JPS63133655A - Lead frame - Google Patents
Lead frameInfo
- Publication number
- JPS63133655A JPS63133655A JP28241786A JP28241786A JPS63133655A JP S63133655 A JPS63133655 A JP S63133655A JP 28241786 A JP28241786 A JP 28241786A JP 28241786 A JP28241786 A JP 28241786A JP S63133655 A JPS63133655 A JP S63133655A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- outer frame
- molded object
- molded body
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims abstract description 38
- 229920005989 resin Polymers 0.000 claims abstract description 38
- 238000000465 moulding Methods 0.000 abstract description 8
- 238000000034 method Methods 0.000 abstract description 3
- 239000000463 material Substances 0.000 abstract 2
- 239000004065 semiconductor Substances 0.000 description 4
- 238000007789 sealing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 230000008733 trauma Effects 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、主に樹脂封止型電子部品に利用することので
きるリードフレームに関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a lead frame that can be mainly used for resin-sealed electronic components.
従来の技術
たとえば、半導体集梼回路装置のように、複数の外部電
極端子を有する樹脂封圧型電子部品では、半導体チップ
を載置した内部支持構体とリードフレームの外枠部とを
連結するフィッシュテールが用いられていた。Conventional technology For example, in a resin-sealed electronic component having multiple external electrode terminals, such as a semiconductor integrated circuit device, a fishtail is used to connect an internal support structure on which a semiconductor chip is mounted and an outer frame portion of a lead frame. was used.
発明が解決しようとする問題点
しかしながら、上述の従来例では、内部支持構体とフィ
ッシュテールとが樹脂成形される時、同時に空気を樹脂
成形内に残留させ、空気の巣を存在させ、樹脂成形体に
樹脂の隆起や陥没を発生させるため、耐湿性低下や特性
不良および、外観不良などの問題点がある。Problems to be Solved by the Invention However, in the above-mentioned conventional example, when the internal support structure and the fishtail are resin-molded, air is allowed to remain in the resin molding at the same time, creating an air void and causing the resin molding to deteriorate. This causes bumps and depressions in the resin, resulting in problems such as reduced moisture resistance, poor properties, and poor appearance.
問題点を解決するための手段
本発明は、これらの問題点を解消するもので要約するに
、一端が樹脂成形体内に封止されろリード部、同リード
部の他端を連結する外枠部および、前記外枠部から前記
樹脂成形体内に埋込まれる位置まで延び、同樹脂成形体
を支承し、なおかつ、同樹脂成形体の構体を良化するた
めに前記外枠部に結合した径大なフィッシュテールフィ
ンをそなえたリードフレームである。Means for Solving the Problems The present invention solves these problems.To summarize, it includes a lead part whose one end is sealed in a resin molded body, and an outer frame part which connects the other end of the lead part. and a large-diameter portion extending from the outer frame to a position embedded in the resin molding, supporting the resin molding, and coupled to the outer frame in order to improve the structure of the resin molding. It is a lead frame with a fishtail fin.
作用
内部支持構体に連結されたフィッシュテールフィンは、
樹脂成形時に流入される樹脂を撹拌し、樹脂成形体の上
方と下方に樹脂を分散させ、樹脂成形体内への空気の残
留を減少し得る。なお、外枠部から延びるフィッシュテ
ールフィンは、いずれの外部電極端子とも電気的に非接
触であり、このフィッシュテールフィンが完成電子部品
の電気的緒特性に影響をおよぼすこともない。A fishtail fin connected to a working internal support structure is
The resin flowing in during resin molding is stirred to disperse the resin above and below the resin molded object, thereby reducing the amount of air remaining in the resin molded object. The fishtail fins extending from the outer frame are not in electrical contact with any external electrode terminals, and the fishtail fins do not affect the electrical characteristics of the completed electronic component.
