JPS63143852A - Semiconductor device and manufacture thereof - Google Patents

Abstract

PURPOSE:To obtain a resin packaged type PGA semiconductor device using transfer molding, whose manufacturing process is simplified, by inserting lead pins having thick parts, and performing one transfer molding of an entire package board, on which a semiconductor chip is mounted. CONSTITUTION:A semiconductor chip 3 is mounted on a package board 1, in which lead pins 2 are inserted. Each electrode of the semiconductor chip and wiring 4 of the package board are connected with a wire 5. The entire package board is packaged with a resin 14. A part of the pin 2 is formed thickly, and a thick part 2a is formed. The thick part 2a is embedded in the resin 14, and the inflow of the resin into a hole 15 of molding die 16 is prevented. Since the entire package board, on which the semiconductor chip is mounted, is packaged with the resin by transfer molding, the reliability, which is equivalnet to that of a conventional resin packaged dual-in-line package semiconductor device can be secured.

Description

Detailed Description of the Invention (Field of Industrial Application) The present invention relates to a pin grid array (PGA) semiconductor device in which AKTI lead pins are arranged in multiple rows, and in which the entire package substrate is fabricated by transfer molding. This invention relates to a resin-sealed PGA bulldozer device and a manufacturing method thereof.

(Prior Art and Problems Solved by the Invention) The structure of a conventional resin-sealed PGA headlight body is shown in FIG. A plurality of lead pins 2 protruding perpendicularly to the bottom surface of the substrate 1 (2) are arranged in multiple rows. In this semiconductor device.

On the package substrate L, there are placed a 3-piece nap 3, a wire 5 for connecting the cap of the cow-shaped nap to the board wiring 4, and a box made of epoxy or silicon. The coating resin 6 maintains the roughness of the workpiece V1 against the surrounding environment. This craft package gm
When U and W resin sealing is performed using Evosen series botting resin, the reliability is inferior to that of a semiconductor device of a dual in-line package, which has a proven track record of transfer molding and failure. Also, sealed? # When using silicone-based bodding resin, the focus is on semiconductor chips that have the same or higher 1g reliability compared to semiconductor devices in dual in-line packages. However, from the perspective of the entire package including the package substrate 1, the moisture resistance, especially the moisture resistance, is poor.

FIG. 7 shows another structure of the conventional resin-blocking PGA''P body device. In the structure of this semiconductor device, at
Reliability against the surrounding environment is ensured by sealing one side and side surfaces of the package substrate l including the semiconductor nap 3 with a transfer molded resin 7 instead of the botting resin 6 in Figure L6. Therefore, this semiconductor device has improved reliability compared to the semiconductor device shown in FIG. 6, but since one side of the package substrate is exposed, the dual in-line package is In addition, the semiconductor device shown in FIG.
In manufacturing, the semiconductor chip is placed under the package substrate.
4I11, that is, it cannot be mounted on the side where the lead pin protrudes.

Furthermore, in Japanese Patent Application Laid-Open No. 60-227457,
A single-resin PGA semiconductor device having the structure shown in Figure 8 has been disclosed. In this semiconductor device, the semiconductor chip 3 is F-molded in one transfer mold, the semiconductor nap 3 is mounted on the 7111 resin package housing 8, the heat sink 9 is bonded to the ultrasonic bath layer, and the semiconductor chip 3 is bonded with a bonding agent.
After connecting the wire 5 with the lead frame 10 of the package housing 8, the plastic cover 11 is joined to the package housing 8 on the ultrasonic V#IN. In the structure of this semiconductor device, what is obtained in one transfer molding process is a package housing 8, which is one part of the semiconductor device, a heat sink 9 on which a 3-ft semiconductor chip is mounted, and a plastic cover. In order to obtain a pin arrangement of three or more rows in the structure of this semiconductor device, the teeth.

Requires two or more transfer molding steps. Therefore, in the structure of this semiconductor device, the manufacturing process is more complicated than that of a semiconductor device, in which the U and ILgl transfer molds are used to mold the cage housing, and the semiconductor chip is also sealed with resin at the same time. become. In addition, in structure 2 of this semiconductor device, when performing transfer molding, the part of the lead pin at the end of the lead frame 10 is inserted into the hole of the molding die without a gap. The reason why this is not done is that resin flows through this gap during transfer molding.
This is to prevent resin from forming around the lead pin. However, in order to easily insert the pin portion of the lead frame into the hole of the mold, a gap is required between the pin portion and the hole of the mold. Due to this reduction, resin flows into this gap during transfer molding and forms a layer around the pin. It is very difficult to remove this layer of fallen fat in subsequent steps.

