JPS6315431A - Molding die for manufacturing semiconductor device - Google Patents

Abstract

PURPOSE: To eliminate the need for die matching by forming a recessed section to an abutting surface in one mold in a pair of molds and substantially shaping the abutting surface of the other mold in a plane. CONSTITUTION:Recessed sections 11b, 11c are formed to the abutting surface 11a of a top force 11, no recessed section is shaped to the abutting surface 12a of a bottom force 12, and the abutting surface 12a is formed substantially in a plane 12b. A tablet is charged into a charging port 17, and pushed by a plunger, thus filling the insides of cavities 13, 14 with a resin through a runner and a gate, then sealing semiconductor chips 15 with the resin together with one parts of lead frames 16. The molds 11, 12 are separated, molded forms are removed from a molding die 10, and the lead frames are cut, thus acquiring a semiconductor device 19 having structure in which leads 16a are bent in the direction of the height of a resin package 18 in the resin package 18 and one end sides 16a-1 are exposed to the lower surface of the resin package 18 as terminals and extended to both sides. Accordingly, the die-matching of the top force 11 and the bottom force 12 is unnecessitated substantially.

Description

[Detailed Description of the Invention] [Summary] The present invention provides a mold for manufacturing four semiconductor devices, in which the four parts are formed in only one of a pair of molds, the other mold has a flat surface, and the molds can be matched easily. This configuration is unnecessary, the other mold is shared, and only one of the molds can be replaced to accommodate molding of semiconductor devices of different model numbers.

[Industrial application field]

The present invention relates to a mold for manufacturing semiconductor devices.

[Conventional technology]

FIG. 8 shows the structure of a conventional molding die 1 for manufacturing semiconductor devices. In the figure, 2 is an upper mold, 3 is a lower mold, and recesses 2b are formed on the butting surfaces 2a and 3a, respectively.

2G, 3b, and 3c are formed. The upper and lower molds 2゜3 are
The recesses 2b and 3b and the recesses 2C and 3C are combined with the lead frame 5 to which the semiconductor chip 4 is fixed sandwiched therebetween.

The four parts 2b and 3b form a hole 6, and the recesses 2C and 3C form a hole 7.

8 is a tablet inlet, 91, 1 is a heater embedded in each mold 2.3.

[Problem that the invention seeks to solve]

The 4-cavity 6.7 supports the semiconductor chip 4 together with a part of the lead frame 5 inside and is filled with resin.
The recess 2b (2C) of the mold 2 and the recess 3b (3c) of the mold 3 are formed to face each other, and there is a problem described below.

First, when matching the molds during molding, the recess 2b (2
c) and the recessed portion 3b (3c) accurately face each other,
There was a problem in that it was necessary to align the molds 2 and 3 with high precision, making the mold alignment work difficult.

Furthermore, it is necessary to prepare a molding die consisting of a dedicated upper mold and a lower mold for each model number of the semiconductor device, resulting in an increase in cost.

Also, when manufacturing semiconductor devices with different model numbers,
It is necessary to replace both the upper mold and the lower mold attached to the molding form, which is time consuming and requires difficult mold matching work as described above.

[Means for Solving the Problems] The present invention provides a molding die for manufacturing a semiconductor device consisting of a pair of dies for resin-sealing a semiconductor chip together with a lead frame to which the semiconductor chip is fixed. Only one mold has four parts formed on its abutting surface, and the other mold has a substantially flat abutting surface.

[Effect]

This configuration eliminates the need for mold matching, and allows the other mold to be used in common regardless of the type of semiconductor device to be manufactured, improving the workability of mold installation and removal, However, only for one of the above requirements is the semiconductor device l
It is sufficient to prepare one according to the type of mold, and the mold cost can be reduced.

〔Example〕

FIG. 1 shows a molding die 10 for manufacturing a semiconductor device, which is an embodiment of the present invention. In the figure, 11 is an upper mold, and 12 is a lower mold. The abutting surface 11a of the upper mold 11 has recesses 11b, 1
1c is formed. No recess is formed in the abutting surface 12a of the lower die 12, and the abutting surface 12a is a substantially flat surface 12b.

The opening of the recessed portion 11b (11c) is closed by the flat surface 12b to form a gap 13.14.

Between the molds 11 and 12, FIGS. 2(A) and (B).

A three-dimensional lead frame 16 to which a semiconductor chip 15 is fixed and wire-bonded is sandwiched, as shown in (C), and the semiconductor chip 15 and leads 16a are supported within the cavity 13.14.

