JPS63155643A - Automatic sticking system for semiconductor wafer - Google Patents

Abstract

PURPOSE:To smoothly take measures for restoration by restoring a malfunction according to a prescribed procedure. CONSTITUTION:A wafer 2 inside cassettes 81-84 and a frame 4 inside a loader part 54 are placed on a sticking table 42, and are stuck on an adhesive tape 82 by means of a sticking roller unit 90. A cutting mechanism 108 cuts the tape 82 along the frame 4, and a mounting frame 6 is formed. After the frame 6 has been transferred to a heating stage 126 and has been heat-treated, it is accommodated inside cassettes 1321-1324. A means to detect a malfunction is installed at each mechanism for a system; when the malfunction occurs, the upper stream part of a transfer mechanism is stopped and its downstream part discharges a workpiece and complete its operation. Then, an instruction for an operator to take measures is displayed. If a malfunction detector or the like confirms that the operator has completed to take the measures, the next instruction is displayed. Accordingly, the operator can take the measures for restoration according to a prescribed procedure when the malfunction occurs.

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to an automatic semiconductor wafer affixing apparatus used for affixing a semiconductor wafer to an adhesive tape in a pre-process of a semiconductor wafer scribing process.

<Prior Art> Generally, in a scribing process for semiconductor wafers, scribing is performed with the semiconductor wafer attached to an adhesive tape. The scribed semiconductor wafer is cracked while attached to adhesive tape. The adhesive tape is then stretched to separate the individual semiconductor elements so that they can be easily handled in the next process, the bonding process.

Such a process of attaching a semiconductor wafer to an adhesive tape is performed as a pre-process of a semiconductor wafer scribing process. With the automation of semiconductor manufacturing lines in recent years,
It is desired to develop an automatic device for attaching semiconductor wafer 1 to adhesive tape.

<Problems to be Solved by the Invention> The present invention is an automatic semiconductor wafer attachment device developed in view of the above circumstances, and in particular, an automatic semiconductor wafer attachment device that can smoothly perform error recovery processing. is intended to provide equipment.

Such objects of the present invention will become clearer in the detailed description of the present invention that follows.

<Means for Solving the Problems> In order to achieve the above object, the present invention adopts the following configuration.

That is, the present invention provides an apparatus for automatically attaching a semiconductor wafer that aligns a semiconductor wafer on which an orientation flat is formed and attaches it to an adhesive tape, and the automatic attaching of the semiconductor wafer prevents errors in each mechanical part of the apparatus. Based on the output of the error detection section and the error detection section, the error location is immediately stopped, each mechanical section downstream from the error location is paused, and each mechanical section downstream from the error location discharges the workpiece. and an error recovery processing section that performs recovery processing from the error, and the error recovery processing section determines whether the error detected by the error detection section is a recoverable error. an error type determining means for detecting whether each mechanism is stopped by the stop control section; a stop detecting means for detecting whether each mechanical section is stopped by the stop control section; and an error type determining means detecting that the error is a recoverable error; and a recovery request display means for displaying a request for recovery of the error location when the stoppage of each mechanical section is confirmed by the stoppage detection means; recovery determination means for determining whether or not the system has been restored based on the output of the error detection means; and a return-to-origin request display for displaying a request to return each mechanism to the origin based on the recovery confirmation output from the recovery determination means. means and 1, a home return determining means for detecting whether or not the home return has been completed after the display by the home return request display means; The present invention is characterized by comprising a start request display means for displaying a request for starting.

<Example> Hereinafter, an example of the present invention will be described in detail based on the drawings.

FIG. 1 is a schematic perspective view showing the overall configuration of the automatic semiconductor wafer attachment device according to the present embodiment, and FIGS. 2 to 9 are schematic diagrams of the configuration of each part of the automatic semiconductor wafer attachment device. It is.

FIG. 10 shows a semiconductor wafer 2 that is attached to an adhesive tape by an apparatus for automatic attachment of semiconductor wafers according to this embodiment.
A frame 4 for holding the adhesive tape 10 to which the semiconductor wafer 2 is attached, and a mount frame 6 to which the semiconductor wafer 2 is attached are shown.

An orientation flat OF, which is a flat cutout surface, is formed on the outer periphery of the semiconductor wafer 2 . An element pattern is formed on the semiconductor wafer 2 using this orientation flat OF as a reference.

The frame 4 is a ring-shaped metal plate or resin plate,
On its outer periphery, notches 4I and 4□ are formed, which are used when aligning the frame 4, which will be described later.

For automatic attachment of semiconductor wafers according to this embodiment, the apparatus separately supplies the semiconductor wafer 2 and the frame 4 from the wafer loader section and the frame loader section, respectively, and attaches them to the adhesive tape, and finally mounts the semiconductor wafers. -The frame 6 is stored in the unloader section.

The configuration of each part of this device will be explained below.

Reference numerals 8 (81 to 84) shown in FIG. 1 are wafer cassettes set in the wafer loader section. Wafer
The cassette 8 holds a plurality of semiconductor wafers 2 horizontally and stores them vertically at regular intervals. In this embodiment, there are two wafer loader sections, and the left wafer loader section has wafer cassettes 8. ．． Wafer cassettes 83 and 84 can be loaded into the right wafer loader section. Each wafer loader section is configured to be movable in the vertical direction, and the wafer cassette 8
The semiconductor wafer 2 is supplied by detecting the semiconductor wafer 2 inside and pushing it out.

The wafer push mechanism provided in each wafer loader section is shown in FIG. That is, in the left wafer loader section, a wafer pushing mechanism 10 driven by a motor is installed.
The right wafer loader section is provided with a wafer pushing mechanism 12 driven by an air cylinder.

The semiconductor wafers 2 supplied from each wafer loader section are
This semiconductor wafer 2 is transported to a semiconductor wafer alignment section 14 for alignment.

The semiconductor wafer 2 is transported to the semiconductor wafer alignment section 14 by a transport belt 16 shown in FIG. This conveyor belt 16 is driven by a motor 18 in forward and reverse directions.

The semiconductor wafer alignment unit 14 includes an alignment table 20 that receives and receives the semiconductor wafer 2 that has been transferred and aligns the orientation flat OF, and an alignment table 20 that aligns the center of the semiconductor wafer 2 with the alignment table 20.
A center alignment plate 22. which aligns the semiconductor wafer 2 so that it aligns with the center of the center alignment plate 22. ．． Including 22□ etc.

