実施例の三層金属ベース回路
基板を示す断面図、第３〜第５図は各々従来の金
属ベース回路基板を示す断面図である。図において、１は金属ベース板、１１は金属露
出部、１２は絶縁層、１３は放熱用スタツド、１
６は導体パターン、１７はボンデイングパツド、
１８はダイパツド、配線パターンは導体パターン
１６ボンデイングパツド１７ダイボンデイングパ
ツド１８で構成される。２０は電子部品、この場
合は半導体素子である。なお、図中、同一符号は
同一又は相当部分を示す。 1A to 1E are cross-sectional views showing a metal base circuit board according to an embodiment of this invention in the order of its manufacturing process;
The figure is a cross-sectional view showing a three-layer metal base circuit board according to another embodiment of the present invention, and FIGS. 3 to 5 are cross-sectional views showing conventional metal base circuit boards. In the figure, 1 is a metal base plate, 11 is an exposed metal part, 12 is an insulating layer, 13 is a heat dissipation stud, 1
6 is a conductor pattern, 17 is a bonding pad,
18 is a die pad, and the wiring pattern is composed of a conductor pattern 16 bonding pad 17 die bonding pad 18. 20 is an electronic component, in this case a semiconductor element. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.

Claims

[Claims for Utility Model Registration] (1) A metal base, an insulating layer formed in a predetermined pattern by leaving an exposed metal portion on this metal base plate, and the above-mentioned method by filling the step between the surface of the exposed metal portion and the surface of the insulating layer. a metal heat dissipation stud formed on the exposed metal portion; a wiring pattern formed on the insulating layer;
and a metal-based circuit board comprising a heat-generating electronic component mounted and fixed on the heat dissipation stud and electrically connected to the wiring pattern. (2) The metal-based circuit board according to claim 1, wherein the heat dissipation stud is formed flush with the insulating layer. (3) The metal-based circuit board according to claim 1 or 2 of the utility model registration claim, in which electronic components are bonded via heat dissipation studs. (4) The metal-based circuit board according to any one of claims 1 to 3, which has an electronic component bonded to a heat dissipation stud via an insulating adhesive.