Specifically, Japanese Patent Application Laid-Open No. 150254/1983 discloses a resin-sealed PGA semiconductor device having the structure shown in FIG. When this semiconductor device is directly removed, the lead frame 12.
After sealing a part of the lead frame 13 and the semiconductor chip 3 with resin, make nine small holes in the lead frame 13 in the outer row, bend the lead frame 12 in the inner row downward with a 2-ft punch, and then ! Machining the second transfer mold 'The small hole used for bending the inner row lead frame 12 and the IA9 part of the inner row lead frame 12 and the outer row lead frame 13 are filled with lubricant, and finally the outer row lead frame 12 is bent. A manufacturing method is adopted in which the row lead frames 13' are bent downward. This semiconductor device requires multiple transfer molding steps to form multiple rows of pins, which increases the manufacturing process.゛Furthermore, when performing the 8g second transfer molding among the multiple transfer molding steps, there are pin rows that are already bent downward as well as pin rows extending in the water direction. In order to carry out transfer molding including the row of pins bent in the F direction, it is necessary to form the pins and the molding die in a dense layer with no gaps in the above-mentioned process. During transfer molding, the resin flows through the gap and forms a layer of resin around the pin.
2: Ya meeting, this part of the resin must be removed. However, in the manufacturing method of this resin-sealed PGA#-body device, the pin bent downward and the molding die are closely layered, and when the resin is layered around the pin, the resin migration occurs. The method of removal was not disclosed. Furthermore, when this semiconductor device is installed horizontally, multiple rows of lead frames meet each other through thin insulation, so
There is a drawback that the crosstalk of Toki No. 100 increases.

In addition to the above-mentioned resin-sealed PGA, ceramic-type PGAs are also available. However, the ceramic type PGA requires many manufacturing steps and has the drawback that the unit price of the primary PGA is higher than that of the resin-sealed type PGA.

(Object of the invention) The invention is proposed to overcome the above drawbacks.
The purpose of the present invention is to provide a resin-sealed PGA cow body device by transfer molding that improves reliability and simplifies #i construction, and its manufacturing method.

(Step + for solving the problem) In order to achieve the above object, a semiconductor device f according to the present invention is provided with a semiconductor device f in which a lead pin having at least one bulge is inserted in the vertical direction by cutting in the axial direction. The method for manufacturing a semiconductor device according to the present invention is characterized in that the entire package substrate on which is mounted is embossed with resin in one transfer molding process. a step of arranging lead pins having one or more bulges on a perforated metal plate; a step of implanting the arranged pins into a cage board; connecting the pins to wiring of a package board; and a step of connecting the pins to the wiring of the package board. The process of mounting a semi-integrated chip on the semiconductor chip and electrically connecting each electrode of the semiconductor chip to the wiring of the package substrate, the process of holding the pins in close contact with the molding die of the transfer mold, and the process of transferring The method is characterized by a step of sealing the entire F-package board in a mold with a resin IJ.

Next, 51 of the present invention! An example will be explained. It goes without saying that, just as an example, we may make some unfavorable changes or improvements without departing from the principles of the present invention.

FIG. 1<&), (b) shows a #tlr side view and a diagram of a semiconductor device according to one embodiment of the present invention. In this semiconductor device, lead pins 2 are inserted, and then the semiconductor step 3 is mounted, each X pole of this semiconductor chip and the wiring 4 of the package board are connected to the wire 5.
connected with. The entire package board is made of resin 14.
However, the bulge 2a of the pin is embedded in the resin 14. A part of pin 2 is shown in Figure 2 (
The bulge of this pin is formed thickly into the shape shown in a) to d) and has a bulge 2a.
As will be described later, this semiconductor device 1 is effective in preventing resin from flowing into the holes of the molding die when transfer molding is performed in the manufacturing process of PGA semiconductor devices.
The duck pins are arranged in multiple rows and are compatible with conventional GA#-conductor devices and can be used in the same devices as conventional PGA. Equipped with tm & half fathom half cup n'
Since the entire fI-package substrate is sealed with resin by transfer molding, it is possible to maintain reliability equivalent to that of a conventional resin-sealed dual in-line package semiconductor device.

Next, a method for manufacturing a semiconductor device according to the present invention will be explained based on FIGS. Prepare and insert the pin 2 into this hole 15.

If the pin shape is 41 cti above the metal plate 16 and the lower part of the bulge is half-sided, the hole to be drilled in this metal plate is as shown in Figure 3 (a) or (b). (
Form into the L-shape of a). In addition, when the shape of the pin is tapered at the lower part of the bulge as shown in FIG. 2(c) or (d), the metal plate 16 also has a taper as shown in FIG. 3(b). 0 This L forms a hole with
By arranging the pins on the metal plate in advance before inserting the pins into the holes in the package substrate, the heights of the F portions of the pin bulges can be made uniform. Therefore, in the subsequent amoled phase of the transformer 7, the tightness between the molding die and the lower part of the bulge of the pin can be maintained. Next, as shown in FIG. 4, holes 17 are drilled corresponding to the positions of the pins 2 arranged on the metal plate 16 as described above.
Prepare the package board 1, insert it into the hole 17e pin 2, and place the package substrate 1 above the bulge part 2a of the pin 2. and.

