JPS6254947A - Metal strip for lead frame - Google Patents
Metal strip for lead frameInfo
- Publication number
- JPS6254947A JPS6254947A JP19549085A JP19549085A JPS6254947A JP S6254947 A JPS6254947 A JP S6254947A JP 19549085 A JP19549085 A JP 19549085A JP 19549085 A JP19549085 A JP 19549085A JP S6254947 A JPS6254947 A JP S6254947A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- metal strip
- resin
- adhesion
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 title claims abstract description 29
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 29
- 238000007788 roughening Methods 0.000 claims description 2
- 229920005989 resin Polymers 0.000 abstract description 19
- 239000011347 resin Substances 0.000 abstract description 19
- 238000007747 plating Methods 0.000 abstract description 17
- 238000000465 moulding Methods 0.000 abstract description 5
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 14
- 235000019592 roughness Nutrition 0.000 description 9
- 230000003746 surface roughness Effects 0.000 description 9
- 239000000463 material Substances 0.000 description 6
- 229910000881 Cu alloy Inorganic materials 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000010970 precious metal Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910000640 Fe alloy Inorganic materials 0.000 description 2
- 238000012993 chemical processing Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 101100127656 Caenorhabditis elegans lam-2 gene Proteins 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は、半導体集積回路用のリードフレームの素材と
なる金属条材に関する。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a metal strip that is a material for a lead frame for a semiconductor integrated circuit.
〈従来の技術〉
リードフレームは、中央部にＩＣ素子を搭載する搭載台
と、その周囲に先端部にてＩＣ素子上の電極とワイヤポ
ンディングされる複数のリード部を形成したもので、搭
載台およびリード先端部に金、銀等の貴金属めっきが施
されている。<Conventional technology> A lead frame has a mounting base on which an IC element is mounted in the center, and a plurality of lead parts formed around it that are wire-bonded to the electrodes on the IC element at their tips. The base and lead tips are plated with precious metals such as gold and silver.
従来、このようなリードフレームは、鉄、鉄合金、銅、
銅合金等の金属条材を素材とし、この素↓↓ ド 雪
し ！ −」Ｌ ・ノ Ｎ 七 嬶、 １
↓−／＋、゛フ 七１°仕 却 自ｎ 丁 Ａ〉施して
不要部分をくり抜いた後、・リード先端部に部分めっき
を行うことにより製造している。Traditionally, such lead frames are made of iron, iron alloys, copper,
The material is metal strips such as copper alloy, and this material↓↓
death ! -” L・ノ N 7嬶, 1
↓-/+, 71°Disposal Self-n Ding A> After applying the process and cutting out unnecessary parts, the lead tip is partially plated.
また、リードフレームは、搭載台にＩＣ素子を搭載し、
ＩＣ素子上の各電極とリード先端部とをワイヤポンディ
ングした後の工程において、ＩＣ素子を環境から物理的
、化学的に保護すること等を目的として、エポキシやシ
リコーン等の樹脂により樹脂モールドがなされる。In addition, the lead frame mounts the IC element on the mounting base,
In the process after wire bonding each electrode on the IC element and the lead tip, a resin mold is molded with a resin such as epoxy or silicone in order to physically and chemically protect the IC element from the environment. It will be done.
従来、リードフレームの素材として用いられる金属条材
、特に一般的に用いられている銅合金や ′４２ア
ロイの圧延板の表面粗さは、平均粗さ１＃Ｌ１１以下で
あった。しかも平均粗さが小さい平滑な面はと前述の部
分めっきにおけるめっき密着性が良好となることがわか
っている。Conventionally, the surface roughness of metal strips used as materials for lead frames, particularly commonly used rolled plates of copper alloys and '42 alloys, has been 1#L11 or less. Moreover, it has been found that a smooth surface with a small average roughness provides good plating adhesion in the above-mentioned partial plating.
しかし、表面粗さが小さいものは、樹脂モールドした際
、リードフレームと樹脂との密着性が劣り、樹脂とリー
ド部の間に微妙なすき間を生じ易く、ここより湿気が侵
入してＩＣパッケージの信頼性を低下させるという問題
が生じる。However, if the surface roughness is small, when molded with resin, the adhesion between the lead frame and the resin is poor, and delicate gaps are likely to be created between the resin and the leads, from which moisture can enter and damage the IC package. A problem arises in that reliability is reduced.
