JPS625653U - - Google Patents
Info
- Publication number
- JPS625653U JPS625653U JP9716285U JP9716285U JPS625653U JP S625653 U JPS625653 U JP S625653U JP 9716285 U JP9716285 U JP 9716285U JP 9716285 U JP9716285 U JP 9716285U JP S625653 U JPS625653 U JP S625653U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- lead frame
- adjacent leads
- view
- metal wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の実施例を示すリードフレーム
の要部平面図、第２図は従来のリードフレームの
平面図、第３図及び第４図は第２図のリードフレ
ームを用いた半導体装置の製造方法を示す図、第
５図は第３図の要部斜視図、第６図は本考案の他
の実施例を示すリードフレームの要部平面図、第
７図は本考案のさらに他の変形例を示すリードの
平面図である。
３２……半導体素子搭載部、３３，４３，５３
……内部リード、３４……タイバー、４０……半
導体素子、４１……金属細線。
FIG. 1 is a plan view of essential parts of a lead frame showing an embodiment of the present invention, FIG. 2 is a plan view of a conventional lead frame, and FIGS. 3 and 4 are semiconductor devices using the lead frame of FIG. 2. FIG. 5 is a perspective view of the main part of FIG. 3, FIG. 6 is a plan view of the main part of a lead frame showing another embodiment of the present invention, and FIG. 7 is a diagram showing another embodiment of the present invention. FIG. 6 is a plan view of a lead showing a modified example of FIG. 32...Semiconductor element mounting section, 33, 43, 53
...Internal lead, 34...Tie bar, 40...Semiconductor element, 41...Thin metal wire.
Claims (1)
設された複数本の隣接するリードを有し、このリ
ードの一端部が金属細線で半導体素子と接続され
、かつ樹脂封止される半導体装置用リードフレー
ムにおいて、 前記隣接する各リードの一端部を、両角を削除
した形状にしたことを特徴とする半導体装置用リ
ードフレーム。[Claim for Utility Model Registration] It has a plurality of adjacent leads arranged so as to surround the place where the semiconductor element is to be mounted, one end of which is connected to the semiconductor element with a thin metal wire, and a resin-sealed What is claimed is: 1. A lead frame for a semiconductor device, wherein one end of each of the adjacent leads has a shape with both corners removed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9716285U JPS625653U (en) | 1985-06-26 | 1985-06-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9716285U JPS625653U (en) | 1985-06-26 | 1985-06-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS625653U true JPS625653U (en) | 1987-01-14 |
Family
ID=30963820
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9716285U Pending JPS625653U (en) | 1985-06-26 | 1985-06-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS625653U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009049072A (en) * | 2007-08-15 | 2009-03-05 | Panasonic Corp | Lead frame, semiconductor device, lead frame manufacturing method, and semiconductor device manufacturing method |
-
1985
- 1985-06-26 JP JP9716285U patent/JPS625653U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009049072A (en) * | 2007-08-15 | 2009-03-05 | Panasonic Corp | Lead frame, semiconductor device, lead frame manufacturing method, and semiconductor device manufacturing method |