The alignment table 20 is equipped with a vacuum chuck for holding the semiconductor wafer 2 by suction. VLI is
The solenoid valve PUSWI that turns on/off the vacuum chuck is a pressure switch that turns on when it detects a drop in pressure within the vacuum chuck.

Further, this alignment table 20 is configured to be rotatable by a pulse motor 24 and configured to be movable in the vertical direction by an air cylinder 26.

Center alignment plate 22. , 22□ are provided at positions facing each other with the alignment table 20 at the upper limit position interposed therebetween. Each center alignment plate 22, . An arc-shaped reference surface corresponding to the outer shape of the semiconductor wafer 2 is formed on the opposing surface side of the semiconductor wafer 2 . Center alignment plates 221, 22
．． is configured to be movable in the horizontal direction by a link mechanism driven by an air cylinder 28.

On both sides of the alignment table 20, conveyor belts 1
There is a wafer stopper 301°30□ for receiving and stopping the semiconductor wafer 2 conveyed on the wafer 6. Wafer stopper 30. ．． It is swung by 30 degrees by an air cylinder (not shown). When the semiconductor wafer 2 is supplied from the left wafer loader section, the right wafer stopper 30□ is used, and when the semiconductor wafer 2 is supplied from the right wafer loader section, the left wafer stopper 30□ 30. , respectively, rise and stop receiving the semiconductor wafer 2 that has been transported.

The reference numeral 32 shown in FIG.
In order to detect the edge of the orientation flat OF of the semiconductor wafer 2 which is being held by suction and rotating,
This is an orientation flat end detection unit equipped with a set of transmission type photoelectric elements PH3WI, 2.3. As shown in FIG.
The light receiving section 38 and the light receiving section 38 are configured to be openable and closable by the air cylinder 34. The reason why such three sets of transmission type photoelectric elements P HS W 1 , 2 , and 3 are used is to select and use an appropriate photoelectric element according to the size of the semiconductor wafer 2 . The orientation flat end detection section 32 is open in a normal state, and is closed when detecting the end of the orientation flat 1-OF for positioning.

Reference numeral 40 shown in FIG. 1 and FIG.
A reversing fork is used to transfer the semiconductor wafer 2 whose OF has been aligned to the table 42. The reversing fork 40 is equipped with a vacuum chuck for suctioning and holding the semiconductor wafer 2 from the back side. VL2 is
The solenoid valve PUSW2 that turns on/off the vacuum chuck is a pressure switch that turns on when it detects a drop in the pressure inside the vacuum chuck.

The reversing fork 40 is driven by an air cylinder 44 to connect the alignment table 20 and the pasting table 4.
2, and is rotated upward by the motor 46, thereby inverting the semiconductor wafer 2 so that the back surface of the semiconductor wafer 2 faces upward. P.H.
3W4 is a photoelectric element for detecting whether the reversing fork 40 is in a predetermined position after performing a reversing operation.

As shown in FIG.
It includes a chuck table 48 and a frame chuck table 50 provided around the wafer chuck table 48. The wafer chuck table 48 is configured to be movable in the vertical direction by an air cylinder 49, and is biased upward by a compression coil spring 51. A protective film 52 is laid on the wafer chuck table 48. Reversing fork 4
The semiconductor wafer 2 transported by the wafer 2 is placed on the wafer chuck table 48 via the protective film 52 with its back side facing upward. Protective film 52
is used to prevent scratches from occurring on the surface of the semiconductor wafer 2.

Returning to FIG. 1, reference numeral 54 is a frame loader section. The frame loader section 54 includes a frame stocker 56 that stores a plurality of frames 4 in a stacked state, and a frame push-out mechanism that sequentially pushes out the frames 4 stored in the frame stocker 56 from below. This frame extrusion mechanism, as shown in Figure 4,
an extrusion plate 58 for extruding the frame 4;
It is composed of an air cylinder 60 that drives this horizontally.

The frame 4 supplied from the frame loader section 54 is
The frame positioning section 62
It is sent out to The frame feeding section includes a frame pusher 64 that engages with the inner circumferential surface of the frame 4 pushed out from the frame stocker 56 and feeds out the frame 4, and an air supply for pushing down the frame pusher 64. It is composed of a cylinder 66, an air cylinder 68 for horizontally driving the frame pusher 64, and the like. In the normal state, frame pusher 64 is lowered.

When the frame 4 is pushed out from the frame stocker 56, the air cylinder 66 is driven to push up the frame pusher 64 and insert it into the frame 4, and then the air cylinder 68 is driven to push the frame pusher 64 up and into the frame 4. is sent out to the frame positioning section 62.

The frame positioning section 62 is provided with two positioning pins 70 (however, only one positioning pin 70 is visible in FIG. 4) for positioning the sent-out frame 4. This positioning bin 70 and the frame 4
The frame 4 is positioned by engaging the notch 41.4°. PH3W5 is a photoelectric element for detecting the positioned frame 4.

The positioned frame 4 is transported to the table 42 for pasting by the frame conveying section, and the pasting is carried out by the table 42.
2 is placed on the frame chuck table 50. As shown in FIG. 5, the frame transport section includes a frame chuck arm 72 that holds the frame 4 by suction, an air cylinder 73 that raises this frame chuck arm 72, and a horizontal drive of the frame chuck arm 72. It is composed of an air cylinder 74, etc. for Vl3 is a solenoid valve that turns on/off the frame chuck arm 72, and PUSW3 is a pressure switch that detects a drop in pressure within the frame chuck arm 72 and turns on.

The frame chuck table 50 attracts and holds the frame 4 transported by the frame transport section. Fifth
Vl,4 shown in the figure is a solenoid valve that turns on/off the frame/chuck table 50, and PUSW4 is a pressure switch that detects a pressure drop within the frame/chuck table 50 and turns on. Further, PH3W6 is a photoelectric element that detects the frame 4 on the frame chuck table 50.

Next, the tape supply/winding mechanism and the adhesive tape cutting mechanism will be explained based on FIGS. 1 and 6.

The protective film 52 described above is pasted and supplied from a protective film supply reel 76 provided on one side of the table 42, and pasted and taken up by a protective film take-up reel 78 provided on the other side of the table 42.

Reference numeral 80 is an adhesive tape supply reel that supplies adhesive tape 82 for pasting the semiconductor wafer 2. The adhesive tape 82 is set on the adhesive tape supply reel 80 in a state where it is overlapped with a separator 84 having the same width. The separator rake 84 is wound up by a separator take-up reel 86 separately from the adhesive tape 82 when the adhesive tape 82 is fed out with the adhesive side facing down.

