JPS63127144U - - Google Patents
Info
- Publication number
- JPS63127144U JPS63127144U JP1771587U JP1771587U JPS63127144U JP S63127144 U JPS63127144 U JP S63127144U JP 1771587 U JP1771587 U JP 1771587U JP 1771587 U JP1771587 U JP 1771587U JP S63127144 U JPS63127144 U JP S63127144U
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- lsi
- cooling water
- compressor
- heating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 5
- 239000000498 cooling water Substances 0.000 claims description 4
- 239000003507 refrigerant Substances 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims 2
- 239000012530 fluid Substances 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Description
第１図は、本考案の一実施例を示す冷却系統図
、第２図は、本考案の他の実施例を示す冷却系統
図である。
１……室内空調機、２……室内空気、３……Ｌ
ＳＩ、４……ＬＳＩの冷却水流路、５……ポンプ
、６……加熱用ヒータ、７……冷媒流路、８……
熱交換器、９……圧縮機、１０……熱交換器、１
１……膨脹弁、１２……温度センサー、１３……
インバータ。
FIG. 1 is a cooling system diagram showing one embodiment of the present invention, and FIG. 2 is a cooling system diagram showing another embodiment of the invention. 1...Indoor air conditioner, 2...Indoor air, 3...L
SI, 4... LSI cooling water flow path, 5... Pump, 6... Heater, 7... Refrigerant flow path, 8...
Heat exchanger, 9... Compressor, 10... Heat exchanger, 1
1... Expansion valve, 12... Temperature sensor, 13...
inverter.
Claims (1)
外部流体との熱交換を行う熱交換器と膨脹弁とか
ら成る冷却装置において、前記冷却装置に接続さ
れているＬＳＩの冷却水流路に加熱用ヒータ及び
温度センサーを設け、ＬＳＩの冷却水の加熱、冷
却量を調節することによる水温制御を可能にした
ことを特徴とするＬＳＩの冷却水供給装置。 In a cooling device that includes a compressor, an inverter that controls the compressor, a heat exchanger that exchanges heat between a refrigerant and an external fluid, and an expansion valve, a heating heater is installed in a cooling water flow path of an LSI connected to the cooling device. 1. A cooling water supply device for an LSI, characterized in that it is provided with a temperature sensor and can control the water temperature by adjusting the amount of heating and cooling of the cooling water for the LSI.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1771587U JPS63127144U (en) | 1987-02-12 | 1987-02-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1771587U JPS63127144U (en) | 1987-02-12 | 1987-02-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63127144U true JPS63127144U (en) | 1988-08-19 |
Family
ID=30810721
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1771587U Pending JPS63127144U (en) | 1987-02-12 | 1987-02-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63127144U (en) |
-
1987
- 1987-02-12 JP JP1771587U patent/JPS63127144U/ja active Pending
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