JPS63181347A - Pressure-sensitive adhesive sheet and semiconductor wafer dicing method using the same - Google Patents
Pressure-sensitive adhesive sheet and semiconductor wafer dicing method using the sameInfo
- Publication number
- JPS63181347A JPS63181347A JP62013035A JP1303587A JPS63181347A JP S63181347 A JPS63181347 A JP S63181347A JP 62013035 A JP62013035 A JP 62013035A JP 1303587 A JP1303587 A JP 1303587A JP S63181347 A JPS63181347 A JP S63181347A
- Authority
- JP
- Japan
- Prior art keywords
- pressure
- sensitive adhesive
- dicing
- sheet
- copolymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004820 Pressure-sensitive adhesive Substances 0.000 title claims description 103
- 239000004065 semiconductor Substances 0.000 title claims description 19
- 238000000034 method Methods 0.000 title claims description 18
- 239000000853 adhesive Substances 0.000 claims description 81
- 230000001070 adhesive effect Effects 0.000 claims description 81
- -1 aminoalkyl acrylate Chemical compound 0.000 claims description 71
- 239000000203 mixture Substances 0.000 claims description 63
- 229920005989 resin Polymers 0.000 claims description 61
- 239000011347 resin Substances 0.000 claims description 61
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 49
- 229920000642 polymer Polymers 0.000 claims description 41
- 229920001577 copolymer Polymers 0.000 claims description 35
- 239000004014 plasticizer Substances 0.000 claims description 33
- 230000004888 barrier function Effects 0.000 claims description 29
- 235000012431 wafers Nutrition 0.000 claims description 28
- 239000000178 monomer Substances 0.000 claims description 27
- 239000005056 polyisocyanate Substances 0.000 claims description 24
- 229920001228 polyisocyanate Polymers 0.000 claims description 24
- 239000000377 silicon dioxide Substances 0.000 claims description 24
- 239000003505 polymerization initiator Substances 0.000 claims description 16
- 229920006395 saturated elastomer Polymers 0.000 claims description 16
- 239000000843 powder Substances 0.000 claims description 15
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 claims description 11
- 229920001225 polyester resin Polymers 0.000 claims description 10
- 239000004645 polyester resin Substances 0.000 claims description 10
- 150000002148 esters Chemical class 0.000 claims description 9
- 230000001678 irradiating effect Effects 0.000 claims description 6
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 5
- 239000004800 polyvinyl chloride Substances 0.000 claims description 5
- 239000010410 layer Substances 0.000 description 42
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 12
- 238000006116 polymerization reaction Methods 0.000 description 12
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 9
- 239000003112 inhibitor Substances 0.000 description 9
- 230000001603 reducing effect Effects 0.000 description 9
- 229910052710 silicon Inorganic materials 0.000 description 9
- 239000010703 silicon Substances 0.000 description 9
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 8
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 8
- 230000000694 effects Effects 0.000 description 8
- 230000009467 reduction Effects 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 230000007423 decrease Effects 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 6
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 6
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 229920006026 co-polymeric resin Polymers 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 6
- 125000001931 aliphatic group Chemical group 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 5
- 238000004132 cross linking Methods 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- 230000003712 anti-aging effect Effects 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- 125000005442 diisocyanate group Chemical group 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 230000009477 glass transition Effects 0.000 description 4
- 229920000728 polyester Polymers 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000003086 colorant Substances 0.000 description 3
- ISAOCJYIOMOJEB-UHFFFAOYSA-N desyl alcohol Natural products C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 3
- 235000014113 dietary fatty acids Nutrition 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 239000000194 fatty acid Substances 0.000 description 3
- 229930195729 fatty acid Natural products 0.000 description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 3
- 238000011160 research Methods 0.000 description 3
- 150000005846 sugar alcohols Polymers 0.000 description 3
- 150000003505 terpenes Chemical class 0.000 description 3
- 235000007586 terpenes Nutrition 0.000 description 3
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 2
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 2
- IRIAEXORFWYRCZ-UHFFFAOYSA-N Butylbenzyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCC1=CC=CC=C1 IRIAEXORFWYRCZ-UHFFFAOYSA-N 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 2
- 235000000126 Styrax benzoin Nutrition 0.000 description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 2
- 229920002433 Vinyl chloride-vinyl acetate copolymer Polymers 0.000 description 2
- SMEGJBVQLJJKKX-HOTMZDKISA-N [(2R,3S,4S,5R,6R)-5-acetyloxy-3,4,6-trihydroxyoxan-2-yl]methyl acetate Chemical compound CC(=O)OC[C@@H]1[C@H]([C@@H]([C@H]([C@@H](O1)O)OC(=O)C)O)O SMEGJBVQLJJKKX-HOTMZDKISA-N 0.000 description 2
- 229940081735 acetylcellulose Drugs 0.000 description 2
- 125000005396 acrylic acid ester group Chemical group 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 2
- 229960002130 benzoin Drugs 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 150000001735 carboxylic acids Chemical class 0.000 description 2
- 229920002301 cellulose acetate Polymers 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- DHZSIQDUYCWNSB-UHFFFAOYSA-N chloroethene;1,1-dichloroethene Chemical compound ClC=C.ClC(Cl)=C DHZSIQDUYCWNSB-UHFFFAOYSA-N 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- 150000001990 dicarboxylic acid derivatives Chemical class 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 235000019382 gum benzoic Nutrition 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- 150000002513 isocyanates Chemical group 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 2
- 238000013508 migration Methods 0.000 description 2
- 230000005012 migration Effects 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- SNTUFFZRLYIJLP-UHFFFAOYSA-N (3-amino-3-hydroxypropyl) 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCC(N)O SNTUFFZRLYIJLP-UHFFFAOYSA-N 0.000 description 1
- JHPBZFOKBAGZBL-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylprop-2-enoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)=C JHPBZFOKBAGZBL-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- RTTZISZSHSCFRH-UHFFFAOYSA-N 1,3-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC(CN=C=O)=C1 RTTZISZSHSCFRH-UHFFFAOYSA-N 0.000 description 1
- VGHSXKTVMPXHNG-UHFFFAOYSA-N 1,3-diisocyanatobenzene Chemical compound O=C=NC1=CC=CC(N=C=O)=C1 VGHSXKTVMPXHNG-UHFFFAOYSA-N 0.000 description 1
- SBJCUZQNHOLYMD-UHFFFAOYSA-N 1,5-Naphthalene diisocyanate Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1N=C=O SBJCUZQNHOLYMD-UHFFFAOYSA-N 0.000 description 1
- RLPSARLYTKXVSE-UHFFFAOYSA-N 1-(1,3-thiazol-5-yl)ethanamine Chemical compound CC(N)C1=CN=CS1 RLPSARLYTKXVSE-UHFFFAOYSA-N 0.000 description 1
- IANQTJSKSUMEQM-UHFFFAOYSA-N 1-benzofuran Chemical compound C1=CC=C2OC=CC2=C1 IANQTJSKSUMEQM-UHFFFAOYSA-N 0.000 description 1
- TXTIIWDWHSZBRK-UHFFFAOYSA-N 2,4-diisocyanato-1-methylbenzene;2-ethyl-2-(hydroxymethyl)propane-1,3-diol Chemical compound CCC(CO)(CO)CO.CC1=CC=C(N=C=O)C=C1N=C=O TXTIIWDWHSZBRK-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- YEVQZPWSVWZAOB-UHFFFAOYSA-N 2-(bromomethyl)-1-iodo-4-(trifluoromethyl)benzene Chemical compound FC(F)(F)C1=CC=C(I)C(CBr)=C1 YEVQZPWSVWZAOB-UHFFFAOYSA-N 0.000 description 1
- DEGZUQBZHACZKW-UHFFFAOYSA-N 2-(methylamino)ethyl 2-methylprop-2-enoate Chemical compound CNCCOC(=O)C(C)=C DEGZUQBZHACZKW-UHFFFAOYSA-N 0.000 description 1
- ULEVTQHCVWIDPC-UHFFFAOYSA-N 2-(methylamino)ethyl prop-2-enoate Chemical compound CNCCOC(=O)C=C ULEVTQHCVWIDPC-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- QLIBJPGWWSHWBF-UHFFFAOYSA-N 2-aminoethyl methacrylate Chemical compound CC(=C)C(=O)OCCN QLIBJPGWWSHWBF-UHFFFAOYSA-N 0.000 description 1
- UGIJCMNGQCUTPI-UHFFFAOYSA-N 2-aminoethyl prop-2-enoate Chemical compound NCCOC(=O)C=C UGIJCMNGQCUTPI-UHFFFAOYSA-N 0.000 description 1
- LIAWCKFOFPPVGF-UHFFFAOYSA-N 2-ethyladamantane Chemical compound C1C(C2)CC3CC1C(CC)C2C3 LIAWCKFOFPPVGF-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- QZWKEPYTBWZJJA-UHFFFAOYSA-N 3,3'-Dimethoxybenzidine-4,4'-diisocyanate Chemical compound C1=C(N=C=O)C(OC)=CC(C=2C=C(OC)C(N=C=O)=CC=2)=C1 QZWKEPYTBWZJJA-UHFFFAOYSA-N 0.000 description 1
- OTKLRHWBZHQJOP-UHFFFAOYSA-N 3-aminopropyl prop-2-enoate Chemical compound NCCCOC(=O)C=C OTKLRHWBZHQJOP-UHFFFAOYSA-N 0.000 description 1
- GNSFRPWPOGYVLO-UHFFFAOYSA-N 3-hydroxypropyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCO GNSFRPWPOGYVLO-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- IEOMKERTJQIKKF-UHFFFAOYSA-N 4-aminobutyl prop-2-enoate Chemical compound NCCCCOC(=O)C=C IEOMKERTJQIKKF-UHFFFAOYSA-N 0.000 description 1
- PGXIJLSNAVMTTA-UHFFFAOYSA-N 6-aminohexyl prop-2-enoate Chemical compound NCCCCCCOC(=O)C=C PGXIJLSNAVMTTA-UHFFFAOYSA-N 0.000 description 1
- WWXUGNUFCNYMFK-UHFFFAOYSA-N Acetyl citrate Chemical compound CC(=O)OC(=O)CC(O)(C(O)=O)CC(O)=O WWXUGNUFCNYMFK-UHFFFAOYSA-N 0.000 description 1
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- 229920002126 Acrylic acid copolymer Polymers 0.000 description 1
- 229910002012 Aerosil® Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 229920001634 Copolyester Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
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- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- 239000004166 Lanolin Substances 0.000 description 1
- LSDPWZHWYPCBBB-UHFFFAOYSA-N Methanethiol Chemical compound SC LSDPWZHWYPCBBB-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- CGSLYBDCEGBZCG-UHFFFAOYSA-N Octicizer Chemical compound C=1C=CC=CC=1OP(=O)(OCC(CC)CCCC)OC1=CC=CC=C1 CGSLYBDCEGBZCG-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- OUUQCZGPVNCOIJ-UHFFFAOYSA-M Superoxide Chemical compound [O-][O] OUUQCZGPVNCOIJ-UHFFFAOYSA-M 0.000 description 1
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 1
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- XRLSGYQIHTVOMC-UHFFFAOYSA-N aminomethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCN XRLSGYQIHTVOMC-UHFFFAOYSA-N 0.000 description 1
- QHOTVLWYQNKORC-UHFFFAOYSA-N aminomethyl prop-2-enoate Chemical compound NCOC(=O)C=C QHOTVLWYQNKORC-UHFFFAOYSA-N 0.000 description 1
- 150000008365 aromatic ketones Chemical class 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- ZFMQKOWCDKKBIF-UHFFFAOYSA-N bis(3,5-difluorophenyl)phosphane Chemical compound FC1=CC(F)=CC(PC=2C=C(F)C=C(F)C=2)=C1 ZFMQKOWCDKKBIF-UHFFFAOYSA-N 0.000 description 1
- 125000002843 carboxylic acid group Chemical group 0.000 description 1
- 239000012986 chain transfer agent Substances 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- SQNNHEYXAJPPKH-UHFFFAOYSA-N chloroethene;prop-2-enoic acid Chemical compound ClC=C.OC(=O)C=C SQNNHEYXAJPPKH-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- MIMDHDXOBDPUQW-UHFFFAOYSA-N dioctyl decanedioate Chemical compound CCCCCCCCOC(=O)CCCCCCCCC(=O)OCCCCCCCC MIMDHDXOBDPUQW-UHFFFAOYSA-N 0.000 description 1
- XWVQUJDBOICHGH-UHFFFAOYSA-N dioctyl nonanedioate Chemical compound CCCCCCCCOC(=O)CCCCCCCC(=O)OCCCCCCCC XWVQUJDBOICHGH-UHFFFAOYSA-N 0.000 description 1
- YCZJVRCZIPDYHH-UHFFFAOYSA-N ditridecyl benzene-1,2-dicarboxylate Chemical compound CCCCCCCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCCCCCCC YCZJVRCZIPDYHH-UHFFFAOYSA-N 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- UIWXSTHGICQLQT-UHFFFAOYSA-N ethenyl propanoate Chemical compound CCC(=O)OC=C UIWXSTHGICQLQT-UHFFFAOYSA-N 0.000 description 1
- JBTWLSYIZRCDFO-UHFFFAOYSA-N ethyl methyl carbonate Chemical compound CCOC(=O)OC JBTWLSYIZRCDFO-UHFFFAOYSA-N 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- XUCNUKMRBVNAPB-UHFFFAOYSA-N fluoroethene Chemical compound FC=C XUCNUKMRBVNAPB-UHFFFAOYSA-N 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 229940039717 lanolin Drugs 0.000 description 1
- 235000019388 lanolin Nutrition 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 239000002480 mineral oil Substances 0.000 description 1
- 235000010446 mineral oil Nutrition 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-N o-dicarboxybenzene Natural products OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 1
- 229920002601 oligoester Polymers 0.000 description 1
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- OXNIZHLAWKMVMX-UHFFFAOYSA-N picric acid Chemical compound OC1=C([N+]([O-])=O)C=C([N+]([O-])=O)C=C1[N+]([O-])=O OXNIZHLAWKMVMX-UHFFFAOYSA-N 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 239000007870 radical polymerization initiator Substances 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229940116351 sebacate Drugs 0.000 description 1
- CXMXRPHRNRROMY-UHFFFAOYSA-L sebacate(2-) Chemical compound [O-]C(=O)CCCCCCCCC([O-])=O CXMXRPHRNRROMY-UHFFFAOYSA-L 0.000 description 1
- 235000012424 soybean oil Nutrition 0.000 description 1
- 239000003549 soybean oil Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Adhesive Tapes (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Dicing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
崖ｍリリ引汰肛
本発明は、感圧接着性シート及びこれを用いる半導体ウ
ェハーのダイシング方法に関し、詳しくは、電磁波、好
ましくは紫外線の照射によって接着力を低減させること
ができる感圧接着性シート、及びかかるシートをダイシ
ングフィルムとして用いると共に、フィルムの伸長工程
を含む半導体ウェハーのダイシング方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a pressure-sensitive adhesive sheet and a method for dicing semiconductor wafers using the same, and more specifically, to reducing adhesive force by irradiation with electromagnetic waves, preferably ultraviolet rays. The present invention relates to a pressure-sensitive adhesive sheet that can be used as a dicing film, and a method for dicing semiconductor wafers that uses such a sheet as a dicing film and includes a step of stretching the film.