The remainder of the adhesive tape 82 used for pasting the semiconductor wafer 2 is taken up by a residual tape take-up reel 88.

Reference numeral 90 denotes a pasting roller unit consisting of a plurality of rollers arranged in the vertical direction. As shown in FIG. 6, the adhesive tape 82 supplied from the adhesive tape supply reel 80 is pasted onto a roller unit 90 in a 'SJ' shape, and is further pasted on the roller unit 90 in parallel. The frame is passed to a peeling roller unit 92, and the residue tape is wound on a take-up reel.

As shown in FIG. 7, the pasting roller unit 90 is connected to the tip of an air cylinder 94 that horizontally drives the pasting roller unit 90. Furthermore, the peeling roller unit 92 is coupled to the cylinder body of the air cylinder 94. The pasting roller unit 90 and the peeling roller unit 92 are configured to slide on a rail 96 by means of cam followers provided above them. The rail 96 has air cylinders 98 provided at both ends thereof.
1.982, it is configured to be able to move up and down. A rack and pinion mechanism 100 is provided at the bottom of the roller unit 90, and this rank and pinion mechanism 100 is driven by a motor 106 coupled via a brake 102 and a clutch 104. There is.

The operations of the above-mentioned pasting roller unit 90 and peeling roller unit 92 will be explained with reference to FIGS. 7 and 8.

In the normal state, each roller unit 90, 92 is attached at the origin position to the left of the table 42, and the rail 9
6 is rising. Further, at this time, the brake 102 and the clutch 104 are released.

When pasting is performed, the air cylinders 9L and 98□ are operated and the rail 96 is lowered. Then, a cock (not shown) provided in connection with the peeling roller unit 92 is operated to maintain the peeling roller unit 92 in a stopped state.

In this state, when the air cylinder 94 is activated, only the roller unit 90 is driven in the horizontal direction, and the roller moves while pressing the adhesive tape 82 on the table 42 downward, thereby applying the adhesive tape. 82
and the semiconductor wafer 2 are attached.

At this time, clutch 104 is released.

When the residual tape is to be peeled off from the frame 4 or the like after cutting the adhesive tape 82, the peeling roller unit 92 is released and the brake 102 is activated. In this state, when the air cylinder 94 is operated, the pasting roller unit 90 remains in a stopped state, so the peeling roller unit 92 and the air cylinder 94 move horizontally to the right as one. The peeling roller unit 92 peels off the residual tape by rotating the peeling roller while moving horizontally. FIG. 8 shows the position of each roller unit 90, 92 at the time when such a peeling operation is completed.

The return of each roller unit 90, 92 to its origin after the peeling operation is completed is performed as follows.

First, air cylinder 98. ．． 98□ operates to raise the rail 96. Raising the rail 96 in this way is done by each roller unit 90 during the return-to-origin operation.
This is because when the adhesive tape 92 rolls on the table 42, the residual tape peeled off by the above-described peeling operation will adhere to the frame 4 etc. again. As the rail 96 rises, the brake 102 is released and the clutch 104 is engaged. Then, when the motor 106 is operated and the rank-binion mechanism 100 is driven, the pasting roller unit 90 and the peeling roller unit 92 are integrally moved horizontally to the left and returned to the origin.

For pasting, an adhesive tape cutting mechanism 1 is provided above the table 42 for cutting the band-shaped adhesive tape 82 pasted by the above-described pasting operation into a circular shape along the frame 4.
08 is provided. This adhesive tape cutting mechanism 108
As shown in FIG.
0, a tape cutter 112 that is rotatably driven along the outer periphery of the presser plate 110, and the like. The pressing plate 110 and the tape cutter 112 are configured to be movable in the vertical direction as a unit.

Reference numeral 114 shown in FIG. 6 is a mount/frame chuck arm for ejecting the mount frame 6 from the attachment table 42. This mount/frame chuck arm 114 is attached to the peeling roller unit 92 described above. The mount/frame chuck arm 114 moves toward the table 42 side with the peeling operation of the peeling roller unit 92, and removes the mount/frame.
The frame 6 is held by suction, and the mount frame 6 is discharged and conveyed by the return-to-origin operation of the peeling roller unit 92 or the like. In addition, VL5 shown in FIG. 6 is a solenoid valve that turns on/off the mount/frame chuck arm 1, and PUSW5 is a solenoid valve that turns on/off the mount/frame chuck arm 1.
This is a pressure switch that detects the lower pressure image in 14 and turns on.

The mount frame 6 suctioned and held by the mount frame chuck arm 114 is conveyed to the swing reversing unit 116 by the return-to-origin operation of each of the roller units 90 and 92. As shown in FIGS. 6 and 9, the swing reversing unit 116 includes a clamp mechanism 11 that holds the transported mount frame 6.
In addition to 8, there is also a swing mechanism 120 that swings the held mount frame 6 approximately 180 degrees in the horizontal direction, an inversion mechanism 122 that inverts the swung mount frame 6 so that the surface of the semiconductor wafer 2 faces up, and The apparatus includes a vertical drive mechanism 124 for lowering the mount frame to the heat stage 126. Note that the PH3W7 provided in the clamp mechanism 118 is a photoelectric element that detects the mount frame 6 clamped by the clamp mechanism 118.

The heat stage 126 is provided for the purpose of increasing tape tension by heating when using an adhesive tape using a heat-shrinkable film as a support.

As shown in FIG. 9, the mount frame 6 on the heat stage 126 is adjacent to the heat stage 126.
Mount frame extrusion mechanism 12 for extruding
8 and a transport table 130 for transporting the extruded mount frame 6 to a frame cassette 132 (132, to 1324) shown in FIG. The conveyance table 130 is configured to be movable in the horizontal direction by an air cylinder 131 shown in FIG. 9, and includes a conveyor belt 134 for conveying to the unloader section on the left side and a conveyor belt 134 for conveying to the unloader section on the right side. The mount frame 6 can be distributed to the belt 136.

In addition, PH3W8 shown in FIG. 9 is heat stage 1.
A photoelectric element for detecting the mounting frame 6 on 26, P
H3W9 is a photoelectric element that detects the extrusion of the mount frame 6 on the heat stage 126, and PH3WIO is a photoelectric element that detects the reception of the mount frame 6 by the transport table 130.

