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JPS63122750U - - Google Patents

Info

Publication number
JPS63122750U
JPS63122750U JP1290287U JP1290287U JPS63122750U JP S63122750 U JPS63122750 U JP S63122750U JP 1290287 U JP1290287 U JP 1290287U JP 1290287 U JP1290287 U JP 1290287U JP S63122750 U JPS63122750 U JP S63122750U
Authority
JP
Japan
Prior art keywords
opening
nozzle
soldering device
jet
forming plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1290287U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1290287U priority Critical patent/JPS63122750U/ja
Publication of JPS63122750U publication Critical patent/JPS63122750U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案のはんだ付け装置の一実施例を
示す縦断面図、第２図はその要部の斜視図である
。 ａ……はんだ、７……ノズル、１２……開口部
、１６……噴流形成板、２６……噴流口。 FIG. 1 is a longitudinal sectional view showing an embodiment of the soldering device of the present invention, and FIG. 2 is a perspective view of the main parts thereof. a... Solder, 7... Nozzle, 12... Opening, 16... Jet flow forming plate, 26... Jet outlet.

Claims (1)

【実用新案登録請求の範囲】 加圧された熔融はんだをノズルの上部の開口部
に噴流するはんだ付け装置であつて、 上記ノズルの上部の開口部に、上面に向かつて
一体に膨出した多数の筒状の噴流口を有する噴流
形成板を設けたことを特徴とするはんだ付け装置
。[Scope of Claim for Utility Model Registration] A soldering device that jets pressurized molten solder into an opening at the top of a nozzle, wherein the opening at the top of the nozzle has a large number of parts bulging out toward the top surface. 1. A soldering device comprising a jet forming plate having a cylindrical jet opening.
JP1290287U 1987-01-31 1987-01-31 Pending JPS63122750U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1290287U JPS63122750U (en) 1987-01-31 1987-01-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1290287U JPS63122750U (en) 1987-01-31 1987-01-31

Publications (1)

Publication Number Publication Date
JPS63122750U true JPS63122750U (en) 1988-08-10

Family

ID=30801463

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1290287U Pending JPS63122750U (en) 1987-01-31 1987-01-31

Country Status (1)

Country Link
JP (1) JPS63122750U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63157476U (en) * 1987-03-30 1988-10-14
WO2005120141A1 (en) * 2004-06-03 2005-12-15 Andes Electric Co., Ltd. Solder jetting apparatus, solder jetting apparatus manufacturing method and electronic component soldering method

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5357157A (en) * 1976-11-04 1978-05-24 Kondo Kenji Solder jet device
JPS59199139A (en) * 1983-04-26 1984-11-12 Mitsubishi Heavy Ind Ltd Forming method of nozzle

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5357157A (en) * 1976-11-04 1978-05-24 Kondo Kenji Solder jet device
JPS59199139A (en) * 1983-04-26 1984-11-12 Mitsubishi Heavy Ind Ltd Forming method of nozzle

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63157476U (en) * 1987-03-30 1988-10-14
WO2005120141A1 (en) * 2004-06-03 2005-12-15 Andes Electric Co., Ltd. Solder jetting apparatus, solder jetting apparatus manufacturing method and electronic component soldering method
JPWO2005120141A1 (en) * 2004-06-03 2008-04-03 アンデス電気株式会社 Solder jet device, method for manufacturing solder jet device, and method for soldering electronic components

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