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JPS63126718A - Monitoring method for injection molder - Google Patents

Monitoring method for injection molder

Info

Publication number
JPS63126718A
JPS63126718A JP27473286A JP27473286A JPS63126718A JP S63126718 A JPS63126718 A JP S63126718A JP 27473286 A JP27473286 A JP 27473286A JP 27473286 A JP27473286 A JP 27473286A JP S63126718 A JPS63126718 A JP S63126718A
Authority
JP
Japan
Prior art keywords
level
darkest
image
brightness level
luminance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP27473286A
Other languages
Japanese (ja)
Other versions
JPH0411805B2 (en
Inventor
Hiroshi Shimizu
清水 洽
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissei Plastic Industrial Co Ltd
Original Assignee
Nissei Plastic Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissei Plastic Industrial Co Ltd filed Critical Nissei Plastic Industrial Co Ltd
Priority to JP27473286A priority Critical patent/JPS63126718A/en
Publication of JPS63126718A publication Critical patent/JPS63126718A/en
Publication of JPH0411805B2 publication Critical patent/JPH0411805B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/84Safety devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

PURPOSE:To monitor always under stabilized conditions by stopping molding halfway automatically when brightness is varied much, and modifying binary coded level basing on the comparison of the darkest luminance when brightness is varied a little. CONSTITUTION:The darkest luminance level in the whole picture elements of a printed image of a mold, sensed by a CCD camera 10, is sensed by a control circuit 14, and when the same is out of the tolerance limits of the level preset by a level-upper limit setting device 20 for the darkest luminance and a level lower-limit setting device 22 for the darkest luminance, an instruction is issued to a molder controller 46 to stop injection molding. When the darkest luminance level is within the tolerance limits, the level difference value between said darkest luminance and the darkest luminance level in the hole picture elements of the normal printed image stored in a reference memory 18a beforehand is operated, the binary coded luminance level preset in a binary coded level setting device 36 is modified and the sensed printed image is binary coded by a binary coded difference sensing circuit 30.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は射出成形機の監視方法に関する。[Detailed description of the invention] (Industrial application field) The present invention relates to a method for monitoring an injection molding machine.

(従来の技術) 射出成形の工程中に、金型内に成形品もしくはその一部
を残したままで型締めを行うと、金型を破損したり、成
形品が不良となったりする。
(Prior Art) During the injection molding process, if the mold is clamped with the molded product or part of it left in the mold, the mold may be damaged or the molded product may be defective.

これを防止するため、従来はテレビカメラを用いて成゛
形金型の状況を画像としてとらえ、予め記憶しておいた
基準画像との輝度レベルの比較により金型内の成形品等
の有無を検出する監視方法が行われている。
In order to prevent this, conventional methods used a television camera to capture images of the condition of the mold, and by comparing the brightness level with a reference image stored in advance, the presence or absence of molded products inside the mold was determined. A monitoring method is in place to detect.

(発明が解決しようとする問題点) しかしながら上記の従来の監視方法には次のような問題
点が有る。
(Problems to be Solved by the Invention) However, the above conventional monitoring method has the following problems.

検出画像と基準画像との間の輝度の比較により異常検出
を行うので、成形機周辺の明るさが変化した場合、例え
ば電灯のON、OFF、直射日光を受けて光った場合、
あるいは成形機の上方をクレーンが通過する際等には輝
度レベルが変化してしまうため、正常状態であるのに異
常と判断されたり、異常状態であるにもかかわらず正常
と判断され実質的に判断が不能となってしまう問題が有
り、その結果成形不良の製品の山を作ったり、離型不良
から金型を破損してしまうという問題を有していた。
Abnormalities are detected by comparing the brightness between the detection image and the reference image, so if the brightness around the molding machine changes, for example if a light is turned on or off, or if it shines due to direct sunlight,
Alternatively, when a crane passes over the molding machine, the brightness level changes, so it may be judged as abnormal even though it is in a normal state, or it may be judged as normal even though it is in an abnormal state, and the brightness level may change. There is a problem in that it becomes impossible to make a judgment, and as a result, there is a problem in that a pile of defective molded products is created and the mold is damaged due to defective mold release.