The frame cassette 132 stores a plurality of mount frames 6 horizontally at equal intervals, and in this embodiment, four frame cassettes 1321 to 1324 can be stored. Frame cassette 132. ．． 132□ is the frame cassette 1323.1 in the left unloader section.
324 are respectively set in the right unloader section. Each unloader section is configured to be movable in the vertical direction.

Reference numeral 138 shown in FIG. 1 is an operation panel. The operation panel 138 is provided with a three-digit, seven-segment LED that displays a code corresponding to the type of error in the device, operation keys, and the like. Further, reference numeral 140 is a patrol light that displays automatic driving operations, error occurrences, and the like.

Next, the configuration of the control system of the apparatus for automatically attaching semiconductor wafers according to this embodiment will be explained based on FIG. 11.

The control unit 142 includes a CPU 144. ROM14.6゜RA
M148. Operation panel controller 150. Sensor controller 152. Actuator controller 154. It is composed of a pulse motor controller 156 and the like. The CPU 144 controls the entire device according to a processing program stored in the ROM 146. RAM148
Data such as the size of the semiconductor wafer to be pasted and processing conditions are written in. Operation panel controller 150
is the operation panel 138, the sensor controller 152 is a group of various sensors 158 such as pressure switches and photoelectric elements provided in this device, and the actuator controller 154 is
A group of various actuators 160 such as motors and air cylinders provided in this apparatus are controlled, and a pulse motor controller 156 controls a pulse motor 24 that rotationally drives the alignment table 20.

Next, the operation of the automatic semiconductor wafer bonding apparatus having the above-described configuration will be explained according to the operation flowchart shown in FIG.

When this apparatus is started with each part of the apparatus having returned to its original position and with the wafer cassette 8 and frame cassette 132 installed in the webber loader section and unloader section, respectively, the wafer - The wafer loader section on one side with the cassette 8 mounted is lowered (step S2).

It is confirmed whether the semiconductor wafer 2 in the wafer cassette 8 has been detected by the wafer detector provided in the wafer loader section (step S4).

When the semiconductor wafer 2 is detected, the transport bell 16 is driven, and the detected semiconductor wafer 2 is pushed out from the wafer cassette 8 by the wafer pushing mechanism 10 or 12 provided in the wafer loader section (step S8). The extruded semiconductor wafer 2 is transferred to the conveyor belt 1
6 and is transported to the semiconductor wafer alignment section 14.

Then, the alignment table 20 is aligned with the semiconductor wafer 2.
It is checked whether the receipt has been received (step 510).

Confirmation that the semiconductor wafer 2 has been received is detected by a photoelectric element PH5WII provided near the alignment table 20, as shown in FIG. If the alignment table 20 does not receive the semiconductor wafer 2 after a certain period of time has elapsed, an error display ■ is performed (step 512), the error display light of the patrol light 140 lights up, and the Segment 1-L
ED displays the code corresponding to this error.

When it is confirmed that the alignment table 20 has received the semiconductor wafer 2, the alignment table 20 is raised (step 514). Then, temporarily align the center position 22. , 22□ are driven to determine the center of the semiconductor wafer 2 (step 816). Once the center of the semiconductor wafer 2 has been determined, the vacuum chuck of the alignment table 20 is operated to suck the semiconductor wafer 2 (step 518). and a pressure swifter PUSWI provided in connection with the vacuum chuck.
Thus, it is confirmed whether the semiconductor wafer 2 is reliably attracted (step 520).

When the suction of the semiconductor wafer 2 is confirmed, the orientation flat OF of the semiconductor wafer 2 is aligned (step 524).

Hereinafter, the procedure for positioning the semiconductor wafer orientation flan 1 to performed in this step will be explained based on FIGS. 13 and 14.

FIG. 13 shows the center alignment plate 22. ．． The semiconductor wafer 2 centered by 22□ is aligned and
A state in which the table 20 has been adsorbed is shown. The end of the orientation flat OF is provided with a photoelectric element PH3W that is appropriately selected according to the size of the semiconductor wafer 2.
I, 2.3. In this figure, only the photoelectric element PH3WI is shown for convenience. The photoelectric element PH3WI is located slightly inside the radius of the semiconductor wafer 2 from the center of the alignment table 20. The output of the photoelectric element P HS W 1 is directly given to a pulse motor controller 156 that controls the pulse motor 24 . The pulse motor controller 156 is configured to stop the pulse motor 24 in response to a detection signal from the photoelectric element PH3WI. Further, the pulse motor controller 156 is controlled by the CPU 14.
Based on the command from 4, the rotation amount is output to the pulse motor 24, and the rotation amount until the pulse motor 24 comes to a stop state is given to the CPU 144.

FIG. 14 is a flowchart of the alignment operation of the orientation flat OF. The following explanation will be based on this.

When the semiconductor wafer 2 is suctioned and held on the alignment table 20, the CPU 44 sets a rotation amount to rotate the pulse motor 24 counterclockwise, for example, by 3606 (step 3130), and controls this via the pulse motor controller 156. It outputs to the pulse motor 24 (step S132).

Thereby, the semiconductor wafer 2 is rotated by the pulse motor 24. And orientation flat O
When one end of F is detected by the photoelectric element PH3WI, the detection signal is given to the pulse motor controller 156, and the pulse motor 24 is stopped.

After completing step 5132, the CPU 44 monitors whether the pulse motor 24 has stopped (step S134).

After confirming that the pulse motor 24 has stopped, the CPU
144 sets the amount of rotation for rotating the pulse motor 24 clockwise 360 degrees (step 5136), and sets the rotation amount to rotate the pulse motor 24 through the pulse motor controller 156.
4 (step 3138). As a result, the semiconductor wafer 2 is rotated clockwise. The other end of the orientation flange 1-OF is the photoelectric element PH3WI.
When detected, the detection signal is given to the pulse motor controller 156, and the pulse motor 24 is stopped.

When the CPU 144 confirms that the pulse motor 24 has stopped (step 5140), the CPU 144 determines the clockwise rotation amount θ at that time.
is read (step 5142).

Then, a rotation amount for rotating the pulse smoke 24 counterclockwise by θ/2 is set (step 5144), and this is output to the pulse motor 24 via the pulse motor controller 156. As a result, the semiconductor wafer 2 is rotated counterclockwise by θ/2.