この問題に対処すべく、リードフレームの表面全体にモ
ールドされる樹脂との密着性の良い金属をめっきする方
法が提案される。しかし、この方法では、めっき工程が
付加されるため、全体としてリードフレームの製造工程
の増加につながると共に、めっき金属の種類、特に金、
銀等の貴金属を用いた場合には、リードフレームが高価
なものとなるという欠点がある。In order to deal with this problem, a method has been proposed in which the entire surface of the lead frame is plated with a metal that has good adhesion to the resin to be molded. However, this method adds a plating process, which leads to an increase in the lead frame manufacturing process as a whole.
When precious metals such as silver are used, there is a drawback that the lead frame becomes expensive.
また他の方法として、リードフレームの樹脂モールドさ
れる部分の表面にエツチング加工により凹部を形成し、
樹脂の密着性の向上を図る方法もあるが、この方法によ
るもリードフレームの製造工程を増加し、しかもエツチ
ング加工に特殊かつ困難な技術を要するという欠点があ
る。Another method is to form a recess by etching on the surface of the resin-molded part of the lead frame.
Although there is a method of improving the adhesion of the resin, this method also has the disadvantage of increasing the number of lead frame manufacturing steps and requiring special and difficult etching techniques.
〈発明が解決しようとする問題点〉
本発明の目的は、上記従来技術の欠点を解消し、複雑な
製造工程を付加することなく容易にリードフレームと樹
脂との密着性を向上し、ＩＣパッケージの信頼性を向上
することができるリードフレーム用金属条材を提供する
ことにある。<Problems to be Solved by the Invention> The purpose of the present invention is to solve the above-mentioned drawbacks of the prior art, to easily improve the adhesion between the lead frame and the resin without adding complicated manufacturing processes, and to improve the adhesiveness of the IC package. An object of the present invention is to provide a metal strip for a lead frame that can improve the reliability of the lead frame.
く問題点を解決するための手段〉 このような目的は以下の本発明によって達成される。Means to solve problems〉 These objects are achieved by the following invention.
すなわち本発明は、金属表面の平均粗さを粗面加工によ
り１．５〜１０ル腸としたことを特徴とするリードフレ
ーム用金属条材である。That is, the present invention is a metal strip for a lead frame, characterized in that the average roughness of the metal surface is set to 1.5 to 10 mm by roughening.
以下本発明のリードフレーム用金属条材の構成を詳細に
説明する。The structure of the metal strip for lead frames of the present invention will be explained in detail below.
リードフレーム用金属条材には、加工性、材料コスト、
物理的・機械的特性等の観点から銅、銅合金、鉄、鉄合
金等が用いられている。Metal strips for lead frames have various characteristics such as processability, material cost,
Copper, copper alloys, iron, iron alloys, etc. are used from the viewpoint of physical and mechanical properties.
このようなリードフレーム用金属条材の表面粗さを、本
発明においては、平均粗さ１．５〜１０ｐｍとする。平
均粗さが１．５ 濤ｒａ未渦の場合には、モールド樹脂
との密着性が悪く、ＩＣパッケージの信頼性は向上せず
、また、平均粗さが１０＃Ｌ＋１をこえると、リード先
端部に施す部分めっきのめっき密着性が低下し、さらに
モールド樹脂との密着性も悪くなるからである。In the present invention, the surface roughness of such a metal strip for a lead frame is set to an average roughness of 1.5 to 10 pm. If the average roughness is 1.5 ra without swirling, the adhesion with the mold resin will be poor and the reliability of the IC package will not improve, and if the average roughness exceeds 10#L+1, the lead tip will This is because the plating adhesion of the partial plating applied to the part will be reduced, and the adhesion to the mold resin will also be deteriorated.
なお、ここで平均粗さとはＪＩＳ ８０＄０１に示す十
点平均粗さをいう。Note that the average roughness here refers to the ten-point average roughness shown in JIS 80$01.
本発明では上記のように、リードフレーム用金属条材の
表面粗さを１．５〜ｌＯＪＬｍとするのであるが、この
ように粗面加工を施す方法には次のようなものが利用で
きる。In the present invention, as described above, the surface roughness of the metal strip for a lead frame is set to 1.5 to 10JLm, and the following methods can be used to roughen the surface in this way.
