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JPS629867A - Grinder - Google Patents

Grinder

Info

Publication number
JPS629867A
JPS629867A JP14825985A JP14825985A JPS629867A JP S629867 A JPS629867 A JP S629867A JP 14825985 A JP14825985 A JP 14825985A JP 14825985 A JP14825985 A JP 14825985A JP S629867 A JPS629867 A JP S629867A
Authority
JP
Japan
Prior art keywords
wheel
grinding
grinder
probe
grindstone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14825985A
Other languages
Japanese (ja)
Inventor
Masaya Watada
和多田 雅哉
Tsutomu Mizuno
勉 水野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Amada Co Ltd
Original Assignee
Amada Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Amada Co Ltd filed Critical Amada Co Ltd
Priority to JP14825985A priority Critical patent/JPS629867A/en
Publication of JPS629867A publication Critical patent/JPS629867A/en
Pending legal-status Critical Current

Links

Landscapes

  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)

Abstract

PURPOSE:To enhance grinding efficiency, by providing a wheel diameter measuring device, grinding surface detecting device and a control device so as to continually catch wearing of a wheel diameter and control a wheel to easily approach to a grinding surface, in the case of a grinder in a surface grinding machine. CONSTITUTION:A grinder provides a light emitting element 11 and a light receiving element 13 to be opposed interposing a wheel 5 mounted to a wheel shaft 3, and if the wheel is moved on a scale 15, the grinder detects a wheel diameter in a position where light is shielded by the wheel 5. While a probe 21, for detecting height of a work, is set longer by DELTAX than the wheel diameter through a probe position detecting scale 23. And the grinder, lowering the wheel 5 to be stopped when the probe 21 is brought into contact with the work W, performs grinding by setting the wheel 5 to a grinding position. If the wheel 5 generates no wearing, it is decided whether or not a ground surface is in the finished dimension, and the grinder ends the grinding or corrects the wheel position. While the grinder, if the wheel 5 is worn, corrects the wheel position in accordance with wearing of the wheel.

Description

【発明の詳細な説明】 [発明の技術分野] この発明は、研削装置に関し、特にワーク研削面の検出
手段を備えた研削装置に関する。
DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a grinding device, and more particularly to a grinding device equipped with means for detecting a grinding surface of a workpiece.

[発明の技術的背頭及びその問題点] 一般に平面研削盤による研削加工の場合、加工中に砥石
が常に摩耗して加工精度を低下させる。
[Technical background of the invention and its problems] Generally, in the case of grinding using a surface grinder, the grindstone is constantly worn during the processing, reducing the processing accuracy.

それを防ぐためには研削面の測定及びそのための段取り
を行なう必要があるが、この作業には時間がかかる。ま
た研削加工に当って、ワークの研削面まで砥石を下降さ
せる作業も、未熟技能者にとってはむずかしいものであ
り、研削面まで到達させるのに時間がかかったり、逆に
下降させすぎてワークに深く切込んでしまい、ドレス作
業した砥石を摩耗させてしまう問題があった。
In order to prevent this, it is necessary to measure the ground surface and make preparations for that purpose, but this work takes time. Furthermore, during grinding, it is difficult for unskilled workers to lower the whetstone to the grinding surface of the workpiece. There was a problem in that the grindstone that was used for the dressing process was worn out.

これは、従来の平面研削盤の場合には、砥石の摩耗によ
る砥石径の変化を把握して砥石下面から研削面までの距
離を演算し、ワーク研削面の高さを適確に検知する研削
面検出手段が備えられていないためであった。
In the case of conventional surface grinders, this is a grinding machine that grasps changes in the diameter of the grinding wheel due to grinding wheel wear, calculates the distance from the bottom surface of the grinding wheel to the grinding surface, and accurately detects the height of the workpiece grinding surface. This is because surface detection means was not provided.