葺】旺肩え古
一般に、基材シート上に感圧接着剤を塗布してなる感圧
接着性シート又は粘着シートは、一般家庭及び産業にお
いて種々の用途に使用されているが、近年、感圧接着性
シートの要求特性が多様且つ多岐にわたり、用途に応じ
て種々の機能性が要求されるに至っている。In general, pressure-sensitive adhesive sheets or pressure-sensitive adhesive sheets, which are made by coating a pressure-sensitive adhesive on a base sheet, are used for a variety of purposes in households and industry. The characteristics required for pressure-adhesive sheets are diverse and wide-ranging, and various functionalities are now required depending on the application.
例えば、集積回路の製作に際して、シリコンウェハーを
所定の寸法に裁断する、即ち、ダイシングを行なってダ
イスを得るためには、所謂ダイシングフィルムと呼ばれ
る感圧接着性シート上にシリコンウェハーを載置し、ダ
イシングフィルム上に感圧接着固定し、裁断した後、こ
れをダイシングフィルムからピックアップ、即ち、剥離
して取り上げる。従って、シリコンウェハーを正確にダ
イシングするためには、ダイシング時にはダイシングフ
ィルムがシリコンウェハーに対して強い接着力を有し、
一方、得られたダイスをダイシングフィルムからピック
アップするに際しては、ダイシングフィルムはその接着
力が弱いことが必要である。何ら制限されるものではな
いが、例えば、シリコンウェハーのダイシングに際して
は、ダイシングフィルムは１００〜１０００ｇ／２５ｆ
ｌ程度又はそれ以上の接着力を有し、一方、ダイスのピ
ックアップに際しては、ダイシングフィルムは数十ｇ／
２５＋ｎ程度又はこれ以下の接着力を有することが望ま
しいといわれている。For example, in the production of integrated circuits, in order to cut a silicon wafer into predetermined dimensions, that is, to obtain dice by dicing, the silicon wafer is placed on a pressure-sensitive adhesive sheet called a dicing film. After being pressure-sensitive adhesively fixed onto a dicing film and cut, it is picked up, that is, peeled off, from the dicing film. Therefore, in order to accurately dice silicon wafers, the dicing film must have strong adhesion to the silicon wafer during dicing.
On the other hand, when picking up the obtained dice from the dicing film, the dicing film needs to have weak adhesive strength. For example, when dicing silicon wafers, the dicing film should be 100 to 1000g/25f, although it is not limited in any way.
On the other hand, when picking up dice, the dicing film has an adhesive strength of several tens of grams per ounce or more.
It is said that it is desirable to have an adhesive strength of about 25+n or less.
他方、例えば、一般に接着剤の分野において、光重合性
オリゴマー、光重合性モノマー、光重合開始剤及びその
他の添加剤からなる電磁波架橋性接着剤、代表的には、
紫外線架橋性接着剤が既に知られており、これは無溶剤
型、−波型の接着剤であり、速硬化性であって、加熱を
要しない等の点ですぐれているが、この接着剤において
は、電磁波照射は、本来、接着剤に所要の接着力を発現
させるために行なわれる。On the other hand, for example, in the field of adhesives, electromagnetic crosslinkable adhesives consisting of photopolymerizable oligomers, photopolymerizable monomers, photopolymerization initiators, and other additives are typically used.
Ultraviolet cross-linkable adhesives are already known, and are excellent in that they are solvent-free, corrugated adhesives, fast-cure, and do not require heating. In , electromagnetic wave irradiation is originally carried out in order to cause the adhesive to develop the required adhesive strength.
日が ° しようとするロ 、占
本発明者らは、当初は強い接着力を有し、必要に応じて
その接着力を低減し得る感圧接着剤を得るために鋭意研
究した結果、予期しないことに、弾性重合体と電磁波架
橋性アクリル酸エステルとを主成分として含有する混合
物からなる感圧接着剤組成物が、これに電磁波を照射す
るとき、その接着力が著しく低減することを見出した。As a result of intensive research to obtain a pressure-sensitive adhesive that initially had a strong adhesive force and could reduce that adhesive force if necessary, the inventors discovered an unexpected result. In particular, we have found that when a pressure-sensitive adhesive composition consisting of a mixture containing an elastic polymer and an electromagnetic crosslinkable acrylic ester as main components is irradiated with electromagnetic waves, its adhesive strength is significantly reduced. .
しかしながら、基材樹脂シートとして、可塑剤を含有し
、伸長性を有する柔軟な透明樹脂フィルム、例えば、可
塑化塩化ビニル樹脂フィルム上に上記した感圧接着剤組
成物の層を形成し、これをダイシングフィルムとして用
いるとき、感圧接着剤組成物に含まれる電磁波架橋性ア
クリル酸エステルが基材樹脂シート中に移行すると共に
、塩化ビニル樹脂フィルムに含まれる可塑剤が感圧接着
剤組成物の層中に移行し、かくして、電磁波照射による
接着力の低減効果が経時的に速やかに失われる。また、
基材樹脂シートが可塑剤を含有しない場合でも、樹脂シ
ートによっては、同様に、電磁波照射による接着力の低
減効果が経時的に速やかに失われることがある。However, as a base resin sheet, a layer of the pressure-sensitive adhesive composition described above is formed on a flexible transparent resin film containing a plasticizer and having extensibility, such as a plasticized vinyl chloride resin film. When used as a dicing film, the electromagnetic crosslinkable acrylic ester contained in the pressure-sensitive adhesive composition migrates into the base resin sheet, and the plasticizer contained in the vinyl chloride resin film forms a layer of the pressure-sensitive adhesive composition. As a result, the adhesive strength reducing effect of electromagnetic wave irradiation is rapidly lost over time. Also,
Even when the base resin sheet does not contain a plasticizer, depending on the resin sheet, the effect of reducing adhesive force due to electromagnetic wave irradiation may similarly be rapidly lost over time.
そこで、本発明者らは、かかる問題を解決するために鋭
意研究した結果、基材樹脂シートと感圧接着剤組成物の
層との間にアミノアルキルアクリレート又はアミノアル
キルメタクリレートとエチレン性不飽和単量体との共重
合体からなる層をバリヤー層として設けるとき、このバ
リヤー層が可塑剤のみならず、電磁波架橋性アクリル酸
エステルの移行を特異的に効果的に防止し、従って、電
磁波照射による接着力の低減効果を長期間にわたって保
持することができるダイシングフィルムを得ることがで
きることを見出して、本発明に至ったものである。Therefore, as a result of intensive research in order to solve this problem, the present inventors discovered that aminoalkyl acrylate or aminoalkyl methacrylate and an ethylenically unsaturated monomer are used between the base resin sheet and the layer of the pressure-sensitive adhesive composition. When a layer consisting of a copolymer with a polymer is provided as a barrier layer, this barrier layer specifically and effectively prevents the migration of not only the plasticizer but also the electromagnetic wave crosslinkable acrylic ester, and therefore The present invention was achieved by discovering that it is possible to obtain a dicing film that can maintain the effect of reducing adhesive force over a long period of time.
更に、本発明者らは、上記感圧接着剤組成物の電磁波照
射による接着力の低減幅を一層大きくするために鋭意研
究した結果、感圧接着剤組成物に更にポリイソシアネー
ト及び／又は無水シリカ粉末を成分として含有させるこ
とによって、これに電磁波を照射するとき、接着力が大
幅に低減し、又は実質的に消滅することを見出して、本
発明に至ったものである。Furthermore, as a result of intensive research in order to further increase the reduction in adhesive strength of the pressure-sensitive adhesive composition due to electromagnetic irradiation, the present inventors have found that the pressure-sensitive adhesive composition further contains polyisocyanate and/or anhydrous silica. The present invention was achieved by discovering that by including powder as a component, the adhesive force is significantly reduced or substantially eliminated when electromagnetic waves are irradiated to the powder.
従って、本発明は、一般には、電磁波、好ましくは、紫
外線を照射しないときは強い接着力を有し、これに紫外
線を照射することにより、接着力を著しく低減させるこ
とができ、且つ、かかる効果を長期間にわたって安定に
保持し得る感圧接着性シート、及びかかる感圧接着性シ
ートを用いる半導体ウェハーのダイシング方法を提供す
ることを目的とする。Therefore, the present invention generally has a strong adhesive force when not irradiated with electromagnetic waves, preferably ultraviolet rays, and by irradiating it with ultraviolet rays, the adhesive force can be significantly reduced. It is an object of the present invention to provide a pressure-sensitive adhesive sheet that can stably maintain a pressure-sensitive adhesive sheet for a long period of time, and a method for dicing semiconductor wafers using such a pressure-sensitive adhesive sheet.