Through such processing, the semiconductor wafer 2 is stopped at a position where the orientation flat OF intersects at right angles to the direction connecting the center of the alignment table 20 and the photoelectric element PH3WI.

The above is the basic procedure for aligning the orientation flat OF, but depending on the model of the semiconductor wafer 2,
Final positioning may be completed by further rotating the semiconductor wafer 2 by 90° or 180°.

Hereinafter, referring back to FIG. 12, the explanation of the operation of this device will be continued.

When the alignment of the orientation flat OF is completed, check again whether or not the semiconductor wafer 2 is attracted (
step 826). This is because the semiconductor wafer 2 may come off from the alignment table 20 during the alignment operation of the orientation flat OF.

If it is detected in this step S26 that the object is not attracted, the process proceeds to step S22 described above and an error display (2) is displayed.

By the way, after the above-mentioned step S14 is completed, the process moves to step S16 and also moves to step 32B. As a result, the reversing fork 40 moves forward and stops while being inserted below the semiconductor wafer 2 that is attracted to the alignment table 20.

After the reversing fork 40 is inserted below the semiconductor wafer 2, the alignment table 20 is lowered (step 530). At the same time as the alignment table 20 is lowered, the suction of the alignment table 20 is released,
The vacuum chuck of the reversing fork 40 is activated. As a result, the semiconductor wafer 2 on the alignment table 20 is moved to the reversing fork 40 and held there by suction.

Then, it is checked whether the reversing fork 40 has reliably attracted the semiconductor wafer 2 (step 532). The presence or absence of suction is determined based on a detection signal from a pressure switch PUSW2 provided in connection with the vacuum chuck of the reversing fork 40. If suction has not been performed, an error display ■ is displayed (step 534), the error display light I on the patrol light 140 lights up, and the operation panel 138
The 7-segment LED displays a code corresponding to this error.

When the semiconductor wafer 2 is reliably attracted to the reversing fork 40, the reversing fork 40 is reversed (step 83).
6). Then, it is confirmed whether the reversing fork 40 is at a predetermined reversing position (step 838). Whether or not the reversing fork 40 is reversed is determined based on the detection signal of the photoelectric element P HS W 4 provided in relation to the reversing fork 40 . If the reversing fork 40 has not been reversed to the predetermined position, an error display ■ is displayed (step 540), the error display light of the patrol light 140 lights up, and the 7-segment LED of the operation panel 138 lights up.
Display the code corresponding to this error.

If the reversing fork 40 is correctly reversed, the suction of the semiconductor wafer 2 is confirmed again (step 34).
．． 1) If the object is not absorbed, the above-mentioned error display (2) is performed (step 534).

When the semiconductor wafer 2 is confirmed to be attracted, the reversing fork 4
0 is pasted and retreats to the table 42 side (step 542
). Then, the reversing fork 40 releases the suction of the semiconductor wafer 2 and transfers the transferred semiconductor wafer onto the wafer chuck table 48 covered with the protective film 52 (step 544). The semiconductor wafer 2 transferred to the wafer chuck table 48 has its back side facing up.

On the other hand, if the semiconductor wafer 2 is detected in step S4 described above, the process moves to step S8 and then moves to step S46. As a result, the frame 4 stored in the frame stocker 56 is pushed out by the frame push-out mechanism. Then, the frame pusher 64 provided in the middle of the conveyance path between the frame stocker 56 and the frame positioning section 62 rises (step 848), and moves forward while engaging the inside of the pushed-out frame 4 (step 550). . As a result, the frame 4 is sent out to the frame positioning section 62, and the notch 4. , 4□ is the frame positioning part 62
The frame 4 is positioned by engaging with a positioning pin 70 provided in the frame 4.

Then, it is confirmed whether the frame 4 has been reliably positioned (step 552). This is determined based on the detection signal of the photoelectric element PH3W5 provided in the frame positioning section 62. If frame 4 is not aligned, an error message ■ is displayed (step 554);
The error indicator light on the patrol light 140 lights up, and the 7-segment LED on the operation panel 138 displays a code corresponding to this error.

If the frame 4 has been positioned, the frame chuck arm 72 that conveys the frame 4 to the table 42 is lowered (step 556) and sucks the positioned frame 4 (step 858). Next, it is determined whether the frame chuck arm 72 has attracted the frame 4 (step 560). this is,
The determination is made based on the detection signal of the pressure switch PUSW3 provided in relation to the frame chuck arm 72. If frame 4 is not adsorbed, an error message appears■
is carried out (step 562), and the error display light of the patrol light 140 lights up, and the 7-segment LED of the operation panel 138 displays a code corresponding to this error.

When it is confirmed that the frame 4 is attracted, the frame chuck arm 72 is raised (step 564).
). Then, it is checked again that frame 4 has been attracted (step 565), and if it has not been attracted, the above-mentioned error display (2) is performed (step 562). When adsorption of the frame 4 is confirmed, the frame chuck arm 72 moves to the attachment table 42 (step 8).
66). Then, the frame chuck arm 72 descends and transfers the frame 4 to the frame chuck table 50 (step 567).

When the transfer of the frame 4 is confirmed, the frame chuck table 50 is operated to suction and hold the placed frame 4 (step 570). Then, it is confirmed whether the frame chuck table 50 is reliably sucking the frame 4 (step 571). This is determined based on the detection signal of the pressure switch PUSW4 provided in relation to the frame/chuck table 50.

If the frame 4 is not attracted, an error display (2) is performed (step 572), the error display light of the patrol light 140 lights up, and the 7-segment LED of the operation panel 138 displays a code corresponding to this error.

After confirming that the frame 4 is attracted to the frame/chuck table 50, the frame/chuck arm 7
In order to release the suction of the frame chuck arm 72 (step S73), the frame chuck arm 72 rises (step 574).

Through the above steps, the semiconductor wafer 2 and frame 4 are placed on the attachment table 42.

When the frame chuck arm 72 is raised, the pasting roller unit 90 is lowered (step 575). As a result, the adhesive tape 82 placed on the roller unit 90 also descends, and this adhesive tape 82 is attached to the wafer.
It comes into contact with the back surface of the semiconductor wafer 2 on the chuck table 48. When the pasting roller unit 90 is lowered, the pasting roller unit 90 moves horizontally toward the pasting table 42. As a result, pasting is performed by the roller unit 9.
0 is attached by a roller rolling over the adhesive tape 82 that is in contact with the back surface of the semiconductor wafer 2 and pressing lightly to attach the semiconductor wafer 2, the adhesive tape 82, and the frame 4 (step 876).