(問題点を解決するための手段) 上記問題点を解決するため、本発明は次の構成を備える
(Means for Solving the Problems) In order to solve the above problems, the present invention has the following configuration.

すなわち、成形金型の画像を画素単位に分割し、各画素
単位毎の輝度レベルを検出し、予め設定された2値化輝
度レベルを基準に画像を白と黒に2値化し、予め記憶し
ておいた正常状態の2値化画像との比較により行う射出
成形機の監視方法において、検出画像の全画素中の最暗
輝度レベルを検出し、該最暗輝度レベルが予め設定され
た許容最暗輝度レベルの範囲外の場合は射出成形作業を
中止し、前記検出画像の全画素中の最暗輝度レベルが予
め設定された許容最暗輝度レベルの範囲内であった場合
には、予め記憶されている正常状態の画像の全画素中の
最暗輝度レベルと、前記検出画像の最暗輝度レベルとを
比較し、そのレベル差値が許容値以上であれば、前記予
め設定された2値化輝度レベルを前記レベル差値に応じ
て上下補正して前記検出画像の2値化を行うことを特徴
とする。
That is, the image of the molding die is divided into pixel units, the brightness level of each pixel unit is detected, the image is binarized into white and black based on a preset binarization brightness level, and the image is stored in advance. In a method for monitoring an injection molding machine by comparing it with a binarized image of the normal state that has been stored, the darkest brightness level of all pixels in the detected image is detected, and the darkest brightness level is set as the preset allowable maximum level. If the dark brightness level is outside the range of the dark brightness level, the injection molding operation is stopped, and if the darkest brightness level of all pixels in the detected image is within the range of the preset allowable darkest brightness level, the injection molding operation is stored in advance. The darkest brightness level among all pixels of the image in the normal state that has been detected is compared with the darkest brightness level of the detected image, and if the level difference value is greater than or equal to the allowable value, the preset binary value is The detected image is binarized by vertically correcting the converted luminance level according to the level difference value.

(作用) 作用を図面と共に説明する。(effect) The operation will be explained with reference to the drawings.

第1図において、CCDカメラlOによって検出された
画像は、CPU34により制御されるコントロール回路
14によって全画素中の最暗輝度レベルが検出され、最
暗輝度レベル上限設定器2゜と最暗輝度レベル下限設定
器22とに予め設定されたレベルの許容範囲内に、検出
された画像の全画素中の最暗輝度レベルが無い時は、C
PU34が成形器コントローラ46に指令を送り、射出
成形作業を中止させる。
In FIG. 1, the control circuit 14 controlled by the CPU 34 detects the darkest brightness level of all pixels in the image detected by the CCD camera lO, and the darkest brightness level upper limit setter 2° and the darkest brightness level When the darkest luminance level of all the pixels of the detected image is not within the tolerance range of the level set in advance in the lower limit setter 22, C
The PU 34 sends a command to the molding machine controller 46 to stop the injection molding operation.

検出された画像の全画素中の最暗輝度レベルが前記許容
範囲内に有る場合は、CPU34がその最暗輝度レベル
と、基準メモリ18aに予め記憶されている正常状態の
画像の全画素中の最暗輝度レベルとの差であるレベル差
値を演算し、該レベル差値で予め2値化レベル設定器3
6に設定しておいた2値化輝度レベルを補正し、検出さ
れた画像を2値化・差分検出回路30で2値化する。
If the darkest brightness level among all pixels of the detected image is within the above-mentioned allowable range, the CPU 34 uses the darkest brightness level and the darkest brightness level among all pixels of the normal state image stored in advance in the reference memory 18a. A level difference value which is the difference from the darkest luminance level is calculated, and the binarization level setter 3 is set in advance using the level difference value.
The binarization brightness level set to 6 is corrected, and the detected image is binarized by the binarization/difference detection circuit 30.

(実施例) 以下、本発明の好適な実施例について別添付図面と共に
説明する。
(Embodiments) Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

まず第1図と共に本発明に係る監視方法に用いる監視装
置の構成について説明する。
First, the configuration of a monitoring device used in the monitoring method according to the present invention will be explained with reference to FIG.

