JPS6286822A - Semiconductor element manufacturing equipment - Google Patents
Semiconductor element manufacturing equipmentInfo
- Publication number
- JPS6286822A JPS6286822A JP22809985A JP22809985A JPS6286822A JP S6286822 A JPS6286822 A JP S6286822A JP 22809985 A JP22809985 A JP 22809985A JP 22809985 A JP22809985 A JP 22809985A JP S6286822 A JPS6286822 A JP S6286822A
- Authority
- JP
- Japan
- Prior art keywords
- cup
- wafer
- coating liquid
- coating
- propeller
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims description 3
- 238000004519 manufacturing process Methods 0.000 title claims 2
- 239000011248 coating agent Substances 0.000 claims abstract description 29
- 238000000576 coating method Methods 0.000 claims abstract description 29
- 239000007788 liquid Substances 0.000 abstract description 16
- 230000000694 effects Effects 0.000 description 4
- 239000002245 particle Substances 0.000 description 3
- 238000004528 spin coating Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Coating Apparatus (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は塗布装置に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a coating device.
従来、この種の塗布装置は円筒状のカップ内に、チャッ
クに吸着したウェハーを回転させて該ウェハーに塗布を
行っているが、カップ部に空気を送り込みカップ内で整
流効果を持たせる機構は使用されていなかった。Conventionally, this type of coating device rotates a wafer attracted to a chuck in a cylindrical cup to coat the wafer, but the mechanism that sends air into the cup to create a rectifying effect within the cup is It wasn't used.
上述した従来の塗布装置には、カップ内に空気を送り込
み、カップ内での整流効果を持たせる機構がなかったの
で、カップ内の排気圧のみにより、ウェハー上のパーテ
ィクル数が左右され、塗布により飛散させられた塗布液
の大きい粒径のものが再びウェハー上に舞い落ちてしま
うという欠点がある。The conventional coating equipment described above did not have a mechanism to send air into the cup to create a rectifying effect within the cup, so the number of particles on the wafer was affected only by the exhaust pressure inside the cup, and the number of particles on the wafer was affected by the coating. There is a drawback that large particles of the sprayed coating liquid fall onto the wafer again.
本発明は前記問題点を解消し、飛散塗布液が再びウェハ
ー上に付着するのを防止する塗布装置を提供するもので
ある。The present invention solves the above problems and provides a coating device that prevents the scattered coating liquid from adhering to the wafer again.
本発明は上面周囲に排気孔を設けた円筒状の塗布用カッ
プと、カップ内でウェハーを支持するチャックと、チャ
ックを回転させる回転軸とを有する塗布装置において、
前記回転軸に、空気を前記カップ内に送り込むプロペラ
を設けたことを特徴とする半導体素子の塗布装置である
。The present invention provides a coating apparatus that includes a cylindrical coating cup with an exhaust hole around the upper surface, a chuck that supports a wafer within the cup, and a rotation shaft that rotates the chuck.
The semiconductor device coating apparatus is characterized in that the rotating shaft is provided with a propeller that sends air into the cup.
次に、本発明の一実施例について図面を参照して説明す
る。第１図は本発明の一実施例の塗布装置カップ部の縦
断・面図である。Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a vertical cross-sectional view of a cup portion of a coating device according to an embodiment of the present invention.
ウェハーを支持するチャック１は回転軸２に取り付けら
れて二重構造のカップ８内に設けられ、該回転軸２に送
気用のプロペラ３が取り付けられ、プロペラ３はカップ
８の底部側に設けられている。A chuck 1 for supporting a wafer is attached to a rotating shaft 2 and provided in a double-structured cup 8, and a propeller 3 for air supply is attached to the rotating shaft 2, and the propeller 3 is provided on the bottom side of the cup 8. It is being
回転塗布によりウェハー８から飛散させられた塗布液の
一部はカップ８内の内壁にぶつかり、塗布液排出口６か
ら排出される。他の塗布液はカップ内の排気孔５へ吸い
込まれ、カップ８内の排気排出口６から排出される。ド
ーナツツ形カップフタ７はカップ内へのウェハー出し入
れと、ダウンスローによる無塵の空気の取り込みのため
、中央に穴があけられている・
次に、本装置の動作について説明する。まず、ローダ−
によりドーナツツ形カップフタ７の上方にウェハー９が
ロードされる。チャックｌの回転軸２が第１図上方向に
伸び、チャック１が真空チャックによりロードされたウ
エノ′Ｓ−９をチャックする。チャック後、回転軸２は
下方に戻り、それと同時に塗布液のノズルがドーナツツ
形カップフタ上部よりカップ内つエノ・−上に降りて来
る。この間、排気孔５による排気は、排気ダクトへつな
がっているカップ内排気排出口４により終始性われてい
る。塗布液ノズルからウエノ・−上に塗布液が滴下され
た直後、回転軸２が回転を始めウエノ・−９への回転塗
布が行われる。このとき第２図で示すように、回転軸２
に取っ付けられたプロペラ３も回転し、第２図に矢印で
示すように空気の流れがカップ８内に生ずる。プロペラ
３０回転により空気はウェハー裏面の中央部からウエノ
１−の端へと流れ、その後ウエノ・−上方へ進み、排気
孔５から排気されてゆく。この流れにより回転塗布で飛
散された塗布液の、カップ内壁によるはねかえり及びウ
エノ・−上方からの舞い降りを排気孔５へ向かって押し
上げることができ、ウエノ・−上のコ゛ミや突起の発生
を低減させる。塗布終了後、ウェハー８は回転軸２がカ
ップ上方へ伸びカップの外へ出され、アンローダ−によ
りアンロードされる。A part of the coating liquid scattered from the wafer 8 by the spin coating collides with the inner wall of the cup 8 and is discharged from the coating liquid outlet 6. The other coating liquid is sucked into the exhaust hole 5 in the cup and discharged from the exhaust outlet 6 in the cup 8. The donut-shaped cup lid 7 has a hole in the center for taking the wafer in and out of the cup and for taking in dust-free air by downthrowing.Next, the operation of this device will be explained. First, the loader
The wafer 9 is loaded above the donut-shaped cup lid 7. The rotating shaft 2 of the chuck 1 extends upward in FIG. 1, and the chuck 1 chucks the wafer S-9 loaded by the vacuum chuck. After chucking, the rotating shaft 2 returns downward, and at the same time, the nozzle for the coating liquid descends from the top of the donut-shaped cup lid onto the inner surface of the cup. During this time, the exhaust from the exhaust hole 5 is controlled from beginning to end by the in-cup exhaust outlet 4 connected to the exhaust duct. Immediately after the coating liquid is dropped from the coating liquid nozzle onto the Ueno layer 9, the rotating shaft 2 starts rotating, and rotational coating is performed on the Ueno layer 9. At this time, as shown in FIG.