。 占を °するための
本発明の電磁波照射によって接着力を低減し得る感圧接
着性シートの第１は、電磁波を透過させ得る基材樹脂シ
ート上に、アミノアルキルアクリレート又はアミノアル
キルメタクリレートとエチレン性不飽和単量体との共重
合体からなるバリヤー層を形成し、この上に弾性重合体
と電磁波架橋性アクリル酸エステルと重合開始剤とを含
有する感圧接着剤の層を形成してなることを特徴とする
。. The first pressure-sensitive adhesive sheet of the present invention whose adhesive force can be reduced by electromagnetic wave irradiation for the purpose of improving the adhesive strength of A barrier layer made of a copolymer with an unsaturated monomer is formed, and a pressure-sensitive adhesive layer containing an elastic polymer, an electromagnetic crosslinkable acrylic ester, and a polymerization initiator is formed on top of this. It is characterized by
本発明による電磁波照射によって接着力を低減し得る感
圧接着性シートの第２は、電磁波を透過させ得る基材樹
脂シート上に、アミノアルキルアクリレート又はアミノ
アルキルメタクリレートとエチレン性不飽和単量体との
共重合体からなるバリヤー層を形成し、この上に弾性重
合体と電磁波架橋性アクリル酸エステルと重合開始剤と
共に、ポリイソシアネート及び／又は無水シリカ粉末を
含有する感圧接着剤の層を形成してなることを特徴とす
る。The second pressure-sensitive adhesive sheet according to the present invention whose adhesive strength can be reduced by electromagnetic wave irradiation is a base resin sheet that can transmit electromagnetic waves and is coated with aminoalkyl acrylate or aminoalkyl methacrylate and an ethylenically unsaturated monomer. Form a barrier layer consisting of a copolymer of , and then form a pressure-sensitive adhesive layer containing polyisocyanate and/or anhydrous silica powder together with an elastic polymer, an electromagnetic crosslinkable acrylic ester, and a polymerization initiator. It is characterized by:
また、本発明による半導体ウェハーのダイシング方法は
、１磁波を透過させ得る基材樹脂シート上に、アミノア
ルキルアクリレート又はアミノアルキルメタクリレート
とエチレン性不飽和単量体との共重合体からなるバリヤ
ー層を形成し、この上に弾性重合体と電磁波架橋性アク
リル酸エステルと重合開始剤とを含有する感圧接着剤の
層を形成してなるダイシングフィルム上に半導体ウェハ
ーを載置し、接着固定して、グイラングした後、上記ダ
イシングフィルムの裏面から電磁波を照射し、上記接着
剤の接着力を低減させ、ダイシングフィルムを伸長させ
、次いで、ダイスを取り上げることを特徴とする。Furthermore, the semiconductor wafer dicing method according to the present invention includes a barrier layer made of a copolymer of aminoalkyl acrylate or aminoalkyl methacrylate and an ethylenically unsaturated monomer on a base resin sheet that can transmit magnetic waves. A semiconductor wafer is placed on a dicing film on which a pressure-sensitive adhesive layer containing an elastic polymer, an electromagnetic crosslinkable acrylic ester, and a polymerization initiator is formed, and the semiconductor wafer is fixed by adhesive. After grooving, the dicing film is characterized in that electromagnetic waves are irradiated from the back side of the dicing film to reduce the adhesive force of the adhesive, the dicing film is stretched, and then the dice are taken up.
従来、種々の感圧接着剤組成物が、例えば「接着ハンド
ブック（第２版）」（日本接着協会編集、日刊工業新聞
社発行、１９８０年）第３９８〜４１４真に記載されて
いるように知られているが、代表的な感圧接着剤組成物
は弾性重合体を主成分とし、これに相溶性の良好な粘着
付与剤や可塑剤、更には、必要に応じて充填剤、老化防
止剤、着色剤等を均一に混合してなる混合物である。本
発明においては、かかる弾性重合体として、特に、飽和
共重合ポリエステル樹脂、ポリアクリル酸エステル及び
アクリル酸エステルの共重合体を好ましく用いることが
できる。Conventionally, various pressure-sensitive adhesive compositions have been known, for example, as described in "Adhesion Handbook (2nd Edition)" (edited by Japan Adhesive Association, published by Nikkan Kogyo Shimbun, 1980), volumes 398-414. However, typical pressure-sensitive adhesive compositions have an elastomeric polymer as the main component, and a tackifier and plasticizer with good compatibility with this, as well as a filler and an anti-aging agent, if necessary. It is a mixture made by uniformly mixing , coloring agent, etc. In the present invention, particularly preferred examples of such elastic polymers include saturated copolymerized polyester resins, polyacrylic esters, and copolymers of acrylic esters.
先ず、飽和共重合ポリエステル樹脂は、例えば、「工業
材料」第２５巻第１１号第１０１〜１０６頁に記載され
ているように、通常、異なる２種以上の飽和２価カルボ
ン酸と飽和２価アルコールとを重縮合させて得られるガ
ラス転移点の比較的低い飽和共重合樹脂であり、通常、
飽和２価カルボン酸として、芳香族２価カルボン酸と脂
肪族２価カルボン酸とが併用され、飽和２価アルコール
として脂肪族又は脂環式２価アルコール、即ち、グリコ
ールが用いられる。特に、本発明においては、芳香族２
価カルボン酸／脂肪族２価カルボン酸モル比が８０／２
０乃至２０／８０、好ましくは７０／３０乃至５０１５
０である飽和２価カルボン酸混合物とグリコールとを等
モルにて重縮合させて得られる飽和共重合ポリエステル
樹脂が好ましく用いられる。本発明においては、芳香族
２価カルボン酸としてテレフタル酸、脂肪族多価カルボ
ン酸としてセバシン酸、アジピン酸、グリコールとして
エチレングリコール、１．４−ブタンジオール、プロピ
レングリコール等を用いて得られる飽和共重合ポリエス
テル樹脂が好ましく用いられる。尚、必要に応じて、飽
和共重合ポリエステル樹脂の製造においては、カルボン
酸成分として３価以上の飽和多価カルボン酸や、３価以
上の多価アルコールが一部併用されてもよい。First, saturated copolymerized polyester resins are usually made by combining two or more different saturated divalent carboxylic acids and saturated divalent carboxylic acids, as described in, for example, "Kogyo Zaizai" Vol. 25, No. 11, pages 101-106. A saturated copolymer resin with a relatively low glass transition point obtained by polycondensation with alcohol.
As the saturated dihydric carboxylic acid, an aromatic dihydric carboxylic acid and an aliphatic dihydric carboxylic acid are used in combination, and as the saturated dihydric alcohol, an aliphatic or alicyclic dihydric alcohol, that is, a glycol is used. In particular, in the present invention, aromatic 2
valent carboxylic acid/aliphatic divalent carboxylic acid molar ratio is 80/2
0 to 20/80, preferably 70/30 to 5015
A saturated copolymerized polyester resin obtained by polycondensing a saturated dicarboxylic acid mixture of 0 and glycol in equimolar amounts is preferably used. In the present invention, the aromatic divalent carboxylic acid is terephthalic acid, the aliphatic polycarboxylic acid is sebacic acid, adipic acid, and the glycol is ethylene glycol, 1,4-butanediol, propylene glycol, etc. Polymerized polyester resins are preferably used. If necessary, in the production of the saturated copolymerized polyester resin, a saturated polyhydric carboxylic acid having a valence of 3 or more or a polyhydric alcohol having a valence of 3 or more may be partially used as the carboxylic acid component.
また、ポリアクリル酸エステル又はアクリル酸の共重合
体としては、従来よりアクリル系粘着剤として知られて
いる粘着剤において、主成分である弾性重合体として用
いられている任意のものを含む。アクリル系粘着剤にお
いて弾性重合体として用いられている重合体は、通常、
実質的にアクリル酸エステル共重合体である。この共重
合体は、通常、粘着性を有せしめるために低いガラス転
移点を有する重合体を形成するアクリル酸エチル、アク
リル酸ブチル、アクリル酸−２−エチルヘキシル等のア
クリル酸アルキルエステルを主モノマーとし、凝集性を
有せしめるために高いガラス転移点を有する硬い重合体
を形成するコモノマー、例えば、酢酸ビニル、アクリロ
ニトリル、スチレン、アクリル酸メチル、メタクリル酸
メチル等、及び架橋性や接着性の改良のためにカルボン
酸基、水酸基、アミド基、グリシジル基、ヒドロキシル
メチル基等の官能基を有する単量体、例えば、アクリル
酸、メタクリル酸、イタコン酸、ヒドロキシルエチルメ
タクリレート、ヒドロキシルプロピルメタクリレート、
アクリルアミド、グリシジルメタクリレート等のモノマ
ーを共重合させてなる共重合体である。Further, the polyacrylic acid ester or acrylic acid copolymer includes any one that is used as an elastic polymer as a main component in adhesives conventionally known as acrylic adhesives. Polymers used as elastic polymers in acrylic adhesives are usually
It is essentially an acrylic ester copolymer. This copolymer usually contains an acrylic alkyl ester as a main monomer, such as ethyl acrylate, butyl acrylate, or 2-ethylhexyl acrylate, which forms a polymer with a low glass transition temperature to provide adhesive properties. , comonomers that form hard polymers with a high glass transition temperature to provide cohesive properties, such as vinyl acetate, acrylonitrile, styrene, methyl acrylate, methyl methacrylate, etc., and to improve crosslinking and adhesion properties. Monomers having functional groups such as carboxylic acid groups, hydroxyl groups, amide groups, glycidyl groups, and hydroxylmethyl groups, such as acrylic acid, methacrylic acid, itaconic acid, hydroxylethyl methacrylate, hydroxylpropyl methacrylate,
It is a copolymer made by copolymerizing monomers such as acrylamide and glycidyl methacrylate.
本発明において用いる電磁波架橋性アクリル酸エステル
は、電磁波の照射によって架橋するオリゴマー又はモノ
マーとしてのアクリル酸エステル又はメタクリル酸エス
テルをいい、分子内に少なくとも２つのアクリロイル基
又はメタクリロイル基を有する。その分子量は、５００
０以下であることが好適である。The electromagnetic crosslinkable acrylic ester used in the present invention refers to an acrylic ester or methacrylic ester as an oligomer or monomer that crosslinks by irradiation with electromagnetic waves, and has at least two acryloyl or methacryloyl groups in the molecule. Its molecular weight is 500
It is suitable that it is 0 or less.
かかる電磁波架橋性アクリル酸エステルとしては、具体
的には、オリゴマーとしては、例えばオリゴエステルア
クリレート等を、また、モノマーとしては、例えば、１
，６−ヘキサンジオールジアクリレート、トリメチロー
ルプロパントリアクリレート、テトラメチロールメタン
テトラアクリレート、ジペンタエリスリトールへキサア
クリレート等の多価アルコールとアクリル酸のエステル
、或いは１．６−ヘキサンジオールジアクリレート、ト
リメチロールプロパントリメタクリレート、テトラメチ
ロールメタンテトラメタクリレート、ジペンタエリスリ
トールペンタメタクリレート等の多価アルコールとメタ
クリル酸のエステル等を挙げることができる。Specifically, examples of such electromagnetic crosslinkable acrylic esters include oligomers such as oligoester acrylates, and monomers such as 1
, 6-hexanediol diacrylate, trimethylolpropane triacrylate, tetramethylolmethanetetraacrylate, dipentaerythritol hexaacrylate, or ester of polyhydric alcohol and acrylic acid, or 1,6-hexanediol diacrylate, trimethylolpropane. Examples include esters of polyhydric alcohols and methacrylic acid such as trimethacrylate, tetramethylolmethanetetramethacrylate, and dipentaerythritol pentamethacrylate.
本発明において用いる感圧接着剤組成物は、前記弾性重
合体１００重量部について、上記電磁波架橋性アクリル
酸エステルを１５〜２００！１部、好ましくは５０〜１
５０重量部の範囲にて含有する。弾性重合体１００重量
部について、上記電磁波架橋性アクリル酸エステルが１
５重置部よりも少ないときは、得られる接着剤組成物に
電磁波を照射しても、その接着力が実質的に変化せず、
一方、２００重量部を越えるときは、電磁波照射によっ
て、その接着力を低減させることはできるが、例えば、
シリコンウェハーのダイシング後のダイスのピックアッ
プ時に、ダイスに接着剤が残留することがあり、好まし
くないからである。The pressure-sensitive adhesive composition used in the present invention contains 15 to 200!1 parts, preferably 50 to 1 part, of the electromagnetic crosslinkable acrylic ester per 100 parts by weight of the elastic polymer.
It is contained in a range of 50 parts by weight. For 100 parts by weight of the elastic polymer, 1 part of the electromagnetic crosslinkable acrylic ester is
When the number is less than 5 overlapping parts, even if the resulting adhesive composition is irradiated with electromagnetic waves, its adhesive strength does not substantially change,
On the other hand, when the amount exceeds 200 parts by weight, the adhesive force can be reduced by irradiating electromagnetic waves, but for example,
This is because adhesive may remain on the dice when picking up the dice after dicing the silicon wafer, which is undesirable.
