JPS6274567A - Polishing method for ceramic plate - Google Patents

Abstract

PURPOSE:To fabricate ceramic plates with a high degree of accuracy without the ceramic plates being scratched, by bonding a carrier and the ceramic plates to the outer surface of a sufficient wall thickness disc-like holder jig so that the ceramic plates are polished at their one side surface. CONSTITUTION:Ceramic plates 30 to be polished are fitted into a plurality of through-holes 7 formed in a carrier 6 in a pattern of concentric rings. The carrier 6 is bonded onto the outer surface of a disc-like holder jig 8 having a diameter equal to that of the carrier 6 while the ceramic plates 30 are bonded to the holder jig 8 within the through-holes 7 in the carrier 6 such that they are projected from the upper surface of the carrier 6. The holder jig 8 to which the carrier 6 and the ceramic plates 30 are bonded is set between an upper stool 1 and a lower stool 3 so that the upper surfaces of the ceramic plates are fabricated by means of free abrasive grain.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention is applicable to the field of electronic industry.
．． The present invention relates to a method of polishing a ceramic plate that can polish the surface of a ceramic plate with high precision.

(Prior Art) Conventionally, as a polishing method for a thin ceramic plate as described above, a carrier having a thickness of Q and about 1 mm is sandwiched between an upper surface plate and a lower surface plate that rotate in opposite directions. A common method was to simultaneously polish both the upper and lower surfaces of a ceramic plate while causing the carrier to perform planetary rotation using teeth carved on the outer peripheral surface of the carrier. However, in this conventional method, the gap between the upper surface plate and the lower surface plate is only 0.15 to 0.20 mm, which is the same as the thickness of the ceramic plate. Polishing is not carried out smoothly and takes time, and if a part of the ceramic plate is chipped during processing, the fragments are likely to damage other ceramic plates, resulting in a high defect rate. Additionally, in order to measure the thickness of a ceramic plate during processing, it is necessary to remove the ceramic plate from the carrier, measure it, and then set it back on the carrier, making it difficult to control the thickness of the ceramic plate during polishing. Ta. Furthermore, since the thickness of the carrier is extremely thin, about 0.1 fi, if the carrier diameter is increased, the ceramic plate cannot be held securely, and a large number of ceramic plates cannot be polished at the same time.

(Problems to be Solved by the Invention) The present invention solves the conventional problems as described above, and has excellent polishing efficiency, and even if fragments are generated during processing, there is little possibility of damaging other ceramic plates. It was also completed with the aim of providing a method for polishing ceramic plates that allows for easy control of the thickness of the ceramic plate and allows for mass polishing.

(Means for Solving the Problems) The present invention sandwiches a ceramic plate held in a hole in a disc-shaped carrier between an upper surface plate and a lower surface plate that rotate relatively, and rotates the carrier planetarily. A method for polishing a ceramic plate in which the ceramic plate is polished while being moved, characterized by bonding the carrier and the ceramic plate to the surface of a sufficiently thick disk-shaped holding jig, and polishing the ceramic plate from one side. It is.

The present invention will be described in more detail below with reference to the drawings, but it should be noted that the dimensions in the height direction are exaggerated in FIG. The upper surface plate (3) has regular grooves (2) carved therein, and the lower surface plate (3) has a column (5) with similar grooves (4) carved on its upper surface. The surface plate (11) and the lower surface plate (3) rotate relative to each other in opposite directions by a mechanism (not shown).The surface plate (6) has a thickness conventionally used in this type of polishing process. It is a carrier made of metal or resin with a diameter of 061 ■-, and has a large number of concentric holes (7) through it as shown in Fig. 1.The ceramic plate (30) to be polished is placed in the carrier. (6) through hole (7)
The process of inserting and polishing is the same as before, but
In the present invention, the carrier (6) is a sufficiently thick disk-shaped holding jig (with the same diameter as the carrier and a thickness of, for example, 2 to 3 mm).
8), and the ceramic plate (30) is
For example, the through holes (
7), the ceramic plate (30) is fixed in such a way that the upper surface of the ceramic plate (30) protrudes from the upper surface of the carrier (6). The holding jig (8) is made of a metal material such as iron or aluminum or a ceramic material, and has a through hole (9) and a shallow recess (10) formed in its center. Also carrier (6
) and the holding jig (8) are formed with teeth (11) of the same shape, and the sun gear (12) in the center and the internal gear (13) located on the outer circumference of each surface plate It is designed to engage at the same time.