When the attachment of the semiconductor wafer 2, adhesive tape 82, and frame 4 is completed, the presser plate 110 and tape cutter 112 are lowered, and the presser plate 110 presses and holds the adhesive tape 82 on the frame 4. Then, by rotating the tape cutter 112 once around the presser plate 110, the adhesive tape 82 is cut so as to be slightly smaller than the outer shape of the frame 4 (step 5).
78).

When cutting of the adhesive tape 82 is completed, the wafer/chuck table 48 is lowered (step 580), the protective film take-up reel 78 is driven to take up the protective film 52, and the new protective film 52 is placed on the wafer/chuck table 48. (step 582).

On the other hand, when the cutting of the adhesive tape 82 is completed, the peeling roller unit 92 moves horizontally toward the adhesion table 42 side. As a result, the residue of the adhesive tape 82 stuck to the periphery of the frame 4 is peeled off from the frame 4 (step 584).

Once the adhesive tape has been peeled off, the mount/frame chuck arm 114 is lowered to eject the mount frame 6 on the table 42 (step 886).
. Attach the mount frame 6 (step 588)
. Then, it is confirmed whether the mount frame 6 has been reliably attracted (step 590). This is determined based on the detection signal of the pressure switch PUSW5 provided in connection with the mount/frame chuck arm 114. If the mount frame 6 is not attracted, an error message X is displayed (step 592), and the patrol light 14
0 error display light lights up and the operation panel 13
8 7-segment LEDs display the code corresponding to this error.

When it is confirmed that the mount frame 6 is attracted, the mount frame chuck arm 114 is raised (step 594). After the mount/frame chuck arm 114 is raised, check again whether the mount/frame 6 is attracted (step 595), and if it is not attracted, an error message X is displayed (step 592). Mount -39= When adsorption of the frame 6 is confirmed, the pasting roller unit 90 and peeling roller unit 92, which have moved to the table 42, return to their original positions (origins) (step 396). For pasting, the roller unit 90 and the peeling roller unit 92 return to their origin, and the mount/frame chuck arm 114 that has attracted the mount frame 6 also moves toward the swing reversing unit 116 (step 898). Then, when the mount/frame chuck arm 114 has moved to the position where one end of the mount frame 6 is inserted into the clamp mechanism 118 of the swing reversing unit 116, check that the mount frame 6 is suctioned again (step 599). If not, an error message X is displayed (step 592).
).

When adsorption of the mount frame 6 is confirmed, the clamp mechanism 118 of the swing reversing unit 116 closes and clamps the mount frame 6 (step 5100).
. Then, it is checked whether the mount frame 6 is securely clamped (step S102). This is determined based on the detection signal of the photoelectric element PH3W7 provided in the clamp mechanism 118. If the mount frame 6 is not clamped, error display XI is displayed (step 5).
104), the error display light on the patrol light 140 lights up, and the 7 segment LED on the operation panel 138 lights up.
Display the code corresponding to this error.

After confirming that the mount frame 6 is clamped, the swing reversing uni-nod 116 swings approximately 180 degrees in the horizontal direction (step 8106), and again confirms that the mount frame 6 is clamped (step 5).
107). If not clamped, error display XI
(Step S104). Mount frame 6
When the clamping is confirmed, the mount frame 6 is turned over so that the surface of the semiconductor wafer 2 faces upward (step 310B). Then, check once again whether the mount frame 6 is clamped (Step 5IO9), and if it is not clamped, an error message xr is displayed (Step S104).

When the clamping of the mount frame 6 is confirmed, it is confirmed that there is no other mount frame 6 on the heat stage 126 (step 5llO). This is performed based on the detection signal of the photoelectric element PH3W8 provided on the heat stage 126. If there is another mount frame 6 on the heat stage 126, an error display X is displayed (step 5llll), the error display light of the patrol light 140 lights up, and the 7-segment LED of the operation panel 138 indicates this error. Display the corresponding code.

When it is confirmed that there is no other mount frame 6 on the heat stage 126, the swing reversing unit 116 descends (step 5112), and when the mount frame 6 reaches above the heat stage 126, the clamp mechanism 118 is released. (Step S113). With this, the mount frame 6 is attached to the heat stage 126.
The mount frame 6 transferred to the heat stage 126 is heated here (step 5l14).

This causes the adhesive tape on the mount frame 6 to contract, increasing the tape tension.

However, if such slack removal is not required, this step 5114 is omitted.

(Left below) Finish heating the mount frame 6.
Frame pushing mechanism 128 is activated to push out the mounting frame on heat stage 126 (step 5116). Then, it is confirmed whether or not the mount frame 6 has been pushed out from the heat stage 126 (Step 1.B5l18). Judgment based on. If the mount frame 6 is not pushed out, error display XI is displayed (step 5).
L20), the error display light on the patrol light 140 lights up, and the 7 segment LED on the operation panel 138 lights up.
Display the code corresponding to this error.

The mount frame 6 pushed out from the heat stage 126 rides on a transport table 130 for transporting to the unloader section. Then, using the photoelectric element pH5w10 provided on the transfer table 130, it is confirmed whether the mount frame 6 has been placed on the transfer table 130 (Sten 7'5I22). If the mount frame 6 is not placed on the transport table 130, an error display XrV is performed (step 5124), the error display light of the patrol light 140 lights up, and the 7-segment LED of the operation panel 138 indicates this error. Display the corresponding code.

If the mount frame 6 is not supported on the transport table 130, the mount frame 6 is transported to the unloader section and stored in the frame cassette 132 set in the unloader section (step 5126).
). When the photoelectric element provided in the unloader part detects that the mount frame 6 is stored in the frame cassette 132, the unloader part moves up 1 pin and 7 inches to store the next mount frame 6. (Step 312B>).

As described above, after the semiconductor wafer 2 is supplied from the wafer loader section and aligned in a predetermined direction, the adhesive tape 8
A series of operations for attaching the semiconductor wafer 2, such as attaching the semiconductor wafer 2 to the frame cassette 132 and storing the mount frame 6 with the semiconductor wafer 2 attached thereto in the frame cassette 132, are automatically performed.

In the apparatus for automatically attaching semiconductor wafers according to the above-described embodiment, an error detection section that detects errors in each mechanical section includes:
Photoelectric element PH3WI~PH3W1, Pressure swift PU
A group of sensors such as SWI to PUSW5 correspond to a CPU 44 that determines errors in each mechanical section based on detection signals from these sensor groups.