（１）機械的加工法
粗面ロールによる圧延
研磨ブラシによる研磨
コイニング
（２）化学的加工法
エツチング
酸洗い
また、本発明の金属条材を用いてリードフレームを形成
したとき、リードフレームのＩＣ搭載台およびリード先
端部に貴金属による部分めっきが施される。従ってこの
部分めっきが施される部分の表面はそのままでも十分な
めっき密着性を有するが、その表面をコイニング等によ
り平滑化しておけば、より良好なめっき密着性を有し、
ＩＣ素子やポンディングワイヤとの接続性が損なわれる
ことがないので好ましい。(1) Mechanical processing method Rolling with a rough surface roll Polishing coining with an abrasive brush (2) Chemical processing method Etching Pickling Also, when a lead frame is formed using the metal strip of the present invention, IC mounting on the lead frame The base and lead tips are partially plated with precious metals. Therefore, the surface of the part to which partial plating is applied has sufficient plating adhesion as it is, but if the surface is smoothed by coining etc., it will have better plating adhesion.
This is preferable because the connectivity with the IC element and the bonding wire is not impaired.
〈実施例〉
銅合金（Ｃｕ９９％、Ｓｎ １％）製金属条材（幅２
５．４１ ａｍ、厚さ０．２５ｍｍ）の表面粗さを化学
的加工法により粗面加工し、十点平均粗さが各々１μｍ
以下、１．５４ｍ 、 ２．０ ＃Ｌｒａ 、 ５．Ｏ
ｐ、ｔｓ 、 １０．０ｇｍ 、 ２０．０μｍの金属
条材を作成した。<Example> Metal strip made of copper alloy (99% Cu, 1% Sn) (width 2
The surface roughness (5.41 am, thickness 0.25 mm) was roughened by chemical processing, and the ten-point average roughness was 1 μm each.
Below, 1.54m, 2.0 #Lra, 5. O
Metal strips with p, ts, 10.0 gm, and 20.0 μm were created.
これらの金属条材について以下に示す方法により樹脂と
の密着性、めっき密着性およびＩＣパッケージの信頼性
の評価を行った。These metal strips were evaluated for adhesion to resin, plating adhesion, and reliability of IC packages using the methods described below.
樹脂との密着性の評価は、第１図に示すように、表面粗
さの異なる各金属条材１の表面の底面積がｌ ａｍ２の
エポキシ樹脂製の円柱体２を密着硬化させ、金属条材ｌ
と上記円柱体２を徐々に引張方向３の方向に引張り、そ
れらの界面が剪断剥離する引張強度で求めた。As shown in Fig. 1, the evaluation of adhesion with resin was carried out by adhesion-curing cylindrical bodies 2 made of epoxy resin, each having a surface base area of lam2, of each metal strip 1 having a different surface roughness. material l
The above-mentioned cylindrical body 2 was gradually pulled in the tensile direction 3, and the tensile strength at which the interface between them was sheared and peeled was determined.
めっき密着性は１表面粗さの異なる各金属条材を長さｌ
ｏｃ＋ａに切断し、これらの試料に全面÷ツケルめっき
（厚さｌＯル層）を行い３００℃×５分間大気中で加熱
し、曲げ戻した後、テープピーリングを行い、めっきの
はがれ性で評価した。The plating adhesion is determined by measuring the length of each metal strip with different surface roughness.
These samples were cut to oc+a, and the entire surface of these samples was plated (with a thickness of 10 mm), heated in the air at 300°C for 5 minutes, bent back, and then tape peeled to evaluate the peelability of the plating. .
ＩＣパッケージの信頼性は、以下の方法で評価した。The reliability of the IC package was evaluated by the following method.
表面粗さの異なる各金属条材を用いて所定形状のリード
フレームを作成し、部分めっき後ＩＣ素子を搭載しワイ
ヤポンディングを行い、エポキシ樹脂によりモールドし
てＩＣパッケージを作成した。A lead frame of a predetermined shape was created using metal strips with different surface roughnesses, and after partial plating, an IC element was mounted, wire bonding was performed, and an IC package was created by molding with epoxy resin.
