JPS63174489U - - Google Patents
Info
- Publication number
- JPS63174489U JPS63174489U JP17336586U JP17336586U JPS63174489U JP S63174489 U JPS63174489 U JP S63174489U JP 17336586 U JP17336586 U JP 17336586U JP 17336586 U JP17336586 U JP 17336586U JP S63174489 U JPS63174489 U JP S63174489U
- Authority
- JP
- Japan
- Prior art keywords
- case
- protrusion
- fixing
- electronic device
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Casings For Electric Apparatus (AREA)
Description
第１図は本考案に係る電子機器の筐体構造の一
実施例を示す分解斜視図、第２図は第１図の要部
縦断面図、第３図は従来の電子機器の筐体構造を
示す分解斜視図である。
１……下ケース、３……ボス、６……基板、７
……上ケース、９……突起部、１１……リブ（支
持部材）、１２……孔部、１３……電子部品。
Fig. 1 is an exploded perspective view showing one embodiment of the casing structure of an electronic device according to the present invention, Fig. 2 is a vertical sectional view of the main part of Fig. 1, and Fig. 3 is a casing structure of a conventional electronic device. FIG. 1... Lower case, 3... Boss, 6... Board, 7
... Upper case, 9 ... Protrusion, 11 ... Rib (supporting member), 12 ... Hole, 13 ... Electronic component.
Claims (1)
割されたケースよりなる電子機器の筐体構造にお
いて、前記ケースの対向する１つの側面の端面部
にそれぞれ形成された少なくとも１個の突起部及
びこの突起部が嵌合可能に形成された少なくとも
１個の孔部と、前記ケースにおける突起部が形成
された側面以外の側面に設けられ前記基板を位置
決め支持する複数個の支持部材と、前記ケースと
前記基板とを一体に固定する固定手段とを具備し
たことを特徴とする電子機器の筐体構造。 In a housing structure for an electronic device consisting of a two-part case for storing and fixing a board on which electronic components are mounted, at least one protrusion formed on each end face of one opposing side surface of the case; at least one hole formed into which a protrusion can be fitted; a plurality of support members provided on a side surface of the case other than the side surface on which the protrusion is formed to position and support the substrate; and the case. A casing structure for an electronic device, comprising a fixing means for fixing the substrate integrally.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17336586U JPS63174489U (en) | 1986-11-13 | 1986-11-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17336586U JPS63174489U (en) | 1986-11-13 | 1986-11-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63174489U true JPS63174489U (en) | 1988-11-11 |
Family
ID=31110759
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17336586U Pending JPS63174489U (en) | 1986-11-13 | 1986-11-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63174489U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101020764B1 (en) | 2007-06-25 | 2011-03-09 | (주)리더라이텍 | Manufacturing method of waterproof PCB case |
| JP2016197553A (en) * | 2015-04-03 | 2016-11-24 | 株式会社ソニー・インタラクティブエンタテインメント | Electronic apparatus |
-
1986
- 1986-11-13 JP JP17336586U patent/JPS63174489U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101020764B1 (en) | 2007-06-25 | 2011-03-09 | (주)리더라이텍 | Manufacturing method of waterproof PCB case |
| JP2016197553A (en) * | 2015-04-03 | 2016-11-24 | 株式会社ソニー・インタラクティブエンタテインメント | Electronic apparatus |
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