JPS63150714U - - Google Patents
Info
- Publication number
- JPS63150714U JPS63150714U JP4054587U JP4054587U JPS63150714U JP S63150714 U JPS63150714 U JP S63150714U JP 4054587 U JP4054587 U JP 4054587U JP 4054587 U JP4054587 U JP 4054587U JP S63150714 U JPS63150714 U JP S63150714U
- Authority
- JP
- Japan
- Prior art keywords
- die
- workpiece
- punch
- bending
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005452 bending Methods 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Landscapes
- Mounting, Exchange, And Manufacturing Of Dies (AREA)
- Bending Of Plates, Rods, And Pipes (AREA)
Description
第１図は本考案による曲げ型の一実施例を示す
断面図、第２図は本考案におけるセラミツク部の
取付例を示す断面図、第３図ａ，ｂは被加工材お
よびその成形例を示す斜視図、第４図は一般的な
曲げ加工を示す模式図である。
１１…被加工材、２０…曲げ型、２２…ポンチ
、２３…ダイス、２６…セラミツク部。
Fig. 1 is a cross-sectional view showing an embodiment of a bending mold according to the present invention, Fig. 2 is a cross-sectional view showing an example of attaching a ceramic part according to the present invention, and Fig. 3 a and b show a workpiece and an example of its molding. The perspective view shown in FIG. 4 is a schematic diagram showing a general bending process. DESCRIPTION OF SYMBOLS 11...Workpiece material, 20...Bending die, 22...Punch, 23...Dice, 26...Ceramic part.
Claims (1)
にセラミツク部を形成したことを特徴とする曲げ
型。[Claims for Utility Model Registration] A bending die having a die and a punch, characterized in that a ceramic portion is formed at least at a portion of the die in contact with a workpiece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4054587U JPS63150714U (en) | 1987-03-19 | 1987-03-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4054587U JPS63150714U (en) | 1987-03-19 | 1987-03-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63150714U true JPS63150714U (en) | 1988-10-04 |
Family
ID=30854730
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4054587U Pending JPS63150714U (en) | 1987-03-19 | 1987-03-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63150714U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04107852U (en) * | 1991-02-28 | 1992-09-17 | 京セラ株式会社 | Jig and tool for bending leads of semiconductor package and lead bending device using the same |
| JP2014226680A (en) * | 2013-05-20 | 2014-12-08 | Ｊｆｅスチール株式会社 | Warm press-forming method |
-
1987
- 1987-03-19 JP JP4054587U patent/JPS63150714U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04107852U (en) * | 1991-02-28 | 1992-09-17 | 京セラ株式会社 | Jig and tool for bending leads of semiconductor package and lead bending device using the same |
| JP2014226680A (en) * | 2013-05-20 | 2014-12-08 | Ｊｆｅスチール株式会社 | Warm press-forming method |