JPS6243145A - Manufacture apparatus of semiconductor element - Google Patents

Abstract

PURPOSE:To form a uniform film and pattern on a material to be machined, by mounting a first turntable, which fixes the material to be machined, and a first driving mechanism, which drives said turntable, on a second turntable so that the second turntable is deviated from the rotary shaft of the first turntable. CONSTITUTION:Fluid is dropped on a material to be machined on a first turntable 1. Thereafter, the first turntable 11 and a second turntable 14 are rotated so that the ratio between the rotating periods of the turntables does not become an integer ratio. Thus, forces in the different directions are always applied to the fluid on the material to be machined, which is fixed to the first turntable 11. Therefore, the fluid is uniformly distributed. Thus the uniform film and pattern can be formed on the material to be machined.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a semiconductor device manufacturing apparatus used for film coating, etching, etc.

[Conventional technology]

FIG. 2 is a schematic diagram showing an example of a conventional semiconductor device manufacturing apparatus, in which 1 is a turntable that rotates the workpiece after fixing it by vacuum suction, 2 is the rotary shaft of the tar/tasle 10, and 3 is the turntable. 1 is a drive mechanism that rotates O through a rotating shaft 2.Next, the operation of this semiconductor device manufacturing apparatus will be explained. After seven drops of fluid are placed on the workpiece fixed on turntable 1 using a dispenser or other method, turntable 1! ! :By rotating K,
This fluid is spread over the entire surface of the workpiece. With this, pattern formation such as film formation, development, or etching is performed.

[Problem that the invention seeks to solve]

In the conventional semiconductor device manufacturing apparatus as described above, the centrifugal force exerted on the dropped fluid is different between the center and the periphery of the turntable 1, so the formed film or pattern is different between the center and the periphery. There was a problem in that the tendency became more pronounced as the size of the workpiece became larger.

The present invention has been made to solve these problems, and an object of the present invention is to provide a semiconductor device manufacturing apparatus that can form a uniform film and pattern on a workpiece.

[Means for solving problems]

A semiconductor device manufacturing apparatus according to the present invention includes a first turntable for fixing a workpiece, and a first drive mechanism for rotating the first turntable! is mounted on a second turntable offset from its rotation axis, and the turntable of this WJ2 is rotated by a second drive mechanism.

[Effect]

In this invention, the fluid on the workpiece is subjected to not only the centrifugal force exerted by the first turntable but also the centrifugal force exerted by the second turntable.

〔Example〕

FIG. 1 is a schematic diagram showing an embodiment of the semiconductor device manufacturing apparatus of the present invention, in which 11 is a first turntable for fixing a workpiece, 12 is a first rotating shaft, and 13 is the first turntable. A first drive mechanism 14 rotates the table 11 via a first rotation shaft 12, and the first drive mechanism 13. A second turntable on which the first rotation shaft 12 and the first turntable 111f are mounted evenly from the rotation shaft, 1
5 is a second rotating shaft, and 16 is a second drive mechanism that rotates the turntable 14 of the WIJ 2 via the N second rotating shaft 15.

In the semiconductor device manufacturing apparatus of the present invention, after dropping the fluid onto the workpiece (not shown) on the first turntable 11, the ratio of the rotation periods of the first turntable 11 and the second turntable 14Y is determined. Rotate so that they are not integer ratios. Then, forces in different directions are always applied to the fluid on the workpiece fixed to the first turntable 11, and the fluid becomes uniformly distributed.

The configuration of the semiconductor device manufacturing apparatus of the present invention may be applied to a pattern forming apparatus such as a photomask, or a pattern forming apparatus using other press technology. moreover,
If the two rotating shafts 12, 15 each have a mechanism that can independently rotate in reverse, it is possible to further increase the uniformity.

〔Effect of the invention〕

As explained above, the present invention includes a first turntable for fixing a workpiece and a first drive mechanism for rotating the first turntable on a second turntable offset from its rotation axis. Since the second turntable is mounted and configured to be rotated by the second drive mechanism, it is possible to form a uniform film and pattern on the workpiece.

[Brief explanation of the drawing]

FIG. 1 is a schematic diagram showing an embodiment of a semiconductor device manufacturing apparatus according to the present invention, and FIG. 2 is a schematic diagram showing an example of a conventional semiconductor device manufacturing device. In the figure, 11 is the first turntable, 12 is the first turntable, and 12 is the first turntable.
13 is a drive mechanism @1, 14 is a second turntable, 15 is a second rotation shaft, and 16 is a second drive mechanism. Agent Masuo Oiwa (2 others) Figure 1 Figure 2 Procedural amendment (voluntary) Commissioner of the Japan Patent Office 111
・Indication of the case: Japanese Patent Application No. 184409/1984 2・Name of the invention: Semiconductor device manufacturing equipment 3, Person making the amendment Relationship to the case Patent applicant address: 2-2-3 Marunouchi, Chiyoda-ku, Tokyo Name (601) ) Mitsubishi Electric Corporation Representative Moriya Shiki 4, Agent Address 2-2-3-5 Marunouchi, Chiyoda-ku, Tokyo
, Claims column and Detailed Description of the Invention column 6 of the specification to be amended, Contents of the amendment (1) The claims of the specification are amended as shown in the attached sheet. (2) On page 3 of the specification, lines 2 to 8, “The workpiece...
・It is configured. ” is corrected as follows. "It has a turntable that fixes the workpiece, a first drive mechanism that causes the turntable to rotate, and a second drive mechanism that allows the turntable to revolve." (3) Similarly, No. "Receive the first turntable" in lines 10 to 12 of page 3 is corrected as follows. "In addition to the centrifugal force due to the turntable's rotation, it also receives centrifugal force due to its revolution." (4) Similarly, on page 5, lines 1 to 5, "Since the turntable is configured with the first turntable," Correct as shown below. ``The turntable and the rotation of this turntable''
and a second drive mechanism that allows the turntable to learn the revolution. 1. A semiconductor device manufacturing apparatus comprising a first drive mechanism that rotates a turntable and a second drive mechanism that causes a turntable to revolve.

Claims (1)

[Claims] a first turntable for fixing a workpiece;
a first drive mechanism for rotating a turntable; a second turntable on which the first drive mechanism and the first turntable are mounted offset from the rotation axis;
A semiconductor device manufacturing apparatus comprising: a second drive mechanism that rotates the second turntable.