By putting the tablet 1- (not shown) into the inlet 17 and pressing it with the plunger j+ (U not shown), the resin is filled into the cavity 13.14 through the launch and gate (both not shown). , the semiconductor chip 15 and a part of the lead frame 16 are fixed in resin 1.1. Thereafter, the molds 11 and 12 are released, the molded product is removed from the mold die 10, and the lead frame is cut, so that the leads 16a are placed at this height within the resin package 18, as shown in FIGS. A superior semiconductor device 19 is obtained, which is bent in the horizontal direction, with one end side 16a-1 exposed as a terminal on the lower surface of the resin package 18 and extending to both sides.

As can be seen from FIG. 1, the molding die 10 has a structure in which the cavities 13.14 are formed by the recessed portion 11b (11c) of the upper mold 11 and the flat surface 12b of the lower mold 12, so that the cavity 13. Upper mold 11 and lower mold 12 for forming
It is actually unnecessary to match the molds 11 and 12 to the molding shell (44) easily and with good workability.

Furthermore, since no recess is formed in the lower mold 12, the structure of the lower mold 12 itself is simpler than in a structure in which a recess is formed, and the cost is reduced to ¥1J. As a result, the molding die 10 also has a simpler structure and is less expensive than the conventional molding die 1 shown in FIG. 8.

Next, a description will be given of changes to the mold 10 when manufacturing a semiconductor device 20 having a shape shown in FIG. 7 and having a different model number from the semiconductor device 19 shown in FIG. 3.

In this case, a semiconductor nail manufacturing mold 21 shown in FIG. 6 is used. In this molding die 20, the lower mold 12 in FIG. 1 is used as is, and only the upper mold 11 has a recess 23b in a shape corresponding to the resin package 22 in FIG. 6 on the abutting surface 23a. This is a structure changed to type 23.

Also at this time, there is no need to match the upper mold 23 and the lower mold 12. Furthermore, the lower mold 12 remains fixed without being removed, and only the upper mold 11 needs to be replaced, which also facilitates the work of removing the mold.

Using this mold 10, a semiconductor device 20 having the shape shown in FIG. 6 is manufactured.

In addition, in FIG. 1 and FIG. 7, 24 is a heater embedded in the mold.

As can be seen from the above, according to the mold of this embodiment, the lower mold 12 is shared, so that pairs of upper molds and lower molds are prepared as many as the number of types of semiconductor devices to be manufactured. It is not necessary to prepare an upper mold for each of the above types, which can reduce mold costs.

〔Effect of the invention〕

According to the present invention, the recess is formed in only one of the pair of molds that are combined to form a mold die, and the other is a flat surface, so that the cavity is substantially formed only by the recess. , there is no need to worry about mold misalignment, there is no need to match the molds, the molding can be easily attached to the mold, and the other mold can be shared, it is sufficient to prepare multiple types of the one mold, and the metal The present invention has the advantage that mold costs can be reduced, and the work of replacing molds depending on the type of semiconductor device to be manufactured can be carried out efficiently.

[Brief explanation of drawings]

FIG. 1 is a diagram showing an embodiment of a mold for manufacturing a semiconductor device TJ according to the present invention, and FIG. 2 (A) is a plan view of a lead frame to which a semiconductor chip is fixed, which is sandwiched between the molds shown in FIG. 1. Figure 2 (B) and (C) are IIB-I in Figure 2 (A), respectively.
IB line, I Medium IV - IV line and ■
- A cross-sectional view taken along line v, Figure 6 is a diagram showing a mold constructed by sharing the middle and lower molds in Figure 1 and replacing only the upper mold, and Figure 7 shows the mold in Figure 6. A perspective view of a semiconductor device manufactured by a mold. FIG. 8 is a diagram showing a conventional mold for manufacturing semiconductor devices. In the figure, 10.21 is an upper mold for manufacturing semiconductor devices, 11.2
3 is the upper mold, 11a, 12a, 23a are the butting surfaces, 11b, 11c
, 23b is a recess, 12 is a lower die, 12b is a flat surface, 13.14 is a cavity, 15 is a semiconductor chip, 16 is a lead frame, 18.22 is a resin package, and 19.20 is a semiconductor device. 10 prison number 1 for knitting 14 = -1 し) zu = pi viewing L 19 cattle production amount CB) ), -11C (C) (A) Mine 3 figure yv + -vt mist elephant I: 喯Hand blow (Sashidan No. 4)
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Claims (1)

[Scope of Claims] In a semiconductor device manufacturing mold consisting of a pair of dies for resin-sealing a semiconductor chip together with a lead frame to which the semiconductor chip is fixed, only one of the pair of dies (11, 23) is used. The abutting surfaces (11a, 23a) are provided with recesses (11b, 11c).
, 23b), and the other mold (12) is characterized in that its abutting surface (12a) is a substantially flat surface (12b).