〔発明の目的] この発明は、このような従来の問題に鑑みてなされたも
のであって、砥石径S1測装置と研削面検出用プローブ
とを備えることにより砥石の摩耗を常に把握して加工寸
法の精度の向上が図れ、またワークの研削面の正しい位
置まで砥石を筒単に下降させることができる研削装置を
提供することを目的とする。
[Purpose of the Invention] This invention was made in view of such conventional problems, and is equipped with a grinding wheel diameter S1 measurement device and a probe for detecting the grinding surface, so that grinding wheel wear can be constantly monitored and processed. It is an object of the present invention to provide a grinding device that can improve dimensional accuracy and can simply lower a grindstone to the correct position on the grinding surface of a workpiece.

[発明の構成] この発明は、砥石回転装置と、砥石径の計測装置と、研
削面検出用のプローブと、このプロープの長さを前記砥
石径計測装置による計測値に対応して設定する制御装置
を具備して成る研削装置である。
[Structure of the Invention] The present invention includes a grindstone rotating device, a grindstone diameter measuring device, a probe for detecting a grinding surface, and a control for setting the length of the probe in accordance with a measurement value by the grindstone diameter measuring device. This is a grinding device comprising a device.

[発明の実施例] 第1図は一実施例回路のブロック図、第2図乃至第4図
は機械構成を示すものである。砥石回転装置1は、回転
軸3に砥石5が取付けられ、カバー7内に収納された構
成である。また砥石径計測装置9は、砥石5を挾んで対
向する発光素子11と受光素子13とを備え、砥石軸位
置検出スケール15に沿って半径方向に移動するように
なっている。そして、センサ駆8装置17により発光素
子11から受光素子13に対して光を発しながらスケー
ル15上を移動させ、砥石5によって光が遮られる位置
を検出回路19が検出し、砥石5の径を知る構成である
[Embodiment of the Invention] FIG. 1 is a block diagram of a circuit of one embodiment, and FIGS. 2 to 4 show the mechanical configuration. The grindstone rotating device 1 has a structure in which a grindstone 5 is attached to a rotating shaft 3 and housed within a cover 7. Further, the grindstone diameter measuring device 9 includes a light emitting element 11 and a light receiving element 13 facing each other with the grindstone 5 in between, and is configured to move in the radial direction along the grindstone axis position detection scale 15. The sensor driver 8 device 17 emits light from the light emitting element 11 to the light receiving element 13 while moving on the scale 15, and the detection circuit 19 detects the position where the light is blocked by the grinding wheel 5, and detects the diameter of the grinding wheel 5. It is a structure that can be learned.

マグネットヂャックM上のワークWの高さを検出するた
めのプローブ21はプローブ位置検出スケール23より
上下所定の高さ位置に設定可能となっている。このプロ
ーブ21は研削面検出装置25に接続され、ワークWの
研削面との接触があった時に研削面検出信号を発する。
A probe 21 for detecting the height of the workpiece W on the magnetic jack M can be set at a predetermined height position above or below a probe position detection scale 23. This probe 21 is connected to a ground surface detection device 25, and when it comes into contact with the ground surface of the workpiece W, it emits a ground surface detection signal.

第1図に示すように、これら砥石回転装置1゜砥石径計
測装置9.研削面検出装置25は制御装置27により制
御される。またこの制御装置27は演算装置29を備え
ている。
As shown in FIG. 1, these grindstone rotating device 1 degree grindstone diameter measuring device 9. The grinding surface detection device 25 is controlled by a control device 27. The control device 27 also includes a calculation device 29 .

上記構成の研削装置では、砥石回転装置1により砥石5
が回転され、ワークWの研削面に砥石5を下降さばて接
触させることにより平面研削が実行される。この加工時
のワークWの研削面の検出、砥石5の径の計測、研削寸
法の測定の動作を第5図に示すフローチャートを基に説
明する。
In the grinding device having the above configuration, the grinding wheel 5 is rotated by the grinding wheel rotation device 1.
is rotated, and the grindstone 5 is brought into contact with the grinding surface of the workpiece W by descending, thereby performing surface grinding. The operations of detecting the grinding surface of the workpiece W, measuring the diameter of the grindstone 5, and measuring the grinding dimensions during this processing will be explained based on the flowchart shown in FIG.