10はCCDカメラであり、固定イメージ素子(CCD
)を使用したテレビカメラで、A/Dコンバータ12を
介してコントロール回路14と接続されている。
10 is a CCD camera, which has a fixed image element (CCD
) is connected to a control circuit 14 via an A/D converter 12.

またCCDカメラ10とコントロール回路14は同期回
路16ととも接続さている。
Further, the CCD camera 10 and the control circuit 14 are also connected to a synchronization circuit 16.

コントロール回路14は基準画像の各画素を16階調の
輝度レベルに分けて記憶する基準メモリ18a118b
、18c、18d、最暗輝度レベル上限設定器20、最
暗輝度レベル下限設定器22及びティーチング指示スイ
ッチ24と接続されると共に、D/Aコンバータ26を
介してCRT28に接続され、更に2値化・差分検出回
路30、カウンター回路32を介してCPU34に接続
されている。
The control circuit 14 includes a reference memory 18a118b that stores each pixel of the reference image divided into 16 gradation brightness levels.
, 18c, 18d are connected to the darkest brightness level upper limit setter 20, the darkest brightness level lower limit setter 22, and the teaching instruction switch 24, and are also connected to the CRT 28 via the D/A converter 26, and are further binarized. - Connected to the CPU 34 via the difference detection circuit 30 and counter circuit 32.

2値化・差分検出回路30はD/Aコンバータ26.2
値化レベル設定器36とも接続されている。
The binarization/difference detection circuit 30 is a D/A converter 26.2
It is also connected to a value level setter 36.

CPU34は、形状面積切換器38、形状許容幅設定器
40、面積許容幅設定器42と接続される一方、インタ
ーフェイス44を介して成形機コントローラ46へ接続
されている。
The CPU 34 is connected to a shape/area switch 38 , a shape allowable width setter 40 , and an area allowable width setter 42 , and is also connected to a molding machine controller 46 via an interface 44 .

次に前述の監視装置の使用方法及び動作について説明す
る。
Next, the usage and operation of the above-mentioned monitoring device will be explained.

なお本実施例では、画素数は48960個で、輝度レベ
ルは1〜16の16階調に設定されている。
In this embodiment, the number of pixels is 48,960, and the brightness level is set to 16 gradations from 1 to 16.

まず通常と同様に成形条件出しを行い、良品成形のでき
る条件が設定されたら、成形品を成形金型に付着させた
まま型開停止位置で型開停止させ、成形品を確実にモニ
ターできるようにCCDカメラlOの位置、フォーカス
、絞り、照明位置をCRT28の画面を見ながら調整す
る。その際、成形品の成形不良となり易い場所を重点的
にモニターすると効率が良い。
First, set the molding conditions as usual, and once the conditions for molding a good product are set, open and stop the mold at the mold opening stop position with the molded product attached to the mold, so that you can reliably monitor the molded product. Then, adjust the position, focus, aperture, and illumination position of the CCD camera 10 while looking at the CRT 28 screen. At this time, it is efficient to focus on monitoring areas where molding defects are likely to occur in the molded product.

次にティーチング指示スイッチ24を入れる。Next, the teaching instruction switch 24 is turned on.

するとCCDカメラ10からの画像情報はA/Dコンバ
ータ12でA/D変換され、各画素毎に輝度レベルが付
されて基準メモリ18aに記憶され、2値化差分検出回
路30で、予め設定しておいた輝度レベル「7」を境に
2値化され、正常状態の基準2値化画像としてCPU3
4に記憶される。
Then, the image information from the CCD camera 10 is A/D converted by the A/D converter 12, a brightness level is assigned to each pixel and stored in the reference memory 18a, and the binarization difference detection circuit 30 sets the brightness level in advance. It is binarized at the brightness level "7" that was set as the boundary, and the CPU 3 uses it as a reference binarized image of the normal state.
4 is stored.

また一方カウンター回路工4により黒い画素数がカウン
トされ、その数は基準カウント数としてCPU34に記
憶される。
On the other hand, the number of black pixels is counted by the counter circuit 4, and the number is stored in the CPU 34 as a reference count number.

