JPS63146441A - Resin sealing apparatus for semiconductor device - Google Patents
Resin sealing apparatus for semiconductor deviceInfo
- Publication number
- JPS63146441A JPS63146441A JP29370286A JP29370286A JPS63146441A JP S63146441 A JPS63146441 A JP S63146441A JP 29370286 A JP29370286 A JP 29370286A JP 29370286 A JP29370286 A JP 29370286A JP S63146441 A JPS63146441 A JP S63146441A
- Authority
- JP
- Japan
- Prior art keywords
- blocks
- chase
- mold
- block
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims description 14
- 238000007789 sealing Methods 0.000 title claims description 11
- 229920005989 resin Polymers 0.000 title claims description 10
- 239000011347 resin Substances 0.000 title claims description 10
- 239000007788 liquid Substances 0.000 claims abstract description 15
- 229920003002 synthetic resin Polymers 0.000 claims description 2
- 239000000057 synthetic resin Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 abstract 2
- 238000000034 method Methods 0.000 description 5
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/64—Mould opening, closing or clamping devices
- B29C45/67—Mould opening, closing or clamping devices hydraulic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C2045/2683—Plurality of independent mould cavities in a single mould
- B29C2045/2689—Plurality of independent mould cavities in a single mould separate independent mould halves mounted on one plate
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は合成樹脂により半導体素子を封止成形する半
導体装置の樹脂封止装置の改良に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an improvement in a resin sealing device for a semiconductor device that seals and molds a semiconductor element with a synthetic resin.
従来の装置を第２図で説明する。図において、（１）は
上型用定盤、（２） 、（３）は上型用チェイスブロッ
ク、（４） 、 （５）は半導体封止を行う下型用チェ
イスプ・ロック、（６）はこの下型用チェイスブロック
（４） 、 （５）を取付けるための定盤、（７）は型
の高さを保つスペーサー、（７）は定盤（６）を支える
ポスト、（３）は金型のペースプレートである。A conventional device will be explained with reference to FIG. In the figure, (1) is a surface plate for the upper mold, (2) and (3) are chase blocks for the upper mold, (4) and (5) are chase blocks for the lower mold that seal the semiconductor, and (6) are chase blocks for the lower mold. is a surface plate for attaching chase blocks (4) and (5) for the lower mold, (7) is a spacer that maintains the height of the mold, (7) is a post that supports the surface plate (6), and (3) is a It is a pace plate for the mold.
次に動作について説明する。Next, the operation will be explained.
ベースプレート（８）はプレス（図示せず）のスライド
フレーム（図示せず）に固定されている。そのスライド
フレーム（図示せず）が上昇すると、プレスの固定フレ
ーム側に取付けられた上型の定盤（１）、チェイスブロ
ック（２） 、 （３）に下型チェイスブロック（４）
、 （５）が合わさり、さらにプレス圧により型締め
された状態で樹脂が注入され半導体の封止が行われる。The base plate (8) is fixed to a slide frame (not shown) of a press (not shown). When the slide frame (not shown) rises, the lower die chase block (4) is attached to the upper die surface plate (1), chase block (2), (3) attached to the fixed frame side of the press.
, (5) are combined, and the mold is further clamped by press pressure, and resin is injected to seal the semiconductor.
従来の装置では、上型、下型はプレスによυ型締されて
樹脂の封止が行われているが、高温作業であるため、温
度による型の変形、特に定盤の変形が発生し、各々のブ
ロックのパーティング面が密着せず、製品にパリが発生
し製品不良となっていた。又パリ発生が少ないものは後
工程のパリ取り工程で除去しているが、パリ取り工程は
設備費が高く、よごれる作業であり、作業環境の改善を
要する職場である。In conventional equipment, the upper and lower molds are clamped with a press and sealed with resin, but since the work is at high temperatures, the molds may deform due to the temperature, especially the surface plate. However, the parting surfaces of each block did not come into close contact with each other, causing cracks to form on the product and resulting in product defects. In addition, items that generate less dust are removed in a post-process deburring process, but the deburring process requires high equipment costs and is dirty work, making it a workplace that requires improvement of the working environment.
この発明は上記のような問題点を解消するためになされ
たもので、上型、下型の各ブロックのパーティング面を
密着でき、製品不良を無くすとともに後工程のパリ取り
工程を廃止できるような半導体装置の樹脂封止装置を得
ることを目的とするものである。This invention was made to solve the above-mentioned problems.The parting surfaces of the upper and lower mold blocks can be brought into close contact with each other, thereby eliminating product defects and eliminating the post-process deburring process. The object of the present invention is to obtain a resin sealing device for a semiconductor device.
この発明に係る半導体装置の樹脂封止装置は、多数個の
下型チェイスブロック、この下型チェイスブロックと対
向する多数個の上型チェイスブロック、上記多数個の下
型チェイスブロックを個別に支持する多数の支柱、及び
この多数の支柱を共通的に支持する液体を収納した支持
台を備えたものである。A resin sealing device for a semiconductor device according to the present invention individually supports a plurality of lower chase blocks, a plurality of upper chase blocks facing the lower chase blocks, and a plurality of lower chase blocks. It is equipped with a large number of support columns and a support base containing a liquid that commonly supports the large number of support columns.
〔作用〕
この発明における半導体装置の樹脂封止装置は、下型チ
ェイスブロックを支持台に取付し、上型のチェイスブロ
ックに段差があっても封入液の作用により、それに追従
しパーティング面が密着され、パリの発生がなくなる。[Function] In the resin sealing device for semiconductor devices according to the present invention, the lower chase block is mounted on a support base, and even if there is a step in the upper chase block, the parting surface follows it due to the action of the filled liquid. Close contact, eliminating the occurrence of Paris.
