JPS6245136A - Support jig and wire bonding device into which said support jig is incorporated - Google Patents

Abstract

PURPOSE:To hold a stem with high precision by constituting a holding section for a support jig for the assembly, etc. of a semiconductor laser device of a housing section and a permanent magnet sucking the housing section. CONSTITUTION:A support jig has a frame made of a rectangular metal and a holding section inserted into mounting holes bored at regular intervals along the center of the frame. The holding section consists of a stepped axial disk, and small diameter sections in a lower section thereof are inserted into the mounting holes. The mounting holes and the small diameter sections take corresponding semicircular shapes, and the small diameter sections are not turned and are positioned with high accuracy when the small diameter sections are inserted into the mounting holes. E-shaped retaining rings are fitted to small diameter sections downward projected from the mounting holes, and the holding section is fixed to the frame. Triangular housing sections are disposed made to correspond to three stems to the holding section, and disposed made to correspond to three stems to the holding section, and permanent magnets are fitted to the holding section in the vicinity of the housing sections. Accord ingly, leads are inserted into the housing sections, and the stems, the bases thereof are placed on the holding section, are fastened firmly to the holding section by the magnetic force of the permanent magnets.

Description

[Detailed Description of the Invention] [Technical Field] The present invention relates to a support jig, particularly a support jig and a support jig that are used when connecting a laser chip and a light receiving element with a lead in the assembly of a semiconductor laser device, and a support jig. This relates to wire bonding equipment ff.

[Background technology]

Light sources for optical communications or digital audio discs,
Semiconductor laser elements with various structures have been developed as light sources for information processing devices such as video discs. For example, a semiconductor laser as described in Nikkei Electronics J, September 14, 1981 issue, pages 138 to 152, published by Nikkei McGraw-Hill, is known as a light source for information processing devices such as digital audio discs and video discs. ing.

Generally, in this type of semiconductor laser device, a semiconductor laser element (laser chip) is fixed to a heat block provided at the center of the main surface of the stem via a submount, and a light receiving element attached to the main surface of the stem emits the laser beam. The light intensity is monitored. Further, the laser light to be used is emitted outside the package through a window into which a transparent body is fitted in the ceiling portion of the cap attached to the main surface of the stem.

Incidentally, in a semiconductor laser device having such a structure, when the lead tip penetrating the stem is connected to the laser chip and the electrode of the light receiving element using a wire, even though the light receiving element is fixed to the main surface of the stem. On the other hand, since the laser chip is fixed to one side of the heat block fixed to the main surface of the stem, the crimping direction of the wire at each wire bonding point is different, and the posture of the stem is changed each time during wire bonding. The need arose;
It is difficult to automate wire bonding assembly and productivity is low. In addition, as a technique to prevent the disturbance of the far-field image caused by the laser light reflected on the light-receiving surface of the light-receiving element being emitted from the window of the cap, the light-receiving element is fixed to the stem at an angle, and the laser light is reflected on the light-receiving surface. A technology was developed to prevent the laser beam from reaching the window of the cap (patent application 1982-
148483)).

In a semiconductor laser device having such a structure in which the light receiving element is tilted to the stem, when wire bonding is performed to the electrode of the light receiving element, it becomes necessary to change the attitude of the stem.

[Purpose of the invention]

An object of the present invention is to provide a wire bonding apparatus that can perform wire bonding by automatically changing the posture of a workpiece during wire bonding.

Another object of the present invention is to provide wire bonding with high wire bonding accuracy.

Another object of the present invention is to provide a wire bonding device that can reduce manufacturing costs.

Another object of the present invention is to provide a support jig that supports the objects to be processed in a line that allows the objects to be easily attached and removed.

The above and other objects and novel features of the present invention include:
It will become clear from the description of this specification and the accompanying drawings.

[Summary of the invention]

A brief overview of typical inventions disclosed in this application is as follows.

That is, according to the present invention, since the wire bonding apparatus has a structure in which the stage can swing, the support jig that holds the stem clamped to the stage automatically moves to a preset posture during wire bonding. Since the wire bonding is corrected, wire bonding can be performed continuously, improving work efficiency and
High precision wire bonding can be achieved. Further, in the support jig, the stem is inserted into a housing portion consisting of housing holes lined up in a row, and is held by the magnetic force of a permanent magnet embedded in the vicinity of the housing holes. This makes it possible to hold the stem with high precision, and also makes it easier to attach and detach the stem, improving work efficiency.

