JPS63168044A - Semiconductor chip mounting structure - Google Patents

Abstract

PURPOSE:To contrive a high density packaging of IC chips and so on by a method wherein the semiconductor chips are housed in the interiors of chambers to extend in the direction to intersect orthogonally the laminated direction of a laminated material and each electrode lead-out terminal of the chips is connected to each terminal formed on the surface of the laminated material through wiring groups. CONSTITUTION:Chambers 2 to extend in the direction to intersect orthogonally the laminated direction of a laminated material 1 are provided in the laminated material 1 formed by laminating plural sheets of substrates 1a, 1b.... Semiconductor chips 3 are housed in the interiors of the chambers 2 and each electrode lead-out terminal of the semiconductor chips 3 is connected to each terminal 6a, 6b... formed on the surface of the laminated material 1 through contact groups 4a, 4b... formed in the chambers 2 and wiring groups 5 provided on the surface of each substrate 1a, 1b.... Thereby, the chips 3 can be subjected to three-dimensional packaging and also, the wirings between the chips also become possible three-dimensionally in the laminated material 1 and a circuit can be brought into the state of higher density.

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a three-dimensional mounting structure of a semiconductor chip such as an RC.

<Prior art> Conventionally, the conventional method for mounting IC chips, etc. has been to house the chip in a package and mount it on a circuit board.Other methods include chip-on-board and flip-chip methods, in which the chip is directly mounted on a circuit. There is also a method of fixing it on a substrate.

<Problems to be solved by the invention> According to conventional mounting methods, the chips are mounted on a flat substrate, so the connections between chips are flat, making it difficult to achieve high density packaging. There is a limit.

This means, for example, that when combining an old sensor with sensor elements arranged in a two-dimensional direction and a processing circuit that inputs the output signals of each sensor element, the processing circuit becomes considerably larger than the old sensor. As a result, a structure is created in which these are provided separately and connected to each other by cables. Here, the distance between the sensor and its signal processing circuit becomes an extremely important factor when the sensor output is weak or when continuous high-speed processing and response is required. That is, the longer this distance is, the more noise is picked up and the signal itself is attenuated more, which may cause problems that far exceed the performance of the sensor itself.

The present invention was made in view of the above circumstances, and I
The purpose is to provide a structure that allows high-density mounting of C-chi, knobs, etc.

Means for Solving the Problems> The configuration for achieving the above object will be described with reference to FIGS. 1 and 2 corresponding to the embodiment.
A laminate 1 formed by laminating a plurality of substrates 1a and lb-,
A chamber 2 extending in a direction intersecting the stacking direction is provided, and a semiconductor chip 3 is housed inside the chamber 2, and each electrode terminal of the semiconductor 3 is connected to a contact group 4a formed in the chamber 2.

4b... and the respective terminals 5a, 5b... formed on the surface of the laminate 1 through the wiring group 5 provided on the surface of each substrate 1a, lb-... can be attached.

Effects> The semiconductor chips 2 can be three-dimensionally mounted, and the wiring between the chips can also be three-dimensionally carried out within the stacked body 1, so that high density circuits can be achieved.

<Example> Embodiments of the present invention will be described below based on the drawings.

FIG. 1 is an external perspective view of an embodiment of the present invention, and FIG. 2 is an exploded perspective view of the main parts thereof.

A stacked body 1 formed by stacking a plurality of substrates ia, lb, -21n on each other is provided with a chamber 2 extending in a direction perpendicular to the substrate stacking direction. is accommodated.

As shown in FIG. 2, bump contacts 4a and 4b are formed on the bottom of the chamber 2 in correspondence with the arrangement pattern of the electrode lead-out terminals of the bare chip IC 3 accommodated therein. , 4b- are mutually connected to each electrode extraction terminal of the pair chip IC3 facing each other,
Moreover, the paired chip IC3 is fixed in the chamber 2 by this.

Each bump contact 4a, 4b, - in the chamber 2 is connected to each board la,
By the wiring group 5 formed on the surface of 1b-.-, the group j
It is connected to each contact point 6a, 6b-... formed on the side surface of Fila, 1b-. Thereby, each electrode extraction terminal of the paired chip IC3 accommodated in the chamber z of the stacked body 1 is three-dimensionally led out to the surface of the stacked body 1. Further, the connections between the chips in the stacked body 1 are similarly made by the wiring group 5 on the surface of each substrate ia, lb, . . . .

The size of the cross section of chamber 2 is determined by the size of the paired chip IC accommodated inside.
It is set to be slightly thicker than the cross section of No. 3, and is used as a ventilation hole for cooling by a fan or the like when the IC is in use, and is used as a heat countermeasure.

In the above-described embodiments of the present invention, the thickness of each substrate la, lb. The dimension in the stacking direction of 1 may be at least equal to the length dimension of the bare chip IC3. As a result, as shown in FIG. 1, for example, the output of each sensor S can be independently controlled based on the end surface area that is almost the same as the area of the solid sensor A, which is formed by arranging sensors S-S in a two-dimensional direction. A signal processing circuit unit capable of processing can be assembled. At this time, the surface opposite to the sensitive surface of each sensor S is arranged in a bin grid array (
(not shown) etc. to connect to the contacts 6a, 6b, -.

Thereby, the probe itself of the solid sensor A can be provided with a signal processing function.

In addition, in the above embodiment, when each board 1a, lb.

4b and - may be difficult at the edge portion, in this case, as shown in FIG. Then, the wiring group 5 and the bump contacts 4a, 4b- are formed on the flexible wiring board 32 to form the bump contact 4a.

This can be solved by bending only the portions 4b--... inward of the chamber 2 and attaching them to the bottom surface of the chamber 2.

Further, in the above embodiment, an example was shown in which the paired chip IC 3 was housed in the chamber 2, but if there is no need to increase the circuit density so much, a packaged IC etc. may be housed in the chamber 2. It's okay.

<Effects of the Invention> As explained above, according to the present invention, a chamber extending in the stacking direction is formed in a stacked body formed by stacking a plurality of substrates, a semiconductor chip is housed inside the chamber, and the semiconductor chip is Since each electrode lead-out terminal is connected to the contact point on the surface of the laminate through the contact point in the room and the wiring group provided on the surface of each board, semiconductor chips can be mounted three-dimensionally and with high density. For example, by applying the present invention to a signal processing circuit of a sensor to increase the density of the circuit, it becomes possible to obtain a signal processing circuit as large as the sensor and to connect it closely to the sensor. This makes it possible to incorporate a signal processing circuit into the probe as described above, and the distance between the sensor and the signal processing circuit can be significantly shortened, resulting in a good signal-to-noise ratio without impairing sensor performance. Detection becomes possible.

[Brief explanation of the drawing]

FIG. 1 is an external perspective view of an embodiment of the present invention; Figure 2 is an exploded perspective view of the main parts. FIG. 3 is a perspective view of essential parts of another embodiment of the present invention. 1... Laminated body la, lb, --1n...substrate 2...room 3...Bare chip IC 4a, 4b...bump contacts 5...Wiring group 6a, 6b...terminals

Claims (1)

[Claims] A laminate formed by laminating a plurality of substrates is provided with a chamber extending in a direction perpendicular to the lamination direction, a semiconductor chip is housed inside the chamber, and each electrode lead-out terminal of the semiconductor chip is formed in the chamber. A semiconductor chip mounting structure in which the semiconductor chip is connected to each terminal formed on the surface of the laminate through a group of contacts and a group of wirings provided on the surface of each of the substrates.