JPS63155677A - Method for connecting tactile sense sensor and substrate - Google Patents

Abstract

PURPOSE:To join a substrate with a tactile sense sensor firmly by bonding a support leg part of its sensor, thereby inserting the leg part into a groove that is prepared at an upper layer part of an interconnection substrate. CONSTITUTION:Electrodes 8 like bumps are mounted at positions desired by a tactile sense sensor 3. A solder plating is performed by using a mask above an Ni base and the electrodes 8 consisting of solder bumps are formed. In such a case, the use of the mask allows a lower edge of the electrodes 8 to be correctly in parallel to a bonded face of both the tactile sense sensor 3 and a pressure receptive plate 2. Although the leg part 3A is inserted in a groove 6 where adhesives are coated, the electrodes 8 come in contact with the electrodes 5 prepared at a substrate 1 and not come in the groove 6.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for three-dimensionally connecting a tactile sensor to a wiring board.

[Prior Art] Conventional tactile sensors used in robots, manipulators, etc. are formed flat, such as conductive sheets. It is desired to develop a sensor that has a function similar to that of tactile sensation and can obtain information such as contact and slippage.
For example, tactile sensors that can detect force components in three directions are being considered.

In such a tactile sensor, the shape of the sensor is not planar, but must have a three-dimensional structure relative to the substrate, and in particular, the substrate on which such a sensor is placed is difficult to make the sensor three-dimensional. Accordingly, the wiring density must be high, and the connection strength must be maintained enough to withstand external forces applied to the order receiving surface of the sensor. Therefore, it has been considered to arrange such tactile sensors in a matrix on a wiring board.

However, when the three-dimensional sensor described above is connected two-dimensionally to a wiring board using the conventional method, sufficient mechanical strength cannot be maintained, and the electrical connection itself is also problematic.

As shown in FIG. 2, electrodes are provided by a method such as plating according to the connection of the tactile sensor to the wiring board, and an appropriate number is determined depending on the design. Reference numeral 5 denotes an electrode provided on the wiring board, and the electrode 4 and the electrode 5 are electrically connected to each other.

Here, one pressure-receiving plate 2 is glued to the tactile sensor 2@
An example of detecting directional force is shown.

It is desirable that the plurality of pressure receiving plates 2 bonded on the plurality of tactile sensors 3 be on the same plane.
Positional relationship between the electrode 4 and the sensor 3 In order to arrange the electrodes on the same plane, this electrode 4 and the electrode 5 on the wiring board must be connected while maintaining an accurate positional relationship.

In the method of mounting the tactile sensor 3 on the substrate 1 and connecting the electrodes 4 and 5 by soldering or the like, it is not possible to maintain the strength after connection to the leg 3. FIG. 4 is a perspective view showing the situation, and FIG. 4 is a sectional view thereof.

In order to bond the tactile sensor 3 to the substrate 1, as shown in FIG. Ru. However, since the electrode 4 provided on the sensor 3 is a thin layer of Ni plating, the electrode 4 also gets into the groove 6, as shown in FIG. Even if the bottom surface 68 is provided parallel to the surface of the substrate 1, it is extremely difficult to maintain the lower end of the leg portion 3 at a constant distance from the bottom surface 6Δ of the base 6. The distance a between the lower surface of the electrode 4 and the lower end of the electrode 4 differs for each tactile sensor or even for both ends of the same tactile sensor 3.

FIG. 5 is a side view of the tactile sensor 3 seen from the electrode 4 side for explaining its removal. As shown in FIG. 5, the height b of the electrode 4 at one end of the tactile sensor 3 from the surface of the substrate 1 is different from the height C at the other end, and as a result, the pressure receiving plate on the sensor 3 2 is not parallel to the substrate 1, and it is impossible to arrange multiple pressure receiving plates on the same plane.
It becomes.

[Problems to be Solved by the Invention] It is an object of the invention to provide a method for connecting a tactile sensor and a board that can be connected and that can provide a highly reliable connection state.

[Means for Solving the Problems] In order to achieve the above object, the present invention provides a tactile sensor with a hump-shaped Na, and a leg portion of the tactile sensor is placed in a groove provided in a substrate with a bump-shaped electrode. After inserting the hang-shaped electrode to the position shown in FIG. The bump-shaped electrodes and the electrodes on the substrate are soldered by heating and melting solder on the tape-shaped film.

[Function] In the present invention, the legs of the tactile sensor are fitted into the grooves provided in the upper layer of the wiring board and bonded, so that they are firmly joined, and
During fitting, the hump-shaped electrode provided in advance on the sensor acts as a stopper, so that a well-aligned fit can be achieved.

[Example code] The present invention will be described in detail below with reference to the drawings.

FIG. 1 is a perspective view showing the state in which the tactile sensor 3 is fitted into the groove of the substrate 1. A hump-shaped electrode 8 is provided at a desired position on the tactile sensor 3. Solder plating is performed using a mask on the N1 base formed in the same manner as the conventional electrode 4, so that the electrode 8 consisting of a solder bump having a thickness of 100 to 150 μm can be formed. At this time, by using a mask, it is possible to make the lower edge of the electrode 8 accurately parallel to the adhesive surface of the tactile sensor 3 and the pressure receiving plate 2.

