JPS63157919U - - Google Patents
Info
- Publication number
- JPS63157919U JPS63157919U JP4904787U JP4904787U JPS63157919U JP S63157919 U JPS63157919 U JP S63157919U JP 4904787 U JP4904787 U JP 4904787U JP 4904787 U JP4904787 U JP 4904787U JP S63157919 U JPS63157919 U JP S63157919U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- capacitor
- conductive plate
- capacitors
- dielectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 claims description 6
- 239000002131 composite material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 4
- 239000003989 dielectric material Substances 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
第１図は本考案の第１実施例を示す図、第２図
は本考案の第２実施例を示す図、第３図は本考案
の第３実施例を示す略図、第４図は従来例を示す
図である。
１，２，３，４，５，６は電極、７１，７２，
７３，７４，……，７１′，７２′，７３′，７
４′，……は導電板、８，９，１０，８′は誘電
体、Ｃ１，Ｃ２，Ｃ３はコンデンサを示す。
Fig. 1 is a diagram showing the first embodiment of the present invention, Fig. 2 is a diagram showing the second embodiment of the invention, Fig. 3 is a schematic diagram showing the third embodiment of the invention, and Fig. 4 is a diagram showing the conventional It is a figure which shows an example. 1, 2, 3, 4, 5, 6 are electrodes, 7 1 , 7 2 ,
7 3 , 7 4 ,..., 7 1 ′, 7 2 ′, 7 3 ′, 7
4 ', . . . are conductive plates, 8, 9, 10, 8' are dielectric materials, and C 1 , C 2 , C 3 are capacitors.
Claims (1)
デンサにおいて、 少なくとも４隅に電極を設け、各電極対に各コ
ンデンサを形成する導電板を接続して、 １チツプに複数のコンデンサを収めたことを特
徴とする複合チツプ・コンデンサ。[Claim for Utility Model Registration] A chip capacitor consisting of an electrode, a conductive plate, and a dielectric, with electrodes provided at at least four corners, each pair of electrodes connected to a conductive plate forming each capacitor, and a plurality of chip capacitors on one chip. A composite chip capacitor characterized by containing several capacitors.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4904787U JPS63157919U (en) | 1987-04-01 | 1987-04-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4904787U JPS63157919U (en) | 1987-04-01 | 1987-04-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63157919U true JPS63157919U (en) | 1988-10-17 |
Family
ID=30871141
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4904787U Pending JPS63157919U (en) | 1987-04-01 | 1987-04-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63157919U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003526221A (en) * | 2000-03-03 | 2003-09-02 | アドバンスト・マイクロ・ディバイシズ・インコーポレイテッド | Printed circuit board assembly with improved bypass decoupling for BGA packages |
-
1987
- 1987-04-01 JP JP4904787U patent/JPS63157919U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003526221A (en) * | 2000-03-03 | 2003-09-02 | アドバンスト・マイクロ・ディバイシズ・インコーポレイテッド | Printed circuit board assembly with improved bypass decoupling for BGA packages |
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