実施例
第１図は、本発明実施例のリードフレームとこれを用い
て形成した電子部品の半製品を示す一部破断斜視図であ
り、第２図は、その一部拡大図である。この実施例のリ
ードフレームは、リード部１を四囲の外枠部２から内側
左右に向かって多数配列した構造であり、同リード部１
の内側先端部分には、電子部品の主部、たとえば、半導
体集積回路のチップを載置し、その各電極部を各外部電
極端子、すなわち、この多数のリード部１に接続した結
線部を有し、そして、この部分を樹脂成形体３で封止し
て用いろものである。このリードフレームには、外枠部
２から樹脂成形体３に向かって延びるフィッシュテール
フィン４をそなえ、このフィッシュテールフィン４は、
支持構体に向かって、樹脂成形体３の中に埋込まれる位
置まで延長され、支持構体と共通の複数細条４ａ、４ｂ
によって支承されている。経験によると、樹脂封止型半
導体集積回路装置の場合、その樹脂封止成形体３の左右
に、このフィッシュテールフィン４が埋込まれるとき、
そのフィッシュテールフィンの形状は幅０．０５ｍｍ〜
２０．０ｍｙｎ、同深さ０ 、０５ ｍｎ＋〜１０．Ｏ
ｎｕ＋＋の範囲に設定され、なるべく、これを支承する
複数の細条４ａ、４ｂの間隔より径大にするとよく、ま
た、幅、深さ方向の幅員を順次径小な構造にすることが
好適である。電子部品としては、樹脂封止成形後に、リ
ード部１は、外枠部２から切り離すと共に、各リード部
を橋絡したタイバー５も切断して、それぞれ、単位の外
部電極端子として分離する。この段階では、樹脂成形体
３がフィッシュテールフィン４および複数細条４ａ、４
ｂによって外枠部２に支承されており、外枠部２と一体
で移送ならびに固定して取扱うことができ、外枠部２に
配設されたパイロット穴６は、そのまま、外部電極端子
の位置合せにも用いることができる。したがって、この
状態で、外部電極端子の成形を実施できる。樹脂成形体
３からフィッシュテールフィンを支承している外枠部２
を分離するには、外枠部２と結合されている複数の各細
条４ａ、４ｂを切断すればよい。第３図は、フィッシュ
テールフィン４が、上型下型に流入される樹脂に対して
影響を、およぼす過程を示す一例の断面図である。まず
、保持手段（上型。Embodiment FIG. 1 is a partially cutaway perspective view showing a lead frame according to an embodiment of the present invention and a semifinished electronic component formed using the lead frame, and FIG. 2 is a partially enlarged view thereof. The lead frame of this embodiment has a structure in which a large number of lead parts 1 are arranged from the four surrounding outer frame parts 2 toward the left and right inside.
The inner tip part has a connection part on which the main part of an electronic component, for example, a semiconductor integrated circuit chip, is placed and each electrode part is connected to each external electrode terminal, that is, the many lead parts 1. Then, this portion is sealed with a resin molded body 3 for use. This lead frame is provided with a fishtail fin 4 extending from the outer frame portion 2 toward the resin molded body 3, and this fishtail fin 4 is
A plurality of strips 4a, 4b extend toward the support structure to a position embedded in the resin molded body 3 and are common to the support structure.
is supported by. According to experience, in the case of a resin-sealed semiconductor integrated circuit device, when the fishtail fins 4 are embedded on the left and right sides of the resin-sealed molded body 3,
The shape of the fishtail fin is 0.05mm wide
20.0 myn, same depth 0, 05 mn+~10. O
It is preferable that the diameter is set in the range of nu++, and that the diameter is preferably larger than the interval between the plurality of strips 4a and 4b that support it, and that the width and the width in the depth direction are successively smaller in diameter. be. As an electronic component, after resin sealing molding, the lead part 1 is separated from the outer frame part 2, and the tie bar 5 bridging each lead part is also cut to separate each lead part as a unit external electrode terminal. At this stage, the resin molded body 3 has a fishtail fin 4 and a plurality of strips 4a, 4.
b is supported by the outer frame part 2, and can be transported and fixed together with the outer frame part 2, and the pilot hole 6 provided in the outer frame part 2 can be directly connected to the position of the external electrode terminal. It can also be used in combination. Therefore, in this state, external electrode terminals can be formed. Outer frame portion 2 supporting the fishtail fin from the resin molded body 3
In order to separate them, each of the plurality of strips 4a, 4b connected to the outer frame portion 2 may be cut. FIG. 3 is a cross-sectional view of an example showing the process in which the fishtail fins 4 influence the resin flowing into the upper and lower molds. First, the holding means (upper mold).
下型）により、外枠部２および、外枠部２に支承される
支持構体とフィッシュテールフィンが、保持された状態
で、樹脂ゲート口より樹脂の流入を受け、フィッシュテ
ールフィン４によって樹脂が上下に分散され、樹脂によ
る空気の残留を発生させないで、金型内に樹脂を充填さ
せることができる。このフィッシュテールフィン４は樹
脂成形体３の封止機能を完全に維持しており、耐湿性の
経時特性に影響をおよぼすことはない。The outer frame 2, the support structure supported by the outer frame 2, and the fishtail fin are held by the lower mold), and the resin is inflowed from the resin gate opening, and the resin is injected by the fishtail fin 4. Since the resin is dispersed vertically, it is possible to fill the mold with resin without causing any residual air due to the resin. The fishtail fins 4 completely maintain the sealing function of the resin molded body 3 and do not affect the moisture resistance over time.