本発明において用いる感圧接着剤組成物は、好ましくは
、更に粘着付与剤を含有する。特に、用いる弾性重合体
が飽和共重合ポリエステル樹脂である場合は、この粘着
付与剤を併用することが好ましい。用い得る粘着付与剤
は特に制限されず、従来より一般に粘着剤の製造におい
て用いられているものが適宜に用いられる。このような
粘着付与剤として、例えば、キシレン樹脂、ロジンや重
合ロジン、水添ロジン、ロジンエステル等の変性ロジン
系樹脂、テルペン樹脂、テルペンフェノール樹脂、ロジ
ンフェノール樹脂等のテルペン系樹脂、脂肪族系、芳香
族系及び脂環式系石油樹脂、クマロン樹脂、スチレン系
樹脂、アルキルフェノール樹脂等を挙げることができる
。粘着付与剤は、飽和共重合ポリエステル樹脂１００重
量部について、通常、１０〜２００重量部の範囲で用い
られる。粘着付与剤の配合量が余りに少ないときは、接
着力又は粘着力が不十分であり、他方、多すぎるときは
、得られる接着剤組成物に電磁波を照射した後の接着力
の低下幅が小さく、また、かかる接着剤組成物をダイシ
ングフィルムに適用した場合、シリコンウェハーのダイ
シング後のダイスのピックアップ時に、ダイスに粘着付
与剤が残留することがあり好ましくないからである。The pressure sensitive adhesive composition used in the present invention preferably further contains a tackifier. In particular, when the elastic polymer used is a saturated copolymerized polyester resin, it is preferable to use this tackifier in combination. The tackifier that can be used is not particularly limited, and those conventionally used in the production of adhesives can be used as appropriate. Examples of such tackifiers include xylene resins, modified rosin resins such as rosin, polymerized rosin, hydrogenated rosin, and rosin esters, terpene resins, terpene resins such as terpene phenol resins, and rosin phenol resins, and aliphatic resins. , aromatic and alicyclic petroleum resins, coumaron resins, styrene resins, alkylphenol resins, and the like. The tackifier is generally used in an amount of 10 to 200 parts by weight per 100 parts by weight of the saturated copolyester resin. When the amount of the tackifier is too small, the adhesive force or adhesion is insufficient, and on the other hand, when it is too large, the amount of decrease in the adhesive force after irradiating the resulting adhesive composition with electromagnetic waves is small. Furthermore, when such an adhesive composition is applied to a dicing film, the tackifier may remain on the dice when the dice are picked up after dicing the silicon wafer, which is undesirable.
本発明において用いる感圧接着剤組成物は、更に重合開
始剤又は光増感剤を含有し、必要に応じて重合禁止剤を
含有する。重合開始剤は、上記電磁波架橋性アクリル酸
エステルの電磁波照射による架橋を促進するために用い
られる。このような重合開始剤は、一般に、電磁波架橋
重合の技術分野においてよ（知られており、本発明にお
いては、従来より一般に知られている重合開始剤を用い
ることができる。かかる重合開始剤の具体例として、例
エバ、ベンゾインメチルエーテル、ベンゾインイソプロ
ピルエーテル等のベンゾインアルキルエーテル類や、ベ
ンゾイン、ベンジル、ベンゾフェノン等の芳香族オキシ
ケトン類や芳香族ケトン類を挙げることができるが、こ
れらに限定されるものではない。The pressure-sensitive adhesive composition used in the present invention further contains a polymerization initiator or a photosensitizer, and if necessary, a polymerization inhibitor. The polymerization initiator is used to promote crosslinking of the electromagnetic crosslinkable acrylic ester by electromagnetic irradiation. Such polymerization initiators are generally well known in the technical field of electromagnetic wave crosslinking polymerization, and in the present invention, conventionally known polymerization initiators can be used. Specific examples include, but are not limited to, benzoin alkyl ethers such as EVA, benzoin methyl ether, and benzoin isopropyl ether, and aromatic oxyketones and aromatic ketones such as benzoin, benzyl, and benzophenone. It's not a thing.
熱重合禁止剤は、上記電磁波架橋性アクリル酸エステル
が電磁波照射によらず、例えば、熱によって重合するこ
とを防止するために、必要に応じて添加されるもので、
かかる重合禁止剤としても、従来より知られている通常
の重合禁止剤を用いることができる。このような重合禁
止剤としては、例えば、ピクリン酸、フェノール、ハイ
ドロキノン、ハイドロキノンモノメチルエーテル等を用
いることができる。The thermal polymerization inhibitor is added as necessary to prevent the electromagnetic wave crosslinkable acrylic ester from polymerizing due to heat, for example, without electromagnetic irradiation.
As such a polymerization inhibitor, conventionally known ordinary polymerization inhibitors can be used. As such a polymerization inhibitor, for example, picric acid, phenol, hydroquinone, hydroquinone monomethyl ether, etc. can be used.
上記重合開始剤及び重合禁止剤の配合量は、電磁波架橋
重合の技術分野において一般に使用されているところに
従えばよく、例えば、重合開始剤は、前記電磁波架橋性
アクリル酸エステル１００重量部について１〜２０重量
部、重合禁止剤は必要に応じて０．１〜１重量部の範囲
で用いられる。The amount of the polymerization initiator and polymerization inhibitor may be in accordance with what is generally used in the technical field of electromagnetic wave crosslinking polymerization. ~20 parts by weight, and a polymerization inhibitor is used in a range of 0.1 to 1 part by weight as necessary.
本発明において用いる感圧接着剤組成物は、好ましくは
、更に、弾性重合体１００重量部について、ポリイソシ
アネート１〜１００重量部及び／又は無水シリカ粉末１
〜３０重量部を含有する。The pressure-sensitive adhesive composition used in the present invention preferably further contains 1 to 100 parts by weight of polyisocyanate and/or 1 part by weight of anhydrous silica powder per 100 parts by weight of the elastic polymer.
~30 parts by weight.
このように、ポリイソシアネート及び／又は無水シリカ
を感圧接着剤中に含有させることによって、電磁波照射
による接着力の低減幅を一層太き（することができる。In this way, by incorporating polyisocyanate and/or anhydrous silica into the pressure-sensitive adhesive, the range of reduction in adhesive strength due to electromagnetic wave irradiation can be further increased.
まず、ポリイソシアネートについて説明する。First, polyisocyanate will be explained.
上記したように、電磁波照射による接着力の低減幅を大
きくするには、ポリイソシアネートを弾性重合体１００
重量部について少なくとも１重量部加える必要がある。As mentioned above, in order to increase the reduction in adhesive strength due to electromagnetic wave irradiation, polyisocyanate is
It is necessary to add at least 1 part by weight for each part by weight.
ポリイソシアネートの配合量が弾性重合体１００重量部
について、１重量部よりも少ないときは、電磁波照射後
の接着力の低下効果が十分でない。しかし、１００重量
部よりも多いときは、得られる感圧接着剤組成物の電磁
波照射前の接着力が経時的に低下する。特に好ましい配
合量の範囲は、弾性重合体１００重量部について、１〜
５０重量部であり、特に好ましくは１〜２０重量部の範
囲である。If the amount of polyisocyanate is less than 1 part by weight per 100 parts by weight of the elastic polymer, the effect of reducing the adhesive force after electromagnetic wave irradiation is not sufficient. However, when the amount is more than 100 parts by weight, the adhesive strength of the resulting pressure-sensitive adhesive composition before irradiation with electromagnetic waves decreases over time. A particularly preferable blending amount range is 1 to 100 parts by weight of the elastic polymer.
The amount is 50 parts by weight, particularly preferably in the range of 1 to 20 parts by weight.
上記ポリイソシアネートとしては、特に限定されるもの
ではないが、本発明においては、ジイソシアネート及び
トリイソシアネートが好適である。The polyisocyanate is not particularly limited, but diisocyanates and triisocyanates are preferred in the present invention.
ジイソシアネートとしては、例えば、２．４− トルエ
ンジイソシアネート、ｍ−フェニレンジイソシアネート
、ｍ−キシリレンジイソシアネート、４，４”−ジフェ
ニルジイソシアネート、４，４”−ジフェニルメタンジ
イソシアネート、１，５−ナフタレンジイソシアネート
、イソホロンジイソシアネート、ジアニシジンジイソシ
アネート、ヘキサメチレンジイソシアネート等を例示す
ることができる。また、トリイソシアネートも種々のも
のが市販されており、例えば、住人化学工業−より［ス
ミジュールＬ」として市販されているトリメチロールプ
ロパントルエンジイソシアネートは、本発明において、
ポリイソシアネートとして好適に用いることができるト
リイソシアネートの一例である。Examples of the diisocyanate include 2,4-toluene diisocyanate, m-phenylene diisocyanate, m-xylylene diisocyanate, 4,4''-diphenyl diisocyanate, 4,4''-diphenylmethane diisocyanate, 1,5-naphthalene diisocyanate, isophorone diisocyanate, Examples include dianisidine diisocyanate and hexamethylene diisocyanate. In addition, various triisocyanates are commercially available; for example, trimethylolpropane toluene diisocyanate, which is commercially available as [Sumidur L] from Sumitomo Chemical Co., Ltd., is used in the present invention.
This is an example of a triisocyanate that can be suitably used as a polyisocyanate.
次に、ジイソシアネートとポリオールとをジイソシアネ
ートの過剰量の存在下に反応させて得られる末端イソシ
アネートの所謂ウレタンプレポリマーもポリイソシアネ
ートとして用いることができる。Next, a so-called urethane prepolymer of terminal isocyanate obtained by reacting a diisocyanate and a polyol in the presence of an excess amount of the diisocyanate can also be used as the polyisocyanate.
また、感圧接着剤組成物に無水シリ、力を配合して、電
磁波照射による接着力の低減幅を大きくするには、無水
シリカを弾性重合体１００重量部について少なくとも１
重量部配合する必要がある。In addition, in order to increase the reduction in adhesive strength due to electromagnetic wave irradiation by adding anhydrous silica to the pressure-sensitive adhesive composition, at least 1 part of anhydrous silica can be added to 100 parts by weight of the elastic polymer.
It is necessary to mix parts by weight.
配合量が弾性重合体１００重量部について、１重量部よ
りも少ないときは、電磁波照射後の接着力の低下効果に
乏しい。他方、３０重量部よりも多いときは、得られる
感圧接着剤組成物が著しく増粘してゲル状となり、例え
ば、塗布操作が困難となる。好ましい配合量の範囲は弾
性重合体１００重量部について１〜２０重量部の範囲で
あり、特に好ましくは１〜１５重量部の範囲である。When the blending amount is less than 1 part by weight per 100 parts by weight of the elastic polymer, the effect of reducing the adhesive force after electromagnetic wave irradiation is poor. On the other hand, if the amount is more than 30 parts by weight, the resulting pressure-sensitive adhesive composition will significantly thicken and become gel-like, making the coating operation difficult, for example. The preferred range of blending amount is 1 to 20 parts by weight, particularly preferably 1 to 15 parts by weight, per 100 parts by weight of the elastic polymer.
上記無水シリカ粉末としては、特に限定されるものでは
ないが、本発明においては、微粒子であることが好まし
く、従って、例えば、デグッサ社による「アエロジル」
を好ましく用いることができる。The above-mentioned anhydrous silica powder is not particularly limited, but in the present invention, it is preferably fine particles, and therefore, for example, "Aerosil" by Degussa
can be preferably used.
以上のように、弾性重合体と電磁波架橋性アクリル酸エ
ステルと重合開始剤とを主成分とする感圧接着剤組成物
にポリイソシアネート又は無水シリカをそれぞれ単独で
配合しても、これに電磁波を照射するとき、その接着力
が著しく低下するが、しかし、上記感圧接着剤組成物に
ポリイソシアネートと無水シリカ粉末とを併用して添加
するとき、ポリイソシアネートと無水シリカ粉末との相
乗的効果によって、それぞれを単独にて配合する場合に
比較して、電磁波照射後の接着力の低下が一層顕著とな
る。As described above, even if polyisocyanate or anhydrous silica is individually blended into a pressure-sensitive adhesive composition whose main components are an elastic polymer, an electromagnetic wave-crosslinkable acrylic ester, and a polymerization initiator, electromagnetic waves cannot be applied to the pressure-sensitive adhesive composition. When irradiated, its adhesive strength decreases significantly, but when polyisocyanate and anhydrous silica powder are added together to the above pressure-sensitive adhesive composition, due to the synergistic effect of polyisocyanate and anhydrous silica powder, The decrease in adhesive strength after irradiation with electromagnetic waves becomes more remarkable than when each of these is blended alone.