砥石回転装置1により砥石5の回転が開始される。(ス
テップ41) つづいて砥石径の計測が行なわれる。この砥石径計測は
、発光素子11から光を発して受光素子13に受光させ
ながらスケール15上を軸3の方向に移動させ、砥石5
の外周部により光が遮られた時の径を知ることによって
行なわれる。(ステップ43) 次にプローブ21の高さ位置が設定される。このプロー
ブ21の位置設定は、計測された砥石径Rに対してΔX
だけ若干長めに行なわれ、軸3の中心からプローブ21
の下端までの距離が(R+△×)となる。(ステップ4
5.47)  つづいて砥石5が下降され、プローブ2
1がワークWと接触したことを研削面検出装置25が検
出した時に下降が停止され、研削開始位置に設定される
The grindstone rotation device 1 starts rotating the grindstone 5 . (Step 41) Next, the diameter of the grindstone is measured. This grinding wheel diameter measurement is performed by moving the grinding wheel in the direction of the axis 3 on the scale 15 while emitting light from the light emitting element 11 and having it received by the light receiving element 13.
This is done by knowing the diameter when the light is blocked by the outer periphery of the . (Step 43) Next, the height position of the probe 21 is set. The position setting of this probe 21 is ΔX with respect to the measured grindstone diameter R.
probe 21 from the center of axis 3.
The distance to the lower end of is (R+Δ×). (Step 4
5.47) Next, the grinding wheel 5 is lowered and the probe 2
When the grinding surface detection device 25 detects that the grinding surface 1 comes into contact with the workpiece W, the lowering is stopped and the grinding start position is set.

(ステップ49.51) 次に研削加工が開始され、定期的に砥石径の計測が実行
される。そして、砥石5が摩耗しておらず、研削加工が
順調に進んでいる時には、研削面の仕上り寸法かどうか
判断される。(ステップ53〜59) ここで仕上り寸法となっていれば研削終了とされ、そう
でなければ砥石位置の補正がなされる。
(Steps 49 and 51) Next, grinding is started, and the diameter of the grindstone is periodically measured. Then, when the grindstone 5 is not worn and the grinding process is progressing smoothly, it is determined whether the finished dimensions of the ground surface are met. (Steps 53 to 59) If the finished dimensions are reached here, the grinding is completed, and if not, the grindstone position is corrected.

(ステップ61.63)この砥石位置の補正は、軸3を
さらに低める補正となり、研削をさらに進めるものとな
る。
(Steps 61 and 63) This correction of the grindstone position is a correction that further lowers the shaft 3 and further advances the grinding.

尚、研削中に砥石径が摩耗のために小さくなれば、研削
が有効に行なえなくなるために、ステップ57において
砥石が摩耗しているものと判断Xれたときにも砥石の位
置補正が行なわれる。(ステップ63) 上記実施例では研削面検出用のプローブとしてワーク面
との機械的な接触を行なうものを示したが、光電素子そ
の他の電気的な検出を行なうものを用いることもできる
。またステップ57において、砥石径が有効最小寸法よ
り小さくなっているかどうかをも判断し、その時には砥
石交換のために停止させるようにすることもできる。
Note that if the diameter of the grindstone becomes smaller due to wear during grinding, grinding cannot be performed effectively, so the position of the grindstone is corrected even when it is determined in step 57 that the grindstone is worn. . (Step 63) In the above embodiment, a probe for detecting the ground surface that makes mechanical contact with the work surface is shown, but a photoelectric element or other probe that performs electrical detection may also be used. In addition, in step 57, it is also possible to determine whether the diameter of the grindstone is smaller than the effective minimum dimension, and in that case, the grindstone may be stopped for replacement.