〔Example〕

FIG. 1 is an exploded perspective view of a support jig according to an embodiment of the present invention, FIG. 2 is a perspective view of a partially cut-out semiconductor laser device, and FIG. 3 is a perspective view of the support jig. figure,
4 is an enlarged cross-sectional view of a part of the same, FIG. 5 is a conceptual plan view showing the positional relationship between the support jig and the semiconductor laser device stem, etc., and FIG. 6 is a wire bonding device according to the present invention. The schematic plan view and FIG. 7 are also sectional views showing the wire bonding state.

This embodiment shows an example in which the present invention is applied to a semiconductor laser device serving as a light source for a compact disc.

As shown in FIG. 2, the semiconductor laser device consists of a plate-shaped stem 1, which is the main component of the assembly, and a cap 2 hermetically fixed to the main surface of the stem 1. The stem 1 is a circular metal plate with a thickness of several mm, and a heat block 3 made of copper is fixed to the center of the main surface (upper surface) with solder or the like. A semiconductor laser element (laser chip) 5 is fixed to the side surface of the heat block 3 via a submount 4. The laser chip 5 has a width of, for example, 400 μm.

The resonator, which has a length of 300 μm and a height of 100 μm and emits the laser beam 6, is located at a depth of about 3 to 5 μm from the surface of the laser chip 4.

On the other hand, a light receiving element 7 is fixed to the main surface of the stem 1 for receiving a laser beam 6 emitted from the lower end of the laser chip 5 and monitoring the optical output of the laser beam 6. This light receiving element 7 is fixed to an inclined surface provided on the main surface of the stem 1, for example, an inclined surface 8 having an angle of 7 degrees, via a bonding material (not shown). This prevents the reflected light from the light receiving surface of the light receiving element 7 of the laser light 6 emitted from the laser chip 5 from entering the camp window, which will be described later, thereby preventing disturbance of the far field pattern. It's for a reason.

On the other hand, three ropes 9 are fixed to the stem 1. One wire 9 is electrically and mechanically fixed to the back side of the stem 1, and the other two wires 9 pass through the stem 1 and are connected to the stem 1 through an insulator 10 such as glass. It is electrically insulated and fixed. The stem 1
The upper ends of the two boards 9 protruding from the main surface are connected to the respective electrodes of the laser chip 5 and the light receiving element 7 via wires 11, respectively.

Further, a metal cap 2 having a window 12 is hermetically fixed to the main surface of the stem 1 to seal the laser chip 5 and the heat block 3.

The window 12 is formed by airtightly closing a circular hole provided in the ceiling of the camp 2 with a transparent glass plate 13. Therefore, the laser beam 6 emitted from the upper end of the laser chip 5 passes through the transparent glass plate 13 and is emitted outside the package formed by the stem 1 and the camp 2.

The outer peripheral portion of the stem 1 includes a pair of V-shaped notches 14 and a rectangular notch 15, which are provided facing each other.
is provided and used for positioning during assembly.

In such a semiconductor laser device, considering the wire bonding state as described above, it is necessary to change the attitude of the stem 1 during wire bonding. That is, when connecting the wire to the laser beam 6, the stem l
When the main surface of the main surface is inclined by 7 degrees and the wire 11 extending from the laser beam 6 is connected to the upper end of one lead 9, it is necessary to return the stem l to the horizontal position again. When connecting one end of the wire 11 to the electrode of the laser chip 5, the stem 1 is tilted (swinged) by 90 degrees, and in this state, the other end of the wire 11 extending from the laser chip 5 is connected. It is connected to one side of the other glued 9.

Next, a wire bonding apparatus that performs wire bonding while changing the posture of the stem will be described.

The wire bonding device, as shown in outline in FIG.
Wire bonding is performed on the frame-shaped support jig 19 that is sent out one by one to the conveyance path 18 by the wire bonding mechanism 7. The support jig 19 sent out onto the conveyance path 18 is hooked by a plurality of claws 21 of a transfer mechanism 20 and is intermittently transferred onto a stage 22. In this stage 22, the stems 1 are attached to the support jig 19 at regular intervals.
Wire bonding is performed for all of the. This wire bonding is performed by a wire bonding mechanism 25 that has a bonding head 24 at the tip of an arm 23 facing above the stage 22. Further, the support jig 19 on which all the stems 1 have been subjected to wire bonding is transported onto the unloader transport path 26 by the transport mechanism 20. This unloader conveyance path 26
A plurality of air injection holes 27 are arranged in several rows, forming an air bearing that feeds the support jig 19 into the cartridge 28 of the unloader section using air pressure.

