JPS6258695A - Soldering of light emitting diode - Google Patents
Soldering of light emitting diodeInfo
- Publication number
- JPS6258695A JPS6258695A JP60199059A JP19905985A JPS6258695A JP S6258695 A JPS6258695 A JP S6258695A JP 60199059 A JP60199059 A JP 60199059A JP 19905985 A JP19905985 A JP 19905985A JP S6258695 A JPS6258695 A JP S6258695A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting diode
- soldering
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 title claims description 7
- 238000000034 method Methods 0.000 claims description 3
- 238000003780 insertion Methods 0.000 description 8
- 230000037431 insertion Effects 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- MGIUUAHJVPPFEV-ABXDCCGRSA-N magainin ii Chemical compound C([C@H](NC(=O)[C@H](CCCCN)NC(=O)CNC(=O)[C@@H](NC(=O)CN)[C@@H](C)CC)C(=O)N[C@@H](CC(C)C)C(=O)N[C@@H](CC=1NC=NC=1)C(=O)N[C@@H](CO)C(=O)N[C@@H](C)C(=O)N[C@@H](CCCCN)C(=O)N[C@@H](CCCCN)C(=O)N[C@@H](CC=1C=CC=CC=1)C(=O)NCC(=O)N[C@@H](CCCCN)C(=O)N[C@@H](C)C(=O)N[C@@H](CC=1C=CC=CC=1)C(=O)N[C@@H](C(C)C)C(=O)NCC(=O)N[C@@H](CCC(O)=O)C(=O)N[C@@H]([C@@H](C)CC)C(=O)N[C@@H](CCSC)C(=O)N[C@@H](CC(N)=O)C(=O)N[C@@H](CO)C(O)=O)C1=CC=CC=C1 MGIUUAHJVPPFEV-ABXDCCGRSA-N 0.000 description 1
Landscapes
- Led Device Packages (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 〈産業上の利用分野〉 本発明は、発光ダイオードの半田付は方法に関する。[Detailed description of the invention] <Industrial application field> The present invention relates to a method for soldering light emitting diodes.
〈従来の技術〉
一般に、発光ダイオードをプリント基板に実装する場合
には、例えば電子機器の前面パネルに合わせて所定の高
さ位置に保持することが必要となる。このため、発光ダ
イオードの半田付は作業は、タクトスイッチ等の他の電
気部品をディップ処理等により半田付けした後、個別に
手作業によシ行なっていた。<Prior Art> Generally, when a light emitting diode is mounted on a printed circuit board, it is necessary to hold it at a predetermined height position to match, for example, the front panel of an electronic device. Therefore, the light emitting diodes were soldered individually by hand after other electrical components such as tact switches were soldered by dip processing or the like.
〈発明が解決しようとする問題点〉
しかしながら、手作業により半田付けでは極めて作業効
率が悪いという問題点がある。<Problems to be Solved by the Invention> However, there is a problem in that manual soldering is extremely inefficient.
く問題点を解決するだめの手段〉
本発明の発光ダイオードの半田付は方法は、前述の問題
点を解決するために、発光ダイオード全位置決め治具に
形成された収納部に収納するとともに、該位置決め治具
に設けたマグネットの吸着力によりプリント基板に対し
て所定の高さ位置に保持した状態で半田付けを行なうこ
とを特徴とする。In order to solve the above-mentioned problems, the method for soldering light emitting diodes of the present invention is to store all the light emitting diodes in a housing formed in a positioning jig, and to It is characterized in that soldering is performed while the printed circuit board is held at a predetermined height position by the attraction force of a magnet provided on the positioning jig.
〈作用〉
発光ダイオードは、マグネットにより所定の高さ位置に
保持されることから、ディップ処理による半田付けが可
能となる。<Function> Since the light emitting diode is held at a predetermined height position by the magnet, it becomes possible to solder the light emitting diode by dipping.
〈実施例〉 図は本発明の一実施例を説明する概略断面図である。<Example> The figure is a schematic sectional view illustrating an embodiment of the present invention.
この実施例に用いられる位置決め治具２は、プリント基
板３上に載置されるもので、発光ダイオード１の収納部
となる挿通孔４と、発光ダイオードｌに近接してプリン
ト基板３に実装されるタクトスイッチ５等を避けるため
の切込み部６とを備えている。The positioning jig 2 used in this embodiment is placed on a printed circuit board 3, and is mounted on the printed circuit board 3 in the vicinity of the insertion hole 4 that serves as a storage area for the light emitting diode 1 and the light emitting diode l. A notch 6 is provided to avoid the tactile switch 5 and the like.
挿通孔４は、発光ダイオード１の本体１ａの形状に対応
するもので、上下方向に貫通形成されて、前記本体１ａ
ｅ上下方向に移動自在に保持している。挿通孔４は、プ
リント基板３に形成した透孔３ａに対応して配置され、
発光ダイオード１のリード片１ｂは、透孔３ａに挿通さ
れている。The insertion hole 4 corresponds to the shape of the main body 1a of the light emitting diode 1, and is formed vertically to penetrate through the main body 1a.
eIt is held movably in the vertical direction. The insertion hole 4 is arranged corresponding to the through hole 3a formed in the printed circuit board 3,
The lead piece 1b of the light emitting diode 1 is inserted into the through hole 3a.
まだ、位置決め治具２は、切込部６によってタクトスイ
ッチ５を含み込む広い載置面積を有しており、安定した
状態でプリント基板３上に載置されている。The positioning jig 2 still has a wide mounting area including the tactile switch 5 due to the notch 6, and is stably mounted on the printed circuit board 3.
