JPS63178583A - Automatic soldering apparatus for flat package integrated device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] <Industrial Application Field> The present invention is applicable to flat package ICs, LSIs, and ultra-L
The present invention relates to an automatic soldering device for flat package integrated devices that mounts SI etc. on predetermined positions on printed circuit boards.

<Conventional technology> In recent years, flat package ICs, LSIs, etc. are often used as circuit components for various electronic devices such as imaging equipment and communication equipment, and flat package ICs, etc. are often mounted on printed circuit boards by soldering. Various automatic systems have been developed and commercialized.

In mounting technology for flat package ICs, etc., a pre-soldered item such as a flat package with solder attached to the legs in advance is placed on a printed circuit board in the proper position and orientation, and then a heated rectangular metal frame is placed on the printed circuit board from above. A method (hereinafter referred to as "method") has been developed in which the IO is attached to a printed circuit board by pressing it against the leg of a 7-rat pancage IC.

Another method is to first apply adhesive to the back side of the flat package IC, etc., then fix it at a predetermined position on the printed circuit board in the proper orientation, and then apply cream solder between the legs of the IO and the printed circuit board. A method (hereinafter referred to as method B) has been developed in which the solder is applied to the contact portion of the IC, and then hot air is applied to the IC to melt the solder and attach the IC to the substrate.

Furthermore, the robot mechanism enables flat package IC
A device (hereinafter referred to as device C) that sequentially connects each leg of the device to the wiring of a printed circuit board using thread solder has also been commercialized.

<Problems to be Solved by the Invention> However, the method requires a separate preliminary soldering process for flat package ICs, etc., and must separately provide soldering equipment for this purpose. In addition, since the method uses contact heating with a metal frame to attach the 7-rat package IO, etc. to the printed circuit board, the IC, etc. are easily affected by heat such as short circuits, and defective products can occur. Occurs frequently.

In addition, in Method B, since the adhesive remains between the flat package IC, etc. and the printed circuit board, the flat cage itself may dissolve or crack over time due to the remaining adhesive, and the IC, etc. may have a lifespan. will be significantly reduced.

Moreover, in method B, it is very difficult to apply an equal amount of cream solder to each leg of the flat package IC, and circuit warpage and poor contact are likely to occur due to too much or too little solder. Furthermore, in method B, it is necessary to prepare cream solder immediately before use, requiring separate equipment for this purpose, and the work of preparing cream solder of a desired concentration is considerably troublesome.

In addition, equipment C is a complex and precise large-scale equipment that is extremely expensive. In addition, when installing 7-rat pancage IO of various sizes, control programming must be performed for each size of workpiece. It is necessary to manufacture it, requires very complicated work, and is not suitable for the era of high-mix, low-volume production.

Furthermore, in general, when mounting a flat package IC, etc., it is necessary to adjust the position and orientation of the IO, etc. with respect to the printed circuit board to a desired and appropriate position.

The present invention has been made in consideration of the above-mentioned circumstances, and its object is to provide an automatic soldering apparatus for flat package integrated devices that eliminates the drawbacks of the above-mentioned methods and apparatuses.

Means for Solving Problems〉 The automatic soldering device for flat package integrated devices of the present invention has various facilities for flux tank fabric, preliminary soldering, and mounting on printed circuit boards for flat package ICs, etc. This is a completely new compact device that can be built into a device and perform a series of these processes continuously.

That is, the automatic soldering apparatus of the present invention includes an element suction head that is connected to a degassing means and that suctions and releases flat package integrated elements, and an elevating and transporting mechanism that raises and lowers the head and transports the head horizontally and in one direction. A board transport conveyor that transports an element mounting plate, a flux tank, a solder tank, and a printed circuit board so as to pass through the transport line, which are arranged in order along the transport line of the head directly below the head; positioning means for adjusting the position and orientation of the integrated element to an appropriate position; and hot air heating for supplying hot air to the integrated element when the integrated element carried by the head is mounted on the printed circuit board on the conveyor. It is characterized by comprising means.

