JPS6284527A - Chip carrier - Google Patents

Abstract

PURPOSE:To improve heat-dissipating properties, and to mount a large-power chip while enhancing workability by fitting a radiator plate to a pin disposed in upright to a substrate and directly joining the chip with the radiator plate. CONSTITUTION:With a substrate 1, four pins 11 and bonding electrodes 12 are formed to a chip loading surface. Connecting terminals with the outside are shaped to the back reverse to the chip loading surface, and connected to the bonding electrodes 12 in the inner layer of the substrate 1. Four fitting holes 21 are formed where corresponding to the pins 11 for the substrate 1 in a radiator plate 2. An integrated circuit and circuit terminals 31 thereof are shaped to a chip 3. Since the radiator plate 2 and the chip 3 are joined directly without clearances extending over a wide range through a thermal conductive material, heat dissipated from the chip 3 is dissipated easily to the radiator plate 2 through the thermal conductive material, thus remarkably improving heat-dissipating properties, then mounting of the large-power chip is enabled.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a package for a semiconductor integrated circuit, and more particularly to a chip carrier with improved heat dissipation.

[Conventional technology]

Conventionally, this type of chip carrier has a structure in which the chip is bonded to the top surface of the carrier body made of ceramic or the like, and then a cover is attached (for example, the chip carrier is
Careers There Application and Tsuyu
Char Direction, Zhu. W, Staff Ode, I, E, E, E, Tran, On C, H, M, T, C H Chem Chi-4
, No. 2, June 1881, or Chip Carriers: Coming Force in Packaging, D. Erickson Electronic Packaging.
and Production, Sanmachi in March 1981.

[Problems to be solved]

Therefore, heat generated in the semiconductor integrated circuit of the chip is mainly dissipated through the carrier body. Therefore, the amount of heat dissipation is limited by the material of the carrier body, the bonding area of the shaped chip, etc., and the power consumption of a chip that can be mounted is usually 1 to 2.
It is up to about W.

However, recent highly integrated and high-speed high-performance chips have power consumption of several watts or more, and in the near future,
A power output of several tens of watts is also expected. When these high-performance, high-power chips are mounted in conventional packages, there are problems such as the chip's temperature rises, which reduces reliability and burns out the circuit.

[Means for solving problems]

The present invention solves the above problems, and includes a carrier body in which a plurality of pins are erected on a predetermined surface having electrodes, and an integrated circuit, and the integrated circuit surface is The chip is mounted with the terminals of the integrated circuit facing the electrodes, and has a plurality of fitting holes, each of which is fitted with each of the pins to the carrier body. The heat sink is attached to the chip and is also configured with a heat sink directly bonded to the chip with a heat conductive material interposed therebetween.

〔Example〕

Next, an example thereof will be explained with reference to FIG.

FIG. 1 is an exploded perspective view of an embodiment of a chip carrier according to the present invention.

In the figure, the IFi chip carrier of the present invention has four pins 11. and bonding electrodes 12 are formed. Furthermore, although not shown, there is a connection terminal with the outside on the back surface opposite to the chip mounting surface, and a bonding electrode 1 is provided on the inner layer of the substrate 1.
2 is connected. 2ri heat sink, pin 1 of board l
Four fitting holes 21 are provided at positions corresponding to 1. 3 is a chip having an integrated circuit and its circuit terminals 31;

Next, the assembly will be explained. First, the chip 3 is mounted face down on the chip mounting surface of the substrate 1, and the terminals 31 are bonded to the bonding electrodes 12 of the substrate 1. Next, the heat sink 2 is attached so that each of its fitting holes 21 fits into each pin 11 of the board 1. At this time, a thermally conductive material such as solder, thermally conductive adhesive, or thermally conductive powder is interposed between the heat sink 2 and the upper surface of the chip 3 to bond them.

According to this, since the heat sink 2 is fitted to the pin 11 of the substrate 1, the position of the heat sink 2 is stable, and even if the height of the chip 3 varies, the heat sink 2 can be slid up and down. It can be easily placed along the top surface of the chip 3, and both 2.3
It is easy to join the stones.

Furthermore, since the heat sink 2 and the chip 3 are directly connected to each other over a wide area through a heat conductive material, the heat generated from the chip 3 is easily radiated to the heat sink 2 through the heat conductive material.
Heat dissipation is significantly improved and high power chips can be mounted.

In the above embodiment, the heat sink 2F'i is shaped like a single flat plate, but fins may be added to provide forced air cooling to further improve heat dissipation, or the heat sink 2 may be shaped like a cavity to support the chip 3. It may be sealed.

〔Effect of the invention〕

As explained above, the present invention has a structure in which the heat sink is fitted onto the pins set up on the substrate and the chip is directly bonded to the heat sink, so heat dissipation is good and high power chips can be mounted. In addition, by fitting the heat sink with the pins, the heat sink can be easily slid and the back side of the chip and the heat sink can be easily joined, even with variations in chip height, improving work efficiency. There are effects such as

[Brief explanation of drawings]

FIG. 1 is an exploded perspective view of an embodiment of a chip carrier according to the present invention. 1... Board 2... Heat sink 3...
Chip 11... Pin] 2... Bonding electrode 21... Fitting hole 31... Terminal

Claims (1)

[Claims] It has a carrier body with a plurality of pins erected on a predetermined surface having electrodes, and an integrated circuit, and is placed with the integrated circuit surface facing the predetermined surface of the carrier body, and has terminals of the integrated circuit. The chip has a chip bonded to the electrode and a plurality of fitting holes, each of the fitting holes is fitted with each pin to be attached to the carrier body, and a thermally conductive material is interposed with respect to the chip. A chip carrier characterized by comprising a heat sink and a heat sink directly bonded to each other.