発明の効果
本発明によれば、リードフレームの外枠部にフィッシュ
テールフィンを設け、このフィッシュテールフィンを樹
脂成形体内に埋込み内部支持構体と外枠部とを連結し、
樹脂成形体を完全に形成することができる。電気特性、
耐湿性、外観の良化を得ることができた。また、゛外枠
部からフィッシュテールフィンを分離する際にも、樹脂
成形体に影響を留めるような応力あるいは、外傷を発生
することもないので、本発明は、電子部品の品質、性能
の維持向上に有益である。Effects of the Invention According to the present invention, a fishtail fin is provided on the outer frame portion of a lead frame, and the fishtail fin is embedded in a resin molded body to connect the internal support structure and the outer frame portion,
A resin molded body can be completely formed. electrical properties,
Improved moisture resistance and appearance were achieved. Furthermore, even when separating the fishtail fin from the outer frame, there is no stress or trauma that would affect the resin molded body, so the present invention maintains the quality and performance of electronic components. It is beneficial for improvement.
第１図は本発明実施例の概要を表わす電子部品（半製品
）の一部破断斜視図、第２図はその一部拡大図、第３図
は上型下型に流入される樹脂がフィッシュテールフィン
によって引き起こされる状態の予想断面図である。
１・・・・・・（リードフレームの）リード部、２・・
・・・・同外枠部、３・・・・・・樹脂成形体、４・・
・・・・フィッシュテールフィン、４ａ、４ｂ・・・・
・・細条、５・・・・・・タイバー、６・・・・・・パ
イロット穴。
代理人の氏名 弁理士 中尾敏男 ほか１名ｆ −リ￥
−％５
２− 科を酔FIG. 1 is a partially cutaway perspective view of an electronic component (semi-finished product) showing an outline of an embodiment of the present invention, FIG. FIG. 5 is a prospective cross-sectional view of the condition caused by the tail fin. 1...Lead part (of lead frame), 2...
...Same outer frame portion, 3...Resin molded body, 4...
...Fishtail fin, 4a, 4b...
...Stripes, 5...Tie bars, 6...Pilot holes. Name of agent: Patent attorney Toshio Nakao and 1 other person
-%5 2- Drunk the department
Claims (2)
ード部の他端を連結する外枠部および前記外枠部から前
記樹脂成形体内に埋込まれる位置まで延び、同樹脂成形
体を支承し、なおかつ、同樹脂成形体の形状を良化する
ために前記外枠部に結合した径大なフィッシュテールフ
ィンをそなえたリードフレーム。(1) A lead portion whose one end is sealed within the resin molded body, an outer frame portion that connects the other end of the lead portion, and an outer frame portion that extends from the outer frame portion to a position embedded in the resin molded body, and the resin molded body A lead frame that supports the resin molded body and is provided with a large-diameter fishtail fin connected to the outer frame portion in order to improve the shape of the resin molded body.
５ｍｍ〜１０．０ｍｍの範囲に設定された特許請求の範
囲第（１）項記載のリードフレーム。(2) The depth at which the embedded part is embedded into the resin molded body is 0.0
The lead frame according to claim (1), wherein the lead frame is set in a range of 5 mm to 10.0 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28241786A JPS63133655A (en) | 1986-11-26 | 1986-11-26 | Lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28241786A JPS63133655A (en) | 1986-11-26 | 1986-11-26 | Lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63133655A true JPS63133655A (en) | 1988-06-06 |
Family
ID=17652138
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28241786A Pending JPS63133655A (en) | 1986-11-26 | 1986-11-26 | Lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63133655A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0782184A1 (en) * | 1995-12-29 | 1997-07-02 | STMicroelectronics S.r.l. | Heat dissipating and supporting structure for a package |
| US5793613A (en) * | 1995-12-29 | 1998-08-11 | Sgs-Thomson Microelectronics S.R.1. | Heat-dissipating and supporting structure for a plastic package with a fully insulated heat sink for an electronic device |
-
1986
- 1986-11-26 JP JP28241786A patent/JPS63133655A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0782184A1 (en) * | 1995-12-29 | 1997-07-02 | STMicroelectronics S.r.l. | Heat dissipating and supporting structure for a package |
| US5793613A (en) * | 1995-12-29 | 1998-08-11 | Sgs-Thomson Microelectronics S.R.1. | Heat-dissipating and supporting structure for a plastic package with a fully insulated heat sink for an electronic device |
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