以下この発明の一実施例を図について説明すん第１図に
おいて、（９）は支柱、（９ａ）はチェイスブロック（
５）用の支柱、 （９ｂ）はチェイスブロック（４）用
の支柱、ｑｏは液体容器本体、（ロ）はこの液体容器本
体ｑＯを密閉する座板、（６）、（至）は液体流出を防
止する封止リング、（至）は液体注入口のメクラナツト
、αＱは液体である。An embodiment of the present invention will be explained below with reference to the drawings.In Fig. 1, (9) is a column, (9a) is a chase block (
(9b) is the support for the chase block (4), qo is the liquid container body, (b) is the seat plate that seals this liquid container body qO, (6) and (to) are the liquid outflow The sealing ring that prevents the liquid inlet, (to) is the liquid inlet hole nut, and αQ is the liquid.
（Ａ）は上型チェイスブロック（２） 、 （３）の熱
変形による段差を示す。(A) shows the step caused by thermal deformation of the upper chase blocks (2) and (3).
その他の符号の説明は従来装置と同様につき省略する。Descriptions of other symbols are omitted as they are the same as in the conventional device.
次に動作について説明する。封止は次の様に行われる。Next, the operation will be explained. Sealing is performed as follows.
プレススライドフレーム（図示せず〕が上昇すると上型
及び下型チェイスブロック（３）及び（５）が当り、さ
らに上昇すると支柱（９ａ）が押し下げられ、液体ａＱ
により他方のチェイスブロック（４）の支柱（９ｂ）を
押し上げ、チェイスブロック（４）が上型チェイスブロ
ック（２）に密着し、プレスが上昇端に達すると、上型
、下型チェイスブロック（２） 、 （３）のパーティ
ング面に圧力がかがり、夫々のパーティング面は完全に
密着された状態で封止が行われる。When the press slide frame (not shown) rises, it hits the upper and lower chase blocks (3) and (5), and when it rises further, the column (9a) is pushed down and the liquid aQ
pushes up the pillar (9b) of the other chase block (4), and the chase block (4) comes into close contact with the upper die chase block (2). When the press reaches the rising end, the upper die and lower die chase block (2) are pushed up. ), (3) pressure is applied to the parting surfaces, and the respective parting surfaces are completely sealed and sealed.
封止の動作については半導体装置の樹脂封止装置として
公知のため省略する。The sealing operation will be omitted since it is well known as a resin sealing device for semiconductor devices.
以上のようにこの発明は、多数個の下型チェイスブロッ
ク、この下型チェイスブロックと対向する多数個の上型
チェイスブロック、上記多数個の下型チェイスブロック
を個別に支持する多数の支柱及びこの多数の支柱を共通
的に支持する液体を収納し九支持台を備えたので、上型
のパーティング面に下型が追従可能となりパーティング
面が密着し、金型の熱変形によるパリの発生を防止でき
、生産性が著しく向上されると共に高精度となる効果が
ある。As described above, the present invention provides a large number of lower chase blocks, a large number of upper chase blocks facing the lower chase blocks, a large number of supports that individually support the multiple lower chase blocks, and Because it contains a liquid that commonly supports a large number of columns and is equipped with nine support stands, the lower mold can follow the parting surface of the upper mold, and the parting surface comes into close contact, preventing the occurrence of cracks due to thermal deformation of the mold. This has the effect of significantly improving productivity and increasing precision.
第１図はこの発明の一実施例を示す断面図、第２図は従
来装置の断面図である。
図中、（２） 、 （３）は上型チェイスブロック、（
４） 、 （５）は下型チェイスブロック、（９）は支
柱、 （１０は液体容器本体、αＱは液体である。
なお、図中同一符号は同−又は相当部分を示す。FIG. 1 is a sectional view showing an embodiment of the present invention, and FIG. 2 is a sectional view of a conventional device. In the figure, (2) and (3) are upper chase blocks, (
4), (5) is the lower chase block, (9) is the support, (10 is the liquid container body, and αQ is the liquid. In addition, the same reference numerals in the figures indicate the same or equivalent parts.
Claims (1)
より封止成形する半導体装置の樹脂封止装置において、
多数個の下型チエイスブロツク、この下型チエイスブロ
ツクと対向する多数個の上型チエイスブロツク、上記多
数個の下型チエイスブロツクを個別に支持する多数の支
柱、及びこの多数の支柱を共通的に支持する液体を収納
した支持台を備えた半導体装置の樹脂封止装置。In a resin sealing device for a semiconductor device, which seals and molds a semiconductor device with synthetic resin after mounting the semiconductor element on a lead frame,
A large number of lower type chase blocks, a number of upper type chase blocks facing the lower type chase blocks, a number of supports that individually support the multiple lower type chase blocks, and this number of supports. A resin sealing device for semiconductor devices, which includes a support stand containing a liquid that commonly supports the semiconductor devices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29370286A JPS63146441A (en) | 1986-12-10 | 1986-12-10 | Resin sealing apparatus for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29370286A JPS63146441A (en) | 1986-12-10 | 1986-12-10 | Resin sealing apparatus for semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63146441A true JPS63146441A (en) | 1988-06-18 |
Family
ID=17798130
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29370286A Pending JPS63146441A (en) | 1986-12-10 | 1986-12-10 | Resin sealing apparatus for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63146441A (en) |
-
1986
- 1986-12-10 JP JP29370286A patent/JPS63146441A/en active Pending
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