このように、感圧接着剤組成物にポリイソシアネートと
無水シリカとを共に配合する場合も、その配合量は、前
述したと同じく、ポリイソシアネ−トは弾性重合体１０
０重量部について１〜１００重量部の範囲であり、また
、無水シリカについては、弾性重合体１００重量部につ
いて１〜３０重量部の範囲である。特に、ポリイソシア
ネートについては、好ましい配合量の範囲は、弾性重合
体１００重量部について、１〜５０重量部であり、特に
好ましくは１〜２０重量部の範囲である。また、無水シ
リカについては、弾性重合体１００重量部について１〜
２０重量部の範囲であり、特に好ましくは１〜１５重量
部の範囲である。In this way, even when polyisocyanate and anhydrous silica are blended together in a pressure-sensitive adhesive composition, the blending amount is the same as described above.
For anhydrous silica, it ranges from 1 to 30 parts by weight per 100 parts by weight of the elastomeric polymer. In particular, the preferred blending amount of polyisocyanate is 1 to 50 parts by weight, particularly preferably 1 to 20 parts by weight, per 100 parts by weight of the elastic polymer. Regarding anhydrous silica, 1 to 100 parts by weight of the elastic polymer
The amount is in the range of 20 parts by weight, particularly preferably in the range of 1 to 15 parts by weight.
本発明において用いる感圧接着剤組成物は、前述した配
合量にて弾性重合体、電磁波架橋性アクリル酸エステル
及び重合開始剤と、好ましくはポリイソシアネート及び
／又は無水シリカ粉末と、必要に応じて粘着付与剤、重
合禁止剤、充填剤、老化防止剤、着色剤等とを、無水シ
リカ粉末を除く有機成分を溶解する適宜の有機溶剤、例
えば、芳香族炭化水素、ケトン類、又はこれらの混合物
に溶解し、無水シリカ粉末を分散させることによって、
均一な液状組成物として得ることができる。The pressure-sensitive adhesive composition used in the present invention contains an elastic polymer, an electromagnetic crosslinkable acrylic ester, a polymerization initiator, preferably a polyisocyanate and/or anhydrous silica powder in the above-mentioned amounts, and optionally a polyisocyanate and/or anhydrous silica powder. A suitable organic solvent that dissolves tackifiers, polymerization inhibitors, fillers, anti-aging agents, colorants, etc., and organic components other than anhydrous silica powder, such as aromatic hydrocarbons, ketones, or mixtures thereof. By dissolving and dispersing anhydrous silica powder in
It can be obtained as a uniform liquid composition.
溶剤としては、例えば、具体的にはトルエンとメチルエ
チルケトンとの混合溶剤が好ましく用いられるが、しか
し、これに限定されるものではない。As the solvent, for example, specifically, a mixed solvent of toluene and methyl ethyl ketone is preferably used, but the solvent is not limited thereto.
また、接着剤組成物における弾性重合体の含有量は、通
常、１０〜５０重量％の範囲である。しかし、これに限
定されるものではない。Moreover, the content of the elastic polymer in the adhesive composition is usually in the range of 10 to 50% by weight. However, it is not limited to this.
上記のような感圧接着剤組成物の調製方法は、何ら制限
されるものではないが、通常、弾性重合体及び粘着付与
剤は溶液の形態にて市販されており、これらを使用する
ことが便利であるので、例えば、これらの溶液を混合し
、これに電磁波架橋性アクリル酸エステル、重合開始剤
、ポリイソシアネート及び／又は無水シリカ粉末、更に
必要に応じて重合禁止剤、充填剤、老化防止剤、着色剤
等を添加し、均一に混合すればよい。The method for preparing the pressure-sensitive adhesive composition as described above is not limited in any way, but the elastic polymer and tackifier are usually commercially available in the form of a solution, and these can be used. As it is convenient, for example, these solutions may be mixed and added with electromagnetic wave crosslinkable acrylic ester, polymerization initiator, polyisocyanate and/or anhydrous silica powder, and if necessary, polymerization inhibitor, filler, and anti-aging agent. The additive, coloring agent, etc. may be added and mixed uniformly.
更に、本発明による感圧接着剤組成物は、必要に応じて
、液状ポリアクリル酸エステル、液状ポリブテン、鉱油
、ラノリン等の可塑剤や、また、充填剤、老化防止剤等
を適宜に含有していてもよい。Furthermore, the pressure-sensitive adhesive composition according to the present invention may contain a plasticizer such as liquid polyacrylate, liquid polybutene, mineral oil, lanolin, filler, anti-aging agent, etc. as necessary. You can leave it there.
本発明による感圧接着性シートは、電磁波を透過させ得
る基材シート上に、後述するように、バリヤー層として
、特に、アミノアルキルアクリレート又はアミノアルキ
ルメタクリレートとエチレン性不飽和単量体との共重合
体からなる樹脂の塗膜層を設け、この上に上述したよう
な液状組成物としての感圧性接着剤組成物を塗布し、乾
燥することによって得ることができる。The pressure-sensitive adhesive sheet according to the present invention is formed by forming a barrier layer on a base sheet that can transmit electromagnetic waves as a barrier layer, in particular, a combination of aminoalkyl acrylate or aminoalkyl methacrylate and an ethylenically unsaturated monomer, as described below. It can be obtained by providing a resin coating layer made of a polymer, applying the pressure-sensitive adhesive composition as a liquid composition as described above thereon, and drying.
上記基材シートとしては、電磁波、好ましくは紫外線を
透過し得る限りは、特に制限されることなく、種々のシ
ートを用いることができるが、通常は、透明乃至半透明
の合成樹脂シートが用いられる。例えば、塩化ビニル樹
脂、塩化ビニル−塩化ビニリデン共重合体樹脂、塩化ビ
ニル−酢酸ビニル共重合体樹脂、塩化ビニリデン樹脂、
ポリオレフィン、アセチルセルロース、ポリビニルアル
コール、ポリアミド、ポリエステル、ポリカーボネート
等からなる樹脂シートが好適に用いられる。As the base sheet, various sheets can be used without particular limitation as long as they can transmit electromagnetic waves, preferably ultraviolet rays, but usually transparent or translucent synthetic resin sheets are used. . For example, vinyl chloride resin, vinyl chloride-vinylidene chloride copolymer resin, vinyl chloride-vinyl acetate copolymer resin, vinylidene chloride resin,
Resin sheets made of polyolefin, acetyl cellulose, polyvinyl alcohol, polyamide, polyester, polycarbonate, etc. are preferably used.
上記した種々の基材樹脂シートのなかでも、可塑剤を含
有するポリ塩化ビニル又は塩化ビニルの共重合体からな
る樹脂シートは、柔軟であって、後述するように、半導
体ウェハーのダイシングにおいて必要とされる伸長を好
適に行なうことができ、更に、廉価でもあるので、本発
明において特に好適に用いることができる。また、塩化
ビニル樹脂シート以外にも、可塑剤を含有する基材シー
トとして、好適に用いる得るものもある。例えば、塩化
ビニル−塩化ビニリデン共重合体樹脂、塩化ビニル−酢
酸ビニル共重合体樹脂、塩化ビニル−アクリル酸エステ
ル共重合体樹脂、ポリ塩化ビニリデン、アセチルセルロ
ース等を挙げることができる。Among the various base resin sheets mentioned above, resin sheets made of polyvinyl chloride or vinyl chloride copolymers containing plasticizers are flexible and are necessary for dicing semiconductor wafers, as described below. It can be used particularly preferably in the present invention because it can suitably perform the elongation and is also inexpensive. In addition to vinyl chloride resin sheets, there are also materials that can be suitably used as base sheets containing plasticizers. Examples include vinyl chloride-vinylidene chloride copolymer resin, vinyl chloride-vinyl acetate copolymer resin, vinyl chloride-acrylic acid ester copolymer resin, polyvinylidene chloride, acetyl cellulose, and the like.
ここに、可塑剤としては、特に制限されるものではない
が、例えば、ジブチルフタレート、ジオクチルフタレー
ト、ジデシルフタレート、ジトリデシルフタレート、ブ
チルベンジルフタレート等のフタル酸ジエステル、トリ
クレジルホスフェート、トリオクチルホスフェート、ト
リフェニルホスフェート、２−エチルヘキシルジフェニ
ルホスフェート、クレジルジフェニルホスフェート等の
すン酸エステル、ジオクチルアジペート、ジオクチルセ
バケート、ジオクチルアゼレート、アセチルクエン酸ト
リー２〜エチルヘキシル等の脂肪酸ジエステル、ポリプ
ロピレンアジベート、ポリプロピレンセバケート等のポ
リエステル系可塑剤、エポキシ化大豆油等のエポキシ系
可塑剤、塩素化パラフィン、塩素化脂肪酸エステル等の
塩素系可塑剤等を挙げることができる。Examples of the plasticizer include, but are not limited to, phthalic acid diesters such as dibutyl phthalate, dioctyl phthalate, didecyl phthalate, ditridecyl phthalate, and butylbenzyl phthalate, tricresyl phosphate, and trioctyl phosphate. , triphenyl phosphate, 2-ethylhexyl diphenyl phosphate, cresyl diphenyl phosphate, and other fatty acid diesters; dioctyl adipate, dioctyl sebacate, dioctyl azelate, tri-2-ethylhexyl acetyl citrate, and other fatty acid diesters; polypropylene adibate, polypropylene Examples include polyester plasticizers such as sebacate, epoxy plasticizers such as epoxidized soybean oil, and chlorine plasticizers such as chlorinated paraffin and chlorinated fatty acid ester.
半導体ウェハーのダイシングにおいては、ウェハーをダ
イシングフィルム上に感圧接着固定し、所定の寸法に裁
断した後、ダイスをダイシングフィルムから剥離させる
ために、ダイシングを一方向に１０〜２５％程度伸長さ
せることが好ましいが、上記したような可塑剤を含有す
る樹脂シートは、容易に伸長させることができる。When dicing semiconductor wafers, the wafer is pressure-sensitive adhesively fixed onto a dicing film, cut into predetermined dimensions, and then the dicing is stretched by about 10 to 25% in one direction in order to separate the dice from the dicing film. However, a resin sheet containing a plasticizer as described above can be easily stretched.
しかしながら、このように、感圧接着性シートの基材樹
脂シートとして、可塑剤を含有する樹脂シートを用いる
場合は、この樹脂シートから可塑剤が感圧接着剤組成物
中に移行し、また、通常、可塑剤と電磁波架橋性アクリ
ル酸エステルとは相溶性がよいために、感圧接着剤組成
物に含まれる電磁波架橋性アクリル酸エステルが樹脂シ
ート中に移行し、このような相互移行によって、感圧接
着性シートの電磁波照射後の接着力の低減効果が著しく
減少する。また、その理由は明らかではないが、おそら
くは電磁波架橋性アクリル酸エステルが基材シートを構
成する樹脂との親和性がよいために、基材樹脂シート中
に移行するためであるとみられるが、樹脂シートによっ
ては、これが可塑剤を含有しない場合であっても、電磁
波照射前の接着力が経時的に著しく低減することがある
。However, when a resin sheet containing a plasticizer is used as the base resin sheet of the pressure-sensitive adhesive sheet, the plasticizer migrates from this resin sheet into the pressure-sensitive adhesive composition, and Usually, since the plasticizer and the electromagnetic wave crosslinkable acrylic ester have good compatibility, the electromagnetic wave crosslinkable acrylic ester contained in the pressure sensitive adhesive composition migrates into the resin sheet, and due to such mutual migration, The effect of reducing the adhesive strength of the pressure-sensitive adhesive sheet after electromagnetic wave irradiation is significantly reduced. Although the reason for this is not clear, it is probably because the electromagnetic wave crosslinkable acrylic ester has a good affinity with the resin that makes up the base sheet, so it migrates into the base resin sheet. Depending on the sheet, even if the sheet does not contain a plasticizer, the adhesive strength before irradiation with electromagnetic waves may decrease significantly over time.
従って、本発明においては、基材シートと感圧接着剤組
成物層との間に電磁波架橋性アクリル酸エステルを透過
させないバリヤー層を形成し、また、感圧接着性シート
の基材シートとして、可塑剤を含有する樹脂シートを用
いる場合は、この基材シートと感圧接着剤組成物層との
間に可塑剤及び電磁波架橋性アクリル酸エステルを共に
透過させない樹脂層からなるバリヤー層を介在させる。Therefore, in the present invention, a barrier layer that does not transmit electromagnetic crosslinkable acrylic ester is formed between the base sheet and the pressure-sensitive adhesive composition layer, and as a base sheet of the pressure-sensitive adhesive sheet, When using a resin sheet containing a plasticizer, a barrier layer consisting of a resin layer that does not transmit both the plasticizer and the electromagnetic crosslinkable acrylic ester is interposed between the base sheet and the pressure-sensitive adhesive composition layer. .
但し、このバリヤー層は、電磁波の透過を妨げるもので
あってはならない。However, this barrier layer must not impede the transmission of electromagnetic waves.
即ち、このバリヤー層は、電磁波の透過は何ら妨げない
が、感圧接着剤組成物に含まれている電磁波架橋性アク
リル酸エステルが基材樹脂シートに移行するのを阻止し
、好ましくは、更に、基材樹脂シートに含まれている可
塑剤が感圧接着剤組成物中に移行するのを阻止し、この
ようにして、基材樹脂シートに含まれている可塑剤をこ
の基材中に保持し、感圧接着剤組成物に含まれている電
磁波架橋性アクリル酸エステルを接着剤組成物中に保持
して、感圧接着性シートの電磁波照射による接着力の経
時的な低下を防止する。That is, this barrier layer does not impede the transmission of electromagnetic waves in any way, but it prevents the electromagnetic wave crosslinkable acrylic ester contained in the pressure sensitive adhesive composition from migrating to the base resin sheet, and preferably further , the plasticizer contained in the base resin sheet is prevented from migrating into the pressure sensitive adhesive composition, and in this way, the plasticizer contained in the base resin sheet is transferred into the base material. The electromagnetic wave crosslinkable acrylic ester contained in the pressure-sensitive adhesive composition is retained in the adhesive composition to prevent the adhesive strength of the pressure-sensitive adhesive sheet from decreasing over time due to electromagnetic wave irradiation. .
本発明においては、かかるバリヤー層として、特に、ア
ミノアルキルアクリレート又はアミノアルキルメタクリ
レートとエチレン性不飽和単量体との共重合体からなる
樹脂の塗膜層が好適に用いられる。即ち、本発明におい
て、バリヤー層は、上記共重合体の上記樹脂の溶液を塗
布し、乾燥することによって、形成することができる。In the present invention, as such a barrier layer, a resin coating layer made of a copolymer of aminoalkyl acrylate or aminoalkyl methacrylate and an ethylenically unsaturated monomer is particularly preferably used. That is, in the present invention, the barrier layer can be formed by applying a solution of the resin of the copolymer and drying it.
上記アミノアルキルアクリレート又はアミノアルキルメ
タクリレートとエチレン性不飽和単量体との共重合体は
、例えば、特公昭３８−２６７６３号公報や特公昭４３
−６２３５号公報に記載されているように、既に知られ
ており、一般式％式％
（但し、Ｒ１は水素又はメチル基、Ｒ′Ｌは炭素数１〜
６のアルキレン基又はヒドロキシアルキレン基、Ｒ３は
水素又は炭素数１〜６のアルキル基を示す。）で表わさ
れるアミノアルキルアクリレート又はアミノアルキルメ
タクリレート単量体単位とエチレン系不飽和単量体単位
との共重合体である。The above-mentioned copolymers of aminoalkyl acrylate or aminoalkyl methacrylate and ethylenically unsaturated monomers are disclosed, for example, in Japanese Patent Publication No. 38-26763 and Japanese Patent Publication No. 43
As described in Publication No. 6235, it is already known and has the general formula % (where R1 is hydrogen or a methyl group, and R'L has 1 to 1 carbon atoms.
6 represents an alkylene group or a hydroxyalkylene group, and R3 represents hydrogen or an alkyl group having 1 to 6 carbon atoms. ) is a copolymer of aminoalkyl acrylate or aminoalkyl methacrylate monomer units and ethylenically unsaturated monomer units.
ここにおいて、アミノアルキルアクリレート又はアミノ
アルキルメタクリレート単量体単位として、例えば、ア
ミノメチルアクリレート、アミノエチルアクリレート、
アミノプロピルアクリレート、アミノ−ｎ−ブチルアク
リレート、アミノへキシルアクリレート、Ｎ−メチルア
ミノエチルアクリレート、Ｎ −ｔｅｒｔ、−ブチルア
ミノエチルアクリレート、アミノヒドロキシプロビルア
クリレート等のアクリル酸エステル、アミノメチルメタ
クリレート、アミノエチルメタクリレート、アミノ−ｎ
−ブチルメタクリレート、Ｎ−メチルアミノエチルメタ
クリレート、Ｎ −ｔｅｒｔ、−ブチルアミノエチルメ
タクリレート、アミノヒドロキシプロピルメタクリレー
ト等のメタクリル酸エステルを挙げることができる。こ
れらアミノアルキルアクリレート又はアミノアルキルメ
タクリレート単量体単位は、共重合体において、通常、
約１〜４０重量％、好ましくは、約２〜２０重量％の範
囲で含有される。Here, the aminoalkyl acrylate or aminoalkyl methacrylate monomer unit includes, for example, aminomethyl acrylate, aminoethyl acrylate,
Acrylic acid esters such as aminopropyl acrylate, amino-n-butyl acrylate, aminohexyl acrylate, N-methylaminoethyl acrylate, N-tert, -butylaminoethyl acrylate, aminohydroxyprobyl acrylate, aminomethyl methacrylate, aminoethyl methacrylate, amino-n
Methacrylic acid esters such as -butyl methacrylate, N-methylaminoethyl methacrylate, N-tert, -butylaminoethyl methacrylate, and aminohydroxypropyl methacrylate can be mentioned. These aminoalkyl acrylate or aminoalkyl methacrylate monomer units are usually used in the copolymer.
It is contained in a range of about 1 to 40% by weight, preferably about 2 to 20% by weight.
一方、エチレン系不飽和単量体単位とは、例えば、メチ
ルアクリレート、エチルアクリレート、ｎ−ブチルアク
リレート、２−エチルへキシルアクリレート等のアクリ
ル酸エステル、メチルメタクリレート、エチルアクリレ
ート、ｎ−ブチルメタクリレート等のメタクリル酸エス
テル、酢酸ビニル、プロピオン酸ビニル等の脂肪族有機
酸ビニルエステル、エチレン、プロピレン、イソブチン
等の脂肪族モノオレフィン、スチレン、ビニルトルエン
等の芳香族モノオレフィン、その他アクリロニトリル、
塩化ビニル、フッ化ビニル等を挙げることができる。On the other hand, ethylenically unsaturated monomer units include, for example, acrylic acid esters such as methyl acrylate, ethyl acrylate, n-butyl acrylate, and 2-ethylhexyl acrylate, methyl methacrylate, ethyl acrylate, n-butyl methacrylate, etc. aliphatic organic acid vinyl esters such as methacrylic acid esters, vinyl acetate and vinyl propionate; aliphatic monoolefins such as ethylene, propylene and isobutyne; aromatic monoolefins such as styrene and vinyltoluene; other acrylonitrile;
Examples include vinyl chloride and vinyl fluoride.
共重合体において、このエチレン系不飽和単量体単位は
、通常、約６０〜９９重量％、好ましくは約８０〜９８
重量％の範囲で含有される。In the copolymer, this ethylenically unsaturated monomer unit usually accounts for about 60 to 99% by weight, preferably about 80 to 98% by weight.
It is contained in a range of % by weight.
かかる共重合体は、上記したアミノアルキルアクリレー
ト又はアミノアルキルメタクリレート単量体単位とエチ
レン系不飽和単量体単位とをトルエン等の芳香族炭化水
素溶剤、イソプロパツール等のアルコール溶剤、酢酸エ
チル等のエステル系溶剤、又はこれらの混合物中におい
て、アゾビスイソブチロニトリル等の過酸化物系ラジカ
ル重合開始剤を用いて、必要ならば、メルカプタン類の
連鎖移動剤を用いて、常法にて重合させることによって
、通常、溶液として得ることができる。Such a copolymer can be prepared by combining the above-mentioned aminoalkyl acrylate or aminoalkyl methacrylate monomer units and ethylenically unsaturated monomer units in an aromatic hydrocarbon solvent such as toluene, an alcohol solvent such as isopropanol, ethyl acetate, etc. in an ester solvent or a mixture thereof using a peroxide radical polymerization initiator such as azobisisobutyronitrile and, if necessary, a chain transfer agent such as a mercaptan, by a conventional method. By polymerizing it, it can usually be obtained as a solution.
上記共重合体は、分子量は、重量平均分子量にて１００
０〜１００００００程度、好ましくは５０００〜５００
００の範囲であることが適当である。The above copolymer has a molecular weight of 100 in terms of weight average molecular weight.
About 0 to 1 million, preferably 5000 to 500
A range of 00 is appropriate.
上記共重合体は、通常、有機溶剤に溶解してなる溶液と
して得られ、かかる溶液として、基材シート上に塗布さ
れ、乾燥されて、バリヤー層を形成する。上記溶液を形
成するための有機溶剤としては、例えば、前記重合溶剤
のほか、アセトン、メチルエチルケトン等のケトン溶剤
を用いることができる。かかる溶液における不揮発分は
、特に限定されるものではないが、通常、約７０重量％
以上であることが好ましい。The copolymer is usually obtained as a solution by dissolving it in an organic solvent, and the solution is applied onto a base sheet and dried to form a barrier layer. As the organic solvent for forming the above solution, for example, in addition to the above polymerization solvent, ketone solvents such as acetone and methyl ethyl ketone can be used. The nonvolatile content in such a solution is not particularly limited, but is usually about 70% by weight.
It is preferable that it is above.
尚、上記共重合体溶液は、必要に応じて、少量のエポキ
シ樹脂、イソシアネート系プレポリマー等の架橋用オリ
ゴマーを含有していてもよい。Note that the copolymer solution may contain a small amount of a crosslinking oligomer such as an epoxy resin or an isocyanate prepolymer, if necessary.
本発明においては、バリヤー層は、上記共重合体溶液を
基材シートに塗布し、乾燥することによって形成するこ
とができる。ここに、塗布手段は何ら制限されず、刷毛
、ローラー刷毛、スプレーガン、フローコーター、ロー
ルコータ−等を用いることができる。基材シートへの塗
布量は、通常、約１〜５０ ｇ／ｎｆの範囲が好適であ
る。In the present invention, the barrier layer can be formed by applying the above copolymer solution onto a base sheet and drying it. Here, the application means is not limited at all, and a brush, roller brush, spray gun, flow coater, roll coater, etc. can be used. The amount of coating on the base sheet is usually preferably in the range of about 1 to 50 g/nf.
本発明による感圧接着シートを所要の被着面に適用した
後に、これに電磁波を照射する手段及び方法は特に制限
されず、電磁波硬化性樹脂塗料や電磁波硬化性接着剤の
技術分野において、従来より通常に行な割れている手段
及び方法によることができる。本発明においては、電磁
波として、特に、紫外線及び電子線が好適に用いられる
が、紫外線を用いる場合は、その照射手段として、例え
ば、キセノンランプ、低圧、中圧、高圧或いは超高圧水
銀灯灯のような電磁波源を使用し、数秒乃至数分、照射
すればよい。The means and method for irradiating the pressure-sensitive adhesive sheet of the present invention with electromagnetic waves after applying it to a desired surface are not particularly limited. This can be done by means and methods that are more commonly practiced. In the present invention, ultraviolet rays and electron beams are particularly preferably used as electromagnetic waves, but when ultraviolet rays are used, the irradiation means may be, for example, xenon lamps, low pressure, medium pressure, high pressure, or ultra-high pressure mercury lamps. It is sufficient to use a suitable electromagnetic wave source and irradiate for several seconds to several minutes.
本発明の方法によれば、上述したような感圧接着剤性シ
ートをダイシングフィルムとして用いることによって、
半導体ウェハーのダイシングを極めて容易に行なうこと
ができる。即ち、前記本発明による感圧接着性シートは
、紫外線照射前は、１００〜１０００ｇ／２５酊程度又
はそれ以上の接着力を有し、一方、紫外線の照射後には
、接着力が数十ｇ ／ ２５ ｗ程度又はこれ以下に低
減される。従って、本発明の方法によれば、半導体ウェ
ハーは、ダイシングフィルム上に大きい接着力にて感圧
接着固定されるので、裁断した後、ダイシングフイルム
の裏面から電磁波、例えば、紫外線を照射すれば、感圧
接着性シートは、その接着力を著しく低減し、しかも、
この後、ダイシングフィルムを１０〜２５％伸長すれば
、ダイスを容易にダイシングフィルムから剥離すること
ができる。According to the method of the present invention, by using the pressure-sensitive adhesive sheet as described above as a dicing film,
Dicing of semiconductor wafers can be performed extremely easily. That is, the pressure-sensitive adhesive sheet according to the present invention has an adhesive strength of about 100 to 1000 g/25 g/25 g/m or more before irradiation with ultraviolet rays, and an adhesive strength of several tens of g/25 g/m after irradiation with ultraviolet rays. It is reduced to about 25 W or less. Therefore, according to the method of the present invention, the semiconductor wafer is pressure-sensitive adhesively fixed on the dicing film with a large adhesive force, so that after cutting, if electromagnetic waves, such as ultraviolet rays, are irradiated from the back side of the dicing film, The pressure-sensitive adhesive sheet significantly reduces its adhesive strength, and
Thereafter, if the dicing film is stretched by 10 to 25%, the dice can be easily peeled off from the dicing film.