次に成形品の突出作業を行い、成形品を離型させ、成形
品が取り出された後の型の画像を同様に基準メモリー1
8bに記憶し、その画像を同様に2値化処理してCPU
34に記憶し、その黒い画素数もカウントされ、CPU
34に記憶される。
Next, the molded product is ejected, the molded product is released from the mold, and the image of the mold after the molded product is taken out is stored in the reference memory 1.
8b, and the image is similarly binarized and sent to the CPU.
34, the number of black pixels is also counted, and the CPU
34.

成形品の形状比較を行う場合について第2図と共に説明
する。
A case in which the shapes of molded products are compared will be explained with reference to FIG. 2.

なお説明の都合上、画像の画素数は36個(6×6)と
して説明する。
For convenience of explanation, the number of pixels in the image is assumed to be 36 (6×6).

第2図(a)に示すのは、正常状態の成形品が型内に有
る場合の画像で■、■、■、■は輝度レベルを示す(他
の図も同じ)。この画像は前述のとおり基準メモリ18
aに記憶されている。
FIG. 2(a) shows an image when a molded product in a normal state is in the mold, and ■, ■, ■, ■ indicate the brightness level (the same applies to the other figures). This image is stored in the reference memory 18 as described above.
It is stored in a.

(b)は(a)の画像を輝度レベルr7Jを境に2値化
した場合を示した図で、輝度レベル「7」以下の画素は
黒とされ、カウンター回路32により黒い画素数「12
」がカウントされCPU34に「12」が記憶されてい
る。
(b) is a diagram showing the case where the image in (a) is binarized with the luminance level r7J as the boundary, pixels with a luminance level of "7" or lower are treated as black, and the counter circuit 32 determines that the number of black pixels is "12".
” is counted and “12” is stored in the CPU 34.

なお基準メモリー(18b)に記憶されている画像の黒
い画素数はもちろん「0」であり、CPU34に記憶さ
れている。
Note that the number of black pixels in the image stored in the reference memory (18b) is, of course, "0" and is stored in the CPU 34.

形状面積切換装置38を形状側に切り換えた後、型閉じ
して射出充填作業を行い、冷却固化完了後に型開して型
の開き具合が型開眼位置に達すると、成形機コントロー
ラ46より型開完了信号がCPU34に送られる。
After switching the shape area switching device 38 to the shape side, the mold is closed and injection filling work is performed, and the mold is opened after cooling and solidification is completed. When the mold opening reaches the mold opening position, the molding machine controller 46 switches the mold open. A completion signal is sent to CPU 34.

するとCPU34からはコントロール回路14に信号が
送られ、コントロール回路14ではその時点でCCDカ
メラ10より送られる検出画像(第2図(C))の全画
素中の最暗輝度レベル「4」が検出され、予め最暗輝度
レベル上限設定器20に設定された輝度レベル「10」
と、予め最暗輝度レベル下限設定器22に設定された輝
度レベル「1」との間、つまり許容最暗輝度レベルの範
囲内にあるかどうか演算する。この結果、検出画像の最
暗輝度レベルが前記許容最暗輝度レベルの範囲外であれ
ば、異常信号がCPU34から成形器コントローラ46
へ送られ、成形作業が中断される。
Then, a signal is sent from the CPU 34 to the control circuit 14, and the control circuit 14 detects the darkest luminance level "4" among all the pixels in the detection image sent from the CCD camera 10 (Fig. 2 (C)) at that point. and the brightness level “10” is set in advance in the darkest brightness level upper limit setter 20.
and the brightness level "1" set in advance in the darkest brightness level lower limit setter 22, that is, it is calculated whether it is within the range of the allowable darkest brightness level. As a result, if the darkest brightness level of the detected image is outside the range of the allowable darkest brightness level, an abnormal signal is sent from the CPU 34 to the molding machine controller 46.
The molding operation is interrupted.

この場合、作業環境の光量が少な過ぎるか、強すぎてハ
レーションを起こした時なので、作業環境の光量を調整
すれば良い。
In this case, the amount of light in the work environment is either too low or too strong, causing halation, so it is best to adjust the amount of light in the work environment.