[発明の効果] この発明は砥石径の計測装置を備えているために、研削
中に砥石の摩耗の度合を常に把握しておくことができ、
平面研削の加工寸法精度を向上させることができる。ま
たプローブによりワークの研削面を検出するので、未熟
練者であっても容易に砥石の下降位置を正しい所におく
ことができ、研削加工能率を高めることができる。
[Effects of the Invention] Since the present invention is equipped with a grindstone diameter measuring device, it is possible to constantly grasp the degree of wear of the grindstone during grinding.
The dimensional accuracy of surface grinding can be improved. Furthermore, since the grinding surface of the workpiece is detected by the probe, even an unskilled person can easily place the grindstone at the correct lowering position, thereby increasing the grinding efficiency.

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの発明の一実施例の回路ブロック図、第2図
は同上実施例の底面図、第3図は同上実施例の平面図、
第4図は同上実施例の側面図、第5図は同上実施例の動
作を示す70−チレートである。 1・・・砥石回転装置   9・・・砥石径計測装置2
1・・・プローブ    27・・・制御装置第1図
FIG. 1 is a circuit block diagram of an embodiment of the invention, FIG. 2 is a bottom view of the embodiment, and FIG. 3 is a plan view of the embodiment.
FIG. 4 is a side view of the same embodiment, and FIG. 5 is a 70-chirate showing the operation of the above embodiment. 1... Grinding wheel rotation device 9... Grinding wheel diameter measuring device 2
1... Probe 27... Control device Fig. 1

Claims (1)

【特許請求の範囲】[Claims] 砥石回転装置と、砥石径の計測装置と、研削面検出用の
プローブと、このプローブの長さを前記砥石径計測装置
による計測値に対応して設定する制御装置を具備して成
る研削装置。
A grinding device comprising a grindstone rotating device, a grindstone diameter measuring device, a probe for detecting a grinding surface, and a control device that sets the length of the probe in accordance with a measurement value by the grindstone diameter measuring device.
JP14825985A 1985-07-08 1985-07-08 Grinder Pending JPS629867A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14825985A JPS629867A (en) 1985-07-08 1985-07-08 Grinder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14825985A JPS629867A (en) 1985-07-08 1985-07-08 Grinder

Publications (1)

Publication Number Publication Date
JPS629867A true JPS629867A (en) 1987-01-17

Family

ID=15448776

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14825985A Pending JPS629867A (en) 1985-07-08 1985-07-08 Grinder

Country Status (1)

Country Link
JP (1) JPS629867A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03123669U (en) * 1990-03-28 1991-12-16
JPH07153722A (en) * 1993-11-26 1995-06-16 Seiko Seiki Co Ltd Dicing device
JPH07153723A (en) * 1993-11-26 1995-06-16 Seiko Seiki Co Ltd Dicing device
KR100480206B1 (en) * 2002-11-23 2005-03-31 주식회사 서울레이저발형시스템 Grinder which grinds uniformly regardless of grinding wheel's wears
JP2018034297A (en) * 2016-08-25 2018-03-08 株式会社岡本工作機械製作所 Automatic grinding device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54143991A (en) * 1978-04-28 1979-11-09 Tokyo Seimitsu Co Ltd Controlling method for grinding

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54143991A (en) * 1978-04-28 1979-11-09 Tokyo Seimitsu Co Ltd Controlling method for grinding

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03123669U (en) * 1990-03-28 1991-12-16
JPH07153722A (en) * 1993-11-26 1995-06-16 Seiko Seiki Co Ltd Dicing device
JPH07153723A (en) * 1993-11-26 1995-06-16 Seiko Seiki Co Ltd Dicing device
KR100480206B1 (en) * 2002-11-23 2005-03-31 주식회사 서울레이저발형시스템 Grinder which grinds uniformly regardless of grinding wheel's wears
JP2018034297A (en) * 2016-08-25 2018-03-08 株式会社岡本工作機械製作所 Automatic grinding device

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