By the way, in the above-mentioned embodiment, when an error is detected in each mechanical part, the corresponding error display ■~XT
Although it has been explained that V is performed, along with such an error display, the stop control section provided in this device operates to stop each mechanical section. The CPU 144 serving as a stop control unit stops the apparatus according to a predetermined program based on the detection signals from the group of error detection sensors.

In other words, the CPU 144 as a stop control unit immediately stops the mechanical section where the error has occurred, pauses each mechanical section downstream from the error point, and causes each mechanical section downstream from the error point to stop the workpiece (semiconductor). Wafer 2.
Frame 4. After the mount frame 6) is paid out, it is stopped.

Here, the term "pause stop" refers to stopping the mechanical parts after each mechanical part completes its delimiting action during one action cycle. The end of the operation of each mechanical section is detected by a sensor provided in the actuator of each mechanical section. Pause-stopping the mechanism downstream from the error point is possible if you stop it immediately, and the CPU determines the stop position of the mechanism.
144, and the error recovery process described later is performed.'' This is because it is inconvenient. On the other hand, stopping the mechanical parts downstream of the error location after discharging the work is important because when the error is recovered and the equipment is restarted, if there is work remaining downstream of the error location, the remaining work will be stopped. This is because there is a risk that the error will occur again due to collision between the workpiece and the workpiece that has flowed from the error location.

Next, an explanation will be given of an error recovery processing section provided in the automatic semiconductor wafer attachment apparatus according to the above-described embodiment.

The error recovery processing procedure is written in the ROM 146 of the control unit 142 in advance as a program.

FIG. 15 is a flowchart showing such an error recovery processing procedure. The error recovery processing procedure will be described below based on this flowchart.

In the automatic attachment of semiconductor wafers according to the above embodiment, when an error occurs in the apparatus, the CPU 1 as an error type determination means
44 determines whether the error is a recoverable error (step 5150). Here, the recoverable error is an error mainly caused by a mistake in receiving or transferring a workpiece, and corresponds to each error explained in the operation flowchart shown in FIG. 12. On the other hand, an unrecoverable error is an error that occurs mainly due to an abnormal operation of a sensor or actuator provided in the apparatus.

In the operation flowchart shown in FIG. 12, explanation of unrecoverable errors is omitted =48-, but the control unit 142 also determines such unrecoverable errors and performs the recovery described above. Displays errors similar to possible errors. Examples of such irrecoverable errors include semiconductor wafer 2° frame 4. mount·
If the dispensing of the frame 6 is not completed within the specified time, the pasting is carried out by the roller unit 90 or the peeling roller unit 92.
The return to origin may not be completed within the specified time.

If it is determined in step 5150 that the error is recoverable, the CPU 14 as a stop detection means
Step 4 confirms whether the operation of the device has been stopped (step 5152). Once it is confirmed that the device has stopped,
Blue patrol light 14 that was lit while the device was operating
0 is turned off, the eject lamp is turned on, and the operator is asked to recover the error location (step 5).
154). This eject lamp is provided on the operation panel 138 and corresponds to the recovery request display means in the present invention.

After completing step 5154, the CPU 144 waits for the eject switch to be pressed by the operator (step 5156). This eject switch provides a trigger to move the error location to the next operation step.
A switch for supplying power to the PU144, which is connected to the operation panel 1.
38. For example, if this eject switch is pressed while the alignment table 20 is suctioning the semiconductor wafer 2, the suction of the semiconductor wafer 2 is released. In addition, the clamp mechanism 118 mounts
When the eject switch is pressed while the frame 6 is being clamped, the clamp is released.

When the eject lamp flashes, the operator determines the type of error from the error code displayed on the operation panel 138. Then, take measures depending on the type of error.

For example, ■In step S12, alignment table 2
If the wafer receiver 0 has an error display (■) indicating a mistake in picking up the wafer, remove the semiconductor wafer 2 from the transfer heald 16 and press the eject switch.

■In step S22, alignment table 2
If an error display (■) indicating a suction error of 0 is displayed, the frame 4 on the frame/chuck table 50 is removed, the eject switch is pressed, and the semiconductor wafer 2 on the alignment table 2o is removed.

, ■ In step S34, if error display ■ indicating a suction error of the reversing fork 40 is displayed, remove the frame 4 on the frame/chuck table 50, press the eject switch, and remove the semiconductor wafer 2 on the reversing fork 40. remove.

(2) In step S40, if the error display (2) indicating a mistake in reversing the reversing fork 40 is displayed, the semiconductor wafer 2 is removed by pressing the eject switch while holding the semiconductor wafer 2 on the reversing fork 40 by hand. Also, the frame 4 on the frame/chuck table 50 is removed.

(2) In step S54, if the error display (2) indicating an error in positioning the frame 4 is displayed, the sent frame 4 is removed and the eject switch is pressed.

(2) In step S62, if the error display (2) indicating an error in frame suction by the frame/chuck arm 72 is displayed, the frame/chuck arm 72 is pushed up, the sent-out frame 4 is removed, and the eject switch is pressed.

■In step S72, if an error message indicating an error in frame suction on the frame chuck table 50 is displayed, press the eject switch and press the eject switch to remove the frame.
Remove the frame on the chuck table 50.

■In step 392, if an error message X indicating an error in suction of the mount/frame chuck arm 114 is displayed, and if the mount/frame 6 on the frame/chuck table 50 is not suctioned, press the eject switch. , remove the mounting frame 6. When the mount frame chuck arm 114 is holding the mount frame 6, the mount frame 6 is removed by pressing the eject switch while holding the mount frame 6 by hand. Mount frame 6
If it has fallen, remove the mount frame 6 and press the eject switch.

(2) In step 5104, if error display XI indicating a mistake in clamping the mount frame 6 is displayed, if the mount frame 6 has fallen, remove the fallen mount frame 6 and press the eject switch. When the mount frame 6 is clamped, the mount frame 6 is held by hand and the eject switch is pressed to remove the mount frame 6.

[Phase] In step 5111, heat stage 12
If an error message indicating that the remaining mount frame on the heat stage 126 is incorrect is displayed, remove the mount frame 6 from the heat stage 126 and press the eject switch.

(2) In step 5120, if the error display X (2) indicating an error in pushing out the mount frame 6 is displayed, the marant frame 6 on the heat stage 126 is removed and the eject switch is pressed.