The pin 2 and the wiring 4 on the package board 1 are joined together by means such as soldering to ensure electrical connection between the pin 2 and the wiring 4 on the package board, and also to connect the wiring 4 on the package board 1. Also ensure mechanical connection between the pin and the pin. In that case, the metal plate 16L is taken out of the package board with the screws that has been passed in this way, the semiconductor chip 3 is mounted on the package board 1, and the wiring between each electrode of the "P" rod chip and the package board 1 is taken out. The process of sealing the entire package board in this manner into a transfer mold with plastic resin is explained below. First, connect the pins 2 of the package board 1 to
is inserted into the hole 19 of the transfer molding mold fi18. This hole 19 is formed with a large external dimension at the bottom of the pin so that the pin 2 can be inserted easily. Next, the portion of the pin 20 that protrudes downward through the hole 19 t-4 of the molding die 18 is held by a mechanical chuck or a magnet, thereby connecting the lower part of the bulging portion of the pin 2 and the molding die. v!
At the same time, one package substrate is fixed inside the mold. +JA In addition to holding the pins with a mechanical chuck, the lower part of the flange part of some of the pins in the multiple rows is usually machined to be long, and only these long pins are held with the mechanical chuck. Even if it is difficult. This long pin will be cut to regular length in a later step. When holding a pin with a magnet, it goes without saying that the material for the pin should be one that attracts the magnet.

Then, match the upper gold u20 and the lower gold fi18 and a! ! When the fat is poured into the mold and resin molding is performed, the semiconductor device shown in Figure 1(a) is produced! ! ! ! Furthermore, if it is public safety to form a standoff pin, insert a strip made of gold or resin into the pin of the PGA semiconductor device on which transformer 7 has been amolded, and solder 7' ( Therefore, according to this manufacturing method, the entire package board is sealed with resin and a PGA semiconductor device with a structure of 7' is made.
M-manufacturing can be performed by one transfer molding. In addition, since the lower part of the bulge provided on a part of the pin and the mold are in close contact with each other, when transfer molding is performed, resin can be prevented from flowing into the pin insertion hole of the mold. Since there is no layer of resin around the pin, the process of removing excess resin around the pin can be omitted.

In the above embodiments, in addition to an ordinary L-shaped printed wiring board such as a glass epoxy substrate, a thin L-shaped substrate such as a flexible substrate may be used as the package substrate.

When using a flexible board as a package board, it is important to avoid bending the part where the conductor is mounted.

The part of the circuit board of the Gyuhintaip Gochi part is reinforced with a plastic material or a metal plate.

(Effects of the invention) According to the company, the grip sealing type dual in-line has a proven reliability in sealing the entire package substrate on which a semiconductor chip is mounted with resin using transfer molding. iM lI equivalent to type packaged conductor device
A property can be ensured. The back passage method of the present invention is
For example, it is possible to fabricate a PGA semiconductor device by sealing the entire n-th package board with a semiconductor chip mounted with resin on one transfer molding machine, and removing excess resin around the pins during transfer molding. Since layer buildup can be prevented, the manufacturing process is simplified, and a resin-sealed PGA semiconductor device can be obtained that is inexpensive in ceramic PGA processing.

[Brief explanation of the drawing]

No. 1 (aJ, (b) is a top view of a resin-sealed PGA semiconductor device according to an embodiment of the present invention; a cross-sectional view of perforated metal plates and lead pins for arranging them; %ag4) Figure 5 is a cross-sectional view of a package substrate with n-order dowels arranged on a perforated metal plate, and Fig. 5 shows a cross-sectional view of a package substrate with n-order pins arranged on a perforated metal plate. 6 to 9 are cross-sectional views showing the state before the process is carried out, and FIGS. ... Lead pin 3 ... Semiconductor tip 4 ... Board wiring 5 ... Wire 6 ... Botting resin 7 ... Resin by transfer molding 8...
... Resin pack - Gino 1 Uzing 9 ... Heat sink lO ... Lead frame 11 ... Plastic cover 12 ... Inner row lead frame 13. ...
... Lead frame 14 in the outer row ... Resin 15 by transfer molding ... Hole 16 ... Metal plate 17 ... Hole 18 ... Lower side of the mold 19... Hole drilling... Upper mold of the mold Patent applicant Nippon Telegraph 11 Tsume Co., Ltd. Agent Patent attorney Toshio Takayama Haka1 Name Figure 5 1312 1Z lj Procedure Ne...Author (self-motivated) February 2, 1986

Claims (2)

[Claims] (1) A package substrate formed by a pin having at least one bulge in a direction perpendicular to the axial direction, the bottom surface of which is in contact with the top surface of the bulge;
A semiconductor device characterized in that a semiconductor chip mounted on the package substrate is sealed with a resin. (2) A step of arranging lead pins having at least one bulge in a direction perpendicular to the axial direction on a perforated metal plate, and implanting the arranged lead pins into a package substrate, and combining the lead pins with the package. a step of connecting the wiring of the substrate; a step of mounting a semiconductor chip on the package substrate; a step of electrically connecting each electrode of the semiconductor chip to the wiring of the package substrate; and molding the lead pins for transfer molding. A method for manufacturing a semiconductor device, comprising: a step of closely holding the package substrate in a mold; and a step of sealing the entire package substrate with a resin by one transfer molding.