The propeller 3 attached to the cup 8 also rotates, creating a flow of air within the cup 8 as indicated by the arrow in FIG. As the propeller rotates 30 times, air flows from the center of the back surface of the wafer to the edge of the wafer 1-, then advances upwards of the wafer 1-, and is exhausted from the exhaust hole 5. This flow makes it possible to push up the coating liquid splashed by the spin coating on the inner wall of the cup and the falling water from above the wafer toward the exhaust hole 5, thereby reducing the occurrence of bumps and protrusions on the wafer. . After the coating is completed, the rotating shaft 2 of the wafer 8 is extended upward from the cup, the wafer 8 is taken out of the cup, and the wafer 8 is unloaded by an unloader.
以上説明したように本発明は回転塗布時の回転を利用し
、回転軸にプロペラを取り付はプロペラを回転させるこ
とにより、カップ内の空気を整流させ、ウェハー上にゴ
ミや突起物の付着を最大限押える効果がある。As explained above, the present invention utilizes the rotation during spin coating, and by attaching a propeller to the rotating shaft and rotating the propeller, the air inside the cup is rectified, and dirt and protrusions are prevented from adhering to the wafer. It has the maximum pressing effect.
第１図は本発明における塗布装置のカップ部を示す縦断
面図、第２図は動作を説明する縦断面図である。
１・・・チャック ２・・・回転軸３・・・プ
ロペラ ４・・・カップ内排気排出口５・
・・カップ内排気孔 ６・・・塗布液排出ロア・・・
ドーナツツ形カップフタ ８・・・カップ９・・・ウェ
ハー
特許出願人 日本電気株式会社
第１図FIG. 1 is a longitudinal sectional view showing the cup portion of the coating device according to the present invention, and FIG. 2 is a longitudinal sectional view illustrating the operation. 1... Chuck 2... Rotating shaft 3... Propeller 4... Exhaust outlet in cup 5.
... Exhaust hole in the cup 6 ... Application liquid discharge lower ...
Donut-shaped cup lid 8...Cup 9...Wafer patent applicant NEC Corporation Figure 1
Claims (1)
と、カップ内でウェハーを支持するチャックと、チャッ
クを回転させる回転軸とを有する塗布装置において、前
記回転軸に、空気を前記カップ内に送り込むプロペラを
設けたことを特徴とする半導体素子の製造装置。(1) In a coating device having a cylindrical coating cup with an exhaust hole around the upper surface, a chuck for supporting a wafer within the cup, and a rotation shaft for rotating the chuck, air is supplied to the rotation shaft to A semiconductor device manufacturing device characterized by being provided with a propeller that feeds into a cup.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22809985A JPS6286822A (en) | 1985-10-14 | 1985-10-14 | Semiconductor element manufacturing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22809985A JPS6286822A (en) | 1985-10-14 | 1985-10-14 | Semiconductor element manufacturing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6286822A true JPS6286822A (en) | 1987-04-21 |
Family
ID=16871175
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22809985A Pending JPS6286822A (en) | 1985-10-14 | 1985-10-14 | Semiconductor element manufacturing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6286822A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4903717A (en) * | 1987-11-09 | 1990-02-27 | Sez Semiconductor-Equipment Zubehoer Fuer die Halbleiterfertigung Gesellschaft m.b.H | Support for slice-shaped articles and device for etching silicon wafers with such a support |
| JP2011222685A (en) * | 2010-04-08 | 2011-11-04 | Tokyo Electron Ltd | Substrate processing apparatus and coating development system equipped with the same |
-
1985
- 1985-10-14 JP JP22809985A patent/JPS6286822A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4903717A (en) * | 1987-11-09 | 1990-02-27 | Sez Semiconductor-Equipment Zubehoer Fuer die Halbleiterfertigung Gesellschaft m.b.H | Support for slice-shaped articles and device for etching silicon wafers with such a support |
| JP2011222685A (en) * | 2010-04-08 | 2011-11-04 | Tokyo Electron Ltd | Substrate processing apparatus and coating development system equipped with the same |
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