もし検出画像の最暗輝度レベルが許容最暗輝度レベルの
範囲内であれば(この例の場合、最暗輝度レベルは「4
」なので範囲内である)、基準メモリー18aに記憶さ
れた基準画像の全画素中の最暗輝度レベル「5」との差
が演算される。
If the darkest brightness level of the detected image is within the allowable darkest brightness level (in this example, the darkest brightness level is "4")
'', so it is within the range), and the difference from the darkest luminance level "5" among all pixels of the reference image stored in the reference memory 18a is calculated.

5−4=1 この得られたレベル差値「1」を、予め2値化レベル設
定器36に設定された輝度レベル「7」より減算し ?−1=6 補正された2値化輝度レベル値「6」が決定され、2値
化・差分検出回路30で検出画像の輝度レベル[6」以
下を黒、他を白として2値化を行うと検出画像の2値化
画像(第2図(d))が得られ、CPU34に記憶され
る。
5-4=1 This obtained level difference value "1" is subtracted from the brightness level "7" set in advance in the binarization level setter 36? -1=6 The corrected binarization luminance level value "6" is determined, and the binarization/difference detection circuit 30 binarizes the detected image with luminance level [6] or lower as black and the others as white. A binarized image (FIG. 2(d)) of the detected image is obtained and stored in the CPU 34.

そしてCPU34に予め記憶されていた正常状態を示し
た基準2値化画像(第2図(b))との比較が2値化・
差分検出回路30で行われ、差分画像(第2図(e))
が得られる。なおり/Aコンバータ26への入力を切り
換えるとこの差分画像もCRT28へ表示が可能となる
Then, a comparison with the reference binarized image (FIG. 2(b)) showing a normal state stored in advance in the CPU 34 is performed.
The difference detection circuit 30 generates a difference image (FIG. 2(e)).
is obtained. By switching the input to the Naori/A converter 26, this difference image can also be displayed on the CRT 28.

次に得られた差分画像はカウンター回路32へ送られ、
基準2値化画像(第2図(b))との差ビツト数(黒の
画素数の差)がカウントされ、該カウント値「2」がC
PU34に送られ、形状差異率(差ビット数/総画素数
X100  (%〕)が計算される。
Next, the obtained difference image is sent to the counter circuit 32,
The difference bit number (difference in the number of black pixels) from the reference binarized image (Fig. 2(b)) is counted, and the count value "2" is
The data is sent to the PU 34, and the shape difference rate (number of difference bits/total number of pixels x 100 (%)) is calculated.

2/36X100 =5.6  C%〕そして予め形状
許容幅設定器40に設定された許容幅(本実施例では4
%とする)と比較される。
2/36X100 = 5.6 C%] and the allowable width set in advance in the shape allowable width setting device 40 (in this example, 4
%).

この場合4%より形状差異率が大きいので形状不良が有
るという事になり、CPU34は成形機のコントローラ
46へ信号を送り作業の中断を指示する。
In this case, since the shape difference rate is greater than 4%, it is determined that there is a shape defect, and the CPU 34 sends a signal to the controller 46 of the molding machine to instruct it to interrupt the operation.

また、形状差異率が4%以下であれば、成形機は次工程
に進み、検出画像データはイニシャライズされる。
Further, if the shape difference rate is 4% or less, the molding machine advances to the next step and the detected image data is initialized.

そして突出完了信号が成形機コントローラ46より送ら
れると、基準メモリー18bに記憶された画像の2値化
画像と、突出完了後の検出画像の2値化画像との比較が
行われ、前記と同様に形状差異率が求められる。この形
状差異率が許容幅より外れた場合には成形品が完全に型
より排出されなかったという事になり、CPU34は成
形機コントローラ46に異常信号を送り作業を中断させ
る。また形状差異率が許容幅内であれば、成形品の排出
が完全に行われたとみなされ1サイクルの工程が終了す
る。
When the ejection completion signal is sent from the molding machine controller 46, the binarized image of the image stored in the reference memory 18b is compared with the binarized image of the detected image after the ejection is completed, and the same as above is performed. The shape difference rate is calculated. If this shape difference rate deviates from the allowable range, it means that the molded product has not been completely ejected from the mold, and the CPU 34 sends an abnormality signal to the molding machine controller 46 to interrupt the operation. If the shape difference rate is within the allowable range, it is assumed that the molded product has been completely discharged, and one cycle of the process ends.