次にこれらのＩＣパッケージに対し、１２１°Ｃ５２気
圧のプレッシャ・フッカ試験を行い、累積故障率１％ま
での寿命時間を求めた。Next, these IC packages were subjected to a pressure hooker test at 121°C and 52 atmospheres to determine the life time until the cumulative failure rate was 1%.
これらの実験結果を表１に示す。The results of these experiments are shown in Table 1.
表 １
（注）評価０：剥離なし
Δ：剥離ややわり
以上の結果より、本発明例ではリードフレーム（金属条
材）と樹脂との密着性が良く、その結果ＩＣパッケージ
の信頼性が向上していることがわかる。Table 1 (Note) Evaluation 0: No peeling Δ: Fair peeling From the above results, in the example of the present invention, the adhesion between the lead frame (metal strip) and the resin was good, and as a result, the reliability of the IC package was improved. You can see that
また、めっき密着性の低下も生じていない。Furthermore, there was no decrease in plating adhesion.
〈発明の効果〉
本発明のリードフレーム用金属条材によれば、金属表面
の平均粗さを１．５〜１０ ｐ−ｒｓとすることにより
、リードフレームとモールドする樹脂との密着性を良好
なものとし、その結果ＩＣパッケージの信頼性を向上す
ることができる。<Effects of the Invention> According to the metal strip for lead frames of the present invention, by setting the average roughness of the metal surface to 1.5 to 10 p-rs, good adhesion between the lead frame and the molding resin is achieved. As a result, the reliability of the IC package can be improved.
しかも本発明は、リードフレームの素材となる金属条材
の表面粗さを上記範囲に限定するだけでよく、特殊な工
程を付加することなく、従来どうりの製造工程にてリー
ドフレームを製造することができる。その結果、コスト
が上昇し、リードフレームが高価となることがない。Furthermore, the present invention only requires that the surface roughness of the metal strip that is the raw material for the lead frame be limited to the above range, and the lead frame can be manufactured using the conventional manufacturing process without adding any special process. be able to. As a result, the cost does not increase and the lead frame does not become expensive.
また、本発明のリードフレーム用金属条材を用いても、
リードフレームに施す部分めっきのめっき密着性を低下
させることがほとんどない。Moreover, even if the metal strip for lead frames of the present invention is used,
There is almost no reduction in the plating adhesion of partial plating applied to the lead frame.
第１図は、リードフレーム用金属条材と樹脂との密着性
を評価するための試験方法を示す斜視図である。
符号の説明
１・・・金属条材、
２・・・円柱体。
３・・・引張力向FIG. 1 is a perspective view showing a test method for evaluating the adhesion between a metal strip for a lead frame and a resin. Explanation of symbols 1... Metal strip, 2... Cylindrical body. 3...Tensile force direction
Claims (1)
０μｍとしたことを特徴とするリードフレーム用金属条
材。(1) The average roughness of the metal surface is 1.5 to 1 by roughening.
A metal strip for lead frames characterized by having a thickness of 0 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19549085A JPS6254947A (en) | 1985-09-04 | 1985-09-04 | Metal strip for lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19549085A JPS6254947A (en) | 1985-09-04 | 1985-09-04 | Metal strip for lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6254947A true JPS6254947A (en) | 1987-03-10 |
Family
ID=16341951
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19549085A Pending JPS6254947A (en) | 1985-09-04 | 1985-09-04 | Metal strip for lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6254947A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5362926A (en) * | 1991-07-24 | 1994-11-08 | Denki Kagaku Kogyo Kabushiki Kaisha | Circuit substrate for mounting a semiconductor element |
| US6002173A (en) * | 1991-12-20 | 1999-12-14 | Sgs-Thomson Microelectronics S.R.L. | Semiconductor device package with metal-polymer joint of controlled roughness |
-
1985
- 1985-09-04 JP JP19549085A patent/JPS6254947A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5362926A (en) * | 1991-07-24 | 1994-11-08 | Denki Kagaku Kogyo Kabushiki Kaisha | Circuit substrate for mounting a semiconductor element |
| EP1132961A1 (en) * | 1991-07-24 | 2001-09-12 | Denki Kagaku Kogyo Kabushiki Kaisha | Circuit substrate for mounting a semiconductor element |
| US6002173A (en) * | 1991-12-20 | 1999-12-14 | Sgs-Thomson Microelectronics S.R.L. | Semiconductor device package with metal-polymer joint of controlled roughness |
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