In this way, in the method of the present invention, the ceramic plate (30) to be polished is firmly bonded together with the carrier (6) to the surface of the sufficiently thick disc-shaped holding jig (8), and (1) and the lower surface plate (3), and rotates the sun gear (12) and the inner surface plate while rotating the upper surface plate (1) and the lower surface plate (3) relatively at a speed of, for example, around 80 rpm. By rotating the gear (13), the polishing process is performed while causing the carrier (6) and the holding jig (8) to perform planetary rotational motion. The polishing process is performed using abrasive grains such as cerium oxide supplied between the lower surface of the upper surface plate (1) and the upper surface of the ceramic plate (30).
0) is polished from the top surface. As shown in FIG. 2, in the method of the present invention, the thickness of the holding jig (8) and the thickness of the ceramic plate (30) are added between the upper surface plate (11) and the lower surface plate (3). Since there is a sufficiently large gap,
The abrasive grains are quickly discharged through the outer periphery of the holding jig (8), the through hole (9), and the concave groove (4) of the lower surface plate (3). This results in higher polishing efficiency. Furthermore, even if a part of the ceramic plate (30) is chipped during the polishing process and fragments are generated, these fragments are also quickly discharged.
The possibility of damaging the surface of 0) is reduced, and the defective rate is reduced. Moreover, in the present invention, the ceramic plate (30) is bonded to the surface of the holding jig (8), so if you want to measure the thickness of the ceramic plate (30) during the polishing process, raise the upper surface plate +11. Then, by removing the ceramic plate (30) together with the holding jig (8) and measuring the distance from the holding jig (8) to the top surface of the ceramic plate (30), easy and accurate measurement is possible. It is also easy to set it again on the lower surface plate (3). Once one side of the ceramic plate (30) has been polished in this way, the holding jig (8) is heated to 70 to 80°C to melt the adhesive, and the carrier (6) and the ceramic plate (3
0) and remove the ceramic plate (3) as necessary.
By reversing the front and back of the ceramic plate (30), the opposite surface of the ceramic plate (30) can be polished.

Generally, when the rough surface of a ceramic plate or glass plate is polished, the compressive stress remaining on the rough surface is released, and the thickness is reduced to 1.
When the thickness is between 00 and 150 μm, a phenomenon called the Twyman effect occurs where the ceramic plate is deformed into a concave shape. However, according to the method of the present invention, polishing can be performed with high efficiency, so the ceramic plate can be made to have a wall thickness that does not cause the Twyman effect. A method can be adopted in which both the top and bottom surfaces are polished, and then one side is polished until a predetermined thickness is achieved. Therefore, according to the method of the present invention, it is possible to manufacture a ceramic plate that is free from warpage and has excellent finishing accuracy.

(Effects of the Invention) As is clear from the above description, the present invention improves polishing efficiency by bonding the ceramic plate together with the carrier to the surface of a sufficiently thick holding jig and polishing it from one side. This method is excellent in that there is little possibility that fragments generated during processing will damage other ceramic plates, and the thickness of the ceramic plates can be easily controlled. Further, in the present invention, since a large number of ceramic plates can be reliably held on the holding jig, there is an advantage that a large amount of polishing can be performed. Therefore, the present invention makes an extremely large contribution to the industry as it solves the problems of the conventional polishing method for ceramic plates of this type.

[Brief explanation of drawings]

FIG. 1 is a partially cutaway plan view showing the implementation state of the present invention, and FIG.
The figure is also a partially cutaway front view. (1): Upper surface plate 7, (3): Lower surface plate, (6): Carrier, (8): Holding jig, (30): Ceramic plate.

Claims (1)

[Claims] A ceramic plate polishing method in which a ceramic plate held in a hole in a disc-shaped carrier is sandwiched between an upper surface plate and a lower surface plate that rotate relatively, and polishing is performed while the carrier is rotated planetarily. A method for polishing a ceramic plate, which comprises bonding a carrier and a ceramic plate to the surface of a sufficiently thick disc-shaped holding jig, and polishing the ceramic plate from one side.