上述の例は形状比較により監視する方法であったが、黒
い画素数をカウントして面積で比較する方法も採ること
が可能である。その際、形状・面積切換器は面積側に切
り換えておく。
Although the above example was a method of monitoring by comparing shapes, it is also possible to adopt a method of counting the number of black pixels and comparing by area. At that time, switch the shape/area switch to the area side.

本実施例では、2つの基準メモリー18a、18bを用
いて型開時の成形品の形状又は面積、型内の成形品の残
りの有無等の監視を行ったが、基準メモリーはどちらか
一方でも良い。
In this example, the two reference memories 18a and 18b were used to monitor the shape or area of the molded product when the mold was opened, the presence or absence of the molded product remaining in the mold, etc. good.

又、ロータリ一式成形機のように複数の型を有する場合
は、各型の工程前、工程後を基準メモリーを増設するこ
とにより監視及びインサート品の確認も可能である。
In addition, when the machine has multiple molds such as a rotary complete molding machine, it is possible to monitor and check the inserted product by adding a reference memory before and after each mold process.

更に基準画像の記憶は、被写体の輝度レベル範囲が、所
定の輝度レベル範囲内でないと行えないようにすれば、
2値化レベルの補正幅が確実に確保できて良い。
Furthermore, if the reference image can be stored only when the brightness level range of the subject is within a predetermined brightness level range,
It is good that the correction width of the binarization level can be ensured.

(発明の効果) 本発明によれば周囲の明るさが大きく変化して正常な監
視が行えなくなった時には自動的に成形を中断するので
、監視不良による成形不良の続出、金型の破損を防ぐこ
とができ、さらに経時的な小さな明るさの変化は最暗輝
度レベルの比較に基づいて2値化レベルの補正により対
応するので常に安定した条件下での監視を行うことがで
き、信頼性、安全性を大幅に、向上できる等の著効を奏
する。
(Effects of the Invention) According to the present invention, molding is automatically interrupted when the surrounding brightness changes significantly and normal monitoring cannot be performed, thereby preventing a series of molding defects due to poor monitoring and damage to the mold. Furthermore, small changes in brightness over time are handled by correcting the binarization level based on a comparison of the darkest brightness levels, so monitoring can always be performed under stable conditions, increasing reliability and It has remarkable effects such as greatly improving safety.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明に係る射出成形機の監視装置のブロック
ダイヤグラムであり、第2図は形状比較方式により監視
を行った際の画像例を示した図である。 10・・・CCDカメラ、14・・・コントロール回路
、 18a、18b、18c、18d・・・基準メモリ
、 20・・・最暗輝度レベル上限設定器、 22・・
・最暗輝度レベル下限設定器、 28・・・CRT、 
 30・・・2値化、差分検出回路、 32・・・カウ
ンタ回路、34・・・CPU、  36・・・2値化レ
ベル設定器、 40・・・形状許容幅設定器、 46・
・・成形器コントローラ。 ・ 特許出願人 日積樹脂工業株式会社 代表者 島  喜 治
FIG. 1 is a block diagram of a monitoring device for an injection molding machine according to the present invention, and FIG. 2 is a diagram showing an example of an image when monitoring is performed using a shape comparison method. 10... CCD camera, 14... Control circuit, 18a, 18b, 18c, 18d... Reference memory, 20... Darkest brightness level upper limit setter, 22...
・Darkest brightness level lower limit setter, 28...CRT,
30... Binarization, difference detection circuit, 32... Counter circuit, 34... CPU, 36... Binarization level setter, 40... Shape allowable width setter, 46.
・Former controller.・Patent applicant: Yoshiharu Shima, representative of Nisseki Jushi Kogyo Co., Ltd.