The element suction head may have a structure in which a passage communicating with a degassing means such as a vacuum pump is formed inside the head, and a flat package IC or the like can be suctioned at the tip of the head by operation of the degassing means.

The lifting/lowering transport mechanism lowers the element suction head until the tip of the head moves upward, reaches the surface of the flat cage on the element mounting plate, the liquid level of the flux tank and the solder tank, and the surface of the printed circuit board on the conveyor, and then rises. In addition, any structure may be used as long as the head is sequentially transported from the element mounting tray to the flux tank, the solder tank, and the board conveyor.

The element mounting plate is a flat plate on which many integrated elements are placed. This plate can be moved forward, backward, left and right while keeping it horizontal.
It is preferable to provide a mechanism that can adjust the position with respect to the element suction head.

The flux tank and the solder tank may be 7 Labs or a cypress filled with solder.

The substrate conveyor may be any conveyor that conveys the printed circuit board horizontally across the conveyance line of the head.

The positioning means may be any device or mechanism that corrects longitudinal, lateral, and rotational deviations of the integrated element carried by the suction head and adjusts it so that it is accurately carried to a predetermined position on the printed circuit board. .

Finally, the hot air heating means may be configured to include a heater, a fan, a communication passageway to the top of the substrate conveyor, etc., and to supply hot air thereto when mounting the integrated device.

Effect〉 The apparatus of the present invention is operated by the following sequence of measures.

First, the device suction head is lowered by driving the lifting/lowering transport mechanism until its tip touches the flat package integrated device on the device mounting tray, and the integrated device is attracted to the device suction head.Then, the device suction head is raised. The device suction head is then lowered to deposit flux on each leg of the integrated device, and then the device suction head is raised and transported above the solder bath.
Thereafter, the element suction head is lowered to solder the legs of the integrated element, and then the element suction head is raised and transported above the substrate conveyor. After the integrated device is soldered, flux may be applied again in the same manner. On the other hand, by driving the substrate conveyor,
Transport the printed circuit board to just below the element suction head. Then, the element suction head is lowered to place the integrated element at a predetermined position K on the surface of the printed circuit board. At the same time, the heating means is activated to blow hot air onto the integrated element, and the integrated element is mounted on the printed circuit board by melting the solder. do. Positioning of the non-integrated components with respect to the printed circuit board is performed at an appropriate step in the above process sequence.

Therefore, when using the apparatus of the present invention, various processes such as preliminary soldering of flat package integrated elements, preparation of cream solder, and application of adhesive are all unnecessary, and since the apparatus uses hot air heating, the integrated elements It is unlikely to be adversely affected by this.

<Example> Embodiments of the present invention will be described below with reference to the drawings.

As shown in FIGS. 1 to 4, the automatic soldering device of the embodiment has eight support shafts 5, 5.5 at the top of the device body 10.
are installed horizontally, and the mounting board 4 is mounted on these support shafts 5, 5.5.
is mounted so as to be movable in the horizontal direction indicated by arrow It moves up and down between the inner lines P and P, and also moves horizontally in one direction by the operation of the transport motor 6.

Further, the inside of the element suction head 2 is connected to a degassing means (not shown), and when the degassing means is operated, the flat package IOI is adsorbed, and when the degassing means is stopped, the IC1 is released.

Furthermore, by means of a control mechanism (not shown), the operations of elevating, lowering, transporting, adsorbing, and releasing the suction head 2 work in conjunction with each other.
The continuous process described below is automatically executed.

In addition, this device includes an element mounting tray 7, a rotational deviation adjustment device 9,
The flux tank 12 and the solder tank 1 are sequentially provided with a flux tank 12 and a substrate conveyor 14.

