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JPS63170961U - Semiconductor element - Google Patents

Semiconductor element

Info

Publication number
JPS63170961U
JPS63170961U JP1987160445U JP16044587U JPS63170961U JP S63170961 U JPS63170961 U JP S63170961U JP 1987160445 U JP1987160445 U JP 1987160445U JP 16044587 U JP16044587 U JP 16044587U JP S63170961 U JPS63170961 U JP S63170961U
Authority
JP
Japan
Prior art keywords
contact surface
semiconductor
semiconductor element
connecting conductor
lead wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987160445U
Other languages
Japanese (ja)
Inventor
Tatsuo Mochizuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP1987160445U priority Critical patent/JPS63170961U/en
Publication of JPS63170961U publication Critical patent/JPS63170961U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L24/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L24/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/4005—Shape
    • H01L2224/4007—Shape of bonding interfaces, e.g. interlocking features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
    • H01L2224/8434—Bonding interfaces of the connector
    • H01L2224/84345—Shape, e.g. interlocking features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8534—Bonding interfaces of the connector
    • H01L2224/85345—Shape, e.g. interlocking features

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の一実施例、第２図は異なる実
施例、第３図はさらに異なる実施例を示し、各図
においてａは封止樹脂を除いた素子の斜視図、ｂ
は素子の要部断面図、ｃは接続導体の上面図、ｄ
は接続導体の断面図を示す。第４図は従来例を示
し、ａは封止樹脂を除いた素子の斜視図、ｂは素
子の要部断面図、ｃは接続導体の上面図を示す。
第５図は本考案による接続導体の一実施例を示し
、ａは上面図、ｂは断面図である。 １……半導体片、２……基板、４……上部電極
、５……はんだ、６……接続導体、７……外部リ
ード、９……はんだ、６１ａ……一先端部、６２
ａ……他先端部、７１……外部リード端部。 Fig. 1 shows one embodiment of the present invention, Fig. 2 shows a different embodiment, and Fig. 3 shows a further different embodiment. In each figure, a is a perspective view of the device excluding the sealing resin, and b
is a sectional view of the main part of the element, c is a top view of the connecting conductor, d
shows a cross-sectional view of the connecting conductor. FIG. 4 shows a conventional example, in which a is a perspective view of the element excluding the sealing resin, b is a sectional view of the main part of the element, and c is a top view of the connecting conductor.
FIG. 5 shows an embodiment of the connecting conductor according to the present invention, in which a is a top view and b is a sectional view. DESCRIPTION OF SYMBOLS 1... Semiconductor piece, 2... Substrate, 4... Upper electrode, 5... Solder, 6... Connection conductor, 7... External lead, 9... Solder, 61a... One tip, 62
a... Other tip, 71... External lead end.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体片と外部導出リード線と、この両者を両
端部にてろう付けにより繋ぐ接続導体とを備えて
なる半導体素子において、この接続導体の両端部
は平板状であつてかつ少なくとも一端部は前記半
導体片と前記リード線との各接触面に向かう突出
部を備え、さらに、この突出部が前記接触面と近
接して対向する中央部分とはんだによつて満たさ
れ前記接触面から離間している周辺部分とを有す
ることを特徴とする半導体素子。 In a semiconductor element comprising a semiconductor piece, an external lead wire, and a connecting conductor that connects the two at both ends by brazing, both ends of the connecting conductor are flat and at least one end is connected to the semiconductor. a protrusion toward each contact surface between the piece and the lead wire, the protrusion further comprising a central portion adjacently facing the contact surface and a periphery filled with solder and spaced from the contact surface. A semiconductor device characterized by having a portion.
JP1987160445U 1986-12-04 1987-10-20 Semiconductor element Pending JPS63170961U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987160445U JPS63170961U (en) 1986-12-04 1987-10-20 Semiconductor element

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP18703786 1986-12-04
JP1987160445U JPS63170961U (en) 1986-12-04 1987-10-20 Semiconductor element

Publications (1)

Publication Number Publication Date
JPS63170961U true JPS63170961U (en) 1988-11-07

Family

ID=33455189

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987160445U Pending JPS63170961U (en) 1986-12-04 1987-10-20 Semiconductor element