As shown in FIGS. 1 and 2, the support jig 19 is inserted into a rectangular metal frame 29 and mounting holes 30 bored at regular intervals along the center of the frame 29. It consists of a holding part 31 that is As shown in FIGS. 1 and 4, the holding portion 31 is made of a stepped shaft-shaped disc, and a small diameter portion 32 at the lower part thereof is inserted into the mounting hole 30. Further, the mounting hole 30 is a semicircular hole, and the cross-sectional shape of the small diameter portion 32 is also a shape corresponding to this.When the small diameter portion 32 is inserted into the mounting hole 30, the small diameter portion 32 does not rotate, and the small diameter portion 32 is positioned with high precision. Further, an E-type stopper 33 is attached to a portion of the small diameter portion 32 that protrudes downward from the attachment hole 30, and the holding portion 31 is fixed to the frame 29.

On the other hand, the holding portion 31 is provided with a triangular accommodating portion 34 . This housing portion 34 corresponds to the arrangement shape of the three stems 1, as shown in FIG. Therefore, when the three leads 9 of the stem 1 are inserted into the accommodating part 34, each lead 9 is located at each vertex of the triangular accommodating part 34, so that the stem 1 can be inserted into the holding part 3 with high precision.
, that is, positioned on the frame 29. The reproducibility of this positioning is high. Further, a permanent magnet 35 (rare earth permanent magnet) is fitted into a portion of the holding portion 31 near the housing portion 34 . Therefore, when the lead 9 is inserted into the accommodating part 34 and the back surface of the stem l is placed on the holding part 31, the stem 1
is fixed to the holding part 31 by the magnetic force of the permanent magnet 35. The magnetic force of this permanent magnet 35 is strong, and even when the stage 22 swings 90' and the stem 1 is in a vertically extending position, as shown in FIG. It will not change position or fall off. Further, the stem 1 fixed to the holding part 31 by the magnetic force of the permanent magnet 35 can be easily pulled out manually or by an automatic machine without damaging the stem 1 etc. 2
Guide holes 36 are provided on both side portions of 9 in correspondence with the mounting holes 30 . This guide hole 36 is used as a guide hole for feeding and positioning when moving on the conveyance path 18 and stage 22 in the wire bonding mechanism 25.

Next, a state in which wire bonding is performed using such a wire bonding apparatus will be described.

As shown in FIG. 7, the stage 22 is controlled to oscillate (rotate) about a shaft 37. As shown in FIG. Therefore, first stage 2
2 to the left by 7 degrees, and a wire bonding mechanism is attached to an electrode (not shown) of the light receiving element 7 fixed to the main surface of the stem 1 supported on the stage 22 via the support jig 19. A bonding tool (capillary) 38 disposed on the bonding head 24 of No. 25 is lowered to connect the tips of the wires 11 by thermocompression bonding. Then arrow 3
As shown at 9, the bonding tool 38 moves while feeding out the wire 11 from its tip (lower end). During this time, the stage 22 is rotated 7 degrees to the right, so that the descending direction of the bonding tool 38 is automatically adjusted so that it protrudes onto the main surface of the stem 1 and is perpendicular to the upper end surface of the lead 9. be operated on. Then wire 11
The other part is fixed to the upper end of the lead 9 by thermocompression bonding, and the wire 11 is clamped and pulled, so that the wire 11 breaks at the root of the joint.

As a result, the wire tension between the board 9 and the light receiving element 7 is completed.

Next, the stage 22 is controlled to rotate (oscillate) 90' to the left. In this state, as shown by the two-dot chain line in FIG.
Each is in a horizontal state. Therefore, the tip of the wire 11 is connected to the electrode of the laser chip 5 by thermocompression bonding using the bonding tool 38, and the bonding tool 38 is moved as shown by the arrow 40 to connect the other part of the wire 11 to the tip of the lead 9. Connect to the side surface to complete the wire tension between the laser chip 5 and the leads 9.

In this way, the stem 1 that is attracted to the support jig 19 by the magnetic force of the permanent magnet 35 and positioned in the housing part 34 is automatically wire-bonded in sequence.

〔effect〕

(1) Since the support jig of the present invention has a structure in which the lead protruding from the stem is inserted into the accommodation hole and the stem is attracted by a permanent magnet, it is extremely easy to insert and remove the jig.

(2) Since the support jig of the present invention has a structure in which the stem is positioned in the accommodation hole, the positioning accuracy of the stem can be determined with high precision simply by inserting the lead part protruding from the stem into the accommodation hole. This effect can be obtained.

