JPS6258045U - - Google Patents
Info
- Publication number
- JPS6258045U JPS6258045U JP1985150095U JP15009585U JPS6258045U JP S6258045 U JPS6258045 U JP S6258045U JP 1985150095 U JP1985150095 U JP 1985150095U JP 15009585 U JP15009585 U JP 15009585U JP S6258045 U JPS6258045 U JP S6258045U
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- slide rail
- chip
- conductor pattern
- connection terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W70/682—
Description
第１図は本考案の一実施例を示す断面図である
。
１……ヒートシンク付集積回路ケース、２……
接続端子、３……絶縁基板、４……導体パターン
、５……チツプ接続端子、６……接続線、７……
保護キヤツプ、８……放熱フイン、９……ヒート
シンク、１０……スライドレール、１１……クラ
ンプ、１２……突起、１３……ＩＣチツプ。
FIG. 1 is a sectional view showing an embodiment of the present invention. 1... Integrated circuit case with heat sink, 2...
Connection terminal, 3... Insulating board, 4... Conductor pattern, 5... Chip connection terminal, 6... Connection wire, 7...
Protective cap, 8...Radiation fin, 9...Heat sink, 10...Slide rail, 11...Clamp, 12...Protrusion, 13...IC chip.
Claims (1)
よりなる導体パターンと、前記導体パターンの一
端に取り付けられた信号入出力用接続端子と、前
記絶縁基板の周囲に設けられた接続用パターンと
、前記導体パターンの他の一端に取り付けられ論
理回路等よりなる半導体ＩＣチツプを接続するた
めのチツプ接続端子と、前記ＩＣチツプを保護し
前記絶縁基板に固定された保護キヤツプと、前記
絶縁基板の一面に取り付けられたスライドレール
と、前記スライドレールをクランプするためのク
ランプと、前記スライドレールと密着する突起と
、熱放散用放熱フインを有するヒートシンクとを
含むことを特徴とするヒートシンク付集積回路ケ
ース。 an insulating substrate, a conductor pattern made of a conductor bonded to the insulating substrate, a signal input/output connection terminal attached to one end of the conductor pattern, and a connection pattern provided around the insulating substrate; , a chip connection terminal attached to the other end of the conductor pattern for connecting a semiconductor IC chip consisting of a logic circuit, etc.; a protective cap that protects the IC chip and is fixed to the insulating substrate; An integrated circuit case with a heat sink, characterized in that it includes a slide rail attached to one side, a clamp for clamping the slide rail, a protrusion that comes into close contact with the slide rail, and a heat sink having heat dissipation fins for heat dissipation. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985150095U JPS6258045U (en) | 1985-09-30 | 1985-09-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985150095U JPS6258045U (en) | 1985-09-30 | 1985-09-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6258045U true JPS6258045U (en) | 1987-04-10 |
Family
ID=31065917
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985150095U Pending JPS6258045U (en) | 1985-09-30 | 1985-09-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6258045U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03194957A (en) * | 1989-12-21 | 1991-08-26 | Internatl Business Mach Corp <Ibm> | Plastic-chip circuit package, method of reinforcing heat dissipation of electronic part and method of mounting heat-sink-element |
-
1985
- 1985-09-30 JP JP1985150095U patent/JPS6258045U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03194957A (en) * | 1989-12-21 | 1991-08-26 | Internatl Business Mach Corp <Ibm> | Plastic-chip circuit package, method of reinforcing heat dissipation of electronic part and method of mounting heat-sink-element |
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