The element mounting plate 7 is 2 x 21111 square or 50 x 50 square.
A flat plate is used to place up to nearly 100 corner flat packages C1... and is set on the moving device 8. The moving device 8 automatically moves the set element mounting tray 7 to the rails 24, 24 and the rail 25.
, 25i in the left, right, front and rear directions (arrow X direction and two directions). Therefore, by positioning the moving device 8, the desired flat package IO1 can be brought to the position AK where the element suction head 2 descends and arrives.

When the 7 runt package IOI is placed on the top of the rotational deviation adjustment device 9, the rotational deviation adjustment device 9 adjusts the work C1 to the four claws 11.
It has a structure that corrects rotational deviation of the IC by surrounding it on all sides, front, back, left, and right.

Flux tank 12 is filled with flux, and solder tank 18 is filled with normal molten solder.

The substrate conveyor 14 has a width of about 5 cIf1 to about 25 cm
This is a conveyor that conveys a cIn-square printed circuit board 15 horizontally in a direction perpendicular to the conveyance line P (direction of arrow Z).

Further, this device includes a position sensor 20 attached to the support shaft 5 and a position sensor 28 attached to the conveyor 14. The position sensor 20 is a sensor that detects when the element suction head 2 carried from the solder bath side reaches a predetermined position f above the conveyor, and the position sensor 28 detects when the printed circuit board 15 carried in the direction of the arrow 2 This is a sensor that detects when the suction head reaches a predetermined position FK below the suction head.

The control mechanism operates so as to automatically stop the transportation of the element suction head 2 and the transportation of the printed circuit board 15 upon detection of these sensors 20 and 28.

This device can move the position sensor 20 left and right (in the direction of the arrow ), thus adjusting the left and right movement of the senna 20 and the sensor 23.
By adjusting the back and forth movement of the flat package C1, it is possible to correct the left and right deviations and back and forth deviations of the flat package C1 with respect to the printed circuit board 15.

Further, in this device, a hot air dryer 16 is fixed to the mounting board 4, a blowing nozzle 18 is attached to the tip of the element suction head 2, and a connecting pipe 17 is used to connect the dryer 16 to the mounting board 4.
and nozzle 18 when required, i.e. flat package I
When the OIs are mounted on the printed circuit board 15, they are connected so that they communicate with each other. In addition, in the figure, 19 indicates a heat exhaust pipe.

The automatic soldering apparatus of the embodiment having the above-described configuration is operated according to the process described below.

■ First, place the element suction head 2 at position a above the element mounting plate.
The flat package IOI is further lowered (in the direction of the arrow Y) to come into contact with a desired flat package IOI at position A, and the flat package IOI is attracted to the head 2 by the operation of the degassing means.

■ Next, raise the suction head 2 from position [A (in the direction of arrow Y) and return it to position aK, then move the suction head 2 to position a
Transport it horizontally until it is located above the rotational deviation adjustment device (in the direction of arrow X).

(2) Next, the first suction head 2 is lowered from its position, and at position B, the flat package C1 is released from the suction head 2 by injecting air into the head, and is set on the top of the rotational deviation adjustment device 9. Then, the adjustment device [claw 11 of 9]
The rotational deviation of the flat package IOI is corrected by the operation of .

■ After that, the 7-rat package IOI is adsorbed onto the suction head 2 again by the degassing means, and then the suction head 2 is raised from position B and returned to position bK, and then the suction head 2 is placed at a position above the Franks tank. Transport horizontally to point d.

■ Next, move the suction head 2 to position C! Lower it further and lower it [
After OK, the flux in the Franks tank 12 is applied to each leg of the flat package IOI.

(2) Next, the suction head 2 is raised from position C and returned to position e, and then the suction hend 2 is horizontally transported from position MC to position d''!! above the solder bath.

■ Next, the suction head 2 is lowered from position d, and the molten solder in the solder bath 13 is transferred to the flat package IO.
Attach it to each leg of I.

(2) Next, the suction hend 2 is raised and returned to position d, and then the suction hend 2 is horizontally transported from position @d to position e above the Franks tank.