完里皇須果
以上のように、本発明による感圧接着性シートは、電磁
波を透過させ得る基材樹脂シート上に所定の単量体成分
組成からなる共重合体の層がバリヤー層として設けられ
ているので、基材樹脂シート中に含まれる可塑剤の感圧
接着剤組成物層中への移行のみならず、感圧接着剤組成
物層中に含まれるｔ磁波架橋性アクリル酸エステルの基
材樹脂シートへの移行が共に防止され、かくして、感圧
接着性シートの裏面からの電磁波照射による接着力の低
減効果が長期間にわたって保持される。As described above, the pressure-sensitive adhesive sheet according to the present invention has a copolymer layer having a predetermined monomer component composition provided as a barrier layer on a base resin sheet that can transmit electromagnetic waves. Therefore, not only does the plasticizer contained in the base resin sheet migrate into the pressure-sensitive adhesive composition layer, but also the t-magnetic wave crosslinkable acrylic ester contained in the pressure-sensitive adhesive composition layer Transfer to the base resin sheet is also prevented, and thus the effect of reducing adhesive force due to electromagnetic wave irradiation from the back side of the pressure-sensitive adhesive sheet is maintained for a long period of time.
従って、本発明によるかかる感圧接着性シートを用いる
ことによって、シリコンウェハーのダイシングを生産性
高く行なうことができる。Therefore, by using the pressure-sensitive adhesive sheet according to the present invention, silicon wafers can be diced with high productivity.
更に、本発明に従って、感圧接着剤組成物に弾性重合体
、電磁波架橋性アクリル酸エステル及び重合開始剤と共
に、ポリイソシアネート及び／又は無水シリカ粉末、特
に好ましくはこれら両者を共に配合することによって、
感圧接着剤組成物の電磁波照射による接着力の低減幅を
一部高めることができ、好ましい場合には、電磁波照射
によって、その接着力を実質的に消滅させることができ
る。Furthermore, according to the invention, by incorporating polyisocyanate and/or anhydrous silica powder, particularly preferably both together, into the pressure-sensitive adhesive composition together with the elastic polymer, the electromagnetic crosslinkable acrylic ester and the polymerization initiator,
The reduction in adhesive strength of the pressure-sensitive adhesive composition caused by electromagnetic irradiation can be partially increased, and in preferred cases, the adhesive strength can be substantially eliminated by electromagnetic irradiation.
ＩＩ医
以下に、実施例を示すが、本発明はこの実施例に限定さ
れるものではない。また、実施例中、部とあるのは重量
部を示す。Examples are shown below, but the present invention is not limited to these examples. Furthermore, in the examples, parts indicate parts by weight.
実施例１
離型紙上に第１表に示す配合の感圧接着剤組成物Ｌ Ｉ
Ｉ及び■をそれぞれ塗布し、１２０℃で１分間乾燥し、
感圧接着剤組成物の層を固形分として１０μｍ厚みに形
成した。Example 1 Pressure-sensitive adhesive composition L I having the formulation shown in Table 1 was placed on release paper.
Coat I and ■ respectively, dry at 120°C for 1 minute,
A layer of the pressure sensitive adhesive composition was formed to have a thickness of 10 μm based on the solid content.
ここに、ポリアクリル酸エステル又はアクリル酸エステ
ルの共重合体を弾性重合体として用いる場合は、市販の
アクリル系粘着剤溶液に所定量の紫外線架橋性アクリル
酸エステル、重合開始剤及びその他の添加剤を加えて、
感圧接着剤組成物を調製し、これを上記のように離型紙
上に塗布し、乾燥させて、感圧接着剤組成物の層を形成
させた。When polyacrylic ester or acrylic ester copolymer is used as the elastic polymer, a predetermined amount of ultraviolet crosslinkable acrylic ester, a polymerization initiator, and other additives are added to a commercially available acrylic adhesive solution. In addition,
A pressure sensitive adhesive composition was prepared and coated onto release paper as described above and dried to form a layer of pressure sensitive adhesive composition.
また、弾性重合体として、飽和共重合ポリエステル樹脂
を用いる場合は、テレフタル酸／セバシン酸モル比７０
／３０の飽和２価カルボン酸混合物とエチレングリコー
ルとを等モルにて重縮合させて得られるガラス転移魚釣
１０℃の樹脂を用いた。In addition, when using a saturated copolymerized polyester resin as the elastic polymer, the molar ratio of terephthalic acid/sebacic acid is 70.
A glass transition resin obtained by polycondensing an equimolar amount of a saturated dicarboxylic acid mixture of /30 and ethylene glycol at 10° C. was used.
次に、平均重合度１３００のポリ塩化ビニル１００部、
可塑剤としてジオクチルフタレート又はポリエステル系
可塑剤３５部及び適宜量の安定剤からなる塩化ビニル樹
脂組成物から成形した厚み０．１鰭のシート上に、第２
表に示す単量体組成を有する固形分３０重量％の共重合
体溶液を塗布し、１２０℃で３０秒間乾燥させて、バリ
ヤー層を形成した。この後、この基材樹脂シートのバリ
ヤー層の表面に上記感圧接着剤層を重ねて貼り合わせて
、本発明による感圧接着性シートを得た。Next, 100 parts of polyvinyl chloride with an average degree of polymerization of 1300,
On a sheet of 0.1 fin thickness molded from a vinyl chloride resin composition consisting of 35 parts of dioctyl phthalate or polyester plasticizer as a plasticizer and an appropriate amount of stabilizer, a second
A copolymer solution having a solid content of 30% by weight and having the monomer composition shown in the table was applied and dried at 120° C. for 30 seconds to form a barrier layer. Thereafter, the pressure-sensitive adhesive layer was laminated and laminated on the surface of the barrier layer of this base resin sheet to obtain a pressure-sensitive adhesive sheet according to the present invention.
前述したように、バリヤー層は、感圧接着剤組成物に含
まれる紫外線架橋性アクリル酸エステル及び基材樹脂シ
ートに含まれる可塑剤のいずれにも溶解しないことが要
求される。第３表に本発明においてバリヤー層として用
いる上記共重合体樹脂とその他の樹脂の紫外線架橋性ア
クリル酸エステル及び可塑剤の溶解性を示す。本発明に
おいて用いる共重合体樹脂は、比較的低分子量の紫外線
架橋性アクリル酸及び可塑剤のいずれをも溶解しないこ
とが理解される。As mentioned above, the barrier layer is required to be insoluble in neither the ultraviolet crosslinkable acrylic ester contained in the pressure-sensitive adhesive composition nor the plasticizer contained in the base resin sheet. Table 3 shows the solubility of ultraviolet crosslinkable acrylic esters and plasticizers in the copolymer resins and other resins used as the barrier layer in the present invention. It is understood that the copolymer resin used in the present invention does not dissolve either the relatively low molecular weight UV crosslinkable acrylic acid or the plasticizer.
尚、上記可塑剤及び紫外線架橋性アクリル酸エステルに
対するバリヤー層の溶解性は、第２表に示す単量体組成
からなる共重合体の厚さ約５０μｍのフィルムを調製し
、これを液体である可塑剤又は紫外線架橋性アクリル酸
エステル１００ｍ１に８０℃の温度にてそれぞれ所定期
間浸漬し、上記フィルムの状態を目視にて観察すること
によって評価した。The solubility of the barrier layer with respect to the plasticizer and ultraviolet crosslinkable acrylic ester is determined by preparing a film with a thickness of approximately 50 μm of a copolymer having the monomer composition shown in Table 2, and then applying the film as a liquid. The film was immersed in 100 ml of a plasticizer or an ultraviolet crosslinkable acrylic ester at a temperature of 80° C. for a predetermined period of time, and the state of the film was evaluated by visually observing it.
また、比較例として、上記した感圧接着性シートの調製
において、バリヤー層を設けない以外は、全く同様にし
て、感圧接着性シートを得た。Further, as a comparative example, a pressure-sensitive adhesive sheet was obtained in exactly the same manner as in the preparation of the pressure-sensitive adhesive sheet described above, except that no barrier layer was provided.
更に、比較例として、ポリイソシアネート及び無水シリ
カ粉末のいずれをも含有しないほかは、上記実施例と同
じ組成の感圧接着剤組成物を調製し、上記と同様にして
感圧接着性シートを調製した。Furthermore, as a comparative example, a pressure-sensitive adhesive composition was prepared with the same composition as in the above example except that it did not contain either polyisocyanate or anhydrous silica powder, and a pressure-sensitive adhesive sheet was prepared in the same manner as above. did.
このようにして得たそれぞれの感圧接着性シートから離
型紙を剥離し、シートをステンレス板に貼り合わせ、温
度２１℃で３０分間放置した後、そのままにて接着力を
測定し、また、別に塩化ビニル樹脂シート側から主波長
３６５ｍμ、１２０Ｗ／ｃｓにて紫外線を７秒間照射し
た後、接着力を測定した。結果を第４表及び第５表に示
す。The release paper was peeled off from each of the pressure-sensitive adhesive sheets obtained in this way, the sheets were bonded to a stainless steel plate, and after being left at a temperature of 21°C for 30 minutes, the adhesive strength was measured as it was. After irradiating the vinyl chloride resin sheet side with ultraviolet rays at a dominant wavelength of 365 mμ and 120 W/cs for 7 seconds, the adhesive strength was measured. The results are shown in Tables 4 and 5.
先ず、実施例番号１〜５にみられるように、本発明の感
圧接着性シートによれば、その調製の後、長期間経過し
ても、紫外線照射前には高い接着力を有し、しかも、紫
外線照射による接着力の低下が顕著である。従って、適
当な配合設計によって、当初数百ｇ／２５ｍの接着力を
有せしめ、紫外線照射後は数十ｇ乃至十数ｇ／２５ｍ程
度にまで接着力を減少させ、又は実質的に消滅させるこ
とができるので、前述したように、シリコンウェハーの
ダイシングに好適に用いることができる。First, as seen in Example Nos. 1 to 5, the pressure-sensitive adhesive sheet of the present invention has high adhesive strength before UV irradiation even after a long period of time after its preparation. Furthermore, the adhesive strength is significantly reduced by ultraviolet irradiation. Therefore, by appropriate formulation design, it is possible to initially have an adhesive force of several hundred g/25 m, but after UV irradiation, the adhesive force can be reduced to about several tens to more than ten g/25 m, or virtually disappear. Therefore, as mentioned above, it can be suitably used for dicing silicon wafers.
しかし、比較例番号１及び２に示すように、バリヤー層
を設けない場合は、感圧接着性シートの調製直後は、紫
外線照射前は高い接着力を有し、紫外線照射によってそ
の接着力は低減するが、しかし、感圧接着性シートを調
製して、長期間の経過後は、紫外線照射前の接着力の経
時低下又は変動が著しく、しかも、紫外線照射による接
着力の低減効果が経時的に不安定である。However, as shown in Comparative Example Nos. 1 and 2, when no barrier layer is provided, the pressure-sensitive adhesive sheet has high adhesive strength immediately after preparation before UV irradiation, but the adhesive strength decreases after UV irradiation. However, after a long period of time has elapsed after preparing a pressure-sensitive adhesive sheet, the adhesive strength before UV irradiation significantly decreases or fluctuates over time, and moreover, the adhesive strength reduction effect of UV irradiation does not change over time. It is unstable.
また、比較例番号３及び４に示すように、バリヤー層と
して、ポリエステルポリウレタン樹脂やポリメタクリル
酸メチルを用いた場合は、感圧接着性シートの調製直後
は、紫外線照射前は高い接着力を有し、紫外線照射によ
ってその接着力は低減するが、しかし、感圧接着性シー
トを調製して、長期間の経過後は、紫外線照射による接
着力の低減効果は、経時的に極めて不安定であって、紫
外線照射によって却って接着力が高まる場合もあること
が認められる。In addition, as shown in Comparative Example Nos. 3 and 4, when polyester polyurethane resin or polymethyl methacrylate is used as the barrier layer, the pressure-sensitive adhesive sheet has high adhesive strength immediately after preparation and before UV irradiation. However, after a long period of time has elapsed after preparing a pressure-sensitive adhesive sheet, the effect of reducing adhesive strength due to UV irradiation is extremely unstable over time. However, it has been found that UV irradiation may actually increase the adhesive strength in some cases.