(3) The wire bonding device of the present invention includes the above (2)
Since wire bonding is performed by placing a support jig like this on the stage and controlling the posture of the stage for each wire bonding, highly accurate wire bonding can be performed even if the bonding postures are different. This effect can be obtained.

(4) The wire bonding apparatus of the present invention performs wire bonding by using a frame-shaped support jig to continuously and intermittently feed a single stem onto a stage where a bonding tool is located. At the same time, all operations are automated, resulting in improved productivity.

(5) In the present invention, if the holding portion of the support jig is designed to correspond to each workpiece and the frame is always of the same shape, the support jig can be used in common. As a result,
The effect is that standardization of equipment can be achieved.

(6) According to the above (11 to (5)), according to the present invention, in wire bonding of a semiconductor laser device where it is difficult to automate wire bonding, a support jig that can connect the stems in series with high precision is adopted; By oscillating the stage, synergistic effects can be obtained, such as improved yield through high-precision wire bonding, improved productivity through automation, and reduced manufacturing costs for semiconductor laser devices.

Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the above Examples and can be modified in various ways without departing from the gist thereof. Nor. For example, even if the holding portion is welded to the frame by spot welding or the like, the same effects as in the above embodiment can be obtained. Furthermore, as shown in FIG. 8, if the frame 29 is molded by press to provide a housing part 34 and a permanent magnet 35 (rare earth permanent magnet) is fixed to the molded part, it is similar to the above embodiment. In addition to obtaining the following effects, it is possible to reduce the manufacturing cost of the support jig.

[Application field]

In the above description, the invention made by the present inventor was mainly applied to the wire bonding technology in a semiconductor laser device, which is the background field of application, but the present invention is not limited thereto.

At least the present invention can be applied to techniques for reading articles directly from one another.

[Brief explanation of the drawing]

FIG. 1 is an exploded perspective view of a support jig according to an embodiment of the present invention, FIG. 2 is a perspective view of a semiconductor laser device with a portion cut away, and FIG. 3 is a perspective view of the support jig. Figures and Figure 4 are the same (
5 is a conceptual plan view showing the positional relationship between the support jig and the semiconductor laser device stem, etc.; FIG. 6 is a schematic plan view showing the wire bonding device according to the present invention. , FIG. 7 is a sectional view showing the same wire bonding state, and FIG. 8 is a sectional view showing a support jig according to another embodiment of the present invention. 1...Stem, 2...Cap, 3. ... Heat block, 4 ... Submount, 5 ... Semiconductor laser element (laser chip), 6 ... Laser light, 7 ... Light receiving element, 8 ... Inclined surface, 9 ... Lead , 10...
Insulator, 11...Wire, 12...Window, 13...
Glass plate, 14... V-shaped notch, 15... Rectangular notch, 16... Cartridge, 17... Button, 18... Conveyance path, 19... Support jig, 20 ...
Transfer mechanism, 21...claw, 22...stage, 23.
...Arm, 24...Bonding hand, 25...
- Wire bonding mechanism, 26... Unloader conveyance path, 27... Air injection hole, 28... Cartridge, 29... Frame, 30... Mounting hole, 31...
Holding part, 32... Small diameter part, 33... E-type retaining ring, 3
4... Accommodating part, 35... Permanent magnet (rare earth permanent magnet), 36... Guide hole, 37... Shaft, 38... Bonding tool (Cabila 'J), 39° 40...
arrow. Agent Patent attorney Katsuma Ogawa ,・'( 3rd figure 11ele7Lcy (HN3) 4th FA tt force=,= (I Hz) 5th figure figure

Claims (1)

[Scope of Claims] 1. At least one holding section consisting of a storage section that positions and accommodates the object to be processed, and a permanent magnet arranged so as to magnetically attract the object to the storage section. A support jig characterized by: 2. The support jig according to claim 1, wherein the holding portions are arranged at regular intervals along the longitudinal direction of the strip-shaped frame. 3. A support jig consisting of storage parts arranged at regular intervals on a frame for positioning and accommodating the objects to be processed, and permanent magnets arranged facing each of the storage parts so as to magnetically attract the objects to be processed. A wire bonding device comprising: a stage that supports a tool; and a wire bonding device that has a wire bonding head facing above the stage. 4. The wire bonding apparatus according to claim 3, wherein the stage is rotatably controlled along a plane perpendicular to the direction in which the support jig is transferred.