■ Next, lower the suction hand 2 from position e, and
The flux in the Franks tank 12 is re-deposited on each leg of the seven-rat bank cage IOI.

■ Next, raise the suction hand 2 from position E to position R.
Then, the suction hand 2 is transported horizontally from position e to position iff above the substrate transport conveyor.

(2) On the other hand, the printed circuit board 15 to be mounted is transported to position F by the transport conveyor 14 in the direction of arrow Z.

■ Next, lower the suction hand 2 from the position if, and
The flat package IOI is placed on the printed circuit board 15. At the same time, the hot air dryer 16 is operated to blow hot air through the nozzle 18 to blow the SiFlat package I01 onto the surface of the printed circuit board 150.
After that, it is fixed by cooling.

(2) After that, the flat package IOI is released from the suction hend 2, and the printed circuit board 15 is conveyed again in the direction of the arrow 2, and the finished printed circuit board product is collected.

0 In addition, before the above process
1 and the adjustment handle 22, and adjust the front/rear/left/right deviation of the flat package IOI to an appropriate value.

In this manner, the automatic soldering apparatus of the embodiment can carry out suction of the flat package E0, Franks coating, soldering, and mounting on the printed circuit board in one operation in accordance with the above-described process. In this case, it is most efficient to use a large number of flat packages and printed circuit boards of the same size to continuously attract, lift, and transport the ICs and transport the boards.

<Effects of the Invention> As explained above, the automatic soldering device for flat package integrated devices of the present invention can perform 7-rank coating, soldering, and mounting of flat package integrated devices onto printed circuit boards using a single device. This is a revolutionary device that can perform a series of processes.

The device of the present invention eliminates the need for pre-soldering processing and its equipment, adhesive coating processing and coating machine, and cream solder adjustment, etc., which were conventionally required. There is no problem of deterioration in performance, and furthermore, there is less wasteful solder, and the amount of solder consumption can be considerably reduced.

Moreover, since the apparatus of the present invention uses a hot air heating method, compared to a conventional method using a contact heating method, there is almost no adverse effect of heat on the flat package integrated device.

Furthermore, the device of the present invention uses solder (flux in sequence).
The solder is attached using a dipping method, which allows an equal amount of solder to be applied to each leg of the flat package integrated device.
Further, by the function of the positioning means, the integrated element can be mounted on the printed circuit board at an accurate position and orientation. Therefore, the finished printed circuit board product has extremely high accuracy in mounting elements and reliability in circuit operation.

Therefore, when the apparatus of the present invention is used, the productivity and quality of printed circuit board products equipped with flat package integrated elements are significantly improved compared to the conventional products.

BRIEF DESCRIPTION OF THE DRAWINGS FIGS. 1 to 4 are a front view, a plan view 1, a left side view, and a right side view showing an outline of an automatic soldering apparatus according to an embodiment of the present invention. In the diagram, 1...Flat package IC2...
・Element suction head 3...Elevating motor 4...Mounting board 5...Support shaft 6...Transportation motor 7...Element mounting plate 9... Rotation misalignment adjustment device 12... Flux tank 18... Solder tank 14... Board conveyor 15... Printed circuit board 16... Hot air dryer 21... Lateral shift adjustment dial 22... Fore-and-aft shift adjustment handle P, p... Transportation line

Claims (1)

[Scope of Claims] An element suction head that is connected to a degassing means and that suctions and releases flat package integrated elements; an elevating and transporting mechanism that raises and lowers the head and transports the head horizontally and in one direction; a board transport conveyor that transports an element mounting tray, a flux bath, a solder tank, and a printed circuit board, which are arranged in order along the transport line of the head, so as to pass through the transport line; and a position of the integrated element with respect to the printed circuit board. and a hot air heating means for supplying hot air to the integrated element when the integrated element carried by the head is mounted on the printed circuit board on the conveyor. An automatic soldering device for flat package integrated devices characterized by: