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JPS63119273U - - Google Patents

Info

Publication number
JPS63119273U
JPS63119273U JP1224687U JP1224687U JPS63119273U JP S63119273 U JPS63119273 U JP S63119273U JP 1224687 U JP1224687 U JP 1224687U JP 1224687 U JP1224687 U JP 1224687U JP S63119273 U JPS63119273 U JP S63119273U
Authority
JP
Japan
Prior art keywords
conductive pattern
pattern
wiring board
printed wiring
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1224687U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1224687U priority Critical patent/JPS63119273U/ja
Publication of JPS63119273U publication Critical patent/JPS63119273U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の一実施例を示すプリント配線
基板の要部平面図、第2図は第1図の―線か
らの拡大断面図、第3図は従来の孔詰り防止対策
を施した導電パターン例の要部平面図、第4図は
孔詰り発生原因の説明図である。 1……導電パターン、2……透孔、3……スリ
ツト、4……プリント配線基板、1a……半田引
込みパターン。
Fig. 1 is a plan view of the main parts of a printed wiring board showing an embodiment of the present invention, Fig. 2 is an enlarged sectional view taken from the - line in Fig. 1, and Fig. 3 is a plan view of the main part of a printed wiring board showing an embodiment of the present invention. FIG. 4, which is a plan view of a main part of an example of a conductive pattern, is an explanatory diagram of the cause of hole clogging. 1... Conductive pattern, 2... Through hole, 3... Slit, 4... Printed wiring board, 1a... Solder lead-in pattern.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 透孔周縁の導電パターンに導電パターンを横切
るスリツトを形成したプリント配線基板において
、上記導電パターンの近傍に半田引込みパターン
を連設したことを特徴とするプリント配線基板。
1. A printed wiring board in which a slit is formed in a conductive pattern at the periphery of a through hole to cross the conductive pattern, characterized in that a solder lead-in pattern is successively provided in the vicinity of the conductive pattern.
JP1224687U 1987-01-29 1987-01-29 Pending JPS63119273U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1224687U JPS63119273U (en) 1987-01-29 1987-01-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1224687U JPS63119273U (en) 1987-01-29 1987-01-29

Publications (1)

Publication Number Publication Date
JPS63119273U true JPS63119273U (en) 1988-08-02

Family

ID=30800197

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1224687U Pending JPS63119273U (en) 1987-01-29 1987-01-29

Country Status (1)

Country Link
JP (1) JPS63119273U (en)

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