そして、この位置決め治具２の上面には、板状のマグネ
ット７が取付けられており、挿通孔４に保持された発光
ダイオード１を磁力によって吸着し、挿通孔４の最上側
位置に保持するようになっている。そしてこの最上側位
置は、発光ダイオード１をプリント基板３に半田付けす
る際の所定の高さ位置に一致するように設定されている
。A plate-shaped magnet 7 is attached to the top surface of the positioning jig 2, and the light emitting diode 1 held in the insertion hole 4 is attracted by magnetic force and held at the uppermost position of the insertion hole 4. It has become. This uppermost position is set to match a predetermined height position when the light emitting diode 1 is soldered to the printed circuit board 3.
この実施例において、発光ダイオード１をプリント基板
３に半田付けするには、まず、プリント基板３上に載置
された位置決め治具２の挿通孔４に発光ダイオード１を
上方より挿入する。このとき、発光ダイオード１のリー
ド片１ｂｉプリント基板３の透孔３ａに挿入する。そし
て、位置決め治具２の上面にマグネット７を装着すると
、発光ダイオード１は、このマグネット７に吸着されて
所定位置に保持される。そこで、この発光ダイオードｌ
’に他のタクトスイッチ５等とともに、ディップ処理に
より半田付けし、最後にマグネット７及び位置決め治具
２を取り除き、作業を終了する。In this embodiment, in order to solder the light emitting diode 1 to the printed circuit board 3, the light emitting diode 1 is first inserted from above into the insertion hole 4 of the positioning jig 2 placed on the printed circuit board 3. At this time, the lead piece 1bi of the light emitting diode 1 is inserted into the through hole 3a of the printed circuit board 3. Then, when a magnet 7 is attached to the upper surface of the positioning jig 2, the light emitting diode 1 is attracted to the magnet 7 and held at a predetermined position. Therefore, this light emitting diode
' along with other tact switches 5, etc. are soldered by dip processing, and finally the magnet 7 and positioning jig 2 are removed to complete the work.
なお、前記実施例では、予めプリント基板３に載置され
た位置決め治具２に発光ダイオード１を挿着する場合に
ついて説明したが、位置決め治具２とマグネット７によ
り発光ダイオード１を予め保持した状態で、自動挿着装
置によりプリント基板３に自動挿着するようにしても良
い。In the above embodiment, the case where the light emitting diode 1 is inserted into the positioning jig 2 placed on the printed circuit board 3 in advance has been explained, but the light emitting diode 1 is held in advance by the positioning jig 2 and the magnet 7. Alternatively, the printed circuit board 3 may be automatically inserted into the printed circuit board 3 by an automatic insertion device.
〈発明の効果〉
以上説明したように、本発明によれば、マグネットの吸
着力により発光ダイオードが所定の高さ位置に保持され
ることから、発光ダイオードを他の電気部品とともにデ
ィップ処理によって半田付けすることもでき、手作業に
よる煩雑さを解消することができる。<Effects of the Invention> As explained above, according to the present invention, since the light emitting diode is held at a predetermined height position by the attraction force of the magnet, the light emitting diode can be soldered together with other electrical components by dip processing. It is also possible to eliminate the complexity of manual work.
図は本発明の一実施例を説明する概略断面図である。
１・・・発光ダイオード、２・・・位置決め治具、３・
・・プリント基板、４・・・挿通孔（収納部）、７・・
・マグネット。
１−）！＃：元タ゛イオード
２ ：イアり置沃ｙつン的」↓
３ニブリント其木反
４：挿通−Ｌ（１４又系内音障
７：マグ２・ソトThe figure is a schematic sectional view illustrating an embodiment of the present invention. 1... Light emitting diode, 2... Positioning jig, 3...
...Printed circuit board, 4...Insertion hole (storage part), 7...
·magnet. 1-)! ＃：Original type diodes 2: Irregular position ytsun' ↓ 3 Niblint 4: Insertion-L (14-way system internal sound disorder 7: Mag 2, Soto
Claims (1)
納するとともに、該位置決め治具に設けたマグネットの
吸着力によりプリント基板に対して所定の高さ位置に保
持した状態で半田付けを行なうことを特徴とする発光ダ
イオードの半田付け方法。The light emitting diode is stored in a housing formed in a positioning jig, and the soldering is performed while the light emitting diode is held at a predetermined height position relative to the printed circuit board by the attraction force of the magnet provided in the positioning jig. A unique method of soldering light emitting diodes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60199059A JPS6258695A (en) | 1985-09-09 | 1985-09-09 | Soldering of light emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60199059A JPS6258695A (en) | 1985-09-09 | 1985-09-09 | Soldering of light emitting diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6258695A true JPS6258695A (en) | 1987-03-14 |
Family
ID=16401419
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60199059A Pending JPS6258695A (en) | 1985-09-09 | 1985-09-09 | Soldering of light emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6258695A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0235473U (en) * | 1988-08-29 | 1990-03-07 | ||
| JPH0513083U (en) * | 1991-07-30 | 1993-02-19 | 太陽誘電株式会社 | Component mounting jig |
-
1985
- 1985-09-09 JP JP60199059A patent/JPS6258695A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0235473U (en) * | 1988-08-29 | 1990-03-07 | ||
| JPH0513083U (en) * | 1991-07-30 | 1993-02-19 | 太陽誘電株式会社 | Component mounting jig |
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