Claims (1)

【特許請求の範囲】 1、成形金型の画像を画素単位に分割し、各画素単位毎
の輝度レベルを検出し、予め設定された2値化輝度レベ
ルを基準に画像を白と黒に2値化し、予め記憶しておい
た正常状態の2値化画像との比較により行う射出成形機
の監視方法において、 検出画像の全画素中の最暗輝度レベルを検 出し、該最暗輝度レベルが予め設定された許容最暗輝度
レベルの範囲外の場合は射出成形作業を中止し、前記検
出画像の全画素中の最暗輝度レベルが予め設定された許
容最暗輝度レベルの範囲内であった場合には、予め記憶
されている正常状態の画像の全画素中の最暗輝度レベル
と、前記検出画像の最暗輝度レベルとを比較し、そのレ
ベル差値が許容値以上であれば、前記予め設定された2
値化輝度レベルを前記レベル差値に応じて上下補正して
前記検出画像の2値化を行うことを特徴とする射出成形
機の監視方法。 2、画像検出手段としてCCDカメラを用いたことを特
徴とする特許請求の範囲第1項記載の射出成形機の監視
方法。
[Claims] 1. Divide the image of the mold into pixel units, detect the brightness level of each pixel unit, and divide the image into white and black based on a preset binarized brightness level. In a method for monitoring an injection molding machine, which is performed by comparing it with a binarized image of a normal state stored in advance, the darkest brightness level among all pixels of the detected image is detected, and the darkest brightness level is If the brightness level is outside the preset allowable darkest brightness level, the injection molding operation is stopped, and the darkest brightness level among all pixels of the detected image is within the preset allowable darkest brightness level. In this case, the darkest luminance level among all pixels of a normal state image stored in advance is compared with the darkest luminance level of the detected image, and if the level difference value is equal to or greater than the allowable value, the preset 2
A method for monitoring an injection molding machine, characterized in that the detected image is binarized by vertically correcting the digitized luminance level according to the level difference value. 2. A method for monitoring an injection molding machine according to claim 1, characterized in that a CCD camera is used as the image detection means.
JP27473286A 1986-11-18 1986-11-18 Monitoring method for injection molder Granted JPS63126718A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27473286A JPS63126718A (en) 1986-11-18 1986-11-18 Monitoring method for injection molder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27473286A JPS63126718A (en) 1986-11-18 1986-11-18 Monitoring method for injection molder

Publications (2)

Publication Number Publication Date
JPS63126718A true JPS63126718A (en) 1988-05-30
JPH0411805B2 JPH0411805B2 (en) 1992-03-02

Family

ID=17545806

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27473286A Granted JPS63126718A (en) 1986-11-18 1986-11-18 Monitoring method for injection molder

Country Status (1)

Country Link
JP (1) JPS63126718A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6810303B2 (en) * 2001-06-19 2004-10-26 Ricoh Company, Ltd Injection mold, a production method thereof, a production system thereof, a designing apparatus and a designing computer program thereof, an injection method, a molded component, and an optical system therewith
US7175408B2 (en) 2002-04-11 2007-02-13 Nissei Plastic Industrial Co., Ltd. Mold monitoring apparatus for injection molding machine
JP2011235657A (en) * 2011-08-30 2011-11-24 Sigumakkusu Kk Device for monitoring of injection molding machine
JP2011235656A (en) * 2011-08-30 2011-11-24 Sigumakkusu Kk Device for monitoring of injection molding machine

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6810303B2 (en) * 2001-06-19 2004-10-26 Ricoh Company, Ltd Injection mold, a production method thereof, a production system thereof, a designing apparatus and a designing computer program thereof, an injection method, a molded component, and an optical system therewith
US7175408B2 (en) 2002-04-11 2007-02-13 Nissei Plastic Industrial Co., Ltd. Mold monitoring apparatus for injection molding machine
JP2011235657A (en) * 2011-08-30 2011-11-24 Sigumakkusu Kk Device for monitoring of injection molding machine
JP2011235656A (en) * 2011-08-30 2011-11-24 Sigumakkusu Kk Device for monitoring of injection molding machine

Also Published As

Publication number Publication date
JPH0411805B2 (en) 1992-03-02

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