また、比較例番号２は、基材シートとして、可塑剤を含
まない塩化ビニル樹脂シートを用いた例を示し、本発明
に従ってバリヤー層を設けないときは、紫外線照射前の
接着力の経時低下が著しい。Furthermore, Comparative Example No. 2 shows an example in which a vinyl chloride resin sheet containing no plasticizer was used as the base sheet, and when no barrier layer was provided according to the present invention, the adhesive strength before UV irradiation decreased over time. Significant.
更に、比較例番号５及び６にみられるように、感圧接着
剤組成物がポリイソシアネート及び無水シリカを含まな
い場合に比べて、本発明に従って、これらのいずれかを
含むときは、感圧接着剤組成物は、紫外線照射による接
着力の低減幅が増幅されており、特に、ポリイソシアネ
ート及び無水シリカの両方を含むときは、紫外線照射に
よる接着力の低減幅が一層増大していることが明らかで
ある。尚、実施例番号６〜８及び比較例番号５及び６は
、いずれも基材シート上に第２表に共重合体２として示
す共重合体からなるバリヤー層を有するものである。Additionally, as seen in Comparative Example Nos. 5 and 6, when the pressure sensitive adhesive composition contains either polyisocyanate and anhydrous silica, the pressure sensitive adhesive is It is clear that the reduction in adhesive strength due to UV irradiation is amplified in the agent composition, and especially when it contains both polyisocyanate and anhydrous silica, the reduction in adhesive strength due to UV irradiation is further increased. It is. In addition, Examples Nos. 6 to 8 and Comparative Examples Nos. 5 and 6 all have a barrier layer made of a copolymer shown as Copolymer 2 in Table 2 on the base sheet.
尚、接着力の測定方法は次のとおりである。即ち、感圧
接着性シートを幅２５ｔｍ、長さ１００ｆｉに裁断して
試験片とし、これを被着体としてのステンレス板上に重
ね、３ ｋｇローラにて５回往復して押圧した後、ショ
ツパーにて引張速度３００ｗ／分にて１８０°剥離試験
を行なった。The method for measuring adhesive strength is as follows. That is, a pressure-sensitive adhesive sheet was cut into a test piece with a width of 25 tm and a length of 100 fi, which was stacked on a stainless steel plate as an adherend, and then pressed back and forth 5 times with a 3 kg roller. A 180° peel test was conducted at a tensile rate of 300 W/min.
Claims (19)
ノアルキルアクリレート又はアミノアルキルメタクリレ
ートとエチレン性不飽和単量体との共重合体からなるバ
リヤー層を形成し、この上に弾性重合体と電磁波架橋性
アクリル酸エステルと重合開始剤とを含有する感圧接着
剤の層を形成してなることを特徴とする電磁波照射によ
つて接着力を低減し得る感圧接着性シート。(1) A barrier layer made of a copolymer of aminoalkyl acrylate or aminoalkyl methacrylate and an ethylenically unsaturated monomer is formed on a base resin sheet that can transmit electromagnetic waves, and an elastic polymer is formed on this. 1. A pressure-sensitive adhesive sheet whose adhesive strength can be reduced by electromagnetic irradiation, characterized by forming a layer of a pressure-sensitive adhesive containing an electromagnetic crosslinkable acrylic ester and a polymerization initiator.
ことを特徴とする特許請求の範囲第１項記載の感圧接着
性シート。(2) The pressure-sensitive adhesive sheet according to claim 1, wherein the elastic polymer is a saturated copolymerized polyester resin.
ル酸エステルの共重合体であることを特徴とする特許請
求の範囲第１項記載の感圧接着性シート。(3) The pressure-sensitive adhesive sheet according to claim 1, wherein the elastic polymer is a polyacrylic ester or an acrylic ester copolymer.
する特許請求の範囲第１項記載の感圧接着性シート。(4) The pressure-sensitive adhesive sheet according to claim 1, wherein the pressure-sensitive adhesive contains a tackifier.
の共重合体からなるシートであることを特徴とする特許
請求の範囲第１項記載の感圧接着性シート。(5) The pressure-sensitive adhesive sheet according to claim 1, wherein the base resin sheet is a sheet made of polyvinyl chloride or a copolymer of vinyl chloride.
する特許請求の範囲第１項又は第５項記載の感圧接着性
シート。(6) The pressure-sensitive adhesive sheet according to claim 1 or 5, wherein the base resin sheet contains a plasticizer.
ノアルキルアクリレート又はアミノアルキルメタクリレ
ートとエチレン性不飽和単量体との共重合体からなるバ
リヤー層を形成し、この上に弾性重合体と電磁波架橋性
アクリル酸エステルと重合開始剤と共に、ポリイソシア
ネート及び／又は無水シリカ粉末を含有する感圧接着剤
の層を形成してなることを特徴とする電磁波照射によつ
て接着力を低減し得る感圧接着性シート。(7) A barrier layer made of a copolymer of aminoalkyl acrylate or aminoalkyl methacrylate and an ethylenically unsaturated monomer is formed on a base resin sheet that can transmit electromagnetic waves, and an elastic polymer is formed on this. It is characterized by forming a layer of a pressure-sensitive adhesive containing polyisocyanate and/or anhydrous silica powder together with an electromagnetic wave crosslinkable acrylic ester and a polymerization initiator, and whose adhesive strength can be reduced by electromagnetic wave irradiation. Pressure sensitive adhesive sheet.
ことを特徴とする特許請求の範囲第７項記載の感圧接着
性シート。(8) The pressure-sensitive adhesive sheet according to claim 7, wherein the elastic polymer is a saturated copolymerized polyester resin.
ル酸エステルの共重合体であることを特徴とする特許請
求の範囲第７項記載の感圧接着性シート。(9) The pressure-sensitive adhesive sheet according to claim 7, wherein the elastic polymer is a polyacrylic ester or an acrylic ester copolymer.
とする特許請求の範囲第７項記載の感圧接着性シート。(10) The pressure-sensitive adhesive sheet according to claim 7, wherein the pressure-sensitive adhesive contains a tackifier.
ルの共重合体からなるシートであることを特徴とする特
許請求の範囲第７項記載の感圧接着性シート。(11) The pressure-sensitive adhesive sheet according to claim 7, wherein the base resin sheet is a sheet made of polyvinyl chloride or a copolymer of vinyl chloride.
とする特許請求の範囲第７項又は第１１項記載の感圧接
着性シート。(12) The pressure-sensitive adhesive sheet according to claim 7 or 11, wherein the base resin sheet contains a plasticizer.
ミノアルキルアクリレート又はアミノアルキルメタクリ
レートとエチレン性不飽和単量体との共重合体からなる
バリヤー層を形成し、この上に弾性重合体と電磁波架橋
性アクリル酸エステルと重合開始剤とを含有する感圧接
着剤の層を形成してなるダイシングフィルム上に半導体
ウェハーを載置し、接着固定して、ダイシングした後、
上記ダイシングフィルムの裏面から電磁波を照射し、上
記接着剤の接着力を低減させ、次いで、ダイシングフィ
ルムを伸長させ、ダイスを取り上げることを特徴とする
半導体ウェハーのダイシング方法。(13) A barrier layer made of a copolymer of aminoalkyl acrylate or aminoalkyl methacrylate and an ethylenically unsaturated monomer is formed on a base resin sheet that can transmit electromagnetic waves, and an elastic polymer is formed on this. After placing a semiconductor wafer on a dicing film formed by forming a layer of a pressure-sensitive adhesive containing an electromagnetic crosslinkable acrylic ester and a polymerization initiator, adhesively fixing it, and dicing,
A method for dicing semiconductor wafers, comprising irradiating electromagnetic waves from the back side of the dicing film to reduce the adhesive force of the adhesive, then stretching the dicing film, and picking up the dice.
ることを特徴とする特許請求の範囲第１３項記載の半導
体ウェハーのダイシング方法。(14) The method for dicing a semiconductor wafer according to claim 13, wherein the elastic polymer is a saturated copolymerized polyester resin.
リル酸エステルの共重合体であることを特徴とする特許
請求の範囲第１３項記載の半導体ウェハーのダイシング
方法。(15) The method for dicing a semiconductor wafer according to claim 13, wherein the elastic polymer is a polyacrylic ester or an acrylic ester copolymer.
とする特許請求の範囲第１３項記載の半導体ウェハーの
ダイシング方法。(16) The method for dicing a semiconductor wafer according to claim 13, wherein the pressure-sensitive adhesive contains a tackifier.
ルの共重合体からなるシートであることを特徴とする特
許請求の範囲第１３項記載の半導体ウェハーのダイシン
グ方法。(17) The method for dicing a semiconductor wafer according to claim 13, wherein the base resin sheet is a sheet made of polyvinyl chloride or a copolymer of vinyl chloride.
とする特許請求の範囲第１３項又は第１７項記載の半導
体ウェハーのダイシング方法。(18) The method for dicing a semiconductor wafer according to claim 13 or 17, wherein the base resin sheet contains a plasticizer.
又は無水シリカを含有することを特徴とする特許請求の
範囲第１３項記載の半導体ウェハーのダイシング方法。(19) The pressure sensitive adhesive composition contains polyisocyanate and/or
14. The method for dicing a semiconductor wafer according to claim 13, further comprising: or anhydrous silica.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62013035A JPS63181347A (en) | 1987-01-21 | 1987-01-21 | Pressure-sensitive adhesive sheet and semiconductor wafer dicing method using the same |
| US07/108,202 US4968559A (en) | 1985-02-14 | 1987-10-14 | Pressure sensitive adhesive film with barrier layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62013035A JPS63181347A (en) | 1987-01-21 | 1987-01-21 | Pressure-sensitive adhesive sheet and semiconductor wafer dicing method using the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63181347A true JPS63181347A (en) | 1988-07-26 |
| JPH0312777B2 JPH0312777B2 (en) | 1991-02-21 |
Family
ID=11821866
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62013035A Granted JPS63181347A (en) | 1985-02-14 | 1987-01-21 | Pressure-sensitive adhesive sheet and semiconductor wafer dicing method using the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63181347A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0366772A (en) * | 1989-08-05 | 1991-03-22 | Furukawa Electric Co Ltd:The | Radiation-curing adhesive tape |
| WO1995012895A1 (en) * | 1993-11-04 | 1995-05-11 | Nitto Denko Corporation | Process for producing semiconductor element and pressure-sensitive adhesive sheet for sticking wafer |
| SG83813A1 (en) * | 1999-09-06 | 2001-10-16 | Nitto Denko Corp | Pressure-sensitive adhesive sheets for dicing |
| EP1312656A3 (en) * | 2001-11-14 | 2004-02-04 | Nitto Denko Corporation | Surface-modified pressure-sensitive adhesive, method of modifying surface of pressure-sensitive adhesive and pressure-sensitive adhesive tape |
| JP2008045091A (en) * | 2006-08-21 | 2008-02-28 | Nitto Denko Corp | Pressure-sensitive adhesive sheet for processing |
-
1987
- 1987-01-21 JP JP62013035A patent/JPS63181347A/en active Granted
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0366772A (en) * | 1989-08-05 | 1991-03-22 | Furukawa Electric Co Ltd:The | Radiation-curing adhesive tape |
| JP2618491B2 (en) * | 1989-08-05 | 1997-06-11 | 古河電気工業株式会社 | Radiation curable adhesive tape |
| WO1995012895A1 (en) * | 1993-11-04 | 1995-05-11 | Nitto Denko Corporation | Process for producing semiconductor element and pressure-sensitive adhesive sheet for sticking wafer |
| SG83813A1 (en) * | 1999-09-06 | 2001-10-16 | Nitto Denko Corp | Pressure-sensitive adhesive sheets for dicing |
| EP1312656A3 (en) * | 2001-11-14 | 2004-02-04 | Nitto Denko Corporation | Surface-modified pressure-sensitive adhesive, method of modifying surface of pressure-sensitive adhesive and pressure-sensitive adhesive tape |
| JP2008045091A (en) * | 2006-08-21 | 2008-02-28 | Nitto Denko Corp | Pressure-sensitive adhesive sheet for processing |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0312777B2 (en) | 1991-02-21 |
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