Country Status (1)

Country Link
JP (1) JPS63170961U (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013047533A1 (en) * 2011-09-29 2013-04-04 シャープ株式会社 Semiconductor device
EP2720263A1 (en) * 2011-06-09 2014-04-16 Mitsubishi Electric Corporation Semiconductor device
JP2017084881A (en) * 2015-10-23 2017-05-18 富士電機株式会社 Semiconductor device
JP6346717B1 (en) * 2017-02-20 2018-06-20 新電元工業株式会社 Electronic device and connector
WO2018150556A1 (en) * 2017-02-20 2018-08-23 新電元工業株式会社 Electronic device, and connector
WO2019049214A1 (en) * 2017-09-05 2019-03-14 新電元工業株式会社 Semiconductor device
EP3503179A1 (en) * 2017-12-20 2019-06-26 Nexperia B.V. Electronic device
JP2021002570A (en) * 2019-06-20 2021-01-07 新電元工業株式会社 Semiconductor device
EP4064338A1 (en) * 2021-03-22 2022-09-28 Kabushiki Kaisha Toshiba Semiconductor device

Cited By (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2720263A1 (en) * 2011-06-09 2014-04-16 Mitsubishi Electric Corporation Semiconductor device
EP2720263A4 (en) * 2011-06-09 2015-04-22 Mitsubishi Electric Corp Semiconductor device
US9401319B2 (en) 2011-06-09 2016-07-26 Mitsubishi Electric Corporation Semiconductor device
WO2013047533A1 (en) * 2011-09-29 2013-04-04 シャープ株式会社 Semiconductor device
CN103828041A (en) * 2011-09-29 2014-05-28 夏普株式会社 Semiconductor device
JPWO2013047533A1 (en) * 2011-09-29 2015-03-26 シャープ株式会社 Semiconductor device
JP2016184757A (en) * 2011-09-29 2016-10-20 シャープ株式会社 Semiconductor device
JP2017084881A (en) * 2015-10-23 2017-05-18 富士電機株式会社 Semiconductor device
EP3584831A4 (en) * 2017-02-20 2020-08-19 Shindengen Electric Manufacturing Co., Ltd. ELECTRONIC DEVICE AND CONNECTOR
US10910292B2 (en) 2017-02-20 2021-02-02 Shindengen Electric Manufacturing Co., Ltd. Electronic device and connection body
WO2018150556A1 (en) * 2017-02-20 2018-08-23 新電元工業株式会社 Electronic device, and connector
JPWO2018150556A1 (en) * 2017-02-20 2019-02-21 新電元工業株式会社 Electronic device and connector
CN110199387B (en) * 2017-02-20 2024-03-01 新电元工业株式会社 Electronic device and connector
WO2018150557A1 (en) * 2017-02-20 2018-08-23 新電元工業株式会社 Electronic device and connector
US10896868B2 (en) 2017-02-20 2021-01-19 Shindengen Electric Manufacturing Co., Ltd. Electronic device and connector
JP6346717B1 (en) * 2017-02-20 2018-06-20 新電元工業株式会社 Electronic device and connector
CN110199387A (en) * 2017-02-20 2019-09-03 新电元工业株式会社 Electronic device and connector
CN110214372A (en) * 2017-02-20 2019-09-06 新电元工业株式会社 Electronic device and connector
JP6517439B1 (en) * 2017-09-05 2019-05-22 新電元工業株式会社 Semiconductor device
US11688714B2 (en) 2017-09-05 2023-06-27 Shindengen Electric Manufacturing Co., Ltd. Semiconductor package with three leads
WO2019049214A1 (en) * 2017-09-05 2019-03-14 新電元工業株式会社 Semiconductor device
CN110021576A (en) * 2017-12-20 2019-07-16 安世有限公司 Electronic device
EP3503179A1 (en) * 2017-12-20 2019-06-26 Nexperia B.V. Electronic device
JP2021002570A (en) * 2019-06-20 2021-01-07 新電元工業株式会社 Semiconductor device
EP4064338A1 (en) * 2021-03-22 2022-09-28 Kabushiki Kaisha Toshiba Semiconductor device

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