FIG. 6 is a sectional view showing how the leg portion 3 is fitted into the groove 6. The leg portion 3A is inserted into the groove 6 coated with adhesive, or the hump-shaped electrode 8 is in contact with the electrode 5 provided on the substrate 1 and does not enter the groove 6. As mentioned above, the lower edge of the bump-shaped electrode 8 is a side view of the tactile sensor 3 seen from the side where the bump-shaped electrode 8 is provided. The height b is equal to the height C below the other end. Therefore, the pressure receiving plate 2 on the tactile sensor 3 is the substrate 1
In addition, the plurality of pressure receiving plates 2 are located in the same plane.

Next, the connection between the hump-shaped electrode 8 of the tactile sensor 3 bonded to the substrate 1 in this manner and the electrode 5 on the substrate 1 will be explained.

The width of the electrode 5 and the bump-shaped electrode 8 are both several hundred μm.
Since the soldering iron cannot be used, laser soldering is used. However, even if the solder hump constituting the bump-shaped electrode 8 is melted by laser irradiation, a good connection with the electrode 5 cannot be obtained.

Therefore, as shown in FIG. 8, a transparent tape-like film 9 made of polyimide or the like is placed over both electrodes 5 and 8, and a preheated copper (Cu) foil is placed at a predetermined interval.

A cross-sectional view of this state is shown in FIG. Thus, while partially irradiating the solder hump 10 with the laser beam 12 through the transparent tape-like film 9, the laser beam 12 is
This is because if the electrode 13 is moved, even after good soldering, it can be used as it is as a preservation film to prevent contact between the electrode 13 and an object, and also as an electrically insulating film. FIG. 10 shows the completed soldering process.

Next, another embodiment of the connection method of the present invention will be described.

As shown in FIGS. 12 and 13, solder strips 14 are melted on the tape-shaped film 9 at predetermined intervals to connect both electrodes 5 and 8. .

This is convenient because good solder adhesion can be obtained on the wood layer side in the same manner as with the film 9.

[Effects of the Invention] As explained above, according to the present invention, it is possible to fit the legs of the tactile sensor into the grooves provided in the upper layer of the wiring board, and to attach tape to the electrical joints with both electrodes. By melting and soldering the solder supported on the shaped film, fine right-angled wiring connections can be made. This connection method can protect and insulate the electrodes in the same way as soldering, and has excellent strength and reliability, so it is not only used for tactile sensors, but also extremely effective for the three-dimensional mounting of a wide range of electronic components, and has great industrial value. big.

[Brief explanation of the drawing]

Fig. 1 is a perspective view of an embodiment of the present invention, Fig. 2 is a perspective view illustrating a tactile sensor, Fig. 3 is a perspective view illustrating how the tactile sensor and substrate fit together, and Fig. 4 is a perspective view of a conventional tactile sensor. 5 is a side view of the connection method; FIG. 6 is a sectional view of the connection method of the present invention; FIG. 7 is a side view of the connection method; FIG. 8 is a first embodiment of the present invention. FIG. 12 is an enlarged plan view of the band soldering, and FIG. 13 is a sectional view thereof. DESCRIPTION OF SYMBOLS 1... Substrate, 2... Pressure receiving plate, 3... Tactile sensor 3A... Leg part, 4.5... Electrode, 6... Groove, 6A... Bottom surface, 7... Adhesive, 8... Bump-shaped electrode, 9... Tape-shaped film, 10... Solder bump, 11... Wiring pattern, 12... Laser emission part, 13... Soldering part electrode, 14...solder band, 15...heating fixing jig. 'Ju Mari) DA Ezuno yo 11J quality Yuki Iizuka A] 2 Teihiroyama Seven Nsa Begging 兇明su 4 Pestle Mizu U-su 1 year old' / Su C Bui (no Denhan Benpetsu p no Mato Imi Bacteria 1st O Illustration 2 Mikata Maki 4 Tari's Hndl Mamoru) Arrow Ward Child Appeal Fig. 1
Figure 1: 7 to 7 / 7 Lisho, poverty ha, ta〉Lower Buddha disaster, 7 Figure 12: Red Bakun, beggars and friends, give consideration to contributions Figure 13

Claims (1)

[Claims] A bump-shaped electrode is provided on the tactile sensor, and the legs of the tactile sensor are inserted into the groove provided on the substrate up to the position of the bump-shaped electrode, and the bump-shaped electrode is brought into contact with the electrode provided on the substrate. After adhering the leg portions and the substrate, the solder carried on the tape-like film is superimposed on the joint between the electrode of the substrate and the bump-like electrode of the antenna sensor, and the solder is placed on the tape-like film. A method for connecting a tactile sensor and a substrate, comprising heating and melting the solder to solder the bump-shaped electrode and the electrode on the substrate.