■In step 5124, the mount/frame receiver of the transport table 130 does not indicate a mistake in picking, and an error message is displayed.
If so, remove the mount frame 6 and press the eject switch.

When it is confirmed that the eject switch has been pressed, the eject lamp is turned on (step 8158). Then, as a recovery determination means, the CPU 44 checks whether the cassette has been correctly sent or the workpiece has been removed by the above-described measures, based on the detection signals of the sensors of each mechanism (step 3160).

When it is confirmed that the error countermeasures have been taken correctly, the eject lamp is turned off, and the origin return lamp as a return to origin request display means is blinked to request the operator to return to the origin of the error location (step 3162). Wait for the origin return switch to be pressed (step 5164). The origin return request lamp and origin return switch are provided on the operation panel 138.

When the origin return switch is pressed, the error location is returned to the origin (step 5166). Then, it is determined whether or not the return to the origin has been completed based on the detection signal of the sensor provided in the actuator at the error location (step S]68).

When the return to origin is completed, the return to origin lamp is turned off and the start lamp serving as a start request display means is blinked to request the operator to start the device (step 5).
170), and waits for the operator to press the start switch (step 5174). A start lamp and a start switch are provided on the operation panel 138.

When it is confirmed that the start switch has been pressed, the operation of attaching the semiconductor wafer 2 is resumed.

By the way, if it is determined in step 5150 that the error is unrecoverable, step 8176 is performed.
The process advances to step 5152 and checks whether the device has stopped, as in step 5152 described above. When it is confirmed that the device has stopped, the blue patrol light 140 is turned off (step 5178),
Wait until the operator presses the return-to-origin switch (step 3180).

The operator checks the operation of the sensor or actuator at the error location, takes necessary measures, and then presses the home return switch.

When it is confirmed that the return-to-origin switch has been pressed, each mechanical section is returned to its origin (step 3182), and the device returns to its initial state.

Note that the present invention includes a recovery request display means.

The display modes of the return-to-origin request display means and the start-up request display means are not limited to the lamp display as in the above-mentioned embodiments, but may be modified in various ways, such as a buzzer display.

Furthermore, it goes without saying that the apparatus for automatically attaching semiconductor wafers according to the present invention is not limited to the apparatus described in the embodiments.

<Effects of the Invention> As is clear from the above explanation, when an error occurs in a certain part of the device, the automatic semiconductor wafer attaching device according to the present invention can recover the error according to a predetermined error recovery procedure. Recovery processing is in progress.

Therefore, according to the present invention, error recovery processing can be performed smoothly, and the operating efficiency of the apparatus can thereby be improved.

[Brief explanation of the drawing]

FIG. 1 is an explanatory diagram schematically showing the overall configuration of a semiconductor wafer automatic pasting apparatus according to an embodiment of the present invention, and FIG. 2 is a configuration of the semiconductor wafer alignment section and the surrounding area of the reversing fork in the embodiment. FIG. 3 is a configuration diagram of the orientation flat end detection section in the above embodiment, and FIG.
The figure is a block diagram of the frame loader section and the surroundings of the frame positioning section in the embodiment, FIG. 5 is a block diagram of the frame transport section and its periphery in the embodiment, and FIG. 6 is the adhesive tape supply system and the adhesive tape in the embodiment. FIGS. 7 and 8 are diagrams illustrating the configuration and operation of the pasting roller unit and the ff1ll separating roller unit in the above embodiment; FIG. 9 is a diagram illustrating the configuration around the heat stage in the embodiment; FIGS. , FIG. 10 is an explanatory diagram of the semiconductor wafer, frame, and mount frame used in the embodiment, FIG. 11 is a block diagram schematically showing the configuration of the control system in the embodiment, and FIG. 12 is a diagram illustrating the configuration of the control system in the embodiment. An example operation flowchart, FIG. 13 is an explanatory diagram of orientation flat alignment in the embodiment,
FIG. 14 is an operational flowchart of orientation flat alignment in the embodiment, and FIG. 15 is a flowchart of error recovery processing in the embodiment. 2... Semiconductor wafer, OF... Orientation flat, 4... Frame, 6... Mount frame, 8... Wafer cassette, 14... Semiconductor wafer positioning unit, 20... Alignment table, 24... Pulse motor, 32... Orientation flat end detection section, 40... Reversing fork, 4
2... Paste on table, 48... Wafer/chuck table, 50... Frame/chuck table, 5
4... Frame loader section, 62... Frame positioning section, 72... Frame chuck arm, 82...
...Adhesive tape, 90...Pasting is done using a roller unit, 9
2... Peeling roller unit, 108... Adhesive tape cutting mechanism, 114... Mount/frame chuck arm, 116... Swing reversing unit, 118...
・Clamp mechanism, 126... Heat stage, 128
...Mount frame extrusion mechanism, 130...
Transport table, 132...Frame cassette, 13
8... Control panel, 140... Patrol light, 142...
・Control unit, 144...CPU, PH3WI to PH5W
I1...Photoelectric element, PUSWI~PUSW5...
Pressure switch.

Claims (1)

[Scope of Claims] An automatic semiconductor wafer pasting device that aligns a semiconductor wafer on which an orientation flat is formed and sticks it onto an adhesive tape, the device detecting errors in each mechanical part of the automatic semiconductor wafer pasting device. Based on the output of the error detection section and the error detection section, the error location is immediately stopped, each mechanism section upstream from the error location is paused, and each mechanism section downstream from the error location is stopped after the workpiece is delivered. It includes a stop control unit that causes the error to stop, and an error recovery processing unit that performs recovery processing from the error, and the error recovery processing unit determines whether or not the error detected by the error detection unit is a recoverable error. an error type determining means for detecting; a stop detecting means for detecting whether each mechanical section is stopped by the stop control unit; and a recoverable error is detected by the error type determining means, and a recovery request display means for displaying a request for recovery of the error location when the stoppage of each mechanical section is confirmed by the stoppage detection means; recovery determination means for determining whether or not the error detection means has been activated based on the output of the error detection means; and origin return request display means for displaying a request to return each mechanism to the origin based on the recovery confirmation output from the recovery determination means. , a return-to-origin determination means for detecting whether the return-to-origin has been completed after the display by the return-to-origin request display means; 1. An automatic semiconductor wafer affixing apparatus, comprising: start request display means for displaying a prompting display.